Electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of waveguides, and discloses an electronic device which comprises a shell and a chip located in the shell, the shell is provided with a front panel, a first heat dissipation hole is formed in the front panel, the electronic device further comprises a waveguide assembly, and the waveguide assembly comprises a first waveguide piece and a second waveguide piece which are connected with each other. The first waveguide piece is provided with a second heat dissipation hole communicated with the first heat dissipation hole. Third heat dissipation holes communicated with the second heat dissipation holes are formed in the second waveguide piece, and each third heat dissipation hole comprises a plurality of waveguide holes. The electronic equipment provided by the utility model can enable the waveguide assembly to generate an inhibition effect on the electromagnetic waves emitted by the chip on the premise of meeting the heat dissipation requirement of the electronic equipment, and can effectively reduce the outward radiation intensity of the electromagnetic waves, thereby effectively reducing the electromagnetic wave radiation of the electronic equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of waveguides, in particular to an electronic device. Background Art

[0002] Data center switches are used to connect servers, storage devices, network devices (such as routers, firewalls) and other IT equipment in the data center to achieve network interconnection.

[0003] Data center switches include switching chips, which are used to exchange and process data and are the most important components in data center switches. Switch chips usually operate at high frequencies, and high-frequency switching chips are prone to excessive radiation during operation. Therefore, in the design of data center switches, radiation protection design is usually required. At present, the size and number of openings on the switch housing are usually reduced to attenuate electromagnetic waves in the small holes to reduce radiation.

[0004] However, when the switch is working, heat needs to be dissipated through the openings on the shell. If the size of the openings is too small, the heat dissipation and cooling of the switch will be affected. Utility Model Content

[0005] In view of this, the utility model provides an electronic device, which can enable the waveguide component to effectively reduce the intensity of electromagnetic waves radiated outward while meeting the heat dissipation requirements of the electronic device, thereby effectively reducing the electromagnetic wave radiation of the electronic device.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the embodiment of the present application is implemented as follows:

[0007] The present application provides an electronic device, comprising a housing and a chip located in the housing;

[0008] The housing has a front panel, and a first heat dissipation hole is formed on the front panel;

[0009] Also included is a waveguide assembly, the waveguide assembly being located in the housing and opposite to the front panel;

[0010] The waveguide assembly comprises a first waveguide component and a second waveguide component connected to each other, the first waveguide component is provided with a second heat dissipation hole, and the second heat dissipation hole is opposite to and connected with the first heat dissipation hole;

[0011] The second waveguide component is provided with a third heat dissipation hole, and the third heat dissipation hole is aligned with the second heat dissipation hole. Each of the third heat dissipation holes includes a plurality of waveguide holes, and the plurality of waveguide holes are arranged in M ​​rows and N columns, wherein M is greater than or equal to 2, and N is greater than or equal to 2.

[0012] In the embodiment of the present application, the third heat dissipation hole on the second waveguide component includes a plurality of waveguide holes, so that the third heat dissipation hole can be divided into a plurality of waveguide holes arranged in a row, and the electromagnetic waves emitted by the chip during operation can be attenuated after passing through the waveguide holes. In this way, the waveguide component can suppress the electromagnetic waves emitted by the chip while meeting the heat dissipation requirements of the electronic device, and can effectively reduce the intensity of the electromagnetic waves radiated outward, thereby effectively reducing the electromagnetic wave radiation of the electronic device.

[0013] In a possible implementation, each of the third heat dissipation holes includes four waveguide holes, and the four waveguide holes are evenly arranged in two rows and two columns.

[0014] In a possible implementation, the first heat dissipation hole, the second heat dissipation hole, the third heat dissipation hole, and the waveguide hole are all rectangular.

[0015] In a possible implementation, a first rib is provided between two adjacent third heat dissipation holes, a second rib is provided between two adjacent waveguide holes in the third heat dissipation holes, and a width of the first rib is greater than a width of the second rib.

[0016] In a possible implementation, the side length of the waveguide hole is 1.5 mm to 2 m.

[0017] In a possible implementation, the side length of the second heat dissipation hole is 3 mm to 4 mm.

[0018] In a possible implementation, the second waveguide is embedded in the first waveguide, and the first waveguide and the second waveguide are connected by bolt fasteners.

[0019] In a possible implementation manner, the thickness of the first waveguide is 5 mm to 15 mm.

[0020] In a possible implementation manner, the thickness of the second waveguide is 3 mm to 12 mm.

[0021] In one possible implementation, the electronic device is a data center switch. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of a waveguide assembly provided in an embodiment of the present application;

[0025] Figure 3 A rear view of a waveguide assembly provided in an embodiment of the present application;

[0026] Figure 4 for Figure 3 Enlarged view of area A in the middle;

[0027] Figure 5 An enlarged view of the third heat dissipation hole provided in an embodiment of the present application;

[0028] Figure 6 A cross-sectional view of a waveguide assembly provided in an embodiment of the present application;

[0029] Figure 7 A side cross-sectional view of a waveguide assembly provided in an embodiment of the present application;

[0030] Figure 8 A side cross-sectional view of a first waveguide provided in an embodiment of the present application;

[0031] Fig. 9 A side cross-sectional view of a second waveguide provided in an embodiment of the present application;

[0032] Fig.10 A front view of a second waveguide provided in an embodiment of the present application;

[0033] Fig.11 A schematic diagram of dimension marking of a waveguide component provided in an embodiment of the present application;

[0034] Fig.12 Another dimension-marking schematic diagram of a waveguide assembly provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100- electronic equipment;

[0037] 110-housing; 111-front panel; 112-first heat dissipation hole;

[0038] 120-waveguide assembly; 121-first waveguide member; 1211-second heat dissipation hole;

[0039] 1212-third rib; 122-second waveguide; 1221-third heat dissipation hole;

[0040] 12211- waveguide hole; 12212- second rib; 1222- first rib;

[0041] 123-shrapnel structure. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0043] As mentioned in the above background technology, a data center switch includes a switching chip, which is used to exchange and process data and is the most important component in a data center switch. The operating frequency of the switching chip is usually high. For example, the operating main frequency of the switching chip is usually 25.78GHz or 26.56GHz. The high-frequency switching chip is easy to radiate excessively during operation. Therefore, in the design of data center switches, radiation protection design is usually required. For example, in the relevant technology, the size and number of openings on the switch housing are usually reduced. When the size of the opening is less than a certain value, the electromagnetic wave will be attenuated during the conduction in the hole to reduce the radiation of the electromagnetic wave.

[0044] However, the switch generates a lot of heat during operation, and the switch has high requirements for heat dissipation. If the number and size of the openings on the shell are too small, it will seriously affect the heat dissipation and cooling of the switch, thereby affecting the normal operation of the switch.

[0045] In order to solve the above problems, the embodiment of the present application provides an electronic device, by making the third heat dissipation hole on the second waveguide component include multiple waveguide holes, the third heat dissipation hole can be divided into multiple waveguide holes arranged in a row, and the electromagnetic waves emitted by the chip during operation can be attenuated after passing through the waveguide holes. In this way, the waveguide component can suppress the electromagnetic waves emitted by the chip while meeting the heat dissipation requirements of the electronic device, and can effectively reduce the intensity of the electromagnetic waves radiated outward, thereby effectively reducing the electromagnetic wave radiation of the electronic device.

[0046] An electronic device provided in an embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0047] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, Figure 2 A schematic diagram of the structure of a waveguide assembly provided in an embodiment of the present application is shown in FIG. Figure 3 A rear view of a waveguide assembly provided in an embodiment of the present application, Figure 4 for Figure 3 A magnified view of area A in the middle. Figure 5 This is an enlarged view of the third heat dissipation hole provided in the embodiment of the present application. Figure 6A cross-sectional view of a waveguide assembly provided in an embodiment of the present application.

[0048] The embodiment of the present application provides an electronic device 100, which may be a data center switch, or may be any other electronic device with a high-frequency chip. The following description will be made by taking the electronic device 100 as a data center switch as an example.

[0049] See also Figure 1 As shown, the electronic device 100 may include a housing 110 and a chip (not shown) located in the housing 110. For example, the chip may be a switching chip, and the chip may be used to exchange and process data. The housing 110, as a carrier of the electronic device 100, may include the chip and other components forming the electronic device 100.

[0050] Among them, the shell 110 can have a front panel 111, and a first heat dissipation hole 112 can be opened on the front panel 111. The first heat dissipation hole 112 can be used for heat dissipation and cooling. The heat generated during the operation of the electronic device 100 can be dissipated outward through the first heat dissipation hole 112 to cool the components inside the electronic device 100, so as to improve the working stability of the electronic device 100.

[0051] For example, according to the heat dissipation requirements of the electronic device 100, a plurality of first heat dissipation holes 112 may be provided on the front panel 111. Figure 1 As shown in FIG. 1 , the first heat dissipation holes 112 are arranged in a form of multiple rows and columns, and the size of the first heat dissipation holes 112 can be larger to meet the heat dissipation requirements of the electronic device 100 .

[0052] See also Figure 2 and Figure 3 As shown, the electronic device 100 may further include a waveguide component 120, which may be located inside the housing 110 and opposite to the front panel 111 on the housing 110, and the waveguide component 120 may include a first waveguide member 121 and a second waveguide member 122 that are connected to each other, and a second heat dissipation hole 1211 is provided on the first waveguide member 121, and the second heat dissipation hole 1211 may be opposite to and connected to the first heat dissipation hole 112, and the heat generated by the electronic device 100 may be exchanged with the external cold air through the second heat dissipation hole 1211 and the first heat dissipation hole 112 in turn to achieve heat dissipation and cooling of the electronic device 100.

[0053] For example, a heat exchange fan can be provided in the electronic device 100, and the heat exchange fan can draw air inside the shell, so that the external cold air can enter the shell 110 through the first heat dissipation hole 112 and the second heat dissipation hole 1211 in sequence to exchange heat with the air in the shell 110, thereby achieving heat dissipation and cooling of the electronic device 100.

[0054] Combination Figure 4 and Figure 5 As shown, the second waveguide 122 is provided with a third heat dissipation hole 1221, and the third heat dissipation hole 1221 can be aligned with the second heat dissipation hole 1211. The third heat dissipation hole 1221 can perform heat dissipation and cooling, and the external cold air can enter the housing 110 of the electronic device 100 through the first heat dissipation hole 112, the second heat dissipation hole 1211 and the third heat dissipation hole 1221 in sequence to perform heat exchange with the air in the housing 110, so as to achieve heat dissipation and cooling of the electronic device 100.

[0055] The third heat dissipation hole 1221 may include a plurality of waveguide holes 12211, and the plurality of waveguide holes 12211 may be arranged in the form of M rows and N columns, wherein M may be greater than or equal to 2, and N may be greater than or equal to 2. For example, it can be understood that the third heat dissipation hole 1221 is in a grid shape, and the third heat dissipation hole 1221 is divided into a plurality of waveguide holes 12211 arranged in an array. The frame between each waveguide hole 12211 is very small, and will not have much impact on heat dissipation. In this way, the third heat dissipation hole 1221 has a small aperture of each waveguide hole 12211 on the premise of meeting the heat dissipation requirements of the electronic device 100. For example, the size of the waveguide hole 12211 that can attenuate the electromagnetic wave can be calculated according to the working main frequency of the chip, and then the waveguide hole 12211 is set according to the calculated size of the waveguide hole 12211, so that the electromagnetic wave can be attenuated in the process of passing through the waveguide hole 12211, so as to reduce the intensity of the electromagnetic wave radiated outward, and can effectively reduce the electromagnetic wave radiation of the electronic device 100.

[0056] Compared with the solutions in the related art, the embodiment of the present application makes the third heat dissipation hole 1221 on the second waveguide 122 include a plurality of waveguide holes 12211, so that the third heat dissipation hole 1221 can be divided into a plurality of waveguide holes 12211 arranged in a row, and the electromagnetic waves emitted by the chip during operation can be attenuated after passing through the waveguide holes 12211. In this way, the waveguide component 120 can suppress the electromagnetic waves emitted by the chip while meeting the heat dissipation requirements of the electronic device 100, and can effectively reduce the intensity of the electromagnetic waves radiated outward, thereby effectively reducing the electromagnetic wave radiation of the electronic device 100.

[0057] The waveguide assembly 120 and the housing 110 may be connected in a detachable manner. When the first heat dissipation holes 112 on the front panel 111 of the electronic device 100 can achieve the radiation reduction effect while meeting the heat dissipation requirements, the waveguide assembly 120 may be removed from the housing 110. When the first heat dissipation holes 112 on the front panel 111 cannot meet the radiation reduction requirements, the waveguide assembly 120 may be reassembled in the housing 110. This can effectively improve the flexibility of the waveguide assembly 120.

[0058] The waveguide assembly 120 and the housing 110 may be connected by snap-fitting, buckling or bolt fasteners.

[0059] For example, see Figure 4 As shown, the waveguide component 120 may have a spring structure 123, and the shell 110 may have a slot that matches the spring structure 123. The spring structure 123 may be inserted into the slot of the shell 110 so that the waveguide component 120 may be connected through the cooperation between the spring structure 123 and the slot.

[0060] Figure 7 A side cross-sectional view of a waveguide assembly provided in an embodiment of the present application, Figure 8 A side cross-sectional view of a first waveguide provided in an embodiment of the present application, Fig. 9 A side cross-sectional view of a second waveguide provided in an embodiment of the present application.

[0061] See also Figure 7 As shown, the second waveguide 122 can be embedded in the first waveguide 121, for example, in combination with Figure 8 and Fig. 9 As shown, a cavity for accommodating the second waveguide 122 may be provided in the first waveguide 121, and the second waveguide 122 may be embedded in the cavity. The first waveguide 121 and the second waveguide 122 may be fixedly connected by bolt fasteners. For example, the second waveguide 122 may be firstly embedded in the first waveguide 121, and then the first waveguide 121 and the second waveguide 122 may be fixed together on the housing 110 of the electronic device 100 by bolt fasteners, so as to realize the installation and fixation of the first waveguide 121 and the second waveguide 122.

[0062] Fig.10 This is a front view of a second waveguide provided in an embodiment of the present application.

[0063] See also Fig.10 As shown, each third heat dissipation hole 1221 may include four waveguide holes 12211, and the four waveguide holes 12211 may be evenly arranged in the form of two rows and two columns. On the premise that the waveguide holes 12211 meet the size of electromagnetic wave attenuation, by making each third heat dissipation hole 1221 include four waveguide holes 12211, it is possible to avoid that the third heat dissipation hole 1221 is too large due to the excessive number of waveguide holes 12211 included in the third heat dissipation hole 1221, and the size of the third heat dissipation hole 1221 can be set more reasonably.

[0064] In the embodiment of the present application, the first heat dissipation hole 112, the second heat dissipation hole 1211, the third heat dissipation hole 1221 and the waveguide hole 12211 are all rectangular. For example, in the embodiment of the present application, the hole of the rectangular structure can make the distance between two adjacent holes smaller, which can improve the rationality of the arrangement of each hole structure (such as the front panel 111, the first waveguide 121 and the second waveguide 122), and improve the adequacy of the arrangement of the holes on the structure.

[0065] For example, taking the arrangement of the first heat dissipation holes 112 on the front panel 111 as an example, compared with the circular or other anisotropic structures, the rectangular structure of the first heat dissipation holes 112 can increase the distribution rate of the first heat dissipation holes 112 on the front panel 111, so that the first heat dissipation holes 112 can fully cover the front panel 111, thereby effectively improving the heat dissipation efficiency of the front panel 111. Correspondingly, the second heat dissipation holes 1211, the third heat dissipation holes 1221 and the waveguide holes 12211 of the rectangular structure also have the above advantages, which will not be repeated here.

[0066] For example, the first heat dissipation hole 112 , the second heat dissipation hole 1211 , the third heat dissipation hole 1221 , and the waveguide hole 12211 may all be square.

[0067] Continue to see Fig.10 As shown, a first rib 1222 may be provided between two adjacent third heat dissipation holes 1221, a second rib 12212 may be provided between two adjacent waveguide holes 12211 in the third heat dissipation hole 1221, and the width of the first rib 1222 may be greater than the width of the second rib 12212. The first rib 1222 is located in the third heat dissipation hole 1221, and is used to decompose the third heat dissipation hole 1221. The width may be set to be relatively small, so that the width of the first rib 1222 is not too large to affect the heat dissipation effect of the third heat dissipation hole 1221.

[0068] The first rib 1222 is aligned with the ribs between the second heat dissipation holes 1211 on the first waveguide 121, and will not adversely affect the heat dissipation of the third heat dissipation holes 1221. Therefore, while meeting the heat dissipation requirements of the third heat dissipation holes 1221, the width of the first rib 1222 can be set wider, which can improve the strength and rigidity of the first rib 1222 and help improve the structural stability of the second waveguide 122.

[0069] Fig.11 A schematic diagram of dimension marking of a waveguide component provided in an embodiment of the present application, Fig.12 Another dimension-marking schematic diagram of a waveguide assembly provided in an embodiment of the present application.

[0070] See also Fig.11As shown, a third rib 1212 may be provided between two adjacent second heat dissipation holes 1211, and the width of the first rib 1222 may be smaller than the third rib 1212. Since the first rib 1222 between the waveguide holes 12211 occupies the internal space of the third heat dissipation hole 1221, it will affect the heat dissipation effect of the third heat dissipation hole 1221 to a certain extent. Therefore, by making the width of the first rib 1222 smaller than the width of the third rib 1212, the effective heat dissipation channel of the third heat dissipation hole 1221 can be increased, and the effective heat dissipation channel of the third heat dissipation hole 1221 can be kept equal to the effective heat dissipation channel of the second heat dissipation hole 1211, which can effectively reduce or avoid the adverse effect of the second rib 12212 on the heat dissipation effect of the third heat dissipation hole 1221.

[0071] Continue to see Fig.11 As shown, in the embodiment of the present application, the side length a of the second heat dissipation hole 1211 can be 3mm to 4mm, for example, the side length of the second heat dissipation hole 1211 can be 3mm, 3.5mm, or 4mm. This can effectively improve the heat dissipation effect of the second heat dissipation hole 1211 and improve the overall heat dissipation efficiency of the electronic device 100.

[0072] Continue to see Fig.11 As shown, the side length D of the waveguide hole 12211 can be 1.5 mm to 2 m. For example, the side length of the waveguide hole 12211 can be 1.5 mm, 1.75 mm, 2 m, etc. The waveguide hole 12211 within this size range has a good attenuation effect on high-frequency signals and can effectively improve the radiation resistance of the electronic device 100.

[0073] Continue to see Fig.11 As shown, the difference between the width of the first rib 1222 and the third rib 1212 can be 2h1, h1 can be 0.2mm, that is, the difference between the width of the first rib 1222 and the third rib 1212 is 0.4mm. The width of the second rib 12212 can be h2, and the value of h2 can be 0.4mm. That is, h2=2h1, so that the difference between the first rib 1222 and the third rib 1212 can compensate for the space occupied by the second rib 12212 in the third heat dissipation hole 1221, so that the overall heat dissipation effect of the third heat dissipation hole 1221 is consistent with the heat dissipation effect of the second heat dissipation hole 1211.

[0074] Among them, see Fig.12As shown, the thickness T of the first waveguide 121 can be 5 mm to 15 mm. Since the second waveguide 122 is embedded in the first waveguide 121, the second waveguide 122 no longer occupies a dimension in the thickness direction. Therefore, the thickness T of the first waveguide 121 is the thickness dimension of the entire waveguide assembly 120. This dimension can effectively reduce the size of the waveguide assembly 120 while satisfying the isolation and attenuation of electromagnetic waves by the waveguide assembly 120, which helps to reduce the space occupied by the waveguide assembly 120 in the housing 110 of the electronic device 100, and can effectively improve the spatial layout inside the electronic device 100.

[0075] The thickness t of the second waveguide 122 can be 3 mm to 12 mm. For example, the thickness of the second waveguide 122 can be 3 mm, 5 mm, 8 mm, 12 mm, etc. When the electromagnetic wave propagates through the waveguide hole 12211, the thickness of the second waveguide 122 is the longitudinal depth of the electromagnetic wave, and this value can affect the shielding effect of the second waveguide 122 on the electromagnetic wave. By making the thickness of the second waveguide 122 fall within the above range, the shielding effect of the second waveguide 122 on the electromagnetic wave can be improved, and the radiation protection performance of the electronic device 100 can be improved.

[0076] The shielding effectiveness and heat dissipation performance of the waveguide assembly 120 provided in the embodiment of the present application are verified by using a numerical formula. For example, the side length D of the waveguide hole 12211 is 1.75 mm, and the thickness of the second waveguide 122 is 0.5 mm. Fig.11 The difference between the side length D of the waveguide hole 12211 and the half side length d of the second heat dissipation hole 1211 is h1 (ie 0.2 mm), that is, Fig.11 The size of d in the middle is 1.55mm.

[0077] The working main frequency of the chip is usually 25.78 GHz or 26.56 GHz. This application embodiment will be verified by taking 26.56 GHz as an example. According to the wavelength formula:

[0078] λ=v / f=3×10 8 / 26.5×10 9 =0.0113m

[0079] Among them, λ is the wavelength of the chip's working electromagnetic wave, v is the speed of light, and f is the chip's working frequency. According to the above formula, the wavelength of the chip's working electromagnetic wave can be calculated to be 0.0113m. According to the quarter-wavelength theorem, the opening size l of the waveguide hole 12211 through which the electromagnetic wave passes needs to be smaller than a quarter of the wavelength, that is, l<λ / 4=2.82mm, that is, the maximum size of the waveguide hole 12211 needs to be smaller than 2.82 to have a shielding effect on the electromagnetic wave, otherwise it will have no shielding effect on the electromagnetic wave of this frequency.

[0080] Since the shape of the waveguide hole 12211 is a square, the side length of the waveguide hole 12211 is Therefore, in the embodiment of the present application, the side length D of the waveguide hole 12211 is 1.75 mm, which meets the above-mentioned size requirements and can shield the electromagnetic wave signal.

[0081] As for heat dissipation performance, since the diameter of the heat dissipation hole (or the diagonal length if it is a rectangular hole) needs to be greater than or equal to 3mm to meet the heat dissipation requirements, the above deduction shows that the side length d of the second heat dissipation hole 1211 is 1.55mm. Therefore, it can be calculated that the side length of the second heat dissipation hole 1211 is 2d+h2=1.55mm×2+0.4=3.5mm. That is, the diagonal length L of the second heat dissipation hole 1211 is It can be seen that the size of the second heat dissipation hole 1211 meets the heat dissipation requirement.

[0082] The shielding effectiveness S of the second waveguide 122 is calculated according to the shielding effectiveness formula in Chapter 6.11 of "Electromagnetic Compatibility Engineering":

[0083] S=27.2×t / l

[0084] Wherein, S is the shielding effectiveness of the waveguide hole 12211, t is the longitudinal depth of the waveguide of the waveguide hole 12211, that is, the thickness of the second waveguide member 122, which is 0.005 m here, and l is the diagonal length of the square waveguide, that is, Substituting the above values ​​into the shielding effectiveness formula, it can be concluded that the shielding effectiveness S of the waveguide hole 12211 is 55.1 dB, which shows that the waveguide hole 12211 has a very high shielding effectiveness.

[0085] The shielding performance of the second waveguide 122 is verified in terms of cut-off frequency. Cut-off frequency formula:

[0086] f c =149.86 / l=149.86 / 2.47=60.67GHz

[0087] The above formula can be used to calculate that the cutoff frequency of the waveguide hole 12211 is 60.67 GHz, that is, electromagnetic waves with frequencies less than the cutoff frequency will be shielded when passing through the waveguide hole 12211, and the operating main frequency of the chip in the electronic device 100 is 25.78 GHz or 26.56 GHz, which is much smaller than the cutoff frequency calculated above. Therefore, the second waveguide 122 provided in the embodiment of the present application has a good shielding effect on electromagnetic waves of the above frequency.

[0088] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more groups.

[0089] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0090] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0091] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0092] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0093] The serial numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments. The above are only preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic device, characterized in that: comprising a housing and a chip located in the housing; The housing has a front panel, and a first heat dissipation hole is formed on the front panel; Also included is a waveguide assembly, the waveguide assembly being located in the housing and opposite to the front panel; The waveguide assembly comprises a first waveguide component and a second waveguide component connected to each other, the first waveguide component is provided with a second heat dissipation hole, and the second heat dissipation hole is opposite to and connected with the first heat dissipation hole; The second waveguide component is provided with a third heat dissipation hole, and the third heat dissipation hole is aligned with the second heat dissipation hole. Each of the third heat dissipation holes includes a plurality of waveguide holes, and the plurality of waveguide holes are arranged in M ​​rows and N columns, wherein M is greater than or equal to 2, and N is greater than or equal to 2.

2. The electronic device according to claim 1, characterized in that: Each of the third heat dissipation holes includes four waveguide holes, and the four waveguide holes are evenly arranged in two rows and two columns.

3. The electronic device according to claim 2, characterized in that: The first heat dissipation hole, the second heat dissipation hole, the third heat dissipation hole and the waveguide hole are all rectangular.

4. The electronic device according to claim 3, characterized in that: A first rib is provided between two adjacent third heat dissipation holes, a second rib is provided between two adjacent waveguide holes in the third heat dissipation holes, and a width of the first rib is greater than a width of the second rib.

5. The electronic device according to any one of claims 2 to 4, characterized in that: The side length of the waveguide hole is 1.5 mm to 2 mm.

6. The electronic device according to any one of claims 1 to 4, characterized in that: The side length of the second heat dissipation hole is 3 mm to 4 mm.

7. The electronic device according to any one of claims 1 to 4, characterized in that: The second waveguide is embedded in the first waveguide, and the first waveguide and the second waveguide are connected by bolt fasteners.

8. The electronic device according to any one of claims 1 to 4, characterized in that: The thickness of the first waveguide is 5 mm to 15 mm.

9. The electronic device according to claim 8, characterized in that: The thickness of the second waveguide is 3 mm to 12 mm.

10. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device is a data center switch.

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