Water bath contact vertical continuous electroplating device

Abstract

The utility model discloses a water bath contact vertical continuous electroplating device, which comprises an electroplating bath and a fixing frame arranged above the electroplating bath, a plurality of groups of anode assemblies which are transversely and sequentially arranged are arranged in the electroplating bath, and each anode assembly comprises a first electroplating anode and a second electroplating anode which are oppositely arranged; a first rectifying machine and a second rectifying machine are arranged on the fixing frame, a cathode hanging tool capable of translating transversely is arranged in the electroplating bath, a PCB to be electroplated is hung on the cathode hanging tool, a cathode conductive copper brush is arranged on the cathode hanging tool, a cathode conductive copper rail is arranged below the cathode conductive copper brush, and the cathode conductive copper rail is arranged below the cathode conductive copper brush. The cathode conductive copper rail is connected to the cathode of the first rectifier and the cathode of the second rectifier through cables, the cathode conductive copper brush makes contact with the cathode conductive copper rail, and the cathode conductive copper brush and the cathode conductive copper rail are both soaked in a preset water bath solution. According to the utility model, the safety and reliability of the PCB electroplating process can be improved.

Description

Technical Field

[0001] The utility model relates to PCB board electroplating equipment, in particular to a water bath contact vertical continuous electroplating device. Background Art

[0002] In the prior art, PCB electroplating processes basically use a common cathode track and a cathode hanger for direct contact and conduction. This method cannot accurately control the given current of each board, and it is also impossible to distinguish whether the amount of electricity obtained by the board during the electroplating process is sufficient or excessive. When the current between the hangers is in an unbalanced state, a galvanic effect will be generated between the PCB boards, and the board edge will be etched back, resulting in poor electroplating quality on the board surface. At the same time, high temperature is easily generated at the conductive contact position. Once the contact area at a certain point is reduced during the movement, it will cause an instantaneous current increase and sparks to be generated, which will have an adverse effect on safe production. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a water bath contact vertical continuous electroplating device which can effectively cool the conductive contact position and accurately control the electrical value of each electroplating station in view of the deficiencies in the prior art.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions.

[0005] A water bath contact vertical continuous electroplating device comprises an electroplating tank and a fixed frame arranged above the electroplating tank, wherein the electroplating tank is provided with a plurality of groups of anode assemblies arranged in sequence transversely, the anode assemblies comprise a first electroplating anode and a second electroplating anode arranged oppositely, the fixed frame is provided with a first rectifier and a second rectifier, the anode output end of the first rectifier and the anode output end of the second rectifier are respectively connected to the first electroplating anode and the second electroplating anode through a cable, the electroplating tank is provided with a cathode hanger which can be translated transversely, a PCB board to be electroplated is hung on the cathode hanger, a cathode conductive copper brush is provided on the cathode hanger, a cathode conductive copper rail is provided below the cathode conductive copper brush, the cathode conductive copper rail is connected to the cathode of the first rectifier and the cathode of the second rectifier through a cable, the cathode conductive copper brush is in contact with the cathode conductive copper rail, and the cathode conductive copper brush and the cathode conductive copper rail are both immersed in a preset water bath solution.

[0006] Preferably, a water bath is fixed at the upper end of the electroplating tank, the water bath contains a water bath solution, and the cathode conductive copper brush and the cathode conductive copper rail are both located in the water bath.

[0007] Preferably, a water inlet pipeline is included, the water inlet pipeline is connected to the water bath, and the water inlet pipeline is used to inject a water bath solution into the water bath.

[0008] Preferably, a track mechanism is fixed to the upper end of the electroplating tank, and a rolling mechanism capable of moving along the track mechanism is provided on the cathode hanger.

[0009] Preferably, a plurality of first rectifiers and a plurality of second rectifiers are provided on the fixing frame, the first rectifiers correspond one-to-one to the first electroplating anodes, and the second rectifiers correspond one-to-one to the second electroplating anodes.

[0010] Preferably, a plurality of cathode conductive copper tracks are included, the plurality of cathode conductive copper tracks are sequentially extended along the length direction, and a breakpoint gap is provided between two adjacent cathode conductive copper tracks.

[0011] In the water bath contact vertical continuous electroplating device disclosed by the utility model, the electroplating tank is filled with electroplating solution, multiple groups of anode components are immersed in the electroplating solution, the anode output end of the first rectifier is connected to the first electroplating anode through a cable, the anode output end of the second rectifier is connected to the second electroplating anode through a cable, and the cathode hanger is used to hang the PCB board and move it horizontally along the electroplating tank. During this process, the cathode conductive copper brush and the cathode conductive copper rail are in contact with each other, so that a current loop is formed between the rectifier, the cathode hanger and the PCB board. During the lateral movement of the cathode hanger, because the cathode conductive copper brush and the cathode conductive copper rail are immersed in a preset water bath solution, the water bath solution completely overflows the conductive contact position, which can prevent the contact position from generating high temperature. In addition, when the contact area of ​​the contact position is suddenly reduced at a certain point, it can avoid the generation of instantaneous large current, which can effectively prevent the occurrence of sparking, thereby improving the safety and reliability of the PCB electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a front view of a plurality of cathode hangers;

[0013] Figure 2 It is a cross-sectional view of the internal structure of the electroplating tank;

[0014] Figure 3 Schematic diagram of the connection between the rectifier and the anode assembly. DETAILED DESCRIPTION

[0015] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments.

[0016] The utility model discloses a water bath contact vertical continuous electroplating device, combined with Figures 1 to 3As shown, it includes an electroplating tank 1 and a fixing frame 2 arranged above the electroplating tank 1, wherein the electroplating tank 1 is provided with a plurality of anode assemblies 3 arranged in sequence in a transverse direction, wherein the anode assemblies 3 include a first electroplating anode 30 and a second electroplating anode 31 arranged opposite to each other, wherein the fixing frame 2 is provided with a first rectifier 20 and a second rectifier 21, wherein the anode output end of the first rectifier 20 and the anode output end of the second rectifier 21 are connected to the first electroplating anode 30 and the second electroplating anode 31 respectively through cables ... first electroplating anode 30 and the second electroplating anode 31 are connected to the first electroplating anode 30 and the second electroplating anode 31 respectively through cables, wherein the first electroplating anode 30 and the second electroplating anode 31 are connected to the first electroplating anode 30 and the second electroplating anode 31 respectively through cables, wherein the first electroplating A cathode hanger 4 which can be translated laterally, on which a PCB board 100 to be electroplated is hung, is provided with a cathode conductive copper brush 40, and a cathode conductive copper rail 41 is provided below the cathode conductive copper brush 40, and the cathode conductive copper rail 41 is connected to the cathode of the first rectifier 20 and the cathode of the second rectifier 21 through a cable, and the cathode conductive copper brush 40 is in contact with the cathode conductive copper rail 41, and both the cathode conductive copper brush 40 and the cathode conductive copper rail 41 are immersed in a preset water bath solution.

[0017] In the above structure, the electroplating tank 1 is filled with an electroplating solution, and multiple groups of anode assemblies 3 are immersed in the electroplating solution. The anode output end of the first rectifier 20 is connected to the first electroplating anode 30 through a cable, and the anode output end of the second rectifier 21 is connected to the second electroplating anode 31 through a cable. The cathode hanger 4 is used to hang the PCB board 100 and move it horizontally along the electroplating tank 1. During this process, the cathode conductive copper brush 40 and the cathode conductive copper rail 41 are in contact with each other, so that a current loop is formed between the rectifier, the cathode hanger 4, and the PCB board 100. During the lateral movement of the cathode hanger 4, because the cathode conductive copper brush 40 and the cathode conductive copper rail 41 are immersed in a preset water bath solution, the water bath solution completely overflows the conductive contact position, which can prevent the contact position from generating high temperature. In addition, when the contact area of ​​the contact position suddenly decreases at a certain point, it can avoid the generation of instantaneous large current, which can effectively prevent the occurrence of sparking, thereby improving the safety and reliability of the PCB electroplating process.

[0018] In order to better hold the water bath solution, in this embodiment, a water bath 5 is fixed at the upper end of the electroplating tank 1, and the water bath 5 is filled with the water bath solution, and the cathode conductive copper brush 40 and the cathode conductive copper rail 41 are both located in the water bath 5. The water bath 5 extends sequentially along the movement trajectory of the cathode hanger 4.

[0019] See also Figure 2 This embodiment includes a water inlet pipeline 6 , which is connected to the water bath 5 , and is used to inject a water bath solution into the water bath 5 .

[0020] In this embodiment, the cathode hanger 4 can be driven to move by a preset traction mechanism. In order to ensure the smooth transverse movement of the cathode hanger 4, in this embodiment, a track mechanism 7 is fixed to the upper end of the electroplating tank 1, and the cathode hanger 4 is provided with a rolling mechanism 42 that can move along the track mechanism 7.

[0021] As a preferred method, see Figures 1 to 3 The fixing frame 2 is provided with a plurality of first rectifiers 20 and a plurality of second rectifiers 21, wherein the first rectifiers 20 correspond one-to-one to the first electroplating anodes 30, and the second rectifiers 21 correspond one-to-one to the second electroplating anodes 31. In this embodiment, each PCB is independently powered by a corresponding rectifier, so that the final power value can be accurately controlled.

[0022] This embodiment includes a plurality of cathode conductive copper tracks, which extend in sequence along the length direction, and a breakpoint gap is provided between two adjacent cathode conductive copper tracks.

[0023] In the above structure, the conductive copper rails are connected in multiple sections, that is, the number of hangers on each section of the copper rail + 1 = the number of rails. This structural setting can avoid the situation where two hangers appear on one copper rail at the same time. In addition, the conductive copper rails between one electroplating tank and the next are disconnected, and the current is added or subtracted by the head and tail rectifiers to ensure that the amount of electricity passing through each board is consistent.

[0024] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the technical scope of the present invention should be included in the scope of protection of the present invention.

Claims

1. A water bath contact vertical continuous electroplating device, characterized in that: The invention comprises an electroplating tank (1) and a fixing frame (2) arranged above the electroplating tank (1), wherein the electroplating tank (1) is provided with a plurality of anode assemblies (3) arranged in sequence in a transverse direction, wherein the anode assemblies (3) comprise a first electroplating anode (30) and a second electroplating anode (31) arranged opposite to each other, wherein the fixing frame (2) is provided with a first rectifier (20) and a second rectifier (21), wherein the anode output end of the first rectifier (20) and the anode output end of the second rectifier (21) are respectively connected to the first electroplating anode (30) and the second electroplating anode (31) via cables, and .... A cathode hanger (4) capable of lateral translation, the cathode hanger (4) hanging a PCB board (100) to be electroplated, the cathode hanger (4) being provided with a cathode conductive copper brush (40), a cathode conductive copper track (41) being provided below the cathode conductive copper brush (40), the cathode conductive copper track (41) being connected to the cathode of the first rectifier (20) and the cathode of the second rectifier (21) via a cable, the cathode conductive copper brush (40) and the cathode conductive copper track (41) being in contact with each other, and both the cathode conductive copper brush (40) and the cathode conductive copper track (41) being immersed in a preset water bath solution.

2. The water bath contact vertical continuous electroplating device as claimed in claim 1, characterized in that: A water bath (5) is fixed at the upper end of the electroplating tank (1), wherein the water bath (5) contains a water bath solution, and the cathode conductive copper brush (40) and the cathode conductive copper rail (41) are both located in the water bath (5).

3. The water bath contact vertical continuous electroplating device as claimed in claim 2, characterized in that: It comprises a water inlet pipeline (6), the water inlet pipeline (6) is connected to the water bath (5), and the water inlet pipeline (6) is used to inject a water bath solution into the water bath (5).

4. The water bath contact vertical continuous electroplating device as claimed in claim 1, characterized in that: A track mechanism (7) is fixed to the upper end of the electroplating tank (1), and a rolling mechanism (42) capable of moving along the track mechanism (7) is provided on the cathode hanger (4).

5. The water bath contact vertical continuous electroplating device as claimed in claim 1, characterized in that: The fixing frame (2) is provided with a plurality of first rectifiers (20) and a plurality of second rectifiers (21), wherein the first rectifiers (20) correspond one-to-one to the first electroplating anodes (30), and the second rectifiers (21) correspond one-to-one to the second electroplating anodes (31).

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