Semiconductor material production polishing device

Abstract

The utility model discloses a polishing device for semiconductor material production, which relates to the technical field of polishing equipment, and is characterized in that a clamping mechanism comprises a motor, the mounting end of the motor is mounted on the inner wall of a workbench, the output end of the motor is connected with a turntable, one side of the turntable is connected with one side of a shell, and the shell is connected with the workbench. The inner wall of the shell is connected with a plurality of groups of sliding rails, and the sliding rails are internally connected with moving rods in a sliding manner, so that the motor can be controlled to drive the turntable to rotate, drive the connecting pieces in the sliding grooves to slide and drive the moving rods to move, and the moving rods can only slide in the directions of the sliding rails under the limitation of the sliding rails; the clamp can clamp semiconductor materials with different diameters, so that the problem that when the diameter of the ground semiconductor material is smaller than that of a slide glass ring, the semiconductor material shakes in the grinding process, and consequently the device can only grind the semiconductor material with the diameter identical to that of the slide glass ring is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding equipment, and more specifically, to a semiconductor material production grinding device. Background Art

[0002] A semiconductor is a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. The electrical conductivity of a semiconductor is mainly determined by the number of electrons and holes between its valence band and conduction band. When electrons gain energy from the valence band and jump to the conduction band, they can move freely between the bands and conduct electricity. The energy gap of a general semiconductor is about 1 to 3 electron volts.

[0003] In the manufacturing process of silicon wafers, polycrystalline silicon needs to be melted, and then single-crystalline silicon ingots are slowly pulled out using silicon seed crystals, and then single-crystalline silicon wafers are obtained after slicing, grinding, and polishing. The grinding and polishing in this process is to improve the flatness and smoothness of the silicon wafer, making it better suitable for subsequent integrated circuit manufacturing.

[0004] According to publication number CN219485253U, a grinding device for semiconductor material production is disclosed, which fixes multiple circular semiconductor materials by setting four carrier circles on the surface of a circular table, cooperates with the grinding assembly, and uses a rotating motor to drive the central gear to rotate. At this time, the sub-gear rotates accordingly, driving four grinding discs to grind the semiconductor materials in the four carrier circles at the same time, thereby improving the grinding efficiency.

[0005] However, the device does not have a clamping device in the wafer carrier ring. When the diameter of the semiconductor material to be polished is smaller than the diameter of the wafer carrier ring, the semiconductor material will shake during the polishing process, resulting in a decrease in the polishing quality or even failure to polish. As a result, the device can only polish semiconductor materials with the same diameter as the wafer carrier ring, which greatly reduces the practicability of the device.

[0006] Therefore, in order to solve the above technical problems, the present application proposes a semiconductor material production polishing device. Utility Model Content

[0007] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a semiconductor material production polishing device.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor material production and polishing device comprises a workbench with multiple groups of openings on the top and a hollow interior, wherein the outer surfaces of the multiple groups of openings on the top of the workbench are connected to the hollow interior shell;

[0009] A clamping mechanism, disposed inside the housing, for clamping the semiconductor material to be polished;

[0010] An adjusting mechanism, disposed inside the housing, for adjusting the height of the semiconductor material;

[0011] The clamping mechanism includes a motor, wherein the motor mounting end is mounted on the inner wall of the workbench, the motor output end is connected to a turntable, one side of the turntable is connected to one side of a shell, the inner wall of the shell is connected to a plurality of sliding rails, the sliding rails are slidably connected to a moving rod, one end of the moving rod passes through the sliding rail to connect to a clamp, and the other end of the moving rod is connected to a connecting piece, a plurality of crescent-shaped sliding grooves are formed on one side of the turntable, and the outer surface of the connecting piece slides in the sliding groove, so as to clamp semiconductor materials of different diameters.

[0012] Preferably, one end of the connecting member is connected to a limiting block to limit the movement of the connecting member and prevent the connecting member from falling out of the sliding groove.

[0013] Preferably, a through hole is formed through the other side of the shell to facilitate the clamping mechanism to drive the clamp to move.

[0014] Preferably, the adjustment mechanism includes a hydraulic telescopic rod, the mounting end of the hydraulic telescopic rod is connected to a turntable, and the outer surface of the clamp is provided with scale lines. When the thicknesses of multiple groups of semiconductor materials to be polished simultaneously are different, the height of the hydraulic telescopic rod can be adjusted according to the scale lines so that the processing surfaces of the semiconductor materials to be processed are in the same plane.

[0015] Preferably, one side of the workbench is connected to a mounting seat, and one side of the mounting seat is connected to a grinding device.

[0016] Preferably, one end of the grinding device is connected to multiple groups of grinding heads, and the grinding device drives the multiple groups of grinding heads to work at the same time, thereby increasing the working efficiency of the grinding device.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] 1. By setting up a clamping mechanism, the turntable can be driven to rotate by controlling the motor, the connecting piece in the sliding groove can be driven to slide, and the moving rod can be driven to move. Under the limit of the sliding track, the moving rod can only slide in the direction of the sliding track, so that the clamp can clamp semiconductor materials of different diameters, thereby solving the problem that when the diameter of the semiconductor material to be polished is smaller than the diameter of the wafer carrier circle, the semiconductor material will shake during the polishing process, resulting in a decrease in the polishing quality or even failure to polish, resulting in the device being able to polish only semiconductor materials with the same diameter as the wafer carrier circle.

[0019] 2. By setting the adjustment mechanism, the height of the hydraulic telescopic rod can be adjusted according to the value of the scale line, so that the processing surface of the semiconductor material to be processed is in a plane, which is convenient for multiple groups of grinding heads to grind the semiconductor material at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the structure of the through hole in the utility model;

[0023] Figure 3 It is a structural schematic diagram of the sliding groove in the utility model;

[0024] Figure 4 It is a structural schematic diagram of the sliding track in the utility model;

[0025] Figure 5 It is a structural schematic diagram of the hydraulic telescopic rod in the utility model;

[0026] Figure 6 It is a structural schematic diagram of the scale line in the utility model;

[0027] 1. Grinding equipment; 2. Mounting seat; 3. Shell; 4. Workbench; 5. Grinding head; 6. Through hole; 7. Turntable; 8. Motor; 9. Limit block; 10. Sliding groove; 11. Sliding track; 12. Connector; 13. Moving rod; 14. Clamp; 15. Hydraulic telescopic rod; 16. Scale line. DETAILED DESCRIPTION

[0028] like Figure 1 - Figure 6 As shown, the utility model provides a semiconductor material production and polishing device, including a workbench 4 with multiple groups of openings on the top and a hollow interior, wherein the outer surfaces of the multiple groups of openings on the top of the workbench 4 are connected to a shell 3 with a hollow interior;

[0029] A clamping mechanism, disposed inside the housing 3, for clamping the semiconductor material to be polished;

[0030] An adjusting mechanism, disposed inside the housing 3, for adjusting the height of the semiconductor material;

[0031] The clamping mechanism includes a motor 8, the mounting end of the motor 8 is mounted on the inner wall of the workbench 4, the output end of the motor 8 is connected to the turntable 7, one side of the turntable 7 is connected to one side of the housing 3, the inner wall of the housing 3 is connected to multiple sets of sliding rails 11, the sliding rails 11 are slidably connected to a moving rod 13, one end of the moving rod 13 penetrates the sliding rail 11 and is connected to a clamp 14, and the other end of the moving rod 13 is connected to a connecting piece 12, and multiple sets of crescent-shaped sliding grooves 10 are penetrated and provided on one side of the turntable 7, and the outer surface of the connecting piece 12 slides in the sliding groove 10;

[0032] The adjustment mechanism includes a hydraulic telescopic rod 15, the mounting end of the hydraulic telescopic rod 15 is connected to the turntable 7, and the outer surface of the clamp 14 is provided with a scale line 16;

[0033] One end of the connecting member 12 is connected to the limiting block 9;

[0034] One side of the workbench 4 is connected to the mounting seat 2, and one side of the mounting seat 2 is connected to the grinding device 1;

[0035] One end of the grinding device 1 is connected to multiple groups of grinding heads 5;

[0036] A through hole 6 is formed on the other side of the housing 3;

[0037] The semiconductor material to be polished is placed on the top of the hydraulic telescopic rod 15, and the height of the hydraulic telescopic rod 15 is adjusted according to the value on the scale line 16, so that the processing surface of the semiconductor material to be processed is in a plane, so that multiple groups of polishing heads 5 can polish semiconductor materials of different thicknesses at the same time, and then the turntable 7 is driven to rotate by controlling the motor 8, and the connecting piece 12 in the sliding groove 10 is driven to slide, and the moving rod 13 is driven to move. Under the limitation of the sliding track 11, the moving rod 13 can only slide in the direction of the sliding track 11, so that the clamp 14 can clamp semiconductor materials of different diameters to prevent the semiconductor material from shaking during the polishing process, and then the polishing equipment 1 is controlled to polish the semiconductor material through the polishing head 5.

[0038] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor material production polishing device, characterized in that: It comprises a workbench (4) with a plurality of groups of openings on the top and a hollow interior, wherein the outer surfaces of the plurality of groups of top openings of the workbench (4) are connected to a shell (3) with a hollow interior; A clamping mechanism, arranged inside the housing (3), and used for clamping the semiconductor material to be polished; An adjustment mechanism, arranged inside the housing (3) and used for adjusting the height of the semiconductor material; The clamping mechanism comprises a motor (8), the mounting end of the motor (8) is mounted on the inner wall of the workbench (4), the output end of the motor (8) is connected to a turntable (7), one side of the turntable (7) is connected to one side of a shell (3), the inner wall of the shell (3) is connected to a plurality of sets of sliding rails (11), a moving rod (13) is slidably connected inside the sliding rail (11), one end of the moving rod (13) passes through the sliding rail (11) and is connected to a clamp (14), the other end of the moving rod (13) is connected to a connecting piece (12), a plurality of sets of crescent-shaped sliding grooves (10) are penetrated through one side of the turntable (7), and the outer surface of the connecting piece (12) slides in the sliding groove (10).

2. A semiconductor material production and polishing device according to claim 1, characterized in that: One end of the connecting piece (12) is connected to the limiting block (9).

3. A semiconductor material production and polishing device according to claim 2, characterized in that: A through hole (6) is formed through the other side of the housing (3).

4. A semiconductor material production and polishing device according to claim 3, characterized in that: The adjustment mechanism comprises a hydraulic telescopic rod (15), the mounting end of the hydraulic telescopic rod (15) is connected to the turntable (7), and the outer surface of the clamp (14) is provided with scale lines (16).

5. A semiconductor material production and polishing device according to claim 4, characterized in that: One side of the workbench (4) is connected to the mounting seat (2), and one side of the mounting seat (2) is connected to the grinding equipment (1).

6. A semiconductor material production and polishing device according to claim 5, characterized in that: One end of the grinding device (1) is connected to a plurality of groups of grinding heads (5).

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