Packaging product and electronic equipment

Abstract

The utility model provides a packaging product and an electronic device, the packaging product comprises a plastic package layer, a substrate and a chip arranged on the substrate, one side of the chip deviating from the substrate is provided with a heat dissipation member in contact connection with the chip, the chip is arranged in the plastic package layer, the heat dissipation member is partially arranged in the plastic package layer, one side of the heat dissipation member deviating from the chip is exposed out of the plastic package layer, and the heat dissipation member is arranged in the plastic package layer. The heat dissipation piece is provided with a first connecting part, and a second connecting part matched with the first connecting part is formed at the position, corresponding to the first connecting part, of the plastic packaging layer. The first connecting part is arranged on the heat dissipation piece, and the second connecting part matched with the first connecting part is formed on the plastic packaging layer, so that the plastic packaging layer and the heat dissipation piece form a mechanical interlocking structure, the connecting area between the plastic packaging layer and the heat dissipation piece is increased, and the connection between the plastic packaging layer and the heat dissipation piece is firmer; in this way, the interface between the plastic packaging layer and the heat dissipation layer is not prone to layering or stripping, external water vapor is not prone to entering an internal chip and other components through diffusion, and the reliability and stability of a product are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging products, in particular to a packaging product and electronic equipment. Background Art

[0002] In order to achieve heat dissipation of the chip, existing packaging products will mount heat sinks on the chip that needs heat dissipation. After plastic packaging, the plastic packaging layer is ground to expose the heat sink to the air to dissipate the heat into the air. During use, this type of packaging product has unstable performance and low reliability.

[0003] The above is merely a description of the relevant technology and does not mean that the applicant admits that the above is the prior art.

[0004] In view of this, it is necessary to provide a new packaging product and electronic device to solve or at least alleviate the above technical defects. Utility Model Content

[0005] In view of the above problems, the utility model provides a packaging product and an electronic device, aiming to solve the technical problems of unstable performance and low reliability of packaging products with heat dissipation components in the related art.

[0006] According to some embodiments of the utility model, the utility model provides a packaging product, including a plastic sealing layer, a substrate, and a chip arranged on the substrate, a heat sink connected to the chip is arranged on the side of the chip facing away from the substrate, the chip is arranged in the plastic sealing layer, the heat sink is partially arranged in the plastic sealing layer, and the side of the heat sink facing away from the chip is exposed to the plastic sealing layer, the heat sink is provided with a first connecting portion, and a second connecting portion cooperating with the first connecting portion is formed at a position of the plastic sealing layer corresponding to the first connecting portion.

[0007] In some embodiments, the heat sink includes a top surface, a bottom surface, and a side enclosure connecting the top surface and the bottom surface, the bottom surface is in contact with the chip, the top surface is exposed to the plastic packaging layer, and the side enclosure is provided with the first connecting portion.

[0008] In some embodiments, the first connecting portion includes a recessed groove formed in the side periphery, and the second connecting portion includes a protruding portion, and the protruding portion extends into the recessed groove and fills the recessed groove.

[0009] In some embodiments, the recessed groove is a square groove or an arc-shaped groove, and the shape of the protrusion matches the shape of the recessed groove.

[0010] In some embodiments, there are multiple recessed grooves, and the multiple recessed grooves are arranged around the side periphery. There are also multiple raised portions, and the multiple recessed grooves and the multiple raised portions are arranged in one-to-one correspondence.

[0011] In some embodiments, the recessed groove is a semicircular groove, and the diameter of the semicircular groove is denoted as H; the plastic encapsulation layer is an epoxy resin layer, and the diameter of the silicon dioxide particles in the epoxy resin layer is denoted as L, then H>5L.

[0012] In some embodiments, the first connecting portion includes a protrusion formed on the side periphery, and the second connecting portion includes a groove, and the protrusion extends into the groove and fills the groove.

[0013] In some embodiments, the side periphery is formed with a step.

[0014] In some embodiments, the step includes a first step and a second step arranged on the first step, the size of the first step is larger than the size of the second step, the side of the first step facing away from the second step is in contact with the chip, and the side of the second step facing away from the first step is exposed to the plastic encapsulation layer.

[0015] In some embodiments, the first connecting portion includes a first sawtooth formed on the side periphery, and the second connecting portion includes a second sawtooth that cooperates with the first sawtooth.

[0016] In some embodiments, the heat sink is a copper sheet, and the bottom surface of the copper sheet is attached to the surface of the chip.

[0017] According to some embodiments of the present invention, the present invention provides an electronic device, wherein the electronic device includes the packaged product described above.

[0018] In the above scheme, the packaged product includes a plastic encapsulation layer, a substrate, and a chip arranged on the substrate. A heat sink in contact with the chip is arranged on the side of the chip facing away from the substrate. The chip is arranged in the plastic encapsulation layer, and the heat sink is partially arranged in the plastic encapsulation layer, and the side of the heat sink facing away from the chip is exposed to the plastic encapsulation layer. The heat sink is provided with a first connection part, and a second connection part cooperating with the first connection part is formed at a position of the plastic encapsulation layer corresponding to the first connection part. By providing the first connection part on the heat sink, and forming the second connection part cooperating with the first connection part on the plastic encapsulation layer, the plastic encapsulation layer and the heat sink form a mechanical interlocking structure, which increases the connection area between the two, making the connection between the two more secure, so that the interface between the plastic encapsulation layer and the heat sink layer is not prone to delamination or peeling problems, and external water vapor is not easy to diffuse into internal chips and other components, thereby improving the reliability and stability of the product.

[0019] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those skilled in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only used for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. In addition, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0021] Figure 1 It is a schematic diagram of the structure of packaging products in some embodiments of the utility model;

[0022] Figure 2 A schematic diagram of the structure of a heat sink and a part of a plastic sealing layer of a packaged product in some embodiments of the utility model;

[0023] Figure 3 Another structural schematic diagram of a heat sink and a part of a plastic sealing layer of a packaged product in some embodiments of the utility model;

[0024] Figure 4 It is another structural schematic diagram of the heat sink and part of the plastic sealing layer of the packaged product in some embodiments of the utility model;

[0025] Figure 5 It is another structural schematic diagram of the heat sink and part of the plastic sealing layer of the packaged product in some embodiments of the utility model;

[0026] Figure 6 A schematic diagram of the structure of a heat sink for packaging products in some embodiments of the utility model;

[0027] Figure 7 This is another structural schematic diagram of the heat sink of the packaged product in some embodiments of the utility model.

[0028] The reference numerals in the specific implementation manner are as follows:

[0029] 10. Packaging products;

[0030] 1. Substrate; 2. Chip; 3. Heat sink; 31. First connection portion; 311. Concave groove; 312. Protrusion; 313. Step; 3131. First step; 3132. Second step; 32. Top surface; 33. Bottom surface; 34. Side enclosure; 4. Plastic sealing layer; 41. Second connection portion; 411. Protrusion; 412. Concave groove. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by technicians in the technical field to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" in the specification and claims of the present invention and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0033] In the description of the embodiments of the present utility model, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present utility model, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0034] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0035] In the description of the embodiments of the present utility model, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0036] In the description of the embodiments of the present invention, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0037] In the description of the embodiments of the present invention, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0038] In the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0039] In order to achieve heat dissipation of the chip, the existing packaging products will mount a heat sink on the chip that needs heat dissipation, and after plastic sealing, the plastic sealing layer will be ground to expose the heat sink to the air to achieve heat dissipation. However. In actual use, this type of packaging product has unstable performance and low reliability. The applicant's research found that there was stratification or peeling at the interface between the heat sink and the plastic sealing layer, and water vapor entered the interior of the packaged product from the interface, affecting the function of components such as the chip. After further research, the applicant found that this was due to the different materials of the heat sink and the plastic sealing layer, the difference in physical and chemical properties between the heat sink and the plastic sealing layer, and the influence of external factors such as water and ions, which caused oxidation corrosion at the interface between the heat sink and the plastic sealing layer, which easily caused stratification, peeling and other problems. After stratification or peeling, water vapor and the like can easily diffuse through the interface to the internal chip and other components, resulting in reduced reliability of the packaged product.

[0040] To this end, the utility model provides a packaging product.

[0041] Reference Figure 1According to some embodiments of the utility model, the utility model provides a packaging product 10, including a plastic sealing layer 4, a substrate 1, and a chip 2 arranged on the substrate 1, a heat sink 3 in contact with the chip 2 is arranged on the side of the chip 2 facing away from the substrate 1, the chip 2 is arranged in the plastic sealing layer 4, the heat sink 3 is partially arranged in the plastic sealing layer 4, and the side of the heat sink 3 facing away from the chip 2 is exposed to the plastic sealing layer 4, the heat sink 3 is provided with a first connecting portion 31, and a second connecting portion 41 matching the first connecting portion 31 is formed at a position of the plastic sealing layer 4 corresponding to the first connecting portion 31.

[0042] In the above embodiment, the substrate 1 can be a printed circuit board, and the chip 2 and other components that need to be mounted are mounted on the substrate 1. For the chip 2 with relatively large heat generation, in order to avoid the chip 2 having too high a temperature and affecting the performance of the packaged product 10, a heat sink 3 can be mounted on the chip 2. The heat sink 3 is in contact with the chip 2, specifically a thermal contact connection. The heat sink 3 is a good conductor of heat, and the heat generated by the chip 2 can be transferred to the heat sink 3. After the chip 2 and other components that need to be installed on the substrate 1 are set, they are plastic-sealed. After the plastic sealing is completed, the chip 2, the heat sink 3 and other components are all wrapped in the plastic sealing layer 4. At this time, the top of the plastic sealing layer 4 is ground until the heat sink 3 is exposed, so that the heat sink can exchange heat with the air. In this way, the heat transferred from the chip 2 to the heat sink 3 can be dissipated into the air. In the above embodiment, by providing a first connection portion 31 on the heat sink 3, a second connection portion 41 that cooperates with the first connection portion 31 is formed on the plastic sealing layer 4, so that the plastic sealing layer 4 and the heat sink 3 form a mechanically interlocking structure, which increases the connection area between the two and makes the connection between the two more secure. In this way, the interface between the plastic sealing layer 4 and the heat sink layer is not prone to delamination or peeling problems, and external water vapor is not easy to diffuse into the internal chip 2 and other components, thereby improving the reliability and stability of the packaged product.

[0043] In addition, it should be noted that after the first connection part 31 structure of the heat sink 3 is formed, the molding material will wrap the first connection part 31 during the molding process, and naturally form a second connection part 41 that matches the shape of the first connection part 31, which will not increase the complexity of the molding process. Moreover, since the formation of the molding layer 4 is a process of pressurized filling and wrapping, the bonding strength between the two is also relatively high.

[0044] Reference Figure 2 or Figure 3In some embodiments, the heat sink 3 includes a top surface 32, a bottom surface 33, and a side enclosure 34 connecting the top surface 32 and the bottom surface 33. The bottom surface 33 is in contact with the chip 2, the top surface 32 is exposed to the plastic layer 4, and the side enclosure 34 is provided with a first connection portion 31. The bottom surface 33 refers to the side facing the chip 2, which is in contact with the chip 2 and transfers the heat of the chip 2 to the heat sink 3. The top surface 32 is exposed to the air and dissipates the heat of the heat sink 3 to the air. In this way, the heat sink 3 can continuously absorb the heat of the chip 2 and play a role in reducing the temperature of the chip 2. The side enclosure 34 can be completely wrapped by the plastic layer 4, or partially wrapped by the plastic layer 4, but the first connection portion 31 is arranged on the part of the side enclosure 34 wrapped by the plastic layer 4, so that it can cooperate with the second connection portion 41 to form an interlocking structure, improve the connection strength, and reduce the risk of delamination or peeling at the interface.

[0045] The structural forms of the first connecting portion 31 and the second connecting portion 41 may include at least the following:

[0046] Reference Figure 2 and Figure 3 In the first embodiment, the first connection part 31 includes a concave groove 311 formed on the side periphery 34, and the second connection part 41 includes a convex part 411, and the convex part 411 extends into and fills the concave groove 311. That is, the concave groove 311 is formed on the side periphery 34 of the heat sink 3, and the second connection part 41 is the convex part 411 formed after the plastic sealing material fills the concave groove 311 and cools during the plastic sealing molding. The mechanical interlocking structure is formed by the cooperation of the concave groove 311 and the convex part 411, which increases the connection area, and the formed concave-convex cooperation structure is more difficult for water vapor to enter even when the interface is slightly split compared with the vertical interface in the prior art, which is conducive to maintaining the stability of the packaged product 10.

[0047] Reference Figure 2 and Figure 3 In some specific embodiments, the concave groove 311 is a square groove or an arc groove, and the shape of the protrusion 411 is adapted to the shape of the concave groove 311. The present invention does not specifically limit the shape of the concave groove 311, which can be a regular shape, such as an arc groove or a square groove, or a wavy shape, or an irregular shape. As long as the protrusion 411 can adapt to the shape of the concave groove 311, any structural form that is conducive to improving the bonding strength between the two is within the scope of the present invention.

[0048] In some specific embodiments, there are multiple recessed grooves 311, and multiple recessed grooves 311 are arranged around the side enclosure 34. There are also multiple raised portions 411, and multiple recessed grooves 311 are arranged one-to-one with multiple raised portions 411. In order to further improve the connection strength of the interface, there can be multiple recessed grooves 311, and multiple recessed grooves 311 are axially distributed around the central axis of the side enclosure 34. Of course, the recessed grooves 311 can also be arranged vertically along the central axis of the side enclosure 34. In this case, during the plastic sealing process, raised portions 411 equal in number to the recessed grooves 311 will also be formed, and each raised portion 411 corresponds to a recessed groove 311.

[0049] Reference Figure 2 In some specific embodiments, the concave groove 311 is a semicircular groove, and the diameter of the semicircular groove is H. The plastic encapsulation layer 4 is an epoxy resin layer, and the diameter of the silicon dioxide particles in the epoxy resin layer is L, then H>5L. In the utility model, the plastic encapsulation material can be epoxy resin, specifically epoxy resin containing silicon dioxide particles. Silicon dioxide is one of the most common fillers in epoxy resin, and has a wide range of particle sizes, generally 0.01 to 40 microns, which can be selected according to needs. It has good high temperature stability, chemical stability and low thermal expansion coefficient, and can improve the mechanical properties and heat resistance of epoxy resin. This embodiment sets the diameter of the semicircular groove to H, which is greater than 5 times the diameter of the silicon dioxide particles, in order to allow the silicon dioxide particles to effectively fill the concave groove 311, and further improve the bonding strength between the protrusion 411 of the plastic encapsulation layer 4 and the concave groove 311.

[0050] Reference Figure 4 and Figure 5 In the second embodiment, the first connection part 31 includes a protrusion 312 formed on the side circumference 34, and the second connection part 41 includes a groove 412, and the protrusion 312 extends into and fills the groove 412. The first connection part 31 can also be a protrusion 312, and the molding material wraps the protrusion 312 to form the groove 412 during molding. The connection strength of the interface between the heat sink 3 and the molding layer 4 is improved by the combination of the groove 412 and the protrusion 312. In addition, the present invention does not specifically limit the shape and number of the groove 412 and the protrusion 312, as long as the shapes of the two are compatible.

[0051] Reference Figure 6 and Figure 7 In the third embodiment, the side wall 34 is formed with a step 313, and the entire heat sink 3 is T-shaped. The step 313 can also be regarded as a part of a protrusion or a depression, which can form a mechanical interlocking structure with the plastic sealing layer 4, thereby improving the connection strength of the interface and reducing the risk of delamination or peeling.

[0052] Reference Figure 6In some specific embodiments, the step 313 includes a first step 3131 and a second step 3132 disposed on the first step 3131. The size of the first step 3131 is larger than that of the second step 3132. The side of the first step 3131 away from the second step 3132 is in contact with the chip 2, and the side of the second step 3132 away from the first step 3131 is exposed to the plastic packaging layer 4. The size of the first step 3131 is designed to be larger in order to increase the contact area with the chip 2 and improve the efficiency of heat conduction from the chip 2 to the heat sink 3. Of course, referring to Figure 7 , the size of the first step 3131 can also be designed to be smaller, and the size of the second step 3132 can be designed to be larger, so that the heat dissipation efficiency of the heat dissipation from the heat sink 3 to the air can be improved. Of course, in addition to this, multiple steps can also be designed, such as three steps or four steps, and those skilled in the art can set them according to actual needs.

[0053] In the fourth embodiment, the first connection portion 31 includes a first sawtooth formed on the side circumference 34, and the second connection portion 41 includes a second sawtooth matched with the first sawtooth. The sawtooth shape is equivalent to forming a plurality of protrusions and depressions arranged at intervals, and the depression of the first sawtooth matches the protrusion of the second sawtooth, and the protrusion of the first sawtooth matches the depression of the second sawtooth, which improves the stability of the connection, makes it difficult for water vapor to corrode the internal chip 2 through the interface, and also improves the reliability of the packaged product 10.

[0054] In some embodiments, the heat sink 3 is a copper sheet, and the bottom surface 33 of the copper sheet is attached to the surface of the chip 2. The heat sink 3 is generally made of a material with good thermal conductivity, which can be a metal material, such as a copper sheet. The bottom surface 33 of the copper sheet is attached to the surface of the chip 2 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0055] According to some embodiments of the present invention, the present invention further provides an electronic device, which includes the above-mentioned packaged product 10, and the electronic device may be a smart wearable device such as headphones, mobile phones, bracelets or tablets, etc. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned packaged product 10, it at least has all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it; although the utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and description of the utility model. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A packaged product, characterized in that: It includes a plastic encapsulation layer, a substrate, and a chip arranged on the substrate. A heat sink in contact with the chip is arranged on the side of the chip facing away from the substrate. The chip is arranged in the plastic encapsulation layer, the heat sink is partially arranged in the plastic encapsulation layer, and the side of the heat sink facing away from the chip is exposed to the plastic encapsulation layer. The heat sink is provided with a first connecting part, and a second connecting part cooperating with the first connecting part is formed at a position of the plastic encapsulation layer corresponding to the first connecting part.

2. The packaged product according to claim 1, characterized in that: The heat sink comprises a top surface, a bottom surface and a side enclosure connecting the top surface and the bottom surface, the bottom surface is in contact with and connected to the chip, the top surface is exposed to the plastic packaging layer, and the side enclosure is provided with the first connecting portion.

3. The packaged product according to claim 2, characterized in that: The first connection portion includes a recessed groove formed in the side periphery, and the second connection portion includes a raised portion, and the raised portion extends into the recessed groove and fills the recessed groove.

4. The packaged product according to claim 3, characterized in that: The concave groove is a square groove or an arc groove, and the shape of the protrusion is adapted to the shape of the concave groove.

5. The packaged product according to claim 3, characterized in that: There are multiple recessed grooves, which are arranged around the side circumference. There are also multiple raised portions, which are arranged in one-to-one correspondence with the multiple recessed grooves and the multiple raised portions.

6. The packaged product according to any one of claims 3 to 5, characterized in that: The concave groove is a semicircular groove, and the diameter of the semicircular groove is denoted as H. The plastic encapsulation layer is an epoxy resin layer, and the diameter of the silicon dioxide particles in the epoxy resin layer is denoted as L, then H>5L.

7. The packaged product according to claim 2, characterized in that: The first connection portion includes a protrusion formed on the side periphery, and the second connection portion includes a groove, and the protrusion extends into the groove and fills the groove.

8. The packaged product according to claim 2, characterized in that: The side perimeter is formed with a step.

9. The packaged product according to claim 8, characterized in that: The step includes a first step and a second step arranged on the first step, the size of the first step is larger than that of the second step, the side of the first step away from the second step is in contact with the chip, and the side of the second step away from the first step is exposed to the plastic packaging layer.

10. The packaged product according to claim 2, characterized in that: The first connecting portion includes a first sawtooth formed on the side periphery, and the second connecting portion includes a second sawtooth matched with the first sawtooth.

11. The packaged product according to any one of claims 1 to 5, characterized in that: The heat sink is a copper sheet, and the bottom surface of the copper sheet is attached to the surface of the chip.

12. An electronic device, characterized in that: The electronic device comprises the packaged product according to any one of claims 1 to 11.

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