Inductor and electronic equipment

Abstract

The utility model provides an inductor and electronic equipment. The inductor comprises a packaging body and a cooling fin, an inductor is arranged in the packaging body, and the packaging body is provided with a plurality of first assembling parts; the radiating fin is provided with a plurality of second assembling parts corresponding to the plurality of first assembling parts, and the plurality of second assembling parts of the radiating fin are assembled and connected with the plurality of first assembling parts.

Description

Technical Field

[0001] The present application relates to the technical field of inductors, and in particular to an inductor and an electronic device. Background Art

[0002] Inductor, also known as choke, reactor, dynamic reactor, is a component that can convert electrical energy into magnetic energy and store it.

[0003] The process of an inductor converting electrical energy into magnetic energy is a power conversion process. The power conversion process will have losses, and the losses will be accompanied by the generation of heat. In order to avoid the generated heat from accumulating around the inductor, it is usually achieved by reducing the power consumption of the inductor to reduce the generated heat or by setting a heat dissipation module around the inductor to dissipate the generated heat.

[0004] However, when the power consumption of the inductor is reduced, the performance of the inductor will be affected; and when a heat dissipation module is added, the air inlet of the heat dissipation module needs to be unobstructed so that the space occupied by the heat dissipation module and the corresponding air inlet is large, thereby affecting the overall structural design of the electronic device where the inductor is located. Utility Model Content

[0005] The present application provides an inductor and an electronic device, and the technical solution is as follows:

[0006] In a first aspect, an embodiment of the present application provides an inductor, comprising: a package body and a heat sink, wherein the package body is provided with an inductor, and the package body is provided with a plurality of first assembly parts; the heat sink is provided with a plurality of second assembly parts corresponding to the plurality of first assembly parts, and the plurality of second assembly parts of the heat sink are assembled and connected with the plurality of first assembly parts.

[0007] In some embodiments, the first assembly portion has at least a first state and a second state, and the hardness of the first assembly portion in the first state is less than the hardness in the second state; the second assembly portion is provided with an assembly hole, and when the first assembly portion is assembled in the assembly hole, the first assembly portion changes from the first state to the second state and extrude to form a second assembly portion of the assembly hole.

[0008] In some embodiments, the multiple first assembly parts include a first sub-assembly part and a second sub-assembly part located on one side of the package body, and the first sub-assembly part and the second sub-assembly part are respectively plug holes; the heat sink includes a first part, and the multiple second assembly parts include a third sub-assembly part and a fourth sub-assembly part connected to one side of the first part; the third sub-assembly part is connected to the first sub-assembly part, and the fourth sub-assembly part is connected to the second sub-assembly part.

[0009] In some embodiments, a limiting recess is provided on the surface of the packaging body corresponding to the first part; after the second assembly part is assembled and connected with the first assembly part, the first part is correspondingly located in the limiting recess and fits at least one inner wall in the limiting recess.

[0010] In some embodiments, the inductor has a first electrode and a second electrode, and the first electrode and the second electrode are located on the same surface of the package body and are respectively located on two sides of the limiting recess.

[0011] In some embodiments, the plurality of first assembly parts of the package body are made of an elastic body, and the first assembly parts corresponding to each other are interference-fitted with the second assembly parts.

[0012] In some embodiments, the multiple first assembly parts include a first sub-assembly part and a second sub-assembly part respectively located on two sides of the package body that are opposite to or adjacent to each other; the heat sink includes a first part, and the multiple second assembly parts include a third sub-assembly part and a fourth sub-assembly part connected at both ends of the first part; the third sub-assembly part has an interference fit with the first sub-assembly part, and / or the fourth sub-assembly part has an interference fit with the second sub-assembly part.

[0013] In some embodiments, the third sub-assembly part is provided with a first recess, and when the third sub-assembly part and the first sub-assembly part are interference fit, the elastomer of the packaging body fills the first recess; and / or, the fourth sub-assembly part is provided with a second recess, and when the fourth sub-assembly part and the second sub-assembly part are interference fit, the elastomer of the packaging body fills the second recess.

[0014] In a second aspect, an embodiment of the present application provides an electronic device, comprising: an electronic device body and an inductor, wherein the inductor is arranged on the electronic device body, and the inductor comprises: a packaging body and a heat sink, wherein the inductor is arranged in the packaging body, and the packaging body is provided with a plurality of first assembly parts; the heat sink is provided with a plurality of second assembly parts corresponding to the plurality of first assembly parts, and the plurality of second assembly parts of the heat sink are assembled and connected with the plurality of first assembly parts.

[0015] In some embodiments, the electronic device may further include: a circuit board, a local area of ​​a surface of one side of the circuit board and the heat sink are bonded to each other, and a ground layer in the circuit board is correspondingly connected to the heat sink.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 Schematic diagram of the decomposed structure of an inductor provided in one embodiment of the present application Figure 1 ;

[0019] Figure 2 Schematic diagram of the decomposed structure of an inductor provided in one embodiment of the present application Figure 2 ;

[0020] Figure 3 A schematic diagram of the structure of an inductor provided in an embodiment of the present application Figure 1 ;

[0021] Figure 4 A schematic diagram of the structure of an inductor provided in an embodiment of the present application Figure 2 ;

[0022] Figure 5 A schematic diagram of the structure of an inductor provided in an embodiment of the present application Figure 3 ;

[0023] Figure 6 A schematic diagram of the structure of an inductor provided in an embodiment of the present application Figure 4 ;

[0024] Figure 7 Schematic diagram of the decomposed structure of an inductor provided in another embodiment of the present application Figure 1 ;

[0025] Figure 8 Schematic diagram of the decomposed structure of an inductor provided in another embodiment of the present application Figure 2 ;

[0026] Fig. 9 A schematic diagram of the structure of an inductor provided in another embodiment of the present application;

[0027] Fig.10 A schematic diagram of the exploded structure of an electronic device provided in one embodiment of the present application.

[0028] Description of reference numerals:

[0029] 1. Inductor; 11. Package; 111. First assembly portion; 112. First electrode; 113. Second electrode; 12. Heat sink; 121. Second assembly portion; 1211. Assembly hole; 1212. First recess; 1213. Second recess; 122. First portion; 2. Electronic device; 3. Circuit board; 31. Ground layer. DETAILED DESCRIPTION

[0030] The following is a further detailed description of the implementation methods of the present application in conjunction with the accompanying drawings and examples. The detailed descriptions of the following examples and the accompanying drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application. The present application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0031] The present application provides these embodiments to make the present application thorough and complete, and to fully express the scope of the present application to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0032] It should be noted that, in the description of this application, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] In addition, the words "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0034] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0035] All terms used in this application have the same meaning as those understood by those of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0037] First aspect

[0038] The present application embodiment provides an inductor 1, see Figures 1 to 10 As shown, the inductor 1 may include: a package body 11 and a heat sink 12, wherein the package body 11 is provided with an inductor, and the package body 11 is provided with a plurality of first assembly parts 111; the heat sink 12 is provided with a plurality of second assembly parts 121 corresponding to the plurality of first assembly parts 111, and the plurality of second assembly parts 121 of the heat sink 12 are assembled and connected with the plurality of first assembly parts 111.

[0039] The package body 11 may be a package structure made of a mixed material of at least one inductor powder material such as carbonyl iron powder, alloy iron powder, reduced powder, etc., mixed with an adhesive and / or insulating material. An inductor may be arranged inside the package structure. The inductor is a power conversion device that can convert electrical energy into magnetic energy. The package body 11 is provided with a plurality of first assembly parts 111. The plurality of first assembly parts 111 may be arranged on the same side of the package body 11, or may correspond to different sides of the package body 11, and the first assembly part 111 may be a plug hole, a plug notch, a plug column, or other structural settings, such as: see Figures 1 to 6 As shown, two first assembly parts 111 may be provided on the same side of the package body 11, and the two first assembly parts 111 may be plug holes; for example: see Figures 7 to 9As shown, two opposite sides of the package body 11 may be respectively provided with a first assembly portion 111 , and the two first assembly portions 111 may be plug-in notches.

[0040] The heat sink 12 is provided with a plurality of second assembly parts 121 corresponding to the plurality of first assembly parts 111. The plurality of second assembly parts 121 of the heat sink 12 are assembled and connected with the plurality of first assembly parts 111. That is, the heat sink 12 can be provided with the same number of second assembly parts 121 as the first assembly parts 111, and one second assembly part 121 can be assembled and connected with one first assembly part 111, thereby realizing the assembly between the heat sink 12 and the package body 11. The second assembly part 121 can be adapted to the first assembly part 111. When the rigid or non-rigid first assembly part 111 is as follows Figure 1 When the plug hole shown in FIG. 1 is shown in FIG. 2 , the second assembly portion 121 may be capable of being plugged in and connected by interference fit (eg, the second assembly portion 121 is an elastic structure) or as shown in FIG. Figures 1 to 6 The plug-in piece is fixed in the plug-in hole by a non-interference fit method; when the first assembly portion 111 is as follows Figure 7 When the insertion notch shown in FIG. 1 is provided, the number of the first assembly portion 111 can be as follows: Figures 7 to 9 The two shown in FIG. 1 correspond to the two opposite sides of the package body 11, and the number of the second assembly portions 121 is also as shown in FIG. Figures 7 to 9 The two shown in the figure are plug-in sheets corresponding to the plug-in notches, and the distance between the two second assembly parts 121 is smaller than the distance between the two first assembly parts 111, so that the two second assembly parts 121 can be assembled in the two plug-in notches when subjected to the pressing force in the direction of the package body 11; when the first assembly part 111 is elastic, it can be interference-fitted in the hole of the second assembly part 121. The heat sink 12 can be a sheet structure with thermal conductivity such as a tinned copper sheet or an aluminum sheet.

[0041] In one example, see Figures 1 to 6 As shown, the inductor 1 may include: a package body 11 and a heat sink 12, wherein the package body 11 is provided with an inductor, and one side of the outer surface of the package body 11 is provided with two first assembly parts 111, and the two first assembly parts 111 are both plug holes; the heat sink 12 is provided with two second assembly parts 121 corresponding to the two first assembly parts 111, and the two second assembly parts 121 of the heat sink 12 are respectively inserted into the two plug holes and fixed in the two plug holes, thereby realizing the assembly connection between the multiple second assembly parts 121 of the heat sink 12 and the multiple first assembly parts 111 of the package body 11. A method for manufacturing the inductor 1 in this example may be: see Figure 1As shown, at least one inductor powder material of carbonyl iron powder, alloy iron powder, reduced powder, etc., mixed with a binder and / or insulating material can be pressed into a package body 11 that wraps the inductor, one end of the first electrode 112, and one end of the second electrode 113 through a pressing process, and while pressing to form the package body 11, two concave first assembly parts 111 are formed on one side of the package body 11; see Figure 1 and Figure 2 As shown, the two second assembly parts 121 of the heat sink 12 can be respectively inserted into the two first assembly parts 111; see Figure 3 As shown, the heat sink 12 , the first electrode 112 and the second electrode 113 can be pressed downward toward the package body 11 by a pressing process, so that the first assembly portion 111 and the second assembly portion 121 corresponding to each other can be assembled and connected in a plug-in fixed manner.

[0042] In one example, see Figures 7 to 9 As shown, the inductor 1 may include: a package body 11 and a heat sink 12, wherein the package body 11 is provided with an inductor, and the two opposite sides of the package body 11 may be provided with first assembly parts 111 respectively, and the two first assembly parts 111 on the two sides may be plug-in notches, and the heat sink 12 is provided with second assembly parts 121 corresponding to the two first assembly parts 111, and the two second assembly parts 121 of the heat sink 12 are respectively inserted into the two plug-in notches and fixed in the two plug-in notches, thereby realizing the assembly connection between the multiple second assembly parts 121 of the heat sink 12 and the multiple first assembly parts 111 of the package body 11. A method for manufacturing the inductor 1 in this example may be: see Figure 7 As shown, at least one inductor powder material selected from carbonyl iron powder, alloy iron powder, reduced powder, etc., can be pressed into a mixed material obtained by mixing a binder and / or an insulating material to form a package body 11 that wraps the inductor, one end of the first electrode 112, and one end of the second electrode 113. When the package body 11 is formed by pressing, two recessed insertion notches are formed on two opposite sides of the package body 11; see Figure 7 and Figure 8 As shown, the two second assembly portions 121 of the heat sink 12 can be respectively inserted into the two insertion notches; see Fig. 9 As shown, the heat sink 12 , the first electrode 112 and the second electrode 113 can be pressed downward toward the package body 11 by a pressing process, so that the first assembly portion 111 and the second assembly portion 121 corresponding to each other can be assembled and connected in a plug-in fixed manner.

[0043] In this embodiment, the inductor 1 may include a package body 11 and a heat sink 12. When the power consumption of the inductor 1 remains unchanged, the package body 11 and the heat sink 12 may be connected by correspondingly assembling a plurality of first assembly portions 111 on the package body 11 and a plurality of second assembly portions 121 on the heat sink 12. When the heat generated by the inductor in the package body 11 during the process of converting electrical energy into magnetic energy is diffused to the heat sink 12, the heat sink 12 may dissipate the heat, thereby cooling the inductor 1 while ensuring the performance of the inductor 1. Meanwhile, relative to the arrangement of the heat sink 12 of the heat dissipation module, the arrangement space requirement of the heat sink 12 is small, so as to reduce the impact on the overall structural design of the electronic device 2 where the inductor 1 is located. Furthermore, compared to the embodiment in which the heat sink 12 and the package body 11 are bonded together by glue, since the thermal conductivity of the glue is poor, which affects the heat transfer between the package body 11 and the heat sink 12, and further affects the heat dissipation effect of the inductor 1, the heat sink 12 in this embodiment is assembled and connected with the first assembly part 111 on the package body 11 through the second assembly part 121 thereon, so as to reduce the use of connecting media such as glue, thereby avoiding the influence of the connecting medium on the heat dissipation effect of the inductor 1.

[0044] In some embodiments, see Figures 1 to 6 As shown, the first assembly part 111 has at least a first state and a second state, and the hardness of the first assembly part 111 in the first state is less than the hardness in the second state; the second assembly part 121 is provided with an assembly hole 1211, and when the first assembly part 111 is assembled in the assembly hole 1211, the first assembly part 111 changes from the first state to the second state and squeezes to form the second assembly part 121 of the assembly hole 1211. The assembly hole 1211 can be a blind hole with one end open and the other end closed, or a through hole with both ends open.

[0045] In one example, at least one inductor powder material selected from carbonyl iron powder, alloy iron powder, reduced powder, etc., mixed with an adhesive and / or an insulating material can be pressed into a mixed material that wraps the inductor, one end of the first electrode 112, and one end of the second electrode 113 through a pressing process to form a package body 11. The two opposite sides of the package body 11 can correspond to a first assembly part 111 respectively, and at this time, the adhesive in the package body 11 still has fluidity so that the hardness of the two corresponding first assembly parts 111 on the package body 11 is small; at this time, a U-shaped heat sink 12, for example, can be applied close to the package body 11. 1, so that the two second assembly parts 121 at both ends of the U-shaped heat sink 12, for example, move toward the surfaces of the two first assembly parts 111 on both sides of the package body 11 that are opposite to each other, and after the package body 11 is subjected to the pressure of the heat sink 12, the first assembly part 111 can enter the assembly holes 1211 of the two second assembly parts 121 through the fluidity of the adhesive. At this time, the first assembly part 111 has a large hardness and squeezes the second assembly part 121 with the assembly hole 1211, so that the first assembly part 111 and the second assembly part 121 corresponding to each other are assembled and connected by plug-in fixing.

[0046] In this embodiment, the first assembly part 111 can be assembled in the assembly hole 1211 of the second assembly part 121 to increase its hardness, so as to extrude the second assembly part 121 forming the assembly hole 1211, thereby making the connection between the first assembly part 111 and the second assembly part 121 tighter and more secure.

[0047] In some embodiments, see Figures 1 to 6 As shown, the plurality of first assembly parts 111 include a first sub-assembly part and a second sub-assembly part located at one side of the package body 11, and the first sub-assembly part and the second sub-assembly part are respectively plug-in holes; the heat sink 12 includes a first part 122, and the plurality of second assembly parts 121 include a third sub-assembly part and a fourth sub-assembly part connected to one side of the first part 122; the third sub-assembly part is connected to the first sub-assembly part, and the fourth sub-assembly part is connected to the second sub-assembly part. That is, after the third sub-assembly part is assembled into the plug-in hole of the first sub-assembly part, the first sub-assembly part forming the inner wall of the plug-in hole can enter the assembly hole 1211 of the third sub-assembly part, and can change from the first state to the second state to realize the connection between the third sub-assembly part and the first sub-assembly part, and is restricted by the first sub-assembly part located in the assembly hole 1211, so that the third sub-assembly part cannot be easily taken out from the plug-in hole of the first sub-assembly part, so as to further improve the firmness of the connection between the third sub-assembly part and the first sub-assembly part; the same setting can improve the firmness between the fourth sub-assembly part and the second sub-assembly part.

[0048] In some embodiments, a limiting recess is provided on the surface of the package body 11 corresponding to the first part 122; after the second assembly part 121 is assembled and connected with the first assembly part 111, the first part 122 is correspondingly located in the limiting recess and fits at least one inner wall in the limiting recess. In this way, the limiting recess can abut against the inner wall of the first part 122 to limit the first part 122, so as to achieve a better fixing effect between the package body 11 and the heat sink 12.

[0049] In some embodiments, see Figures 1 to 6 As shown, the inductor has a first electrode 112 and a second electrode 113, and the first electrode 112 and the second electrode 113 are located on the same surface of the package body 11 and are respectively located on both sides of the limiting recess. In other words, the first electrode 112, the second electrode 113 and the first part 122 of the heat sink 12 can be located on the same side of the package body 11, and the first part 122 can be located between the first electrode 112 and the second electrode 113. In this way, the heat generated by the first electrode 112 and the second electrode 113 can be dissipated through the heat sink 12 at the first time, thereby further improving the heat dissipation efficiency of the inductor 1. Here, the first electrode 112 and the second electrode 113 can be symmetrical about the limiting recess, or they can be asymmetrical about the limiting recess.

[0050] In some embodiments, the plurality of first assembly parts 111 of the package body 11 may be formed of an elastic body, and the first assembly parts 111 corresponding to each other may be interference-fitted to the second assembly part 121. In other words, the first assembly part 111 may be deformed to be compressed in the recess of the second assembly part 121, thereby realizing an interference-fit assembly connection between the first assembly part 111 and the second assembly part 121, and the interference-fit connection enables the first assembly part 111 and the second assembly part 121 corresponding to each other to be pressed against each other, thereby making the package body 11 and the heat sink 12 connected more tightly and firmly.

[0051] In some embodiments, the plurality of first assembly parts 111 may include a first sub-assembly part and a second sub-assembly part respectively located on two sides opposite to or adjacent to each other of the package body 11; the heat sink 12 may include a first part 122, and the plurality of second assembly parts 121 may include a third sub-assembly part and a fourth sub-assembly part connected at both ends of the first part 122; the third sub-assembly part may have an interference fit with the first sub-assembly part, and / or the fourth sub-assembly part may have an interference fit with the second sub-assembly part.

[0052] The multiple first assembly parts 111 may include a first sub-assembly part and a second sub-assembly part respectively located on the two sides opposite to or adjacent to each other of the package body 11, that is, the number of the multiple first assembly parts 111 may be two, namely the first sub-assembly part and the second sub-assembly part, and the first sub-assembly part and the second sub-assembly part may respectively correspond to the two sides opposite to each other of the package body 11, or the first sub-assembly part and the second sub-assembly part may also respectively correspond to the two sides adjacent to each other of the package body 11. However, the present application does not specifically limit the types and / or quantities of the multiple first assembly parts 111, that is, those skilled in the art may adjust their types according to actual conditions. The above situation is only an exemplary explanation of the types and / or quantities in which the multiple first assembly parts 111 in the present application can be applied, but is not limited to the situations described in the above embodiments.

[0053] The heat sink 12 may include a first part 122, and the plurality of second assembly parts 121 may include a third sub-assembly part and a fourth sub-assembly part connected to both ends of the first part 122; the third sub-assembly part may be interference fit with the first sub-assembly part, and / or the fourth sub-assembly part may be interference fit with the second sub-assembly part, that is, the number of the second assembly parts 121 may be two, namely the third sub-assembly part and the fourth sub-assembly part, and the third sub-assembly part may be assembled and connected with the first sub-assembly part to form a first assembly combination, and the fourth sub-assembly part may be assembled and connected with the second sub-assembly part to form a second assembly combination, and at the same time, the two assembly parts in at least one of the first assembly combination and the second assembly combination are assembled and connected to each other by interference fit. Here, the first assembly part 111 can be composed of an elastomer, and the second assembly part 121 can be a recessed part that achieves an interference fit with the elastomer. For example, the first sub-assembly part can be composed of an elastomer, and the third sub-assembly part can be a recessed part that achieves an interference fit with the first sub-assembly part. When the first sub-assembly part and the third sub-assembly part are assembled, the first sub-assembly part is in a compressed state in the recess of the third sub-assembly part to squeeze and form the inner wall of the recess.

[0054] In this embodiment, the multiple first assembly parts 111 can be located on the two sides of the package body 11 opposite to each other, or on the two adjacent sides, so that they can be flexibly arranged according to actual needs. For example, if the space on the two sides of the package body 11 opposite to each other is large, it is possible to choose to arrange the multiple first assembly parts 111 on the two sides of the package body 11 opposite to each other.

[0055] In some embodiments, the third sub-assembly part is provided with a first recess 1212, and when the third sub-assembly part and the first sub-assembly part have an interference fit, the elastomer of the package body 11 fills the first recess 1212; and / or, the fourth sub-assembly part is provided with a second recess 1213, and when the fourth sub-assembly part and the second sub-assembly part have an interference fit, the elastomer of the package body 11 fills the second recess 1213.

[0056] The first recess 1212 may be a blind hole with one end open and the other end closed, or a through hole with both ends open. During the process of assembling the third subassembly part and the first subassembly part by pressing, the elastic body of the package body 11 fills the first recess 1212, so that the package body 11 and the heat sink 12 are relatively squeezed and combined more tightly, thereby increasing the pressing strength between the package body 11 and the heat sink 12 and the heat conduction effect of the heat sink 12.

[0057] The second recess 1213 can be a blind hole with one end open and the other end closed, or a through hole with both ends open. During the process of assembling the fourth subassembly part and the second subassembly part by pressing, the elastomer of the package body 11 fills the second recess 1213, so that the package body 11 and the heat sink 12 are relatively squeezed and combined more tightly, thereby increasing the pressing strength between the package body 11 and the heat sink 12 and the heat conduction effect of the heat sink 12.

[0058] In one example, see Figures 1 to 6 As shown, the inductor 1 may include:

[0059] The package body 11 may be provided with two first assembly parts 111 on one side of the package body 11 . The two first assembly parts 111 are both plug holes, and the first electrode 112 and the second electrode 113 of the inductor are correspondingly located on both sides of the connection direction of the two first assembly parts 111 .

[0060] The heat sink 12 may include: a first portion 122 and two second assembly portions 121 respectively connected to two ends of the first portion 122 , wherein the two second assembly portions 121 are respectively provided with a first recess 1212 and a second recess 1213 in the form of through holes.

[0061] During assembly, a pressing force close to the package body 11 can be applied on the side of the heat sink 12 facing away from the package body 11, and the two second assembly parts 121 respectively enter the two first assembly parts 111, and the first recess 1212 and the second recess 1213 are filled with the corresponding parts in the two plug holes of the package body 11, so as to realize the assembly connection between the corresponding first assembly parts 111 and the second assembly parts 121. At the same time, the assembled first part 122 is located between the first electrode 112 and the second electrode 113.

[0062] Second aspect

[0063] The present application embodiment generally provides an electronic device 2, see Fig.10As shown, it may include: an electronic device body and an inductor 1, wherein the inductor 1 is arranged on the electronic device body, and the inductor 1 may include: a package body 11 and a heat sink 12, wherein the package body 11 is provided with an inductor, and the package body 11 is provided with a plurality of first assembly parts 111; the heat sink 12 is provided with a plurality of second assembly parts 121 corresponding to the plurality of first assembly parts 111, and the plurality of second assembly parts 121 of the heat sink 12 are assembled and connected with the plurality of first assembly parts 111.

[0064] Here, the electronic device 2 can be a computer, a server, a mobile phone, a television, an electric fan, or other electronic devices.

[0065] In this embodiment, the inductor 1 on the electronic device 2 may include a package body 11 and a heat sink 12, which can be connected to the package body 11 and the heat sink 12 by correspondingly assembling a plurality of first assembly portions 111 on the package body 11 and a plurality of second assembly portions 121 on the heat sink 12 when the power consumption of the inductor 1 remains unchanged. When the heat generated by the inductor in the package body 11 during the conversion of electrical energy into magnetic energy is diffused to the heat sink 12, the heat sink 12 can dissipate the heat, thereby cooling the inductor 1 while ensuring the performance of the inductor 1. At the same time, relative to the setting of the heat dissipation module, the heat sink 12 has a small requirement for the setting space, so as to reduce the impact on the overall structural design of the electronic device 2 where the inductor 1 is located. Furthermore, compared to the embodiment in which the heat sink 12 and the package body 11 are bonded together by glue, since the poor thermal conductivity of the glue affects the heat transfer between the package body 11 and the heat sink 12, and further affects the heat dissipation effect of the inductor 1, the heat sink 12 in this embodiment is assembled and connected with the first assembly part 111 on the package body 11 through the second assembly part 121 thereon, so as to reduce the use of connecting media such as glue, thereby avoiding the influence of the connecting medium on the heat dissipation effect of the inductor 1.

[0066] In some embodiments, see Fig.10 As shown, the electronic device 2 may further include: a circuit board 3, a local area of ​​a side surface of the circuit board 3 and the heat sink 12 are attached to each other, and the grounding layer 31 in the circuit board 3 is correspondingly connected to the heat sink 12. In this way, the heat sink 12 can disperse the heat on the circuit board 3 with a larger area, and then conduct the heat to the grounding layer 31 in the circuit board 3 for dissipation, thereby further improving the heat dissipation efficiency.

[0067] It should be noted that Fig.10 The circuit board 3 in the figure may include at least two grounding layers 31. The circle in the figure may indicate the connection position between the heat sink 12 and the grounding layer 31. In this way, the heat of the heat sink 12 can be dissipated through the two grounding layers 31 to further improve the heat dissipation efficiency.

[0068] It should be noted that the inductor in the electronic device provided in the embodiment of the present application is similar to the description of the inductor embodiment described above, and has similar beneficial effects as the inductor embodiment described above. For technical details not disclosed in the electronic device embodiment of the present application, please refer to the description of the inductor embodiment in the present application for understanding, and no further description will be given here.

[0069] So far, various embodiments of the present application have been described in detail. In order to avoid obscuring the concept of the present application, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed herein.

[0070] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. An inductor, characterized in that: include: A package body, in which an inductor is arranged, and the package body is provided with a plurality of first assembly parts; The heat sink is provided with a plurality of second assembly parts corresponding to the plurality of first assembly parts, and the plurality of second assembly parts of the heat sink are assembled and connected with the plurality of first assembly parts.

2. The inductor according to claim 1, characterized in that The first assembly portion has at least a first state and a second state, and the hardness of the first assembly portion in the first state is smaller than the hardness in the second state; The second assembly portion is provided with an assembly hole. When the first assembly portion is assembled in the assembly hole, the first assembly portion changes from the first state to the second state and presses to form the second assembly portion of the assembly hole.

3. The inductor according to claim 2, characterized in that The plurality of first assembly parts include a first sub-assembly part and a second sub-assembly part located at one side of the package body, the first sub-assembly part and the second sub-assembly part are respectively plug holes; The heat sink includes a first portion, and the plurality of second assembly portions include a third subassembly portion and a fourth subassembly portion connected to one side of the first portion; The third sub-assembly portion is connected to the first sub-assembly portion, and the fourth sub-assembly portion is connected to the second sub-assembly portion.

4. The inductor according to claim 3, characterized in that The packaging body is provided with a limited recess on the surface corresponding to the first part; After the second assembly portion is assembled and connected with the first assembly portion, the first portion is correspondingly located in the limiting recess and fits at least one inner wall in the limiting recess.

5. The inductor according to claim 4, characterized in that The inductor has a first electrode and a second electrode. The first electrode and the second electrode are located on the same surface of the package body and are respectively located on two sides of the limiting recess.

6. The inductor according to claim 1, characterized in that The plurality of first assembly parts of the package body are made of an elastic body, and the first assembly parts corresponding to each other are interference-fitted with the second assembly parts.

7. The inductor according to claim 6, characterized in that The plurality of first assembly parts include a first sub-assembly part and a second sub-assembly part respectively located on two sides of the package body that are opposite to or adjacent to each other; The heat sink includes a first portion, and the plurality of second assembly portions include a third subassembly portion and a fourth subassembly portion connected to two ends of the first portion; The third sub-assembly portion is interference-fitted with the first sub-assembly portion, and / or the fourth sub-assembly portion is interference-fitted with the second sub-assembly portion.

8. The inductor according to claim 7, characterized in that The third sub-assembly part is provided with a first recess, and when the third sub-assembly part is interference-fitted with the first sub-assembly part, the elastic body of the packaging body fills the first recess; and / or, The fourth sub-assembly portion is provided with a second recessed portion, and when the fourth sub-assembly portion is interference-fitted with the second sub-assembly portion, the elastic body of the packaging body fills the second recessed portion.

9. An electronic device, characterized in that: include: Electronic device body; The inductor is arranged on the electronic device body and comprises: A package body, in which an inductor is arranged, and the package body is provided with a plurality of first assembly parts; The heat sink is provided with a plurality of second assembly parts corresponding to the plurality of first assembly parts, and the plurality of second assembly parts of the heat sink are assembled and connected with the plurality of first assembly parts.

10. The electronic device according to claim 9, characterized in that: Also includes: A circuit board, a local area of ​​a surface of one side of the circuit board and the heat sink are attached to each other, and a grounding layer in the circuit board is correspondingly connected to the heat sink.

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