PCB processor with double-cavity structure

Abstract

The utility model discloses a PCB (Printed Circuit Board) processor with a double-cavity structure, which comprises a plasma gas source generator, a first plasma processing cavity and a second plasma processing cavity, and a main gas source pipeline is arranged on the top side of the plasma gas source generator; the main gas source pipeline is provided with a first branch pipeline for dividing a gas source into two paths which are respectively communicated with the first plasma processing cavity and a second branch pipeline which is communicated with the second plasma processing cavity; a first stop valve is arranged on the first branch pipeline, and a second stop valve is arranged on the second branch pipeline; the two plasma processing cavities are switched and controlled by one plasma gas source generator through sequential replacement opening of the two branch pipelines, etching processing and degumming cleaning are carried out on a PCB, and the processing quality and the production efficiency are effectively improved.

Description

[Technical field]

[0001] The utility model relates to a plasma processing technology for a PCB board, in particular to a PCB board processing machine with a double-cavity structure. [Background technology]

[0002] PCB plasma treatment is a method of surface treatment of PCB circuit boards using plasma technology. PCB plasma treatment uses high-energy plasma to clean, activate and modify the surface of PCB. This is because, first, plasma can effectively remove organic pollutants, oxides and other impurities on the surface of PCB boards, making the surface clean; second, plasma treatment can activate the surface of PCB boards, increase its surface energy, and improve the adhesion of coating, bonding or plating; third, through plasma treatment, functional groups can be introduced into the surface of PCB boards, the surface chemical properties can be changed, and specific surface functionalization can be achieved. Therefore, the plasma treatment technology of PCB boards has important applications in PCB manufacturing and welding processes, and can effectively improve the quality, reliability and performance of PCB boards; at the same time, in the plasma treatment process of PCB boards, it is also necessary to select appropriate plasma treatment parameters according to the specific PCB materials and process requirements to ensure the best treatment effect.

[0003] However, the existing plasma processing mode of PCB boards generally only uses a plasma processing machine in one working chamber to synchronously process PCB boards in different process stages. For example, in one working chamber, the process parameters of the PCB board after plasma cleaning or plasma degumming are directly converted to perform etching processing on the PCB board. This easily causes the impurities remaining from the previous process or the reserved waste gas in the working chamber to be difficult to clean up during the processing, and inevitably directly introduce them into the processing of the next process. The plasma processing of PCB boards often requires plasma processing under strict conditions, and has relatively high requirements for the process environment of cleaning or etching. Therefore, in the existing plasma processing process of PCB boards, the processing mode of one chamber cannot effectively guarantee the provision of good etching quality and through-hole contaminant removal effect. [Contents of the utility model]

[0004] The embodiment of the utility model provides a PCB board processing machine with a dual-chamber structure. During the PCB board processing process, plasma processing is performed on the PCB board through different chambers respectively, which effectively avoids environmental pollution and effectively improves the processing quality and processing efficiency.

[0005] The technical solution adopted by at least one embodiment of the utility model is:

[0006] A PCB board processing machine with a dual-chamber structure, used for plasma degumming, cleaning and etching of PCB boards, comprising a plasma gas source generator, a first plasma processing chamber and a second plasma processing chamber, wherein the plasma gas source generator is arranged at the lower side of the first plasma processing chamber and the second plasma processing chamber;

[0007] A main gas source pipeline for outputting the plasma gas source is arranged on the top side of the plasma gas source generator;

[0008] The main gas source pipeline is installed with a first branch pipeline that branches the gas source into two branches, a first branch pipeline that is connected to the first plasma processing chamber and a second branch pipeline that is connected to the second plasma processing chamber respectively;

[0009] The first branch pipeline is provided with a first stop valve for controlling the on-off of the pipeline;

[0010] The second branch pipeline is provided with a second stop valve for controlling the on-off of the pipeline;

[0011] The gas source generated by the plasma gas source generator sequentially passes through the main gas source pipeline, the first branch pipeline and the first stop valve into the first plasma processing chamber to perform etching processing on the PCB board;

[0012] The first stop valve controls the closure of the first branch pipeline, and the PCB board after etching in the first plasma processing chamber is transferred to the second plasma processing chamber. The second stop valve controls the opening of the second branch pipeline, and the gas source generated by the plasma gas source generator sequentially passes through the main gas source pipeline, the second branch pipeline and the second stop valve into the second plasma processing chamber to remove the glue and clean the PCB board after etching.

[0013] Preferably, the first plasma processing chamber and the second plasma processing chamber are horizontally arranged in parallel on both sides of the main gas source pipeline on the plasma gas source generator.

[0014] Preferably, the first plasma processing chamber and the second plasma processing chamber are both rectangular box structures, and an inlet and outlet for the PCB board to enter and exit are arranged on the front side of the box structure.

[0015] Preferably, the inlet and outlet of the first plasma processing chamber and the inlet and outlet of the second plasma processing chamber are located on the same side and are parallel to each other.

[0016] The beneficial effects of the utility model are:

[0017] In the utility model, by sequentially replacing and opening two branch pipelines, a plasma gas source generator can switch and control two plasma processing chambers, and the PCB board can be etched and debonded and cleaned respectively, which effectively ensures the working environment for PCB board processing and effectively improves processing quality and production efficiency.

Brief Description of the Drawings

[0018] Figure 1 It is a main perspective structural schematic diagram of the utility model;

[0019] Figure 2 It is a schematic diagram of the top view structure of the utility model;

[0020] Figure 3 It is a side structural schematic diagram of the utility model. [Specific implementation method]

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] This embodiment provides a PCB board processing machine with a dual-cavity structure, such as Figures 1 to 3 As shown, it is used for plasma degumming, cleaning and etching of PCB boards, including a plasma gas source generator 1, a first plasma processing chamber 2 and a second plasma processing chamber 3. The plasma gas source generator 1 adopts a box-type structure, and four universal casters 4 for easy movement, four leveling knob seats 5 for leveling and positioning, and four angle iron pieces 6 fixed to the ground by bolts are also arranged on the four feet at the bottom of the plasma gas source generator 1; the plasma gas source generator 1 is arranged on the lower side of the first plasma processing chamber 2 and the second plasma processing chamber 3; the first plasma processing chamber 2 and the second plasma processing chamber 3 are both rectangular box structures, and an inlet and outlet 7 for PCB boards to enter and exit is arranged on the front side of the front of the box structure.

[0023] Continue as Figures 1 to 3As shown, a main gas source pipeline 8 for plasma gas source output is arranged on the top side of the plasma gas source generator 1, and the first plasma processing chamber 2 and the second plasma processing chamber 3 are arranged horizontally and side by side on both sides of the main gas source pipeline 8 on the plasma gas source generator 1; the main gas source pipeline 8 is installed with a first branch pipeline 9 which branches the gas source into two paths respectively connected to the first plasma processing chamber 2 and the second branch pipeline 10 which is connected to the second plasma processing chamber 3, the first branch pipeline 9 is provided with a first stop valve 11 for controlling the on-off of the pipeline, and the second branch pipeline 10 is provided with a second stop valve 12 for controlling the on-off of the pipeline; wherein the first stop valve 11 and the second stop valve 12 are both electrically controlled stop valves, and the inlet and outlet port 7 of the first plasma processing chamber 2 and the inlet and outlet port 7 of the second plasma processing chamber 3 are located on the same side, and are parallel to each other and arranged side by side.

[0024] During operation, the gas source generated by the plasma gas source generator 1 passes through the main gas source pipeline 8, the first branch pipeline 9 and the first stop valve 11 in sequence, and enters the first plasma processing chamber 2 to etch the PCB board; when the first stop valve 11 controls the first branch pipeline 9 to be closed, the PCB board after the etching process in the first plasma processing chamber 2 is transferred to the second plasma processing chamber 3, and the second stop valve 12 controls the second branch pipeline 10 to be opened, and the gas source generated by the plasma gas source generator 1 passes through the main gas source pipeline 8, the second branch pipeline 10 and the second stop valve 12 in sequence, and enters the second plasma processing chamber 3 to remove the glue and clean the PCB board after the etching process.

[0025] In this embodiment, by sequentially replacing and opening two branch pipelines, a plasma gas source generator 1 is used to control the orderly interval switching of the first plasma processing chamber 2 and the second plasma processing chamber 3, so that the etching processing and degumming cleaning of the PCB board are carried out in an orderly replacement cycle, and the PCB board is etched, which effectively ensures the working environment of the PCB board processing and effectively improves the processing quality and production efficiency.

[0026] In the description of the present utility model, it should be noted that the terms "top", "bottom", "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.

[0027] The above-described embodiments are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. All equivalent changes made based on the shape, structure and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A PCB board processing machine with a dual-chamber structure, used for plasma degumming, cleaning and etching of PCB boards, characterized in that: It comprises a plasma gas source generator, a first plasma processing chamber and a second plasma processing chamber, wherein the plasma gas source generator is arranged at the lower side of the first plasma processing chamber and the second plasma processing chamber; A main gas source pipeline for outputting the plasma gas source is arranged on the top side of the plasma gas source generator; The main gas source pipeline is installed with a first branch pipeline that branches the gas source into two branches, a first branch pipeline that is connected to the first plasma processing chamber and a second branch pipeline that is connected to the second plasma processing chamber respectively; The first branch pipeline is provided with a first stop valve for controlling the on-off of the pipeline; The second branch pipeline is provided with a second stop valve for controlling the on-off of the pipeline; The gas source generated by the plasma gas source generator sequentially passes through the main gas source pipeline, the first branch pipeline and the first stop valve into the first plasma processing chamber to perform etching processing on the PCB board; The first stop valve controls the closure of the first branch pipeline, and the PCB board after etching in the first plasma processing chamber is transferred to the second plasma processing chamber. The second stop valve controls the opening of the second branch pipeline, and the gas source generated by the plasma gas source generator sequentially passes through the main gas source pipeline, the second branch pipeline and the second stop valve into the second plasma processing chamber to remove the glue and clean the PCB board after etching.

2. A PCB board processing machine with a dual-chamber structure according to claim 1, characterized in that: The first plasma processing chamber and the second plasma processing chamber are arranged horizontally and in parallel on both sides of the main gas source pipeline on the plasma gas source generator.

3. A PCB board processing machine with a dual-chamber structure according to claim 2, characterized in that: The first plasma processing chamber and the second plasma processing chamber are both rectangular box structures, and an inlet and outlet for PCB boards to enter and exit are arranged on the front side of the box structure.

4. A PCB board processing machine with a dual-chamber structure according to claim 3, characterized in that: The inlet and outlet of the first plasma processing chamber and the inlet and outlet of the second plasma processing chamber are located on the same side and are parallel to each other.

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