Cutting structure for chip plastic packaging machine
By designing the cutting structure for the chip plastic sealing machine, using moving components and dust hoods for automated cleaning, and combining telescopic components and return springs to prevent damage to chip products, the problem of chip contamination and chip contamination during the cutting process in the existing technology has been solved. The problem of product damage is eliminated, and an efficient and automated production process is realized.
Patent Information
- Application Number
- CN202420287917.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-07
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-02-07
AI Technical Summary
During the cutting process, existing chip plastic sealing machines can easily cause chips to fall into the mold, which will not blow cleanly and blow everywhere, affecting product quality, and at the same time, it can easily crush the chip product and cause adhesions, affecting subsequent processes.
A cutting structure including an upper support frame, a lower support frame, an upper mold pressure plate and a lower mold pad is designed. It uses mobile components and vacuum hoods for automatic cleaning, and combines telescopic components and return springs to prevent chip products from being crushed and damaged. Adhesions.
It realizes automated cleaning, avoids scrap contamination and chip product damage, improves product quality and production efficiency, and meets the needs of automated production.
Smart Images
Figure CN222371763U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip plastic packaging, in particular to a cutting structure used for a chip plastic packaging machine. Background Art
[0002] A chip is a miniature electronic device or component that uses a certain process to interconnect the transistors, diodes, resistors, capacitors, inductors and other components and wiring required in a circuit, and is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates. It is then packaged in a tube shell to become a miniature structure with the required circuit function. When the chip is plastic-sealed, there is usually some excess resin around the chip product, so the cutting structure needs to be removed to remove the excess resin.
[0003] In the prior art, after cutting, material scraps on the product will fall into the mold, and they are mostly cleaned by blowing. However, it is easy for the scraps to be blown everywhere instead of cleanly, thus affecting the product quality. At the same time, the chip product is easily crushed and damaged during the cutting process, and the cutter is easy to stick the cut chip product out, affecting the next step of chip processing. Utility Model Content
[0004] The purpose of the utility model is to provide a cutting structure for a chip plastic packaging machine to solve the problems raised in the above background technology.
[0005] The cam is secured to the upper and lower surfaces of the mold and is adapted to engage the mold by pushing the mold upwards and downwards.
[0006] As a further improvement of the above scheme, the moving assembly includes a metal slide rail, a rack, a traveling gear and a moving frame. A pair of the metal slide rails are fixedly mounted on the outer side wall of the vertical frame, and the moving frame is slidably mounted on the pair of metal slide rails. A traveling motor is installed on the moving frame. The traveling gear is fixed to the output end of the traveling motor, and the traveling gear is meshingly connected with the rack.
[0007] As a further improvement of the above scheme, the mobile component also includes a supporting frame, which is fixedly installed on the outer end of the mobile frame. A second cylinder is also fixed to the outer side wall of the mobile frame, and an electric clamp is fixed to the telescopic end of the second cylinder; the dust hood is also fixed to the front end of the supporting frame, and a pair of dust baffles are also provided at the bottom dust suction port of the dust hood.
[0008] As a further improvement of the above scheme, the telescopic assembly includes a telescopic rod, a cylinder and a limiting cap. The telescopic rod is sleeved inside the cylinder, and the top end of the telescopic rod is fixed to the limiting cap, and the bottom end of the telescopic rod is fixed to the upper surface of the upper mold stripping plate.
[0009] As a further improvement to the above solution, circular holes are provided at four corners of the lower surface of the upper mold clamping plate, and the cylinder is fixedly mounted on the inner wall of the circular hole.
[0010] As a further improvement to the above solution, a rectangular hole is opened at the center of the upper surface of the upper mold stripping plate, and the rectangular hole is located directly below the cutter, and the length of the rectangular hole is greater than the length of the cutter.
[0011] As a further improvement to the above scheme, a resin waste outlet hole is opened at the center of the upper surface of the lower mold pad, and the resin waste outlet hole is arranged between a pair of lower mold bases, and the bottom end of the resin waste outlet hole is connected to a resin waste collecting bucket.
[0012] As a further improvement to the above scheme, a pair of linear bearings are also installed on the upper pressure plate of the mold, and a cylindrical shaft is sleeved inside each of the linear bearings, and the bottom ends of the pair of cylindrical shafts are fixed to the upper end of the lower mold pad.
[0013] As a further improvement to the above solution, a pair of upper limit rods are fixed to the lower surface of the upper pressing plate of the mold, and the pair of upper limit rods are respectively arranged on the left and right sides of the upper mold clamping plate.
[0014] As a further improvement to the above scheme, a pair of lower limit rods are fixed to the upper surface of the lower mold pad, and the lower limit rods and the upper limit rods are arranged one by one and opposite to each other up and down, and buffer rubber pads are bonded to the upper surfaces of the pair of lower limit rods.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] 1. In the utility model, a vertical frame is fixed to the upper surface of the lower support frame, a movable component is installed on the vertical frame, and a dust hood is installed on the movable component. The dust hood can be flexibly driven to move forward and backward by controlling the movable component. When the cutting is completed, the dust hood can be automatically moved to the top of the lower mold base, and the mold surface can be vacuumed and cleaned; in addition, the dust hood can be automatically moved out in advance during the cutting process, and will not hinder subsequent cutting work; in summary, the utility model can meet the needs of automated production and bring better economic benefits to the enterprise.
[0017] 2. In the utility model, a cutter is fixed on the lower surface of the upper mold clamping plate, and the upper mold stripping plates are installed on the four corners of the lower surface of the upper mold clamping plate through telescopic components. A number of reset springs are also fixed between the upper surface of the upper mold stripping plate and the lower surface of the upper mold clamping plate. The combination of the telescopic component and the reset spring can not only utilize the upper mold stripping plate to elastically press the chip product, thereby avoiding crushing and damaging the chip product, but also further prevent the cutter from sticking and carrying out the cut chip product, ensuring that the chip product is still located on the upper surface of the lower mold seat after cutting, thereby facilitating the subsequent clamping and delivery. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model from a first viewing angle;
[0020] Figure 2 This is a schematic diagram of the third perspective structure of the utility model;
[0021] Figure 3 It is a structural schematic diagram of a partial component in the utility model;
[0022] Figure 4 For this utility model Figure 3 Schematic diagram of the three-dimensional structure after the middle and lower mold bases are removed;
[0023] Figure 5 It is a schematic diagram of the assembly of the upper mold pressing plate, the upper mold clamping plate and the upper mold stripping plate in the utility model;
[0024] Figure 6 For this utility model Figure 5 Schematic diagram of the structure after the middle and upper molds are removed;
[0025] Figure 7 For this utility model Figure 6 Schematic diagram of the structure after the middle telescopic component is removed;
[0026] Figure 8 It is a three-dimensional structural schematic diagram of the telescopic component in the utility model;
[0027] Fig. 9 It is a schematic diagram of the structure of the neutral frame, the movable assembly and the dust cover of the utility model from the first perspective;
[0028] Fig.10 This is a schematic structural diagram of the neutral frame, movable assembly and dust hood from a second viewing angle of the present invention.
[0029] In the figure: 1-upper support frame; 2-lower support frame; 3-mold upper pressure plate; 4-lower mold pad; 5-support column; 6-telescopic assembly; 601-telescopic rod; 602-cylinder; 603-limiting cap; 7-first cylinder; 8-moving assembly; 801-metal slide rail; 802-rack; 803-travel gear; 804-moving frame; 805-travel motor; 806-carrying frame; 807-second cylinder; 808-electric clamp; 9-upper mold clamp; 10-cutter; 11-upper mold stripping plate; 12-reset spring; 13-lower mold base; 14-stand; 15-dust hood; 16-round hole; 17-rectangular hole; 18-resin waste outlet hole; 19-linear bearing; 20-cylindrical shaft; 21-resin waste collection bucket; 22-upper limit rod; 23-lower limit rod. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] A cutting structure for a chip laminating machine, such as Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6The figure shows that it includes an upper support frame 1, a lower support frame 2, a mold upper pressure plate 3 and a lower mold pad 4, two groups of support columns 5 are fixedly installed between the upper support frame 1 and the lower support frame 2, a first cylinder 7 is fixed on the upper surface of the upper support frame 1, the telescopic rod of the first cylinder 7 passes through the upper support frame 1 and is fixed to the upper surface of the mold upper pressure plate 3, and the first cylinder 7 can drive the mold upper pressure plate 3 to move up and down after being started; the lower surface of the mold upper pressure plate 3 is integrally connected with the upper mold clamping plate 9, and a cutter 10 is fixed on the lower surface of the upper mold clamping plate 9, and an upper mold stripping plate 11 is installed at the four corners of the lower surface of the upper mold clamping plate 9 through a telescopic component 6, and a number of reset springs 12 are also fixed between the upper surface of the upper mold stripping plate 11 and the lower surface of the upper mold clamping plate 9, and a rectangular hole 17 is opened at the center of the upper surface of the upper mold stripping plate 11, and the rectangular hole 17 is located directly below the cutter 10, the length of the rectangular hole 17 is greater than the length of the cutter 10, and the cutter 10 can freely pass through the inside of the rectangular hole 17.
[0032] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a lower mold pad 4 is fixed to the upper surface of the lower support frame 2, and a pair of parallel lower mold seats 13 are fixed to the upper surface of the lower mold pad 4. A resin waste outlet hole 18 is opened at the center position of the upper surface of the lower mold pad 4, and the resin waste outlet hole 18 is arranged between the pair of lower mold seats 13, and the bottom end of the resin waste outlet hole 18 is connected to a resin waste collecting bucket 21. The upper surfaces of the pair of lower mold seats 13 are used to place chip products, and the excess resin area after the chip products are placed is just located directly above the resin waste outlet hole 18; a vertical frame 14 is also fixed to the upper surface of the lower support frame 2, and a moving component 8 is installed on the vertical frame 14, and a dust hood 15 is installed on the moving component 8. The dust hood 15 is a well-known structure in the art and is used to absorb cut resin debris. The suction end of the dust hood 15 can be connected to an external dust pump through a hose.
[0033] like Figure 1 , Figure 2 and Figure 3 As shown, a pair of linear bearings 19 are also installed on the upper pressure plate 3 of the mold, and a cylindrical shaft 20 is sleeved inside each linear bearing 19, and the bottom ends of the pair of cylindrical shafts 20 are fixed to the upper end of the lower mold pad 4, and the linear bearings 19 are arranged so that the upper pressure plate 3 of the mold can slide vertically upward or downward along the outer wall of the cylindrical shaft 20; a pair of upper limit rods 22 are also fixed to the lower surface of the upper pressure plate 3 of the mold, and the pair of upper limit rods 22 are respectively arranged on the left and right sides of the upper mold clamping plate 9; a pair of lower limit rods 23 are also fixed to the upper surface of the lower mold pad 4, and the lower limit rods 23 and the upper limit rods 22 are arranged one by one up and down, and the upper surfaces of the pair of lower limit rods 23 are also bonded with buffer rubber pads, and the upper limit rods 22 and the lower limit rods 23 are arranged to limit the spatial range of downward movement of the upper pressure plate 3 of the mold.
[0034] like Figure 1 , Figure 2 , Fig. 9 and Fig.10 As shown, the moving assembly 8 includes a metal slide rail 801, a rack 802, a travel gear 803 and a moving frame 804. A pair of metal slide rails 801 are fixedly mounted on the outer side wall of the frame 14, and the rack 802 is also fixed on the outer side wall of the frame 14, and the rack 802 is located between the pair of metal slide rails 801; a moving frame 804 is slidably mounted on the pair of metal slide rails 801, and a travel motor 805 is installed on the moving frame 804. The output end of the travel motor 805 is fixed with a travel gear 803, and the travel gear 803 is meshed and connected with the rack 802; the moving assembly 8 also includes a supporting frame 806, and the supporting frame 806 is fixedly mounted on the outer end of the moving frame 804. The outer side wall of the moving frame 804 is also fixed with a second cylinder 807, and the telescopic end of the second cylinder 807 is fixed with an electric clamp 808. The electric clamp The claw 808 is a well-known structure in the art and is used to clamp chip products; a dust hood 15 is also fixed to the front end of the carrier 806, and a pair of dust baffles are also provided at the bottom dust suction port of the dust hood 15. After the travel motor 805 is energized, it can drive the travel gear 803 to rotate clockwise or counterclockwise. Since the travel gear 803 and the rack 802 are meshed and connected, and the rack 802 is fixed to the outer wall of the stand 14, the movable frame 804 can move forward or backward along the direction of the metal slide rail 801. When the cutting is completed, the dust hood 15 can be automatically moved to the top of the lower mold base 13, and the mold surface can be vacuumed and cleaned; in addition, the dust hood 15 can be automatically removed in advance during the cutting process, and it will not hinder the subsequent cutting work. Therefore, it can meet the needs of automated production and bring better economic benefits to the enterprise.
[0035] like Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the telescopic assembly 6 includes a telescopic rod 601, a cylinder 602 and a limiting cap 603. The telescopic rod 601 is sleeved inside the cylinder 602, and the top of the telescopic rod 601 is fixed to the limiting cap 603, and the bottom of the telescopic rod 601 is fixed to the upper surface of the upper mold stripping plate 11; circular holes 16 are provided at the four corners of the lower surface of the upper mold clamping plate 9, and the inner wall of the circular hole 16 is fixedly installed with the cylinder 602. The telescopic rod 601 can slide up and down along the inner wall of the cylinder 602, and the telescopic assembly 6 is arranged to provide support for the upper and lower movements of the upper mold stripping plate 11.
[0036] The working principle of the utility model is as follows: after the chip product is plastic-sealed, the electric clamp 808 is used to clamp the chip product first, and then the travel motor 805 is controlled to drive the travel gear 803 to rotate clockwise, and the movable frame 804, the carrier frame 806 and the electric clamp 808 as a whole can move forward along the direction of the metal slide rail 801 until the electric clamp 808 is moved to the top of the resin waste outlet hole 18, and then the electric clamp 808 is closed, and the chip product falls onto the upper surface of a pair of lower mold seats 13, and then the travel motor 805 is controlled to drive the travel gear 803 to rotate counterclockwise, and the movable frame 804, the carrier frame 806 and the electric clamp 808 as a whole can move forward along the metal slide rail 801. 801 backward; after the chip product placement work is completed, the telescopic rod of the first cylinder 7 is started to extend downward, which can then drive the mold upper pressure plate 3, the upper mold clamping plate 9 and the upper mold stripping plate 11 to move downward as a whole, and the upper mold stripping plate 11 will first contact and press on the upper surface of the chip product. As the first cylinder 7 is continuously pressed downward, the return spring 12 is also continuously compressed until the cutter 10 fixed on the lower surface of the upper mold clamping plate 9 passes through the rectangular hole 17 and cuts off the excess resin sheet on the chip product, and the cut resin sheet falls into the resin waste collection bucket 21 under the action of its own gravity; after the cutting work is completed, the telescopic rod of the first cylinder 7 is started to retract upward, and the mold upper pressure plate 3, the upper mold clamping plate 9 and the upper mold stripping plate 11 are moved downward as a whole, and the upper mold stripping plate 11 will first contact and press on the upper surface of the chip product. The upper mold plate 3 and the upper mold clamping plate 9 will first move upward. Under the elastic action of the reset spring 12, the upper mold stripping plate 11 will stay on the chip product for a period of time until the cutter 10 moves upward and disengages from the rectangular hole 17 opened on the upper mold stripping plate 11. After the reset spring 12 returns to its initial state, the mold upper pressing plate 3, the upper mold clamping plate 9 and the upper mold stripping plate 11 will move upward as a whole; then, the travel motor 805 is controlled to drive the travel gear 803 to rotate clockwise, and the moving frame 804, the supporting frame 806, the electric clamping jaw 808 and the dust cover 15 can move forward along the direction of the metal slide rail 801 until the electric clamping jaw 808 moves to the resin waste outlet The electric clamp 808 is then started to clamp the cut chip product just above the hole 18; finally, the travel motor 805 is controlled to drive the travel gear 803 to rotate counterclockwise, and the movable frame 804, the supporting frame 806, the electric clamp 808 and the dust cover 15 as a whole can move backward along the direction of the metal slide rail 801, and the dust cover 15 works during the backward movement, so that the cut resin debris on the lower mold base 13 can be vacuumed and cleaned; this cycle is repeated, and the electric clamp 808 can put the next chip product on the lower mold base 13 and carry out a new round of cutting work, thereby meeting the needs of automated production and bringing better economic benefits to the enterprise.
[0037] In addition, since the four corners of the lower surface of the upper mold clamping plate 9 are equipped with an upper mold stripping plate 11 through the telescopic assembly 6, a number of return springs 12 are fixed between the upper surface of the upper mold stripping plate 11 and the lower surface of the upper mold clamping plate 9. When the telescopic rod of the first cylinder 7 extends downward to drive the cutter 10 to cut, the upper mold stripping plate 11 will first contact and press on the upper surface of the chip product. As the first cylinder 7 is continuously pressed downward, the return spring 12 is also continuously compressed. Therefore, the upper mold stripping plate 11 elastically presses the chip product, thereby avoiding crushing and damaging the chip product, and at the same time preventing the chip product from changing position during cutting; when the cutting is completed and the telescopic rod of the first cylinder 7 contracts upward, under the elastic action of the return spring 12, the upper mold stripping plate 11 will stay on the chip product for a period of time, thereby preventing the cutter 10 from sticking and bringing out the cut chip product, ensuring that the chip product is still located on the upper surface of the lower mold seat 13 after cutting, so as to facilitate subsequent clamping and delivery.
[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A cutting structure for a chip plastic sealing machine, comprising an upper support frame (1), a lower support frame (2), a mold upper pressure plate (3) and a lower mold pad (4), wherein two groups of support columns (5) are fixedly installed between the upper support frame (1) and the lower support frame (2), and characterized in that: A first cylinder (7) is fixed on the upper surface of the upper support frame (1); a telescopic rod of the first cylinder (7) penetrates the upper support frame (1) and is fixed to the upper surface of the mold upper pressure plate (3); an upper mold clamping plate (9) is integrally connected to the lower surface of the mold upper pressure plate (3); a cutting knife (10) is fixed to the lower surface of the upper mold clamping plate (9); an upper mold stripping plate (11) is installed at four corners of the lower surface of the upper mold clamping plate (9) through a telescopic component (6); and the upper mold stripping plate (11) is fixed to the lower surface of the upper mold clamping plate (9). A plurality of return springs (12) are also fixed between the upper surface of the plate (11) and the lower surface of the upper die clamping plate (9); the lower die pad (4) is fixed to the upper surface of the lower support frame (2), and a pair of parallel lower die seats (13) are fixed to the upper surface of the lower die pad (4); a vertical frame (14) is also fixed to the upper surface of the lower support frame (2), a movable assembly (8) is installed on the vertical frame (14), and a dust hood (15) is installed on the movable assembly (8).
2. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: The moving assembly (8) comprises a metal slide rail (801), a rack (802), a travel gear (803) and a moving frame (804); a pair of the metal slide rails (801) are fixedly mounted on the outer side wall of the stand (14); the moving frame (804) is slidably mounted on the pair of metal slide rails (801); a travel motor (805) is mounted on the moving frame (804); the travel gear (803) is fixed to the output end of the travel motor (805); and the travel gear (803) is meshedly connected with the rack (802).
3. The cutting structure for a chip plastic packaging machine according to claim 2, characterized in that: The moving assembly (8) further comprises a support frame (806), wherein the support frame (806) is fixedly mounted on the outer end of the moving frame (804); a second cylinder (807) is also fixed to the outer side wall of the moving frame (804); an electric clamp (808) is fixed to the telescopic end of the second cylinder (807); the dust hood (15) is also fixed to the front end of the support frame (806); a pair of dust baffles are also provided at the bottom dust suction port of the dust hood (15).
4. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: The telescopic assembly (6) comprises a telescopic rod (601), a cylinder (602) and a limiting cap (603); the telescopic rod (601) is sleeved inside the cylinder (602), the top end of the telescopic rod (601) is fixed to the limiting cap (603), and the bottom end of the telescopic rod (601) is fixed to the upper surface of the upper mold stripping plate (11).
5. The cutting structure for a chip plastic packaging machine according to claim 4, characterized in that: Circular holes (16) are provided at four corners of the lower surface of the upper mold clamping plate (9), and the cylinder (602) is fixedly mounted on the inner wall of the circular hole (16).
6. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: A rectangular hole (17) is provided at the center of the upper surface of the upper mold stripping plate (11), and the rectangular hole (17) is located directly below the cutter (10). The length of the rectangular hole (17) is greater than the length of the cutter (10).
7. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: A resin waste outlet hole (18) is provided at the center of the upper surface of the lower die pad (4), and the resin waste outlet hole (18) is arranged between a pair of lower die seats (13), and the bottom end of the resin waste outlet hole (18) is connected to a resin waste collection bucket (21).
8. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: A pair of linear bearings (19) are also installed on the upper mold plate (3), and a cylindrical shaft (20) is sleeved inside each of the linear bearings (19), and the bottom ends of the pair of cylindrical shafts (20) are fixed to the upper end of the lower mold pad (4).
9. The cutting structure for a chip plastic packaging machine according to claim 1, characterized in that: A pair of upper limit rods (22) are also fixed on the lower surface of the upper mold plate (3), and the pair of upper limit rods (22) are respectively arranged on the left and right sides of the upper mold clamping plate (9).
10. The cutting structure for a chip plastic packaging machine according to claim 9, characterized in that: A pair of lower limiting rods (23) are also fixed on the upper surface of the lower die pad (4), and the lower limiting rods (23) and the upper limiting rods (22) are arranged one by one in a vertically opposite manner, and a buffer rubber pad is also bonded to the upper surface of the pair of lower limiting rods (23).