1.6 T silicon light engine

Abstract

The utility model relates to a 1.6 T silicon light engine, a modulation light source is arranged in a silicon light chip, the surface of the silicon light chip, which is provided with a copper convex column, is inversely pasted on a PCB (Printed Circuit Board), the PCB is provided with a clearance groove in an area below a light emitting waveguide of the silicon light chip, a ceramic heat sink is fixed on the silicon light chip, one end of the ceramic heat sink extends to the upper part of the clearance groove, and the other end of the ceramic heat sink extends to the lower part of the clearance groove. An array silicon lens and an optical fiber array which are fixed to the ceramic heat sink are sequentially arranged in the receding groove in the light propagation direction, the array silicon lens is coupled with a light outlet waveguide of the silicon optical chip, and an optical isolator fixed to the ceramic heat sink or the optical fiber array is coupled between the array silicon lens and the optical fiber array. The 1.6 T silicon light engine has the advantages that the silicon light chip with a built-in modulation light source is selected, coupling of an external light source is not needed, the 1.6 T silicon light engine assembled through the structure can reduce one-time high-frequency bonding pad switching, shorten the length of an RF circuit and greatly improve the high-frequency electrical performance, in addition, optical elements are all arranged on the ceramic heat sink, the light path is stable and reliable, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon photonics engines, and in particular to a 1.6T silicon photonics engine. Background Art

[0002] The mainstream solution of 1.6T silicon photonic engine cancels gold wire bonding, and instead makes copper bumps on the silicon photonic chip, and uses flip-stick assembly process to achieve high-frequency electrical connection. The current solution is as follows Figure 1 As shown, an RF adapter board is introduced. During assembly, the silicon photonic chip is first placed upside down on the RF adapter board, and then the RF adapter board is soldered to the PCB board. This method involves two soldering steps, resulting in discontinuous impedance and decreased high-frequency electrical performance. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide a 1.6T silicon photonic engine to overcome the deficiencies in the above-mentioned prior art.

[0004] The utility model provides a technical solution to the above-mentioned technical problems as follows: a 1.6T silicon photonic engine, comprising: a silicon photonic chip and a PCB board, the silicon photonic chip having a built-in modulated light source, the surface of the silicon photonic chip having a copper convex column being attached upside down on the PCB board, an air avoidance groove being provided in the area below the light output waveguide of the silicon photonic chip on the PCB board, a ceramic heat sink having one end extending to the top of the air avoidance groove being fixed on the silicon photonic chip, an array silicon lens and an optical fiber array fixed to the ceramic heat sink being arranged in sequence in the air avoidance groove along the light propagation direction, the array silicon lens being coupled to the light output waveguide of the silicon photonic chip, and an optical isolator fixed to the ceramic heat sink or the optical fiber array being coupled between the array silicon lens and the optical fiber array.

[0005] The beneficial effects of the utility model are as follows: by selecting a silicon photonic chip with a built-in modulated light source, there is no need for external light source coupling. The 1.6T silicon photonic engine assembled with this structure can reduce one high-frequency pad transfer and shorten the RF line length, has good impedance continuity, and greatly improves high-frequency electrical performance. In addition, all optical components are on a ceramic heat sink, the optical path is stable and reliable, and the cost is low.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the optical isolator is bonded to the optical fiber array.

[0008] A further beneficial effect of the above method is that a small-sized optical isolator can be selected, thereby reducing the cost.

[0009] Furthermore, the upper surface of the ceramic heat sink conducts heat with the upper cover of the housing via the thermal conductive paste.

[0010] A further beneficial effect of the above method is that the ceramic heat sink can directly dissipate heat through the upper cover of the housing, thereby improving the heat dissipation performance of the product.

[0011] Furthermore, the air-avoiding groove is narrowed in the area corresponding to the pigtail fiber in the optical fiber array.

[0012] A further beneficial effect of the above method is that the influence of the air-avoiding groove on the strength of the PCB board is reduced.

[0013] Furthermore, an underfill is filled between the silicon photonic chip and the PCB board to increase bonding strength and absorb thermal stress.

[0014] A further beneficial effect of the above method is that it can effectively prevent the silicon photonic chip from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the main view of a 1.6T silicon photonics engine in the prior art;

[0016] Figure 2 This is the front view of the 1.6T silicon photonic engine in the present invention;

[0017] Figure 3 This is a bottom view of the 1.6T silicon photonic engine in the present invention;

[0018] Figure 4 This is a structural diagram of the silicon photonic chip in the present invention.

[0019] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0020] 1. Silicon photonic chip, 110. Optical waveguide, 120. Copper boss, 2. PCB board, 210. Air avoidance groove, 3. Ceramic heat sink, 4. Array silicon lens, 5. Optical fiber array, 6. Optical isolator. DETAILED DESCRIPTION

[0021] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0022] Example 1

[0023] like Figure 2 , Figure 3 , Figure 4 As shown, a 1.6T silicon photonic engine includes: a silicon photonic chip 1 and a PCB board 2. The silicon photonic chip 1 has a built-in modulated light source. By selecting the silicon photonic chip 1 with a built-in modulated light source, no external light source coupling is required;

[0024] The surface of the silicon photonic chip 1 with the copper protrusion 120 is inverted on the PCB board 2, and a high-frequency electrical connection is achieved by using an inverted assembly process;

[0025] An air avoidance groove 210 is provided on the PCB board 2 in the area below the light output waveguide 110 of the silicon photonic chip 1, a ceramic heat sink 3 having one end extending to the top of the air avoidance groove 210 is fixed on the silicon photonic chip 1, an array silicon lens 4 and an optical fiber array 5 are sequentially arranged in the air avoidance groove 210 along the light propagation direction, wherein the array silicon lens 4 and the optical fiber array 5 are respectively fixed to the ceramic heat sink 3, and the fixing method may be bonding, the array silicon lens 4 is coupled to the light output waveguide 110 of the silicon photonic chip 1, an optical isolator 6 is coupled between the array silicon lens 4 and the optical fiber array 5, and the optical isolator 6 may be fixed to the ceramic heat sink 3 or to the optical fiber array 5;

[0026] The 1.6T silicon photonic engine assembled with this structure can reduce one high-frequency pad transfer and shorten the RF line length, greatly improving the high-frequency electrical performance. In addition, all optical components are on the ceramic heat sink 3, the optical path is stable and reliable, and the cost is low.

[0027] Example 2

[0028] like Figure 2 , Figure 3 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0029] The optical isolator 6 is bonded to the optical fiber array 5 , and a small-sized optical isolator 6 can be selected to reduce the cost.

[0030] Example 3

[0031] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0032] The upper surface of the ceramic heat sink 3 conducts heat with the upper cover of the shell through the thermal conductive paste, and the thermal conductive paste fills the gap between the ceramic heat sink 3 and the upper cover of the shell. The ceramic heat sink 3 can directly dissipate heat through the upper cover of the shell, thereby improving the heat dissipation performance of the product.

[0033] Example 4

[0034] like Figure 3 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0035] The air-avoiding groove 210 is narrowed in the area corresponding to the pigtail in the optical fiber array 5 , so as to reduce the influence of the air-avoiding groove 210 on the strength of the PCB board 2 .

[0036] Example 5

[0037] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0038] An underfill is filled between the silicon photonic chip 1 and the PCB board 2 to increase the bonding strength and absorb thermal stress, which can effectively prevent the silicon photonic chip 1 from being damaged.

[0039] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A 1.6T silicon photonics engine, characterized in that: include: A silicon photonic chip (1) and a PCB (2), wherein the silicon photonic chip (1) has a built-in modulated light source, the surface of the silicon photonic chip (1) having a copper convex column (120) is attached upside down on the PCB (2), an air avoidance groove (210) is provided on the PCB (2) in an area below a light output waveguide (110) of the silicon photonic chip (1), a ceramic heat sink (3) having one end extending above the air avoidance groove (210) is fixed on the silicon photonic chip (1), an array silicon lens (4) and an optical fiber array (5) fixed to the ceramic heat sink (3) are arranged in sequence in the air avoidance groove (210) along the light propagation direction, the array silicon lens (4) is coupled to the light output waveguide (110) of the silicon photonic chip (1), and an optical isolator (6) fixed to the ceramic heat sink (3) or the optical fiber array (5) is coupled between the array silicon lens (4) and the optical fiber array (5).

2. A 1.6T silicon photonics engine according to claim 1, characterized in that: The optical isolator (6) is bonded to the optical fiber array (5).

3. The 1.6T silicon photonics engine according to claim 1, characterized in that: The upper surface of the ceramic heat sink (3) conducts heat with the upper cover of the housing via the thermal conductive paste.

4. The 1.6T silicon photonics engine according to claim 1, characterized in that: The air avoidance groove (210) is narrowed in the area corresponding to the pigtail fiber in the optical fiber array (5).

5. The 1.6T silicon photonics engine according to claim 1, characterized in that: An underfill glue is filled between the silicon photonic chip (1) and the PCB board (2) to increase bonding strength and absorb thermal stress.

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