Cutting equipment for semiconductor wafer processing

Abstract

The utility model relates to the technical field of cutting equipment, and discloses cutting equipment for semiconductor wafer processing, which comprises a box body, an air inlet filter assembly arranged on the right side of the box body, a support fixedly connected to the bottom of the inner side of a discharge pipe, a motor fixedly connected to the inner side of the support, and fan blades fixedly connected to an output shaft of the motor. A supporting plate is fixedly connected to the middle of the inner side of the discharging pipe, a filtering frame is installed at the top of the inner side of the discharging pipe, an activated carbon filter element is arranged on the inner side of the filtering frame, a discharging assembly is arranged, a circular block is pressed, then a cylindrical rod pushes a plug pin rod to be separated from the inner side of a circular hole, and then the filtering frame is taken out vertically upwards through a hand lifting block; the filter frame and the activated carbon filter element are quickly disassembled, the filter frame is inserted into the inner side of the discharge pipe, the bolt rod is aligned with the circular hole, and the bolt rod extends into the inner side of the circular hole under the elastic action of the spring, so that the filter frame and the activated carbon filter element are quickly assembled.

Description

Technical Field

[0001] The utility model relates to the technical field of cutting equipment, and more specifically to a cutting equipment for semiconductor wafer processing. Background Art

[0002] Semiconductor wafers are the basic materials in semiconductor technology and are usually made of single crystal silicon. In the semiconductor manufacturing process, wafers are used as substrates for making various semiconductor devices such as integrated circuits (ICs), photovoltaic cells, and optoelectronic devices. Semiconductor wafers usually use high-purity single crystal silicon as the basic material. Single crystal silicon has excellent electrical and mechanical properties and is one of the ideal materials for manufacturing semiconductor devices.

[0003] In the field of semiconductor processing, wafer cutting is an important technical link. The current cutting equipment uses cutting discs for cutting. The other is the more advanced laser cutting equipment. Laser cutting equipment is highly efficient and has a better protection effect on wafers by non-contact cutting. However, the existing laser cutting equipment still has the following shortcomings:

[0004] Laser cutting equipment in the prior art will produce harmful smoke during cutting, and a filtering device is generally provided to filter the harmful smoke. However, the filtering device is generally fixed by multiple bolts. After the filter element has been used for a long time, it needs to be replaced, and the replacement procedure is cumbersome and inefficient. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the utility model provides a cutting device for semiconductor wafer processing to solve the problems existing in the above-mentioned background technology.

[0006] The utility model provides the following technical solution: a cutting device for semiconductor wafer processing, comprising a box body, a closed door is installed on the front side of the box body, an exhaust assembly is installed on the left side of the top of the box body, an air inlet filter assembly is installed on the right side of the box body, the exhaust assembly comprises a exhaust pipe, a bracket is fixedly connected to the bottom of the inner side of the exhaust pipe, a motor is fixedly connected to the inner side of the bracket, a fan blade is fixedly connected to the output shaft of the motor, a support plate is fixedly connected to the middle of the inner side of the exhaust pipe, a filter frame is installed on the top of the inner side of the exhaust pipe, an activated carbon filter element is arranged on the inner side of the filter frame, and hand blocks are fixedly connected to the tops of both sides of the inner wall of the filter frame.

[0007] Furthermore, positioning blocks are fixedly connected to the front and back sides of the filter frame, and positioning grooves are provided on the front and back sides of the inner wall of the discharge pipe, and the positioning grooves and the positioning blocks are matched with each other.

[0008] Furthermore, cylindrical grooves are provided on both sides of the filter frame, a spring is fixedly connected to the inner side of the cylindrical groove, a latch rod is fixedly connected to the other end of the spring, and the latch rod is movably sleeved with the cylindrical groove.

[0009] Furthermore, circular holes are provided at the tops of both sides of the discharge pipe, a cylindrical rod is movably sleeved on the inner side of the circular hole, a circular block is fixedly connected to one end of the cylindrical rod located outside the circular hole, the top and bottom of the cylindrical rod are fixedly connected to the limiting blocks, and limiting grooves are provided on the top and bottom of the inner wall of the circular hole, and the limiting grooves and the limiting blocks are adapted to each other.

[0010] Furthermore, the air inlet filter assembly includes a fixing plate fixedly connected to the right side of the box body, the front and back sides of the top of the fixing plate are fixedly connected to fixing frames, and a filter screen is arranged on the inner side of the fixing frame.

[0011] Furthermore, the box body includes a laser cutting assembly, an air inlet hole is opened on the right side of the box body, and an exhaust hole is opened on the left side of the top of the box body.

[0012] Technical effects and advantages of the utility model:

[0013] 1. The utility model is provided with a discharge assembly. When the activated carbon filter element is saturated with adsorption, its purification effect on the exhaust air will be greatly reduced. The circular block is pressed so that the cylindrical rod pushes the latch rod to separate from the inner side of the circular hole and retract into the inner side of the cylindrical groove. Then the filter frame can be taken out vertically upward by the carrying block, thereby realizing the rapid disassembly of the filter frame and the activated carbon filter element. When it is necessary to install a new filter frame and activated carbon filter element, the latch rod is pressed into the inner side of the cylindrical groove, the positioning block is aligned with the positioning groove, and the filter frame is inserted into the inner side of the discharge pipe. When the bottom of the filter frame fits the surface of the support plate, the latch rod is aligned with the circular hole. Under the elastic force of the spring, the latch rod extends into the inner side of the circular hole, thereby completing the rapid installation of the filter frame and the activated carbon filter element.

[0014] 2. The utility model is provided with an exhaust component. When the laser cutting component processes the semiconductor wafer, high temperature and harmful gases are generated. The starting motor drives the fan blades to rotate, so that the high-temperature air and harmful exhaust gas inside the box are discharged through the exhaust pipe, thereby cooling the interior of the box. The activated carbon filter element can effectively absorb odors and harmful gases in the exhausted air through the filtering effect, thereby purifying the air and making the cutting equipment more environmentally friendly. The outside air enters the interior of the box through the air inlet hole. The filtering effect of the filter net can filter out dust and foreign matter in the outside air to avoid entering the interior of the box and causing pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1It is a schematic diagram of the overall structure of the utility model.

[0016] Figure 2 This is a schematic diagram of the box structure of the utility model.

[0017] Figure 3 This is a schematic diagram of the structure of the air intake filter assembly of the utility model.

[0018] Figure 4 This is a schematic diagram of the exhaust assembly structure of the utility model.

[0019] Figure 5 It is a schematic diagram of the latch rod structure of the utility model.

[0020] Figure 6 It is a schematic diagram of the cylindrical rod structure of the utility model.

[0021] The accompanying drawings are marked as follows: 1. box body; 101. closed door; 102. laser cutting assembly; 103. air inlet; 104. discharge hole; 2. discharge assembly; 201. discharge pipe; 202. positioning groove; 203. bracket; 204. motor; 205. fan blade; 206. support plate; 207. filter frame; 271. activated carbon filter element; 272. positioning block; 273. hand block; 274. cylindrical groove; 275. spring; 276. latch rod; 208. circular hole; 281. limit groove; 209. cylindrical rod; 291. limit block; 210. circular block; 3. air inlet filter assembly; 301. fixing plate; 302. fixing frame; 303. filter net. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely illustrative. The semiconductor wafer processing cutting equipment involved in the present invention is not limited to the various structures recorded in the following embodiments. All other implementations obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0023] Reference Figure 1-Figure 6The utility model provides a cutting device for semiconductor wafer processing, including a box body 1, a closed door 101 is installed on the front of the box body 1, an exhaust assembly 2 is installed on the left side of the top of the box body 1, and an air inlet filter assembly 3 is installed on the right side of the box body 1. The exhaust assembly 2 includes an exhaust pipe 201, a bracket 203 is fixedly connected to the bottom of the inner side of the exhaust pipe 201, a motor 204 is fixedly connected to the inner side of the bracket 203, a fan blade 205 is fixedly connected to the output shaft of the motor 204, a support plate 206 is fixedly connected to the middle of the inner side of the exhaust pipe 201, a filter frame 207 is installed on the top of the inner side of the exhaust pipe 201, an activated carbon filter element 271 is arranged on the inner side of the filter frame 207, and the tops of both sides of the inner wall of the filter frame 207 are fixedly connected to portable blocks 273.

[0024] In the embodiment of the present application, the laser cutting assembly 102 generates high temperature and harmful gases during the processing of the semiconductor wafer, and the start motor 204 drives the fan blades 205 to rotate, so that the high-temperature air and harmful exhaust gas inside the box body 1 are discharged through the exhaust pipe 201, so as to cool the inside of the box body 1, and the activated carbon filter element 271 can effectively absorb the odor and harmful gases in the discharged air through the filtering effect, so as to achieve the effect of purifying the air, making the cutting equipment more environmentally friendly, and the outside air enters the inside of the box body 1 through the air inlet 103, and the filtering effect of the filter net 303 can filter the dust and foreign matter in the outside air to avoid entering the inside of the box body 1 and causing pollution;

[0025] When the activated carbon filter element 271 is saturated with adsorption, its purification effect on the exhaust air will be greatly reduced. The circular block 210 is pressed, so that the cylindrical rod 209 pushes the latch rod 276 to separate from the inner side of the circular hole 208 and retract into the inner part of the cylindrical groove 274. Then, the filter frame 207 can be taken out vertically upwards through the hand-held block 273, thereby realizing the rapid disassembly of the filter frame 207 and the activated carbon filter element 271. A new filter frame 207 and the activated carbon filter element 271 need to be replaced. During installation, press the latch rod 276 into the inner side of the cylindrical groove 274, align the positioning block 272 with the positioning groove 202, and insert the filter frame 207 into the inner side of the discharge pipe 201. When the bottom of the filter frame 207 fits with the surface of the support plate 206, the latch rod 276 is aligned with the circular hole 208. Under the elastic force of the spring 275, the latch rod 276 extends into the inner side of the circular hole 208, thereby completing the quick installation of the filter frame 207 and the activated carbon filter element 271.

[0026] In a preferred embodiment, the front and back sides of the filter frame 207 are fixedly connected with positioning blocks 272, and the front and back sides of the inner wall of the discharge pipe 201 are provided with positioning grooves 202. The positioning grooves 202 and the positioning blocks 272 are adapted to each other. Through the positioning effect of the positioning blocks 272 and the positioning grooves 202, when the bottom of the filter frame 207 is in contact with the top of the support plate 206, the latch rod 276 can be aligned with the circular hole 208.

[0027] In a preferred embodiment, cylindrical grooves 274 are provided on both sides of the filter frame 207, a spring 275 is fixedly connected to the inner side of the cylindrical groove 274, a latch rod 276 is fixedly connected to the other end of the spring 275, the latch rod 276 is movably connected to the cylindrical groove 274, and the end of the latch rod 276 away from the spring 275 is set to be hemispherical.

[0028] In a preferred embodiment, circular holes 208 are provided at the tops of both sides of the discharge pipe 201, and a cylindrical rod 209 is movably sleeved on the inner side of the circular hole 208. A circular block 210 is fixedly connected to one end of the cylindrical rod 209 located outside the circular hole 208. The top and bottom of the cylindrical rod 209 are fixedly connected to a limiting block 291. Limiting grooves 281 are provided at the top and bottom of the inner wall of the circular hole 208. The limiting grooves 281 and the limiting blocks 291 are adapted to each other. The limiting grooves 281 position the limiting blocks 291 so that the cylindrical rod 209 will not detach from the inner side of the circular hole 208.

[0029] In a preferred embodiment, the air inlet filter assembly 3 includes a fixed plate 301 fixedly connected to the right side of the box body 1, and the front and back sides of the top of the fixed plate 301 are fixedly connected to a fixed frame 302, and a filter net 303 is arranged on the inner side of the fixed frame 302. When the outside air enters the interior of the box body 1 through the air inlet hole 103, the filter net 303 can filter the dust entering the air.

[0030] In a preferred embodiment, the box body 1 includes a laser cutting assembly 102, an air inlet 103 is opened on the right side of the box body 1, and an exhaust hole 104 is opened on the left side of the top of the box body 1. The laser cutting assembly 102 is a prior art and will not be described in detail in this application.

[0031] Working principle of the utility model: when the laser cutting assembly 102 processes the semiconductor wafer, the start motor 204 drives the fan blade 205 to rotate, so that the air and harmful exhaust gas inside the box body 1 are discharged through the exhaust pipe 201, and after the filtering effect of the activated carbon filter element 271, the odor and harmful gas in the discharged air can be effectively adsorbed to achieve the effect of purifying the air, making the cutting equipment more environmentally friendly, and the outside air enters the inside of the box body 1 through the air inlet 103, and the filtering effect of the filter net 303 can filter the dust and foreign matter in the outside air to avoid entering the inside of the box body 1 and causing pollution;

[0032] When the activated carbon filter element 271 is saturated with adsorption, its purification effect on the exhaust air will be greatly reduced. The circular block 210 is pressed, so that the cylindrical rod 209 pushes the latch rod 276 to separate from the inner side of the circular hole 208 and retract into the inner part of the cylindrical groove 274. Then, the filter frame 207 can be taken out vertically upwards through the hand-held block 273, thereby realizing the rapid disassembly of the filter frame 207 and the activated carbon filter element 271. A new filter frame 207 and the activated carbon filter element 271 need to be replaced. During installation, press the latch rod 276 into the inner side of the cylindrical groove 274, align the positioning block 272 with the positioning groove 202, and insert the filter frame 207 into the inner side of the discharge pipe 201. When the bottom of the filter frame 207 fits with the surface of the support plate 206, the latch rod 276 is aligned with the circular hole 208. Under the elastic force of the spring 275, the latch rod 276 extends into the inner side of the circular hole 208, thereby completing the quick installation of the filter frame 207 and the activated carbon filter element 271.

[0033] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0034] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0035] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A cutting device for semiconductor wafer processing, comprising a housing (1), characterized in that: A closed door (101) is installed on the front of the box (1), an exhaust assembly (2) is installed on the left side of the top of the box (1), and an air intake filter assembly (3) is installed on the right side of the box (1). The exhaust assembly (2) comprises an exhaust pipe (201), a bracket (203) is fixedly connected to the bottom of the inner side of the exhaust pipe (201), a motor (204) is fixedly connected to the inner side of the bracket (203), a fan blade (205) is fixedly connected to the output shaft of the motor (204), a support plate (206) is fixedly connected to the middle of the inner side of the exhaust pipe (201), a filter frame (207) is installed on the top of the inner side of the exhaust pipe (201), an activated carbon filter element (271) is arranged on the inner side of the filter frame (207), and hand blocks (273) are fixedly connected to the tops of both sides of the inner wall of the filter frame (207).

2. A semiconductor wafer processing cutting device according to claim 1, characterized in that: The front and back sides of the filter frame (207) are fixedly connected with positioning blocks (272), and the front and back sides of the inner wall of the discharge pipe (201) are provided with positioning grooves (202), and the positioning grooves (202) and the positioning blocks (272) are mutually adapted.

3. The semiconductor wafer processing cutting device according to claim 1, characterized in that: Both sides of the filter frame (207) are provided with cylindrical grooves (274), the inner side of the cylindrical groove (274) is fixedly connected with a spring (275), the other end of the spring (275) is fixedly connected with a latch rod (276), and the latch rod (276) is movably sleeved with the cylindrical groove (274).

4. The semiconductor wafer processing cutting device according to claim 1, characterized in that: The tops of both sides of the discharge pipe (201) are provided with circular holes (208), the inner side of the circular hole (208) is movably sleeved with a cylindrical rod (209), one end of the cylindrical rod (209) located outside the circular hole (208) is fixedly connected with a circular block (210), the top and bottom of the cylindrical rod (209) are fixedly connected with a limiting block (291), the top and bottom of the inner wall of the circular hole (208) are provided with limiting grooves (281), and the limiting grooves (281) and the limiting blocks (291) are adapted to each other.

5. The semiconductor wafer processing cutting device according to claim 1, characterized in that: The air intake filter assembly (3) comprises a fixing plate (301) fixedly connected to the right side of the box body (1), the front and back sides of the top of the fixing plate (301) are fixedly connected to fixing frames (302), and a filter screen (303) is arranged on the inner side of the fixing frame (302).

6. The semiconductor wafer processing cutting device according to claim 1, characterized in that: The box body (1) comprises a laser cutting assembly (102), an air inlet hole (103) is opened on the right side of the box body (1), and an exhaust hole (104) is opened on the left side of the top of the box body (1).

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