Heat dissipation device and medical equipment

Abstract

The utility model provides a heat dissipation device and medical equipment, and the heat dissipation device is used for carrying out the heat dissipation of a heating assembly on heat production equipment, and comprises a first heat dissipation mechanism, a heat conduction part and a second heat dissipation mechanism. The first end of the heat conduction piece is connected with the first heat dissipation mechanism, and the second end of the heat conduction piece is connected with the second heat dissipation mechanism. The first heat dissipation mechanism is used for being connected with the heating assembly so as to receive heat generated by the heating assembly. The second heat dissipation mechanism is additionally arranged on the first heat dissipation mechanism, so that the heat dissipation efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and medical equipment. Background Art

[0002] The current heat dissipation device has a low heat dissipation efficiency due to its small contact area with the space.

[0003] In particular, the heat dissipation device used to dissipate heat from the detection module of the CT machine, because the detection module has a large power and thus generates a large amount of heat, if the heat dissipation treatment is not performed, the excessive heating of the detection module will lead to problems such as reduced image quality of the CT machine and increased radiation dose. The traditional heat dissipation device used to dissipate heat from the detection module of the CT machine usually increases the contact area with the space by increasing the volume, thereby improving the heat dissipation efficiency.

[0004] However, this method has the following defects: first, the heat dissipation efficiency of the heat dissipation device is not significantly improved; second, it is not applicable to scenarios with certain restrictions on volume space. Utility Model Content

[0005] The purpose of the present application is to provide a heat dissipation device and a medical device, which can improve the heat dissipation efficiency of the heat dissipation device by additionally providing a second heat dissipation mechanism on the first heat dissipation mechanism.

[0006] In a first aspect, the present application provides a heat dissipation device for dissipating heat from a heat-generating component on a heat-generating device; the device comprises a first heat dissipation mechanism, a heat conductor and a second heat dissipation mechanism; the first end of the heat conductor is connected to the first heat dissipation mechanism, and the second end of the heat conductor is connected to the second heat dissipation mechanism; the first heat dissipation mechanism is used to connect to the heat-generating component to receive the heat generated by the heat-generating component.

[0007] The heat dissipation device mentioned above improves the heat dissipation efficiency of the heat dissipation device by additionally arranging a second heat dissipation mechanism on the first heat dissipation mechanism.

[0008] In combination with the first aspect, optionally, the first heat dissipation mechanism includes a plurality of heat dissipation fins; there are gaps between the plurality of heat dissipation fins; and the first end of the heat conductor is connected to the gap of the first heat dissipation mechanism.

[0009] The heat dissipation device improves the heat dissipation efficiency of the first heat dissipation mechanism by arranging a plurality of heat dissipation fins on the first heat dissipation mechanism. In addition, by arranging the first end of the heat conductive member in the gap between the plurality of heat dissipation fins, the heat transfer efficiency between the first heat dissipation mechanism and the heat conductive member is improved. Finally, the heat dissipation efficiency of the heat dissipation device is further improved.

[0010] In combination with the first aspect, optionally, an assembly groove is provided on the first heat dissipation mechanism; the assembly groove is located in the gap between the plurality of heat dissipation fins and extends along the direction of the gap; the shape of the inner wall of the assembly groove is consistent with the outer shape of the first end of the heat conductor.

[0011] The heat dissipation device mentioned above avoids the influence on the layout of the heat dissipation fins by setting the assembly groove in the gap between a plurality of heat dissipation fins, thereby simplifying the manufacturing process of the heat dissipation device. In addition, by designing the inner wall of the assembly groove to be consistent with the shape of the first end of the heat conductive member, the assembly groove is better fitted with the first end of the heat conductive member, thereby further improving the heat transfer efficiency between the first heat dissipation mechanism and the heat conductive member. Finally, the heat dissipation efficiency of the heat dissipation device is further improved.

[0012] In combination with the first aspect, optionally, the second heat dissipation mechanism includes a plurality of heat dissipation fins; the heat dissipation fins include a first clamping portion and a second clamping portion; the first clamping portion of one of the heat dissipation fins is clamped with the second clamping portion of another of the heat dissipation fins.

[0013] The above-mentioned heat dissipation device, by providing a first clamping portion and a second clamping portion on the same heat dissipation fin, allows one of the heat dissipation fins to be clamped with the second clamping portion of another heat dissipation fin through its first clamping portion, or one of the heat dissipation fins to be clamped with the first clamping portion of another heat dissipation fin through its second clamping portion, thereby achieving assembly of the heat dissipation fins so that each heat dissipation fin has the same structure, reducing the number of molds to be opened, thereby facilitating the manufacture of the heat dissipation fins and reducing the manufacturing cost of the heat dissipation device provided by the present application.

[0014] In combination with the first aspect, optionally, the heat dissipating fin also includes a fin body; the first clamping portion includes a first extension portion extending outward from the fin body along the plane where the fin body is located; a through hole is provided between the first extension portion and the fin body; the second clamping portion includes a second extension portion extending from the fin body along the plane where the fin body is located to the through hole; when one of the heat dissipating fins is clamped with another of the heat dissipating fins, the first extension portion of one of the heat dissipating fins is bent toward the other of the heat dissipating fins and is hung on the second extension portion of the other of the heat dissipating fins.

[0015] The above-mentioned heat dissipation device has the first extension portion, the second extension portion and the fin body that can be coplanar before the heat dissipation fins are assembled to each other. Therefore, the structural design of the first extension portion and the second extension portion on the above-mentioned heat dissipation fin simplifies the opening of the mold for manufacturing the heat dissipation fins, facilitates the manufacturing of the heat dissipation fins, and further reduces the manufacturing cost of the heat dissipation device.

[0016] In combination with the first aspect, optionally, the heat dissipation fin has an upper surface and a lower surface, and is provided with heat dissipation holes; the heat dissipation holes penetrate the upper surface and the lower surface of the heat dissipation fin.

[0017] The heat dissipation device increases the surface area of ​​the heat dissipation fins by arranging heat dissipation holes on the heat dissipation fins, thereby improving the heat dissipation efficiency of the heat dissipation fins. Finally, the heat dissipation efficiency of the heat dissipation device is improved.

[0018] In combination with the first aspect, optionally, the heat dissipation fin also includes a fin body and a connecting portion; a connecting hole is provided on the fin body; the connecting portion extends from the hole wall of the connecting hole to outside the plane where the fin body is located; the heat conductor passes through the connecting hole and fits with the connecting portion.

[0019] In the above heat dissipation device, the connection portion around the connection hole is equivalent to the flange structure of the connection hole. The flange structure design increases the contact area between the heat dissipation fins and the heat conducting member, thereby improving the heat conduction efficiency between the heat dissipation fins and the heat conducting member. Finally, the heat dissipation efficiency of the heat dissipation device is further improved.

[0020] In combination with the first aspect, optionally, the heat-conducting member includes a first heat-conducting rod, a second heat-conducting rod and a third heat-conducting rod; the length direction of the first heat-conducting rod is parallel to the length direction of the second heat-conducting rod; one end of the third heat-conducting rod is connected to one end of the first heat-conducting rod, and the other end of the third heat-conducting rod is connected to one end of the second heat-conducting rod; the first end of the heat-conducting member includes an end of the first heat-conducting rod not connected to the third heat-conducting rod and an end of the second heat-conducting rod not connected to the third heat-conducting rod; the second end of the heat-conducting member includes an end of the first heat-conducting rod connected to the third heat-conducting rod, an end of the second heat-conducting rod connected to the third heat-conducting rod, and the third heat-conducting rod.

[0021] In the above heat dissipation device, the heat conducting member has a simple structure and is easy to manufacture. The third heat conducting rod plays a role of being hung on the first heat dissipation mechanism, thereby improving the connection stability and reliability between the heat conducting member and the first heat dissipation mechanism.

[0022] In combination with the first aspect, optionally, a length direction of the third heat conducting rod is perpendicular to a length direction of the first heat conducting rod.

[0023] The heat dissipation device described above has more options for the heat conductive member during the manufacturing process, for example, one can choose to manufacture the heat conductive member in an integrated manner, or one can choose to manufacture heat conductive rods with the same structure and shape, and select three of them to connect the heat conductive member structure described in this application by welding or other methods. Therefore, the manufacturing process of the heat conductive member is facilitated, thereby further reducing the manufacturing cost of the heat dissipation device.

[0024] In a second aspect, the present application provides a medical device, comprising the heat dissipation device described in the first aspect.

[0025] The above-mentioned medical device has the same beneficial effects as the first aspect or any optional implementation of the first aspect, which will not be described in detail here.

[0026] In summary, the heat dissipation device and medical equipment provided by the present application improve the heat dissipation efficiency of the heat dissipation device by additionally setting a second heat dissipation mechanism on the first heat dissipation mechanism. By setting the assembly groove in the gap between a plurality of heat dissipation fins, the influence on the layout of the heat dissipation fins is avoided, thereby simplifying the manufacturing process of the heat dissipation device. In addition, by designing that the inner wall of the assembly groove is consistent with the shape of the first end of the heat conductor, the assembly groove is better fitted with the first end of the heat conductor, thereby further improving the heat transfer efficiency between the first heat dissipation mechanism and the heat conductor. Finally, the heat dissipation efficiency of the heat dissipation device is further improved. By setting the first clamping portion and the second clamping portion on the same heat dissipation fin. Each heat dissipation fin has the same structure, which reduces the number of molds opened, thereby facilitating the manufacture of the heat dissipation fins and reducing the manufacturing cost of the heat dissipation device provided by the present application. Through the structural design of the flange, the contact area between the heat dissipation fin and the heat conductor is increased, thereby improving the heat conduction efficiency between the heat dissipation fin and the heat conductor. Finally, the heat dissipation efficiency of the heat dissipation device is further improved. In addition, the heat dissipation device provided by the present application also reduces its space occupation in the CT machine on the basis of improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A first stereoscopic diagram of a heat dissipation device provided in an embodiment of the present application;

[0029] Figure 2 A second stereoscopic diagram of the heat dissipation device provided in an embodiment of the present application;

[0030] Figure 3 A three-dimensional diagram of a first heat dissipation mechanism in a heat dissipation device provided in an embodiment of the present application;

[0031] Figure 4 A first stereoscopic view of the heat dissipation fins in the heat dissipation device provided in an embodiment of the present application;

[0032] Figure 5 A second stereoscopic view of the heat dissipation fins in the heat dissipation device provided in an embodiment of the present application;

[0033] Figure 6 A first stereoscopic diagram of the heat dissipation fins in the heat dissipation device provided by an embodiment of the present application in a state of being assembled to each other;

[0034] Figure 7 A second stereoscopic view of the heat dissipation fins in the heat dissipation device provided by the embodiment of the present application in a state of being assembled with each other;

[0035] Figure 8 A three-dimensional diagram of a heat-conducting member in a heat dissipation device provided in an embodiment of the present application.

[0036] Icons: 100, heat dissipation device; 110, first heat dissipation mechanism; 111, heat dissipation fins; 112, assembly groove; 120, heat conducting member; 121, first heat conducting rod; 122, second heat conducting rod 123, third heat conducting rod; 130, second heat dissipation mechanism; 131, heat dissipation fins; 1311, first clamping portion; 1312, second clamping portion; 1313, fin body; 1314, first extension portion; 1315, second extension portion; 1316, heat dissipation hole; 1317, connecting portion; 1318, connecting hole. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0041] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0042] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] Please refer to Figure 1 and Figure 2 , Figure 1 This is a first stereoscopic diagram of the heat dissipation device 100 provided in an embodiment of the present application; Figure 2 This is a second stereoscopic diagram of the heat dissipation device 100 provided in the embodiment of the present application. The heat dissipation device 100 provided in the embodiment of the present application can be used to dissipate heat from a heat generating component on a heat generating device; the heat dissipation device 100 can include a first heat dissipation mechanism 110, a heat conductive member 120, and a second heat dissipation mechanism 130; the first end of the heat conductive member 120 is connected to the first heat dissipation mechanism 110, and the second end of the heat conductive member 120 is connected to the second heat dissipation mechanism 130; the first heat dissipation mechanism 110 can be used to connect to the heat generating component to receive the heat generated by the heat generating component.

[0044] The heat generating device may be a detection module on a CT machine, or may be other types of heat generating devices having a heat generating component capable of generating heat.

[0045] The first heat dissipation mechanism 110 and the second heat dissipation mechanism 130 may have the same structure as the heat dissipation mechanism in a conventional heat dissipation device, or may have other structures, and may be made of aluminum, copper, etc.

[0046] The heat conducting member 120 may also be made of copper or aluminum, etc. It may be a solid heat conducting rod or a hollow heat conducting pipe.

[0047] The connection between the first heat dissipation mechanism 110 and the heating component can be screwed, clamped, welded, etc. The connection between the heat conduction member 120 and the first heat dissipation mechanism 110 and the second heat dissipation mechanism 130 can also be screwed, clamped, welded, etc.

[0048] In the above implementation process, the second heat dissipation mechanism 130 is additionally provided on the first heat dissipation mechanism 110 , thereby improving the heat dissipation efficiency of the heat dissipation device 100 .

[0049] Please continue to refer to Figure 1 and Figure 2 In some optional embodiments, the first heat dissipation mechanism 110 may include a plurality of heat dissipation fins 111 ; there may be gaps between the plurality of heat dissipation fins 111 ; and the first end of the heat conductor 120 may be connected to the gap of the first heat dissipation mechanism 110 .

[0050] That is, the first end of the heat conducting member 120 can be clamped in the gaps between the heat dissipating fins 111 on the first heat dissipating mechanism 110 .

[0051] In the above implementation process, the heat dissipation efficiency of the first heat dissipation mechanism 110 is improved by arranging a plurality of heat dissipation fins 111 on the first heat dissipation mechanism 110. In addition, the heat transfer efficiency between the first heat dissipation mechanism 110 and the heat dissipation member 120 is improved by arranging the first end of the heat conductive member 120 in the gap between the plurality of heat dissipation fins 111. Finally, the heat dissipation efficiency of the heat dissipation device 100 is further improved.

[0052] Please combine Figure 1 and Figure 2 Reference Figure 3 , Figure 3 1 is a three-dimensional diagram of the first heat dissipation mechanism 110 in the heat dissipation device 100 provided in the embodiment of the present application. In some optional embodiments, the first heat dissipation mechanism 110 may be provided with a mounting groove 112; the mounting groove 112 may be located in the gap between the plurality of heat dissipation fins 111 and may extend along the direction of the gap; the shape of the inner wall of the mounting groove 112 may be consistent with the shape of the first end of the heat conducting member 120.

[0053] The assembly groove 112 can be opened in the gap between several heat dissipating fins 111 according to the arrangement of the heat dissipating fins 111, and the shape of the inner wall of the assembly groove 112 is consistent with the shape of the first end of the heat conductive member 120, so that the assembly groove 112 can better fit with the first end of the heat conductive member 120.

[0054] The depth of the assembly groove 112 in the direction perpendicular to the plane in which it is located can be greater than 1 / 2 of the radial width of the heat conductor 120. In the above implementation process, by setting the assembly groove 112 in the gap between a number of heat dissipation fins 111, the influence on the layout of the heat dissipation fins 111 is avoided, thereby simplifying the manufacturing process of the heat dissipation device 100. In addition, by designing the inner wall of the assembly groove 112 to be consistent with the shape of the first end of the heat conductor 120, the assembly groove 112 is better fitted with the first end of the heat conductor 120, thereby further improving the heat transfer efficiency between the first heat dissipation mechanism 110 and the heat conductor 120. Finally, the heat dissipation efficiency of the heat dissipation device 100 is further improved.

[0055] Please refer to Figures 4 to 7 , Figure 4 This is a first stereoscopic view of the heat dissipation fins 131 in the heat dissipation device 100 provided in an embodiment of the present application; Figure 5 This is a second stereoscopic view of the heat dissipation fins 131 in the heat dissipation device 100 provided in the embodiment of the present application; Figure 6 This is a first stereoscopic diagram of the heat dissipation fins 131 in the heat dissipation device 100 provided in the embodiment of the present application in a state of being assembled with each other; Figure 7 This is a second stereoscopic diagram of the heat dissipation fins 131 in the heat dissipation device 100 provided in the embodiment of the present application when they are assembled with each other. In some optional embodiments, the second heat dissipation mechanism 130 may include a plurality of heat dissipation fins 131; the heat dissipation fins 131 may include a first clamping portion 1311 and a second clamping portion 1312; the first clamping portion 1311 of one heat dissipation fin 131 may be clamped with the second clamping portion 1312 of another heat dissipation fin 131.

[0056] The first clamping portion 1311 and the second clamping portion 1312 are structures such as clamping pieces, clamping grooves, clamping rings, and clamping pins known to those skilled in the art.

[0057] In the above-mentioned implementation process, by providing the first clamping portion 1311 and the second clamping portion 1312 on the same heat sink fin 131, one of the heat sink fins 131 can be clamped with the second clamping portion 1312 of another heat sink fin 131 through its first clamping portion 1311, or one of the heat sink fins 131 can be clamped with the first clamping portion 1311 of another heat sink fin 131 through its second clamping portion 1312, thereby achieving the assembly of the heat sink fins 131 so that each heat sink fin 131 has the same structure, reducing the number of molds to be opened, thereby facilitating the manufacture of the heat sink fins 131 and reducing the manufacturing cost of the heat sink 100 provided in the embodiment of the present application.

[0058] Please continue to refer to Figures 4 to 7In some optional embodiments, the heat dissipation fin 131 may also include a fin body 1313; the first clamping portion 1311 may include a first extension portion 1314 extending outward from the fin body 1313 along the plane where the fin body 1313 is located; a through hole may be provided between the first extension portion 1314 and the fin body 1313; the second clamping portion 1312 may include a second extension portion 1315 extending from the fin body 1313 along the plane where the fin body 1313 is located to the through hole; when one of the heat dissipation fins 131 is clamped with another of the heat dissipation fins 131, the first extension portion 1314 of one of the heat dissipation fins 131 may be bent toward the other of the heat dissipation fins 131, and may be hung on the second extension portion 1315 of the other of the heat dissipation fins 131.

[0059] In addition to having good thermal conductivity, the material used to manufacture the heat sink fins 131 may have good elasticity or toughness. Before the heat sink fins 131 manufactured by the mold are assembled with each other, the first extension portion 1314, the second extension portion 1315 and the fin body 1313 may be coplanar. During the assembly of the heat sink fins 131 with each other, based on the elasticity or toughness of the heat sink fins 131, the first extension portion 1314 is bent toward another heat sink fin 131 assembled with the heat sink fin 131, so that the first extension portion 1314 is hung on the second extension portion 1315 of the other heat sink fin 131.

[0060] In the above implementation process, since the first extension portion 1314, the second extension portion 1315 and the fin body 1313 can be coplanar before the heat dissipation fins 131 are assembled to each other, the structural design of the first extension portion 1314 and the second extension portion 1315 on the above-mentioned heat dissipation fins 131 simplifies the opening of the mold for manufacturing the heat dissipation fins 131, facilitates the manufacturing of the heat dissipation fins 131, and further reduces the manufacturing cost of the heat dissipation device 100.

[0061] Please continue to refer to Figures 4 to 7 In some optional implementations, the heat dissipation fin 131 may have an upper surface and a lower surface, and may be provided with heat dissipation holes 1316 ; the heat dissipation holes 1316 may penetrate the upper surface and the lower surface of the heat dissipation fin 131 .

[0062] In the above implementation process, by providing the heat dissipation holes 1316 on the heat dissipation fins 131, the surface area of ​​the heat dissipation fins 131 is increased, thereby improving the heat dissipation efficiency of the heat dissipation fins 131. Finally, the heat dissipation efficiency of the heat dissipation device 100 is improved.

[0063] Please refer to the figure, which is. In some optional embodiments, the heat sink 131 may also include a fin body 1313 and a connecting portion 1317; the fin body 1313 may be provided with a connecting hole 1318; the connecting portion 1317 may extend from the hole wall of the connecting hole 1318 to outside the plane where the fin body 1313 is located; the heat conductor 120 may pass through the connecting hole 1318 and may be attached to the connecting portion 1317.

[0064] That is to say, the heat conducting member 120 can be connected by penetrating into the connection hole 1318 on the heat dissipation fin 131 . The connection hole 1318 also has a flange and is attached to the surface of the heat conducting member 120 .

[0065] In the above implementation process, the connection portion 1317 around the connection hole 1318 is equivalent to the flange structure of the connection hole 1318. The contact area between the heat sink fins 131 and the heat conductor 120 is increased through the flange structure design, thereby improving the heat conduction efficiency between the heat sink fins 131 and the heat conductor 120. Finally, the heat dissipation efficiency of the heat sink 100 is further improved.

[0066] Please refer to Figure 8 , Figure 8 1 is a three-dimensional diagram of the heat conducting member 120 in the heat dissipation device 100 provided in the embodiment of the present application. In some optional embodiments, the heat conducting member 120 may include a first heat conducting rod 121, a second heat conducting rod 122 and a third heat conducting rod 123; the length direction of the first heat conducting rod 121 may be parallel to the length direction of the second heat conducting rod 122; one end of the third heat conducting rod 123 may be connected to one end of the first heat conducting rod 121, and the other end of the third heat conducting rod 123 may be connected to one end of the second heat conducting rod 122; the first end of the heat conducting member 120 may include an end of the first heat conducting rod 121 not connected to the third heat conducting rod 123 and an end of the second heat conducting rod 122 not connected to the third heat conducting rod 123; the second end of the heat conducting member 120 may include an end of the first heat conducting rod 121 connected to the third heat conducting rod 123, an end of the second heat conducting rod 122 connected to the third heat conducting rod 123 and the third heat conducting rod 123.

[0067] That is, the heat conducting member 120 may be a “U” shaped structure.

[0068] In the embodiment of the present application, the length of the assembly groove 112 in the length direction of the first heat conducting rod 121 can be 1 / 2 of the length of the first heat dissipation mechanism 110 in the same direction, or can be close to the length of the first heat dissipation mechanism 110 in the same direction.

[0069] As a preferred embodiment, the length of the matching groove 112 in the length direction of the first heat conducting rod 121 can be close to the length of the first heat dissipation mechanism 110 in the same direction, so as to increase the contact area between the heat conducting member 120 and the first heat dissipation mechanism 110, thereby improving the heat dissipation efficiency.

[0070] In the above implementation process, the heat conducting member 120 has a simple structure and is easy to manufacture. The third heat conducting rod 123 is connected to the first heat dissipation mechanism 110 , thereby improving the connection stability and reliability between the heat conducting member 120 and the first heat dissipation mechanism 110 .

[0071] Please continue to refer to Figure 8 In some optional embodiments, the length direction of the third heat conducting rod 123 may be perpendicular to the length direction of the first heat conducting rod 121 .

[0072] That is to say, the third heat conducting rod 123 is perpendicular to the first heat conducting rod 121 and the second heat conducting rod 122 .

[0073] In the above implementation process, the structure of the heat conducting member 120 described above provides more options for the manufacturing process of the heat conducting member 120, for example, one can choose an integrated manufacturing method, or one can choose to manufacture heat conducting rods with the same structure and shape, and select three of them to connect the structure of the heat conducting member 120 described in the embodiment of this application by welding or the like. Therefore, the manufacturing process of the heat conducting member 120 is facilitated, thereby further reducing the manufacturing cost of the heat dissipation device 100.

[0074] Based on the same concept, an embodiment of the present application further provides a medical device, which may include the heat dissipation device 100 described in the above embodiment of the heat dissipation device 100.

[0075] The medical device may be a CT machine.

[0076] The above implementation process may be the same as the heat dissipation device 100 described above, and will not be described again here.

[0077] In summary, the heat dissipation device 100 and the medical device provided in each embodiment of the present application are provided with a second heat dissipation mechanism 130 additionally on the first heat dissipation mechanism 110, thereby improving the heat dissipation efficiency of the heat dissipation device 100. By providing the assembly groove 112 in the gap between a plurality of heat dissipation fins 111, the influence on the layout of the heat dissipation fins 111 is avoided, thereby simplifying the manufacturing process of the heat dissipation device 100. Furthermore, by designing that the inner wall of the assembly groove 112 is consistent with the shape of the first end of the heat conductive member 120, the assembly groove 112 is better fitted with the first end of the heat conductive member 120, thereby further improving the heat transfer efficiency between the first heat dissipation mechanism 110 and the heat conductive member 120. Finally, the heat dissipation efficiency of the heat dissipation device 100 is further improved. By providing the first clamping portion 1311 and the second clamping portion 1312 on the same heat dissipation fin 131. Each heat dissipation fin 131 has the same structure, which reduces the number of molds, thereby facilitating the manufacture of the heat dissipation fins 131, and reducing the manufacturing cost of the heat dissipation device 100 provided in the embodiment of the present application. The flanged structure design increases the contact area between the heat sink fins 131 and the heat conductor 120, thereby improving the heat conduction efficiency between the heat sink fins 131 and the heat conductor 120. Finally, the heat dissipation efficiency of the heat sink 100 is further improved.

[0078] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: Used to dissipate heat from a heat generating component on a heat generating device; the device comprises a first heat dissipation mechanism, a heat conducting member and a second heat dissipation mechanism; The first end of the heat conducting member is connected to the first heat dissipation mechanism, and the second end of the heat conducting member is connected to the second heat dissipation mechanism; The first heat dissipation mechanism is connected to the heat generating component to receive the heat generated by the heat generating component.

2. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation mechanism includes a plurality of heat dissipation fins; There are gaps between the plurality of heat dissipation fins; The first end of the heat conducting member is connected to the gap of the first heat dissipation mechanism.

3. The heat dissipation device according to claim 2, characterized in that: The first heat dissipation mechanism is provided with an assembly groove; The assembly groove is located in the gap between the plurality of heat dissipation fins and extends along the direction of the gap; The shape of the inner wall of the assembly groove is consistent with the outer shape of the first end of the heat conducting member.

4. The heat dissipation device according to claim 1, characterized in that: The second heat dissipation mechanism includes a plurality of heat dissipation fins; The heat dissipation fin comprises a first clamping portion and a second clamping portion; The first clamping portion of one of the heat dissipation fins is clamped with the second clamping portion of another of the heat dissipation fins.

5. The heat dissipation device according to claim 4, characterized in that: The heat dissipation fin also includes a fin body; The first clamping portion includes a first extending portion extending outward from the fin body along the plane where the fin body is located; a through hole is provided between the first extending portion and the fin body; The second clamping portion includes a second extending portion extending from the fin body along the plane where the fin body is located to the through hole; When one of the heat dissipation fins is clamped with the other of the heat dissipation fins, the first extension portion of one of the heat dissipation fins is bent toward the other of the heat dissipation fins and is hung on the second extension portion of the other of the heat dissipation fins.

6. The heat dissipation device according to claim 4, characterized in that: The heat dissipation fin has an upper surface and a lower surface, and is provided with heat dissipation holes; The heat dissipation holes penetrate through the upper surface and the lower surface of the heat dissipation fins.

7. The heat dissipation device according to claim 4, characterized in that: The heat dissipation fin also includes a fin body and a connecting portion; The fin body is provided with a connection hole; The connecting portion extends from the hole wall of the connecting hole to outside the plane where the fin body is located; The heat conducting member passes through the connecting hole and is fitted with the connecting portion.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The heat conducting member comprises a first heat conducting rod, a second heat conducting rod and a third heat conducting rod; The length direction of the first heat-conducting rod is parallel to the length direction of the second heat-conducting rod; One end of the third heat-conducting rod is connected to one end of the first heat-conducting rod, and the other end of the third heat-conducting rod is connected to one end of the second heat-conducting rod; The first end of the heat conducting member includes an end of the first heat conducting rod not connected to the third heat conducting rod and an end of the second heat conducting rod not connected to the third heat conducting rod; The second end of the heat conducting member includes an end of the first heat conducting rod connected to the third heat conducting rod, an end of the second heat conducting rod connected to the third heat conducting rod, and the third heat conducting rod.

9. The heat dissipation device according to claim 8, characterized in that: in, The length direction of the third heat-conducting rod is perpendicular to the length direction of the first heat-conducting rod.

10. A medical device, characterized in that: The invention comprises the heat dissipation device as claimed in any one of claims 1 to 9.

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