Anti-shake MEMS substrate, anti-shake camera module and mobile terminal

Abstract

The utility model relates to an anti-shake MEMS substrate, an anti-shake camera module and a mobile terminal, the anti-shake MEMS substrate comprises an MEMS base and an MEMS driving part, the middle part of the MEMS base is provided with a square hole, the size of the square hole is larger than that of the MEMS driving part, and the MEMS driving part is connected with the MEMS base through an elastic conductive member; the top surface of the MEMS driving part is provided with a plurality of first solder balls used for being connected with a PCB hard board. The bottom surface of the MEMS base is provided with a plurality of second solder balls used for being connected with the FPC soft board, one end of the elastic conductive part is connected with the first solder balls, and the other end of the elastic conductive part is connected with the second solder balls. According to the anti-shake camera module, on the premise of realizing anti-shake, the cost can be reduced, the processing technology can be simplified, and meanwhile, the size of the anti-shake camera module can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of an anti-shake camera module, and in particular to an anti-shake MEMS substrate, an anti-shake camera module and a mobile terminal. Background Art

[0002] With the rapid development of technology, the camera function of mobile devices has become more and more important. Especially when shooting videos or photos, the anti-shake function is essential to improve image quality.

[0003] Currently, most anti-shake systems use voice coil motors to move the lens in the X and Y directions to correct image shake during user shaking. At high pixels, the lens is large and heavy, and the voice coil motor consumes a lot of power to move the lens, which poses a great challenge to the energy consumption of smart products.

[0004] Another part of the design uses a MEMS micro-electromechanical system to move the photosensitive chip to achieve image stabilization during user shaking. This design solution has low power consumption, but requires multiple gold wire welding and a complex assembly process, which makes the overall size of the anti-shake camera module larger.

[0005] Therefore, it is necessary to develop an anti-shake MEMS substrate, an anti-shake camera module and a mobile terminal. Summary of the invention

[0006] The purpose of the utility model is to provide an anti-shake MEMS substrate, an anti-shake camera module and a mobile terminal, which can reduce costs, simplify processing technology and reduce the size of the anti-shake camera module while achieving anti-shake.

[0007] In the first aspect, the utility model describes an anti-shake MEMS substrate, comprising a MEMS base and a MEMS driving unit, wherein a square hole is provided in the middle of the MEMS base, and the size of the square hole is larger than the size of the MEMS driving unit, and the MEMS driving unit is connected to the MEMS base through an elastic conductive member; a plurality of first solder balls for connecting to a PCB hard board are provided on the top surface of the MEMS driving unit; a plurality of second solder balls for connecting to an FPC soft board are provided on the bottom surface of the MEMS base, one end of the elastic conductive member is connected to the first solder ball, and the other end of the elastic conductive member is connected to the second solder ball.

[0008] In a second aspect, the utility model discloses an anti-shake camera module, comprising an anti-shake MEMS substrate, an FPC soft board, a bracket, a motor, a lens, a filter, a chip and a PCB hard board, wherein the chip is arranged on the PCB hard board, the lower end of the bracket is fixedly mounted on the FPC soft board, the filter and the motor are mounted on the bracket, and the filter is located below the motor, and the lens is mounted on the motor; the characteristic is that: the anti-shake MEMS substrate adopts the anti-shake MEMS substrate as claimed in the claim;

[0009] A plurality of first solder ball pads are provided on the bottom surface of the PCB hard board, each first solder ball pad corresponds to each first solder ball one by one, and the MEMS driving part of the anti-shake MEMS substrate is fixedly connected to the PCB hard board through the first solder balls and the first solder ball pads;

[0010] A plurality of second solder ball pads are provided on the top surface of the FPC soft board, each second solder ball pad corresponds to each second solder ball one by one, and the MEMS base of the anti-shake MEMS substrate is fixedly connected to the FPC soft board through the second solder balls and the second solder ball pads.

[0011] Optionally, the first solder ball on the MEMS driving unit is soldered to the first solder ball pad through an SMT process.

[0012] Optionally, the second solder ball on the MEMS base is soldered to the second solder ball pad through an SMT process.

[0013] Optionally, the anti-shake camera module is 14 mm long and 14 mm wide, has a compact structure and a small size, and is suitable for various mobile devices.

[0014] In a third aspect, a mobile terminal described in the utility model adopts the anti-shake camera module described in the utility model.

[0015] The utility model has the following advantages:

[0016] (1) The gold wires between the existing MEMS base and FPC board, and between the MEMS driver and the PCB hard board, are replaced with solder balls, thereby transforming the production process from the traditional COB (chip on board) to SMT (surface mount technology). Because SMT technology has a higher degree of automation, it reduces production difficulty and improves production efficiency.

[0017] (2) The cost of solder balls is much lower than that of gold wires. Therefore, using solder balls as connecting materials significantly reduces the processing cost of anti-shake camera modules.

[0018] (3) After using solder ball connection, the size of the anti-shake camera module can be made smaller (14 mm in length and 14 mm in width), making the anti-shake camera module have a compact structure and a small size, which is suitable for various mobile devices.

[0019] In summary, the anti-shake MEMS substrate of the utility model uses MEMS technology to achieve the anti-shake function, and has the advantages of simple structure, low cost, small size and good anti-shake effect. The anti-shake camera module using the anti-shake MEMS substrate has a compact structure and a small size, and is suitable for various mobile devices. The mobile terminal using the anti-shake camera module can improve the photo and video recording effects and enhance the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the internal structure of an anti-shake camera module that uses multiple gold wire connections;

[0021] Figure 2 This is a cross-sectional view of an anti-shake camera module that uses multiple gold wire connections;

[0022] Figure 3 This is one of the structural schematic diagrams of the anti-shake MEMS substrate described in the embodiment of the present application (the side connected to the PCB hard board);

[0023] Figure 4 This is the second structural schematic diagram of the anti-shake MEMS substrate described in the embodiment of the present application (the side connected to the FPC soft board);

[0024] Figure 5 is a cross-sectional view of the anti-shake camera module described in an embodiment of the present application;

[0025] Explanation of the accompanying drawings: 1'-existing anti-shake MEMS substrate, 1. Anti-shake MEMS substrate, 2. FPC soft board, 3. Bracket, 4. Motor, 5. Lens, 6. Filter, 7. Chip, 8. PCB hard board, 9. Connector, 10. Gold wire, 11. MEMS base, 12. Square hole, 13. MEMS driving unit, 14. Elastic conductive part, 15. First solder ball, 16. Second solder ball. DETAILED DESCRIPTION

[0026] The following will refer to the accompanying drawings and preferred embodiments to illustrate the implementation of the technical solution of the utility model. Those skilled in the art can easily understand other advantages and effects of the utility model from the contents disclosed in this specification. The utility model can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the utility model. It should be understood that the preferred embodiments are only for illustrating the utility model, not for limiting the scope of protection of the utility model.

[0027] like Figure 1 and Figure 2 As shown, in the anti-shake camera module that achieves image anti-shake correction during user shaking by moving the photosensitive chip through the anti-shake MEMS substrate (micro-electromechanical system), the anti-shake MEMS substrate mainly realizes the movement of the PCB hard board 8 and the chip 7 in the X (left-right direction) and Y (front-back direction), thereby achieving the anti-shake function of the camera module. However, if the anti-shake MEMS substrate 1' and the PCB hard board 8, the PCB hard board 8 and the chip 7, and the FPC board and the anti-shake MEMS substrate 1' are connected by gold wires 10, that is, the electrical signals between the FPC and the anti-shake MEMS substrate 1', the anti-shake MEMS substrate 1' and the PCB hard board 8, and the PCB hard board 8 and the chip 7 are connected by gold wires 10. The problem with this structure is that due to the multiple welding of gold wires 10, the assembly process of the camera module is more complicated, and the overall size of the anti-shake camera module is larger.

[0028] like Figure 3 and Figure 4 As shown, in order to solve the problems of complex process and large size of the existing anti-shake camera module. A new anti-shake MEMS substrate is provided in the embodiment of the present application, and the anti-shake MEMS substrate 1 includes a MEMS base 11 and a MEMS driver 13. Among them, a square hole 12 is provided in the middle of the MEMS base 11, and the size of the square hole 12 is slightly larger than the size of the MEMS driver 13 to ensure that the MEMS driver 13 has enough space for movement inside the base. The MEMS driver 13 is located in the square hole 12 inside the MEMS base 11, and is connected to the MEMS base 11 through an elastic conductive part 14 (such as a spring or an elastic beam). The elastic conductive part 14 can realize the anti-shake function in the X+, X-, Y+, and Y- directions, and can also realize the conduction of electrical signals. A plurality of first solder balls 15 are provided on the front of the MEMS driver 13. These first solder balls 15 will be used to connect with the first solder ball pads (not shown in the figure) on the PCB hard board 8 in the future. The first solder balls 15 are welded with the first solder ball pads to achieve the fixation of the MEMS driver 13 and the PCB hard board 8 and the transmission of electrical signals between the two. A plurality of second solder balls 16 are evenly distributed on the periphery of the MEMS base 11. These second solder balls 16 are used to connect with the second solder ball pads (not shown in the figure) on the FPC soft board 2 in the future. The second solder balls 16 are welded with the second solder ball pads to achieve the fixation of the MEMS base 11 and the FPC soft board 2 and the transmission of electrical signals between the two.

[0029] like Figure 5As shown, in the embodiment of the present application, an anti-shake camera module includes an FPC soft board 2, a bracket 3, a motor 4, a lens 5, a filter 6, a chip 7, a PCB hard board 8 and an anti-shake MEMS substrate 1 as described in the embodiment of the present application. Among them:

[0030] The FPC soft board 2 is used as the basis of the anti-shake camera module. The main function of the FPC soft board 2 is to transmit the MEMS electrical signal to the connector 9 set on the FPC soft board 2, and the connector 9 then transmits it to the mainboard of the whole machine.

[0031] Chip 7, the chip 7 is mainly used to convert the received optical signal into an electrical signal.

[0032] PCB hard board 8, as the main circuit part of the anti-shake camera module, PCB hard board 8 mainly carries the functions of electronic components such as chip 7, resistors, capacitors, etc. A plurality of first solder ball pads are provided on the bottom surface of PCB hard board 8, and these first solder ball pads correspond one by one to the first solder balls 15 on the MEMS driver 13. Through the SMT process, the first solder balls 15 on the MEMS driver 13 are soldered to the first solder ball pads on the PCB hard board 8, so as to realize the fixed connection between the MEMS driver 13 and the PCB hard board 8, and the electrical signal connection between the anti-shake MEMS substrate 1 and the PCB hard board 8.

[0033] The FPC soft board 2 has a plurality of second solder ball pads on the top surface of the FPC soft board 2, and these second solder ball pads correspond one by one to each second solder ball 16 on the MEMS base 11. Through the SMT (surface mount technology) process, the second solder balls 16 on the MEMS base 11 are soldered to the second solder ball pads on the FPC soft board 2, so as to achieve a fixed connection between the MEMS base 11 and the FPC soft board 2, and an electrical signal connection between the anti-shake MEMS substrate 1 and the FPC soft board 2.

[0034] The bracket 3 is fixedly mounted on the FPC soft board 2. The bracket 3 is mainly used to carry the lens 5 and the motor 4, and protect the anti-shake MEMS substrate 1 and internal electronic components.

[0035] The filter 6 is mounted on the bracket 3 and is located below the motor 4 to filter out unnecessary components in the light collected by the lens 5 to improve the quality of the image.

[0036] The motor 4 is installed on the bracket 3. The motor 4 mainly supports the lens 5 and drives the lens 5 to move up and down to change the focal length.

[0037] The lens 5 is installed on the motor 4 , and the lens 5 is mainly used to gather the light signal to be photographed and transmit it to the chip 7 .

[0038] In the embodiment of the present application, the anti-shake camera module adopts this structure, so that the structural size of the anti-shake camera module can be reduced from 15 mm x 15 mm to 14 mm x 14 mm, so that the anti-shake camera module has a compact structure and a small size, which is very suitable for use in mobile devices such as smartphones.

[0039] Through the description of the above specific embodiments, it can be seen that the anti-shake MEMS substrate 1 and the anti-shake camera module applied thereto described in the embodiments of the present application have the advantages of simple structure, small size, good anti-shake effect, etc., and can meet the high requirements of mobile devices for anti-shake camera modules.

[0040] In an embodiment of the present application, an anti-shake camera module adopts the anti-shake MEMS substrate 1 as described in the embodiment of the present application.

[0041] In an embodiment of the present application, a mobile terminal adopts the anti-shake camera module as described in the embodiment of the present application.

[0042] The above-mentioned embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited by the above-mentioned embodiments. Any other changes, modifications, substitutions, combinations and simplifications made without departing from the spirit and principle of the present invention shall be equivalent replacement modes and shall be included in the protection scope of the present invention.

Claims

1. An anti-shake MEMS substrate, comprising a MEMS base (11) and a MEMS driving part (13), wherein a square hole (12) is provided in the middle of the MEMS base (11), and the size of the square hole (12) is larger than the size of the MEMS driving part (13), and the MEMS driving part (13) is connected to the MEMS base (11) via an elastic conductive member (14); characterized in that: A plurality of first solder balls (15) for connecting to a PCB hard board (8) are provided on the top surface of the MEMS driving part (13); a plurality of second solder balls (16) for connecting to an FPC soft board (2) are provided on the bottom surface of the MEMS base (11); one end of the elastic conductive part (14) is connected to the first solder ball (15), and the other end of the elastic conductive part (14) is connected to the second solder ball (16).

2. An anti-shake camera module, comprising an anti-shake MEMS substrate, an FPC soft board (2), a bracket (3), a motor (4), a lens (5), a filter (6), a chip (7) and a PCB hard board (8), wherein the chip (7) is arranged on the PCB hard board (8), the lower end of the bracket (3) is fixedly mounted on the FPC soft board (2), the filter (6) and the motor (4) are mounted on the bracket (3), and the filter (6) is located below the motor (4), and the lens (5) is mounted on the motor (4); characterized in that: The anti-shake MEMS substrate adopts the anti-shake MEMS substrate (1) as claimed in claim 1; A plurality of first solder ball pads are provided on the bottom surface of the PCB hard board (8), each first solder ball pad corresponds to each first solder ball (15) one by one, and the MEMS driving part (13) of the anti-shake MEMS substrate (1) is fixedly connected to the PCB hard board (8) via the first solder balls (15) and the first solder ball pads; A plurality of second solder ball pads are provided on the top surface of the FPC soft board (2), each second solder ball pad corresponds to each second solder ball (16) one by one, and the MEMS base (11) of the anti-shake MEMS substrate (1) is fixedly connected to the FPC soft board (2) via the second solder balls (16) and the second solder ball pads.

3. The anti-shake camera module according to claim 2, characterized in that: The first solder ball (15) on the MEMS driving part (13) is soldered to the first solder ball pad through the SMT process.

4. The anti-shake camera module according to claim 2, characterized in that: The second solder ball (16) on the MEMS base (11) is soldered to the second solder ball pad through the SMT process.

5. The anti-shake camera module according to claim 2, characterized in that: The anti-shake camera module is 14mm long and 14mm wide.

6. A mobile terminal, characterized in that: An anti-shake camera module as described in any one of claims 2 to 5 is used.

Images