Electronic equipment and heat dissipation module thereof

Abstract

The utility model discloses an electronic device and a heat dissipation module thereof, and the heat dissipation module comprises a body which is used for conducting heat; the outer surface of the body is provided with a first area, the first area is provided with a first functional layer with a heat conduction characteristic, and the first functional layer is used for metal welding; the thermal conductivity of the body is greater than that of the first functional layer.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment and a heat dissipation module thereof. Background Art

[0002] Graphene has become a heat dissipation material in the field of thermal management in electronic devices and the semiconductor industry, such as making heat sinks.

[0003] However, graphene materials face an important challenge in practical applications, which is that it is difficult to connect them through traditional metal welding methods. This limits the possibility of directly welding and assembling graphene heat sinks with other components, hindering the widespread application of graphene in efficient thermal management systems. Utility Model Content

[0004] In order to solve the above technical problems, the following technical solutions are provided in the embodiments of the present application:

[0005] A first aspect of the present application provides a heat dissipation module, the heat dissipation module comprising:

[0006] The body is used for conducting heat; the outer surface of the body has a first area, the first area is provided with a first functional layer with heat conduction characteristics, and the first functional layer is used for metal welding; the thermal conductivity of the body is greater than the thermal conductivity of the first functional layer.

[0007] In some modified implementations of the first aspect of the present application, the outer surface of the main body has a second area, and the second area is provided with a second functional layer with electrical insulation properties, and the second functional layer is used to form an insulation barrier with the electronic components.

[0008] In some modified implementations of the first aspect of the present application, the first region and the second region are connected so that the first functional layer and the second functional layer can be wrapped together to cover the outer surface of the body.

[0009] In some modified embodiments of the first aspect of the present application, the first functional layer is a metal precipitation layer connected to the first region to metallize the first region of the body.

[0010] In some modified embodiments of the first aspect of the present application, the second functional layer is an ink layer connected to the second area.

[0011] In some modified embodiments of the first aspect of the present application, the main body includes a first structure in a layered structure, and the first structure is made of a graphene material.

[0012] In some modified implementations of the first aspect of the present application, the outer surface of the first structure has a first area and a second area;

[0013] The first structure has a first region and / or a second region disposed on two adjacent outer surfaces, and a receiving portion capable of being attached to the heating element is also formed on the second region.

[0014] In some modified embodiments of the first aspect of the present application, at least the same surface of the first structure has a first region and a second region.

[0015] In some modified embodiments of the first aspect of the present application, the main body includes two first structures in a layered structure; the two first structures are made of graphene material; the two first structures are stacked through a second structure, and the second structure is connected to the two first structures for supporting the two first structures.

[0016] A second aspect of the present application provides an electronic device, the electronic device comprising:

[0017] a mainboard having at least one heating element;

[0018] The heating element is connected to the heat dissipation module through the heat exchange module to discharge the heat generated by the heating element out of the electronic device; the heat dissipation module includes:

[0019] The main body is used to conduct heat; the outer surface of the main body has a first area, the first area is provided with a first functional layer with heat conduction characteristics, and the first functional layer is used for metal welding with the heat exchange module; the thermal conductivity of the main body is greater than the thermal conductivity of the first functional layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0021] Figure 1 The structure diagram of the first embodiment of the main body in the heat dissipation module is schematically shown;

[0022] Figure 2 The structure diagram of the second embodiment of the main body in the heat dissipation module is schematically shown;

[0023] Figure 3 The figure schematically shows the assembly structure diagram of the heat dissipation module in the electronic device.

[0024] Description of Figure Numbers:

[0025] 1. Ontology;

[0026] 11. first structure; 12. second structure; 13. first functional layer; 14. second functional layer;

[0027] 2. Heat exchange module;

[0028] 3a, first heating element; 3b, second heating element; 31, heating cross-sectional material;

[0029] 4. Thermal conductive layer. DETAILED DESCRIPTION

[0030] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments disclosed in the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0031] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0032] At present, from the perspective of market development, the application of electronic equipment is becoming more and more extensive, and the system operation quality of electronic equipment is closely related to the properties of its own heat dissipation device. Graphene, as a new type of two-dimensional carbon nanomaterial, has a single atomic layer thickness and is composed of sp 2 The honeycomb lattice structure composed of hybrid orbitals gives it many excellent properties. Its thermal conductivity is as high as 5300 watts per meter per Kelvin (W / m·K), where "W" represents the power unit watt (Watt), indicating the speed or ability of heat transfer. "m" represents the length unit meter (meter), indicating the unit length of the material. "K" represents the temperature unit Kelvin (Kelvin), indicating the heat transfer rate per unit cross section when the temperature difference increases by 1K. This feature makes it an ideal heat dissipation material, especially in the field of thermal management of high-end electronic equipment and semiconductor industry.

[0033] However, the inventors of this application have found that such an ideal heat dissipation material does not have the function of metal welding with other components. Traditional welding processes such as arc welding, laser welding, brazing, etc. all rely on melting or diffusion connection between metals, which are not applicable to graphene materials. Therefore, how to solve the problem of effective connection between graphene heat sink and other components has become a key technical bottleneck in the practical application of graphene materials in the field of thermal management.

[0034] refer to Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present application provides a heat dissipation module, which includes:

[0035] The main body 1 is used for conducting heat; the outer surface of the main body 1 has a first area, and the first area is provided with a first functional layer 13 with heat conduction characteristics, and the first functional layer 13 is used for metal welding; the thermal conductivity of the main body 1 is greater than the thermal conductivity of the first functional layer 13.

[0036] Specifically, in the technical solution adopted by the present application, the body 1 is a carrier for conducting heat. Therefore, in the embodiment of the present application, the body 1 at least has a structure formed by graphene material, which can be a layered structure of only graphene material, or a composite layered structure composed of multiple layers of graphene and copper material. The technical key point of the present application is that a first area for connecting other components is divided on the body 1, and a first functional layer 13 is formed on the first area. The first functional layer 13 belongs to a layer body that can be connected by various welding processes. The first functional layer 13 can be formed on the part of the body 1 with graphene material by chemical vapor deposition, so that the outer surface of the body 1 with graphene material can also have an area suitable for welding process, so that the body 1 can be connected to the heat exchange device by welding, effectively increasing the connection structure strength and connection structure density between the graphene material and other materials, and the use of the heat dissipation module of the present application can make the thermal conductivity of the graphene material in a more favorable condition.

[0037] In some embodiments, the first functional layer 13 is a metal thin layer formed on the graphene material by a chemical vapor deposition process. The metal thin layer can be made of materials with high thermal conductivity such as copper, silver and aluminum, and can be suitable for metal welding processes.

[0038] The first area on the main body 1 is the area determined to perform chemical vapor deposition. It can be understood that only the range in the first area on the main body 1 has the first functional layer 13 formed by chemical vapor deposition. The first area can be understood as the area where the main body and other electronic components or functional modules are welded.

[0039] The body 1 is made of graphene, and the thermal conductivity of graphene is much higher than that of copper. The thermal conductivity of graphene is very high, up to 5300W / mK, and the thermal conductivity of graphene in a two-dimensional plane is very good. Its thermal conductivity can theoretically reach several kilowatts per meter per Kelvin (W / m·K), and the actual measured value is also in the range of several hundred to thousands of W / m·K. Relative to the plane, the thermal conductivity of graphene in the direction perpendicular to the plane (thickness direction) is weak. Since graphene is only one atomic layer thick, its thermal conduction in the vertical direction is limited, and the thermal conductivity is significantly lower than the value in the plane. If the first functional layer 13 is made of copper material, in comprehensive comparison, the thermal conductivity of the body 1 is much higher than that of the first functional layer 13.

[0040] For further reference, Figure 1and Figure 2 As shown, in some embodiments, the outer surface of the body 1 has a second area, and the second area is provided with a second functional layer 14 with electrical insulation properties, and the second functional layer 14 is used to form an insulation barrier with the electronic components.

[0041] Specifically, in the technical solution adopted by the present application, in some embodiments, the main body 1 can also be arranged with a second area on the outer surface, which can be arranged on the outer surface of the main body 1 other than the above-mentioned first area. Since the first area has a first functional layer 13 that can be suitable for welding connection, the first area on the outer surface of the main body 1 is used as a connection area. If the heat dissipation module of the present application is used in electronic equipment, due to the current trend, its design structure is becoming more and more compact, and the exposed second area is more likely to be close to or near other electronic components. Since the graphene material also has excellent electrical conductivity, it is easy to cause interference with other electronic components. Therefore, a second functional layer 14 with electrical insulation is provided on the second area of ​​the main body 1, which effectively reduces the probability of electrical characteristic reactions between the heat spreader made of graphene material and other electronic components.

[0042] In some embodiments, the second functional layer 14 may be an ink layer or other insulating materials, such as insulating paint, insulating paper, etc.

[0043] For further reference, Figure 1 and Figure 2 As shown, in some embodiments, the first region and the second region are connected, so that the first functional layer 13 and the second functional layer 14 can be wrapped together to cover the outer surface of the body 1.

[0044] Specifically, in the technical solution adopted in the present application, the first area and the second area on the outer surface of the main body 1 are connected, that is, the partial area on the outer surface of the main body 1 that requires welding connection serves as the first area, and the other areas that do not require welding connection serve as the second area. The first area that can be suitable for welding is used for fixed connection with the heat exchange device through the characteristics of the first functional layer 13, and the second area electrically insulated by the second functional layer 14 corresponds to the outer surface of the entire main body 1 with the first area. It can be understood that the first functional layer 13 and the second functional layer 14 cooperate to completely cover the outer surface of the entire main body 1, so that on the premise that the main body 1 with graphene material can excellently complete heat conduction, it can also weaken the interference of graphene on the electrical characteristics of other electronic components.

[0045] For further reference, Figure 1 and Figure 2 As shown, in some embodiments, the first functional layer 13 is a metal deposition layer connected to the first region to metallize the first region of the body 1 .

[0046] Specifically, in the technical solution adopted by the present application, in some embodiments, the first functional layer 13 is a metal thin layer formed on the outer surface of the body 1 by chemical vapor deposition. The area on the outer surface of the body 1 having the metal film layer is the first area defined in the above content. The metal thin layer can be connected with other metals by welding. The material of the metal thin layer is a metal material with thermal conductivity, such as copper, silver, and aluminum. Considering the total performance and cost, in the present application, the metal thin layer preferably uses copper material to implement chemical vapor deposition on the outer surface of the body 1, so that the first area on the body 1 is metallized, so that the part of the body 1 having graphene material can also be connected with other thermal conductive components by welding.

[0047] When copper is selected as the deposition material, the process is as follows: an organic metal precursor of copper, such as cuprocenes or hydrides, such as copper dihydride, is used. These precursors can be decomposed into copper elements under appropriate conditions and deposited on the first area. The chemical vapor deposition system includes a reaction chamber, in which the first area of ​​the body 1 where metal deposition is required is placed, and a gas mixture containing a copper precursor is introduced through an intake system. If necessary, an appropriate inert gas such as nitrogen or argon is also required for dilution and gas delivery.

[0048] In the process of chemical vapor deposition of copper, the temperature, pressure and gas flow rate need to be strictly controlled, depending on the precursor used and the desired film quality. The copper precursor will undergo a chemical reaction to release free copper atoms or ions. When the precursor gas contacts the first area, chemical decomposition occurs, and the copper atoms are converted from gas to solid, and adsorb, diffuse, nucleate and grow on the surface of the substrate, eventually forming a continuous and uniform copper film.

[0049] It should be noted that during the entire chemical vapor deposition process, fresh precursor gas is continuously delivered into the reaction chamber, and reaction by-products and unreacted gases are discharged through a vacuum pump to ensure that the quality and thickness of the copper film are controllable.

[0050] Further, in some embodiments, the second functional layer 14 is an ink layer connected to the second area.

[0051] Specifically, in the technical solution adopted in the present application, since the main body 1 having graphene material is in a long-term high-temperature environment, the second functional layer 14 in the present application can preferentially adopt an ink material having both electrical insulation properties and heat resistance, and be formed in the second area on the main body 1 by brushing, so as to effectively insulate and block the main body 1 from other electronic components.

[0052] In one embodiment, the ink layer on the second area can be solder resist ink. Since one of the main characteristics of solder resist ink is its excellent insulation performance, it can form a uniform and tough insulation film to effectively isolate different circuit tracks and prevent current from flowing in areas where it should not flow. At the same time, the solder resist ink must also have characteristics such as high temperature resistance, chemical corrosion resistance, good adhesion and optical properties to ensure that the second functional layer 14 plays a stable insulation role in a high temperature environment.

[0053] For further reference, Figure 1 As mentioned above, in some embodiments, the body 1 includes a first structure 11 in a layered structure, and the first structure 11 is made of a graphene material.

[0054] Specifically, the technical solution adopted in the present application proposes a first embodiment of the main body 1, wherein the main body 1 is a first structure 11 made of graphene material, and the first structure 11 is a thin film layer structure, and the first structure 11 has the characteristics of graphene material so that the planar thermal conductivity is much higher than the thermal conductivity perpendicular to the planar direction (thickness direction), so that the main body 1 has the performance of quickly conducting heat along the planar direction to achieve a uniform heat effect, effectively avoiding the formation of obvious "hot spots" on the surface of the main body 1 under the influence of the heating element.

[0055] For further reference, Figure 1 , in some embodiments, the outer surface of the first structure 11 has a first area and a second area;

[0056] The first structure 11 is provided with a first region and / or a second region on two adjacent outer surfaces, and a receiving portion capable of being attached to the heating element is also formed on the second region.

[0057] Specifically, in the technical solution adopted by the present application, the first area and the second area can be arranged in a manner of completely covering the outer surface of the first structure 11, or the first area and the second area can be arranged according to the required connection position and the required insulation blocking position. In order to better adapt to the more compact layout of current electronic devices, the present application can arrange the first area and the second area on the first structure 11 in a completely covered manner; therefore, in some embodiments, each adjacent surface on the first structure 11 can be composed of a variety of areas, for example: the first area and the second area are set on two adjacent surfaces, or the adjacent surfaces are all the first areas, or the adjacent surfaces are all the second areas, so that the first structure 11 made of graphene material can achieve the comprehensive function of welding connection to other heat-conducting components and / or insulation blocking on the adjacent surfaces. The present application does not limit one of the combinations, and the first area and the second area are arranged according to actual needs. The reason why part of the second area can also be in contact with the heating element or close to the first structure 11 for heat conduction is that the second functional layer 14 is attached to the second area, which significantly reduces the interference of the first structure 11 on the electrical characteristics of the heating element. Therefore, a receiving part that can be close to or even in contact with the heating element is formed in part of the second area or part of each second area, and is used to conduct the heat of the heating element to the heat exchange device or the heat exchange module 2 through the first structure 11.

[0058] refer to Figure 3 As shown, in some embodiments, when the heating element is attached to the second functional layer on the main body 1, the outer surface of the main body 1 in the second area can be used as a receiving part to transfer the heat of the heating element to the main body 1. Since the second area has the second functional layer 14, the interference of the graphene material on the electrical characteristics of the heating element is effectively reduced, so that the part of the main body 1 with the second functional layer can be used as a receiving part to respectively export the heat of different heating elements.

[0059] For further reference, Figure 1 and Figure 2 As shown, in some embodiments, at least the same surface of the first structure has a first region and a second region.

[0060] Specifically, in the technical solution adopted in the present application, a welding layer and an interference blocking layer can be respectively formed on a surface of the first structure, so that the heating element or other functional modules, such as a heat exchange module, can be connected by welding on the same surface of the first structure, and the heating element or other functional modules can also be connected by bonding, so that a variety of connection combinations can be realized on the main body 1, and the remaining surfaces of the first structure are not limited here.

[0061] For further reference, Figure 2As shown, in some embodiments, the main body 1 includes two first structures 11 in a layered structure; the two first structures 11 are made of graphene material; the two first structures 11 are stacked through a second structure 12, and the second structure 12 is connected to the two first structures 11 for supporting the two first structures 11.

[0062] Specifically, the technical solution adopted in the present application proposes a second embodiment of the body 1, and the body 1 can also be a composite layer structure with graphene material. In one embodiment, the body 1 includes two first structures 11 made of graphene material, and in order to increase the mechanical strength of the stacked structure and more effectively adapt to the thermal conductivity in the direction perpendicular to the plane, a second structure 12 is also provided between the two first structures 11. The second structure 12 can be fixed between the two first structures 11 by bonding, and in order to ensure the thermal conductivity efficiency in the direction perpendicular to the plane, the second structure 12 can be bonded between the two first structures 11 with a thermally conductive adhesive. In a further embodiment, the second structure 12 is a layer structure made of a thermally conductive material, such as a copper sheet layer, which can allow excess heat exceeding the thermal conductivity limit of one of the first structures 11 to be introduced into the other first structure 11 through the characteristics of the second structure 12, so as to achieve a more excellent heat-dissipating effect for the body 1 in this embodiment.

[0063] refer to Figure 2 As shown, in one embodiment, the main body 1 is composed of two graphene layers and a copper sheet layer stacked together, and the copper sheet layer is located between the two graphene layers, wherein the copper sheet layer is fixed by bonding with a thermal conductive adhesive, and the two graphene layers are supported by the copper sheet layer to have a certain mechanical strength, and the heat of one of the graphene layers can be introduced into the other graphene layer through the copper sheet layer in a direction perpendicular to the plane, thereby enhancing the heat uniformity effect of the main body 1 itself through the two graphene layers.

[0064] In one embodiment, the second area on the body 1 can also be precisely arranged according to the positions of some heating elements, that is, the outer surface of the body 1 is provided with the second area at a position close to the heating element, and the second functional layer 14 is applied to the second area, so that the heating element on the body 1 has a third area where the first functional layer 13 is not formed and the second functional layer 14 is not applied. The above embodiment can save raw materials constituting the second functional layer, such as solder resist ink.

[0065] Reference Figure 3 As shown, in some embodiments, the present application also proposes an electronic device, the electronic device includes a main board, the main board has at least one heating element;

[0066] The heating element is connected to the heat dissipation module through the heat exchange module 2 to discharge the heat generated by the heating element out of the electronic device;

[0067] The heat dissipation module includes: a main body 1 for conducting heat; the outer surface of the main body 1 has a first area, the first area is provided with a first functional layer 13 with heat conduction characteristics, and the first functional layer 13 is used for metal welding with the heat exchange module 2; the thermal conductivity of the main body 1 is greater than the thermal conductivity of the first functional layer 13.

[0068] Specifically, in the technical solution adopted by the present application, the heating element closest to the heat exchange module 2 is the first heating element 3a, and the heat conducting plate is fully attached to the heat exchange module 2 through the heating cross-sectional material 31, and the heat conducting plate can be bonded to the heat exchange module 2 through the heat conducting adhesive, so that the heat of the heating element can be smoothly transferred to the heat exchange module 2. The heat dissipation module in this embodiment can be used in the embodiment provided in the first aspect of the present application. It should be noted that in this embodiment, the heat dissipation module can be arranged on an adjacent surface of the body 1. The first area is metallized by chemical vapor deposition to form a first functional layer 13, and the remaining outer surface of the body 1 is the second area coated with an ink layer, so that the first area on the first surface can be fixedly connected to the heat conducting layer 4 connected to the heating element by welding, and the first area on the second surface can be fixedly connected to the heat exchange module 2 by welding. In another embodiment, the first area can be arranged only on the second surface of the body 1, and the first surface of the body 1 is connected to the heat conductive layer 4 of the heating element by bonding, and the first area is fixedly connected to the heat exchange module 2 by welding.

[0069] Reference Figure 3 As shown, the main board may also include a second heating element 3b, which is connected to the second area of ​​the main body 1 by a heat-generating cross-sectional material 31 in a close-fitting or adhesive manner, so that the heat of the second heating element 3b can be transferred to the heat exchange module 2 through the main body 1.

[0070] After adopting the heat dissipation module in the first aspect of the present application, it can be understood that the main body 1 having a graphite outer surface material has the performance of being connected to other components or heat dissipation modules by welding, and this is achieved by forming a metal material suitable for welding on the outer surface of the main body 1 by chemical vapor deposition, thereby solving the problem that the graphene material is difficult to connect with other components by traditional metal welding, in order to overcome this problem and give full play to the excellent thermal conductivity of graphene.

[0071] Referring to the above disclosed embodiments, it can be seen that the present application is to grow a copper film on graphene by using chemical vapor deposition technology, aiming to overcome the limitation that graphene materials are difficult to connect in conventional welding processes. The specific beneficial effects are as follows:

[0072] The deposited copper film serves as a connecting layer, which greatly improves the welding compatibility between graphene and traditional metal materials, allowing graphene to be firmly connected through welding like metal, solving the key problem that graphene itself is not suitable for welding technology.

[0073] The metal precipitation layer is preferably made of copper material because of its good conductivity and excellent welding performance, which can provide a stable welding interface and enhance the connection strength between graphene and other metal structural parts, thereby ensuring the stability and reliability of graphene in complex electronic equipment or structures, so that graphene materials can be used in fields that originally have high requirements for their welding performance, such as circuit boards, sensors, heat dissipation materials and various devices that require welding connections, thereby greatly broadening the practical application areas of graphene in industrial production.

[0074] While retaining the unique properties of graphene such as high thermal conductivity and high mechanical strength, this application uses copper film to achieve welding connection, which is conducive to integrating the advantages of graphene and traditional metal materials, and provides new ideas and technical support for the research and development of high-performance and multifunctional new composite materials.

[0075] The density of the metal precipitation layer on the graphene material is 2.1 grams per cubic centimeter, which can replace the conventional copper fins, making it more meet the lightweight requirements of electronic devices. During the test, it can be seen that the lightweight benefit is about 76.5%. And because the thickness of the metal precipitation layer is thin, it can also adapt to the equivalent thermal conductivity of graphene, which is generally 600+w / mk. In comparison, the heat dissipation capacity is increased by about 55%, breaking through the bottleneck of heat dissipation performance in current electronic devices.

[0076] In summary, by depositing copper film on graphene to adapt to welding connections, not only the process applicability of graphene itself is improved, but also its practicality in many engineering applications is enhanced, laying a solid foundation for the industrialization of graphene materials.

[0077] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0078] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0079] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation module, characterized in that: include: The body is used to conduct heat; The outer surface of the body has a first area, the first area is provided with a first functional layer with heat conduction properties, and the first functional layer is used for metal welding; The thermal conductivity of the body is greater than the thermal conductivity of the first functional layer.

2. The heat dissipation module according to claim 1, characterized in that: The outer surface of the body has a second area, and the second area is provided with a second functional layer with electrical insulation properties, and the second functional layer is used to form an insulation barrier with the electronic components.

3. The heat dissipation module according to claim 2, characterized in that: The first region and the second region are connected so that the first functional layer and the second functional layer can be wrapped together to cover the outer surface of the body.

4. The heat dissipation module according to claim 1, characterized in that: The first functional layer is a metal deposition layer connected to the first region to metallize the first region of the body.

5. The heat dissipation module according to claim 2, characterized in that: The second functional layer is an ink layer connected to the second area.

6. The heat dissipation module according to claim 2, 3 or 5, characterized in that: The body includes a first structure in a layered structure, and the first structure is made of a graphene material.

7. The heat dissipation module according to claim 6, characterized in that: The outer surface of the first structure has the first area and the second area; The first structure is provided with the first region and / or the second region on two adjacent outer surfaces, and a receiving portion capable of being attached to a heating element is also formed on the second region.

8. The heat dissipation module according to claim 6, characterized in that: At least the same surface of the first structure has the first region and the second region.

9. The heat dissipation module according to claim 2, 3 or 5, characterized in that: The body comprises two first structures in a layered structure; the two first structures are made of graphene material; The two first structures are stacked via a second structure, and the second structure is connected to the two first structures to support the two first structures.

10. An electronic device, characterized in that: include: a mainboard having at least one heating element; The heating element is connected to a heat dissipation module through a heat exchange module to discharge the heat generated by the heating element out of the electronic device; the heat dissipation module includes: The body is used to conduct heat; The outer surface of the body has a first area, the first area is provided with a first functional layer with heat conduction characteristics, and the first functional layer is used for metal welding with the heat exchange module; The thermal conductivity of the body is greater than the thermal conductivity of the first functional layer.

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