Material distributing device

Abstract

The utility model provides a material distributing device which comprises a supporting frame. The material distributing mechanism is arranged on the supporting frame, the material storing mechanism is arranged below the material distributing mechanism, the material storing mechanism comprises a material storing frame and a plurality of material storing boxes arranged on the material storing frame, and the material distributing mechanism comprises a material distributing block rotationally arranged on the supporting frame and an air blowing assembly arranged above the material distributing block; the material distributing block is provided with a vertically-communicated grading channel, the grading channel comprises a first channel, a horizontal channel and a second channel which are sequentially communicated, and the material distributing block can selectively rotate to enable the second channel to be communicated to any material storage box. The grading channel is arranged in the material distributing block, the workpieces entering the material distributing block are temporarily stored in the material distributing block, when the material distributing block rotates to the corresponding material storage box, the workpieces are blown out of the material distributing block through the blowing assembly and enter the corresponding material storage box, the structure is simple, operation is easy, and accurate and rapid material distributing of the workpieces is achieved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor device manufacturing, in particular to a material dividing device. Background Art

[0002] At present, semiconductor device production generally includes inspection items such as laser marking on the surface of materials, vacuuming, and visual inspection of marking. After various inspections are completed, the unqualified products of various categories in the production will be screened out according to the inspection results, and then the defective products of each category will be classified and stored. In addition, different types of semiconductor devices also need to be transported and stored in different containers.

[0003] The traditional way of sorting semiconductor devices is mainly achieved through a feed assembly, a branch pipe and a terminal pipe. After the branch pipe is connected to the corresponding terminal pipe, the feed assembly sequentially sends the semiconductor devices through the branch pipe and the terminal pipe into the corresponding container to achieve the sorting and storage of semiconductor devices. However, as the application fields of small-sized semiconductor devices become more and more extensive, the structure of the pipe-type sorting device is complex and the transportation speed is slow. When semiconductor devices are transported in the pipe, friction loss of semiconductor devices will occur, resulting in low production efficiency and increased production costs. Utility Model Content

[0004] The utility model aims to provide a material dividing device to solve the technical problems existing in the prior art that the material dividing device has a complex structure and a slow transportation speed, resulting in low production efficiency and increased production costs.

[0005] In order to solve the above technical problems, the utility model provides a material dividing device, comprising: a support frame;

[0006] A material distribution mechanism is arranged on the support frame and a material storage mechanism is arranged below the material distribution mechanism, the material storage mechanism includes a material storage frame and a plurality of material storage boxes arranged on the material storage frame, the material distribution mechanism includes a material distribution block rotatably arranged on the support frame and a blowing component located above the material distribution block,

[0007] The material distribution block has a vertically conductive grading channel, and the grading channel includes a first channel, a horizontal channel and a second channel that are connected in sequence. The material distribution block can be selectively rotated to connect the second channel to any of the storage boxes.

[0008] Optionally, in the material dividing device, the blowing assembly includes a blowing nozzle and a rotating shaft, one end of the blowing nozzle is rotatably connected to the rotating shaft, and the other end leads to the top of the material dividing block; the air outlet of the blowing nozzle is set downward, and when the blowing nozzle rotates to above the first channel, the air outlet of the blowing nozzle is aligned with the inlet of the first channel.

[0009] Optionally, in the material dividing device, the grading channels are arranged in a stepped manner.

[0010] Optionally, in the material dividing device, the multiple storage boxes are arranged in a cylindrical array with the rotation axis of the material dividing block as the center and along the circumferential direction of rotation of the material dividing block.

[0011] Optionally, in the material dividing device, a detection component is provided on the support frame, and the detection component is used to detect a material signal.

[0012] Optionally, in the material dividing device, the detection component is a counter-fiber sensor, and two groups of the counter-fiber sensors are arranged on both sides of the material dividing block, and the light emitted by the two groups of the counter-fiber sensors passes above the first channel inlet.

[0013] Optionally, in the material dividing device, the support frame includes a fixed plate supporting the material dividing mechanism at the top, a bottom plate supporting the material storage mechanism at the bottom, and a side plate supporting and connecting the fixed plate and the bottom plate, the side plate encloses the fixed plate and the bottom plate to form an internal space; a slide groove is provided on the bottom plate, and the material storage mechanism is movably and disassembled in the internal space through the slide groove; a pull-out piece is provided on one side of the material storage frame along the sliding direction, and the pull-out piece cooperates with the slide groove to move the material storage mechanism out of or into the internal space.

[0014] Optionally, in the dividing device, the fixed plate has a plurality of connecting holes centered on the rotation axis of the dividing block and along the circumferential direction of the rotation of the dividing block; during the rotation of the dividing block, the discharge port of the second channel is sequentially connected to the plurality of connecting holes.

[0015] Optionally, in the material distributing device, an adsorption member is provided on the contact surface where the material storage rack and the side plate are in sliding contact.

[0016] Optionally, the material distributing device further includes a driving component, which is disposed on the fixed plate and is used to drive the material distributing block to rotate.

[0017] The utility model provides a material dividing device, which arranges a rotatable material dividing block on a support frame, and a plurality of circumferentially arranged storage boxes are provided under the material dividing block. The rotating material dividing block selects and divides the tested chips located in the material dividing block into corresponding storage boxes. The structure is simple and occupies a small space, and the rapid packaging of chips is realized. At the same time, a horizontal channel is arranged in the material dividing block, so that the chips stay in the horizontal channel for a short time. After the material dividing block is rotated to the corresponding position, the blowing nozzle above the material dividing block is cooperated to blow the chips in the horizontal channel out of the material dividing block to the corresponding storage box. By setting the horizontal channel, the chip clamping claw releases the chip into the material dividing block when reaching the material dividing mechanism, and then returns to clamp the next chip. There is no need to wait until the system identifies and selects the corresponding storage box before releasing the chip, which effectively saves time and improves work efficiency, and solves the problems of low semiconductor production efficiency and high cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a disassembled material storage mechanism of a material distributing device provided in this embodiment;

[0019] Figure 2 A schematic diagram of the structure of the material storage mechanism of the material distribution device provided in this embodiment in the installed state;

[0020] Figure 3 A schematic diagram of a cross section of a material block provided in this embodiment.

[0021] The symbols in the figure are described as follows:

[0022] 10-support frame; 20-material distribution mechanism; 30-material storage mechanism;

[0023] 11-fixed plate; 12-bottom plate; 13-side plate; 31-storage rack; 32-storage box; 311-adsorption piece; 33-proximity sensor; 21-dividing block; 22-blowing assembly; 222-blowing nozzle; 223-rotating shaft; 23-grading channel; 231-first channel; 232-horizontal channel; 233-second channel; 24-conveying pipe; 401-fixed seat; 402-opposite optical fiber sensor; 50-driving assembly. DETAILED DESCRIPTION

[0024] The chip processing equipment and chip processing method proposed in the present invention are further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the accompanying drawings is often a part of the actual structure. In particular, the emphasis that each drawing needs to show is different, and sometimes different proportions are used.

[0025] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of the present invention are used to distinguish similar objects in order to describe the embodiments of the present invention, rather than to describe a specific order or sequence. It should be understood that the structures used in this way can be interchanged under appropriate circumstances. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] The present embodiment provides a material distribution device, comprising a support frame 10; a material distribution mechanism 20 disposed on the support frame 10 and a material storage mechanism 30 disposed below the material distribution mechanism 20, wherein the material storage mechanism 30 comprises a material storage frame 31 and a plurality of material storage boxes 32 disposed on the material storage frame 31, and the material distribution mechanism 20 comprises a material distribution block 21 rotatably disposed on the support frame 10 and a blowing component 22 disposed above the material distribution block 21.

[0027] The dividing block 21 has a vertically conducting grading channel 23 , and the grading channel 23 includes a first channel 231 , a horizontal channel 232 , and a second channel 233 that are connected in sequence. The dividing block 21 can be selectively rotated to connect the second channel 233 to any of the storage boxes 32 .

[0028] The above-mentioned material dividing device is provided with a material dividing mechanism 20 on a support frame 10 and a material storage mechanism 30 below the material dividing mechanism 20, and a plurality of material storage boxes 32 are provided on a material storage rack 31 of the material storage mechanism 30, which respectively receive different categories of chips that have been inspected and classified in the material dividing mechanism 20.

[0029] The material distribution mechanism 20 includes a material distribution block 21 rotatably arranged on the support frame 10 and a blowing assembly 22 located above the material distribution block 21. A vertically conductive grading channel 23 is arranged inside the material distribution block 21. By providing a horizontal channel 231 in the grading channel 23, when the chip enters the grading channel 23 in the material distribution block 21, the chip automatically stays in the horizontal channel 232, so that the chip stays briefly in the material distribution block 21. During this period, the material distribution block 21 is rotated to select the corresponding storage box 32 to be connected, and the air is blown into the grading channel 23 through the upper blowing assembly 22, so that the chip is blown into the corresponding storage box 21. The overall structure is simple, and by setting a rotatable material distribution block 21, the chip classification and packaging can be quickly realized; at the same time, before the chip is packaged into the storage box 32, it stays briefly in the material distribution block 21, and the category and state of the chip can be identified again, so that the chip is blown into the corresponding storage box again, which improves the accuracy of classification while simplifying the operation.

[0030] like Figure 1 As shown, as a specific implementation of the dividing device provided in this embodiment, the dividing device includes a support frame 10, a dividing mechanism 20 arranged on the support frame 10 and a storage mechanism 30 arranged below the dividing mechanism 20, the dividing mechanism 10 includes a dividing block 21 rotatably arranged on the support frame 10 and a blowing assembly 22 arranged above the dividing block 21, the dividing block 21 has a vertically conductive grading channel 23, the grading channel 23 includes a first channel 231, a horizontal channel 232 and a second channel 233 that are connected in sequence, after the chip enters the grading channel 23 of the dividing block 21, it passes through the first channel 231, the horizontal channel 232 and the second channel 233 in sequence, and finally separates from the dividing block 21 from the second channel 233.

[0031] Further, such as Figure 3 As shown, the first channel 231 and the second channel 233 are arranged to be tilted downward in the same direction, that is, the grading channel 23 is arranged in a stepped manner as a whole, so that after the chip is placed in the dividing block 21, the chip can automatically slide downward along the first channel 231, slide to the horizontal channel 233 and stop, and stay in the horizontal channel 232. At this time, the dividing block 21 is rotated by a certain angle according to the preset program, so that the discharge port of the second channel 233 is connected with the corresponding storage box 32, and the blowing component 22 blows air into the grading channel 23, so that the chip, under the impetus of the airflow, slides a short distance along the horizontal channel 232 and slides to the second channel 233, and continues to slide downward along the second channel 233 until it slides out of the dividing block 21 and finally enters the corresponding storage box 32.

[0032] Specifically, in the present embodiment, the support frame 10 includes a fixed plate 11 supporting the dividing block 21, and the dividing block 21 is arranged in a rectangular parallelepiped shape and placed on the fixed plate 11, and rotates with the vertical line direction at the feed port of the first channel 231 as the rotation axis of the dividing block 21. Since the grading channel 23 is arranged in a stepped manner, the entire grading channel 23 occupies the lateral space of the dividing block 21 in the transverse tangential direction, that is, the feed port of the first channel 231 is located above one end of the dividing block 21, and the discharge port of the second channel 233 is located below the other end of the dividing block 21, and the discharge port points to the fixed plate 11 and contacts the fixed plate 11. When the dividing block 21 rotates with its rotating shaft, the grading channel 23 performs a circular motion with the dividing block 21 around the central axis of the dividing block 21, so that the discharge port of the second channel 233 performs a circumferential motion to select the corresponding storage box 32 for communication.

[0033] like Figure 1 As shown, in this embodiment, the fixing plate 11 is provided with a plurality of connecting holes, and the plurality of connecting holes are arranged circumferentially with respect to the rotating shaft. When the material dividing plate 21 rotates along its axis, the discharge port of the second channel 233 will sequentially pass through the plurality of connecting holes. The second channel 233 selects to connect to different connecting holes, so that the chips staying in the horizontal channel 232 pass through different connecting holes and finally fall into different storage boxes 32.

[0034] Furthermore, the plurality of storage boxes 32 are arranged in a cylindrical array with the rotation axis of the dividing block 21 as the center and along the circumferential direction of the dividing block 21; the plurality of storage boxes 32 are respectively used to store chips of different categories. The arrangement of the storage boxes 32 is consistent with the circumferential direction of the dividing block 21. During the rotation of the dividing block 21, the corresponding storage box 32 below can be aligned by directly rotating, so as to realize the rapid classification and storage of chips.

[0035] Specifically, the plurality of storage boxes 32 are respectively connected with the delivery pipe 14, and the plurality of storage boxes 32 are respectively connected to the corresponding communication holes on the fixed plate 11 through their respective delivery pipes 14. When the dividing block 21 rotates to the top of the corresponding storage box 32, the blowing assembly 22 blows the chip located in the dividing block 21 out of the dividing block 21, and the chip enters the delivery pipe 14 through the communication hole and slides into the storage box 32. That is to say, the plurality of storage boxes 32, the plurality of delivery pipes 14 and the plurality of communication holes correspond one to one in the vertical direction. In other embodiments, the storage box 32 is directly connected to the communication hole, and after the corresponding storage box 32 is selected by rotating the dividing block 21, it directly slides into the storage box 32 through the communication hole.

[0036] like Figure 1-2 As shown, the blowing assembly 22 includes a blowing nozzle 222 and a rotating shaft 223; one end of the blowing nozzle 222 is connected to the rotating shaft 223, and the other end extends to the top of the dividing block 21 and the air outlet of the blowing nozzle 222 opens downward. When the blowing nozzle 222 moves to the dividing block 21, the air outlet of the blowing nozzle 222 faces the first channel 231.

[0037] The blowing nozzle 222 is driven to rotate by the rotating shaft 223, so that the air outlet of the blowing nozzle 222 slides through the upper surface of the dividing block 21 and can be accurately docked with the first channel 231; after the air outlet of the blowing nozzle 22 is docked with the first channel 231, air is blown into the first channel 231, and the chip located in the horizontal channel 232 is pushed forward by the airflow and finally slides into the storage box 32.

[0038] Preferably, the rotating shaft 223 is a universal shaft, and the blowing nozzle 222 can be rotated in various directions in cooperation with the dividing block 21 through the universal shaft.

[0039] Before the chip needs to enter the material distribution block 21 for packaging, the blowing nozzle 222 is not located above the material distribution block 21. After the robot grips the chip and moves it to the material distribution device and releases the chip to enter the classification channel 23, the material distribution block 21 is rotated to connect to the corresponding material storage box 21, and the blowing nozzle 222 is controlled to move above the first channel 231 to blow air into the classification channel. After the blowing is completed, it is controlled to move away from the first channel to provide a channel for the next chip to be released.

[0040] Preferably, the outlet area of ​​the air outlet of the blowing nozzle 222 matches the area of ​​the inlet of the first channel 231. When the blowing nozzle 222 rotates to the top of the first channel 231, the size of the blowing nozzle opening can just cover the inlet opening of the first channel 231. In this way, the maximum utilization rate of the gas can be guaranteed when blowing air into the first channel 231, and no excess gas will be generated to affect other processes. Of course, in other embodiments, the blowing nozzle 222 and the first channel 231 do not need to be tightly connected, and the area of ​​the air outlet does not need to be equal to the area of ​​the inlet. The blowing nozzle 222 can generate an airflow that pushes the chip in the horizontal channel 232 to move to the second channel 233.

[0041] Further, the support frame 10 also includes a bottom plate 12, and a slide groove is provided on the bottom plate 12. The storage mechanism 30 is detachably connected to the support frame 10 through the slide groove. The storage frame 31 and the storage box 32 can be separated from the support frame 10, and multiple storage boxes 32 can be detachably arranged on the storage frame 31. Preferably, a drawer 312 is provided on the storage frame 31 along the side of the slide groove sliding outward, so that the user can pull out the storage box 32 loaded with chips, replace the storage box 32 of the storage mechanism 30, and then put the new storage box 32 into the storage frame 31, and push the drawer 312 to place the storage frame 31 and the replaced storage box 32 along the slide groove under the material distribution mechanism 20, waiting for the subsequent chip distribution.

[0042] The control system of the material distribution device counts the number of placed chips and calculates whether the chips in the storage box 32 are full according to the volume of the storage box 32. If it is detected that the chips in any storage box 32 are full, the system will issue a reminder to remind the staff to replace them in time.

[0043] Further, such as Figure 2 As shown, the support frame 10 also includes a side plate 13, and the side plate 13 encloses the fixed plate 11 and the bottom plate 12 to form an internal space. The material distribution mechanism 20 is arranged on the upper fixed plate, and the storage mechanism 30 is movably and disassembled in the internal space through the slide groove on the bottom plate. The contact surface of the storage frame 31 and the support frame 10 is provided with an adsorption member 311. When the storage mechanism 30 is placed on the support frame 10, the adsorption member 311 will generate a certain suction force between the storage mechanism 30 and the side plate 13 to avoid the displacement of the storage mechanism 30 during the working process, resulting in the misalignment between the conveying pipe 14 and the storage box 32, so that the chip cannot fall accurately into the storage box 32, thereby affecting the processing efficiency. At the same time, by arranging an adsorption member between the side plate 13 and the storage mechanism 30, a certain suction force is generated when the storage mechanism 30 is re-placed, so as to realize the rapid docking installation of the storage mechanism 30.

[0044] Specifically, in this embodiment, the adsorption member 311 is disposed on the material storage rack 31, and the adsorption member is a magnet.

[0045] Furthermore, the material dividing device also includes a proximity sensor 33, which is located on the support frame 10 and is arranged close to the material storage mechanism 30. When the material storage mechanism 30 is installed close to the support frame 10, the proximity sensor 33 receives the position signal of the material storage mechanism 30, and determines that the material storage mechanism 30 has been completed installed in the material dividing device at this time, so as to perform corresponding material dividing work; if the proximity sensor 33 does not detect the signal, it means that the material storage mechanism 30 has not been installed properly, then the material dividing device is controlled to suspend operation and sound an alarm to remind the staff to check the material storage mechanism 30, and the material dividing device restarts operation after the material storage mechanism 30 is installed in place.

[0046] Furthermore, the material dividing device further comprises a detection component, which is arranged on the fixed plate 11 and is used to detect whether there is material to be divided in the material dividing block 21. The detection component is arranged close to the material dividing block 21, and when the clamping jaws clamp the chip and move it to the top of the material dividing block 21 and put the chip into the feed port, the detection component 21 recognizes the material signal, thereby triggering the material dividing block 21 to selectively rotate, and triggering the blowing component 22 to rotate and move to the top of the material dividing block 21 to connect with the first channel 231.

[0047] After the blowing nozzle 222 blows the chip out of the dividing block 21 through the grading channel, the servo controls the blowing nozzle 222 to move away from the top of the first channel 231, so that the feed port of the first channel 231 is exposed, so that the next chip that has completed inspection can enter the dividing block from the feed port of the first channel 231 for classification and storage.

[0048] In this embodiment, the detection component includes a fixing seat 401 and a through-beam optical fiber sensor 402 . The through-beam optical fiber sensor 402 is disposed on the fixing seat 401 , and the fixing seat 401 is fixed on the fixing plate 11 .

[0049] Specifically, the fixing base 401 is divided into two groups and is respectively arranged on both sides of the inlet of the material dividing block 21. The two groups of fixing bases 401 are respectively provided with opposite-beam optical fiber sensors 402, and the emission ports of the opposite-beam optical fiber sensors 402 are arranged opposite to each other. The light emitted by the two groups of opposite-beam optical fiber sensors 402 passes above the inlet of the first channel 231. When the chip is clamped and moved above the material dividing block 21, the chip passes through the light emitted by the opposite-beam optical fiber sensors 402 above the first channel 231, and the opposite-beam optical fiber sensors 402 detect the arrival of the material, and transmit the chip arrival information to the control system, thereby triggering the material dividing block 21 and the blowing nozzle to perform corresponding actions.

[0050] Furthermore, the detection component also includes a fiber optic amplifier, which is arranged on the support frame 10 to amplify the fiber optic signal detected by the opposing fiber optic sensor 402 and accurately identify the arrival of the chip.

[0051] Furthermore, the material distribution device further includes a driving assembly 50, and the driving assembly 50 is used to drive the material distribution block 21 to rotate to a certain angle. In this embodiment, the driving assembly 50 is arranged below the fixed plate 11 and located in the middle of the plurality of circumferentially arranged conveying pipes 14, which effectively saves occupied space and does not affect the disassembly and replacement of the storage mechanism 30.

[0052] When the detected chip moves to the top of the dividing block 21, the reflected optical fiber sensor 402 detects the material presence signal and transmits the signal to the system. At this time, the chip will be released into the horizontal channel 232 of the dividing block 21; the control system drives the driving component 50 to drive the dividing block 21 to rotate a certain angle to connect to the top of the corresponding storage box 32 according to the sorting information, triggering the blowing nozzle 222 to move to the top of the first channel 231 to blow air into the grading channel, and the chip slides out of the dividing block 21 along the second channel 233 with the air flow and finally falls into the corresponding storage box 32, completing the chip packaging; after the blowing nozzle 222 completes blowing, the blowing nozzle 222 is driven back to the initial position and moves again when the next chip is packaged.

[0053] According to a material dividing device provided by the utility model, there are the following beneficial effects:

[0054] 1. The overall structure is simple, occupies a small space and can realize the rapid packaging of chips;

[0055] 2. By setting a horizontal channel in the dividing block, the chip can stay in the horizontal channel for a short time while identifying and selecting the corresponding storage box for rotation. During this period, the normal operation of the previous process is not affected. That is, after the robot gripper drops the chip into the dividing block, it can return to perform other operations. There is no need to wait until the identification and selection of the corresponding category of storage box is completed before releasing the chip, which effectively improves the processing efficiency.

[0056] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other. In addition, the different parts between the various embodiments can also be used in combination with each other, and the present invention is not limited to this.

[0057] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A material distribution device, characterized in that: include Support frame; A material distribution mechanism is arranged on the support frame and a material storage mechanism is arranged below the material distribution mechanism, the material storage mechanism includes a material storage frame and a plurality of material storage boxes arranged on the material storage frame, the material distribution mechanism includes a material distribution block rotatably arranged on the support frame and a blowing component located above the material distribution block, The material distribution block has a vertically conductive grading channel, and the grading channel includes a first channel, a horizontal channel and a second channel that are connected in sequence. The material distribution block can be selectively rotated to connect the second channel to any of the storage boxes.

2. The material distribution device according to claim 1, characterized in that: The blowing assembly includes a blowing nozzle and a rotating shaft, one end of the blowing nozzle is rotatably connected to the rotating shaft, and the other end leads to the top of the dividing block; the air outlet of the blowing nozzle is set downward, and when the blowing nozzle rotates to above the first channel, the air outlet of the blowing nozzle is aligned with the inlet of the first channel.

3. The material distribution device according to claim 1, characterized in that: The grading channels are arranged in a stepped manner.

4. The material distribution device according to claim 1, characterized in that: The plurality of material storage boxes are arranged in a cylindrical array with the rotation axis of the material distribution block as the center and along the circumferential direction of rotation of the material distribution block.

5. The material distribution device according to claim 1, characterized in that: The support frame is provided with a detection component, and the detection component is used to detect the material signal.

6. The material distribution device according to claim 5, characterized in that: The detection component is a counter-fiber sensor, and two groups of the counter-fiber sensors are arranged on both sides of the material distribution block. The light emitted by the two groups of the counter-fiber sensors passes above the first channel inlet.

7. The material distribution device according to claim 1, characterized in that: The support frame includes a fixed plate supporting the material distribution mechanism at the top, a bottom plate supporting the material storage mechanism at the bottom, and side plates supporting and connecting the fixed plate and the bottom plate, the side plates enclosing the fixed plate and the bottom plate to form an internal space; a slide groove is provided on the bottom plate, and the material storage mechanism is movably and disassembled in the internal space through the slide groove; a drawer is provided on one side of the material storage frame along the sliding direction, and the drawer cooperates with the slide groove to move the material storage mechanism out of or into the internal space.

8. The material distribution device according to claim 7, characterized in that: The fixed plate is provided with a plurality of connecting holes centered on the rotation axis of the dividing block and along the circumferential direction of the dividing block; during the rotation of the dividing block, the discharge port of the second channel is connected with the plurality of connecting holes in sequence.

9. The material distribution device according to claim 7, characterized in that: A suction piece is provided on the contact surface where the material storage rack and the side plate are slidably mounted and abutted.

10. The material distribution device according to claim 7, characterized in that: Also includes A driving assembly is arranged on the fixing plate, and is used for driving the dividing block to rotate.

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