Ceramic substrate facilitating installation of semiconductor chip

Abstract

The utility model discloses a ceramic substrate convenient for installation of a semiconductor chip. The ceramic substrate comprises a ceramic body, a conductive circuit and a waterproof sealing ring. The ceramic body is internally provided with an accommodating cavity matched with the semiconductor chip, and the upper surface of the ceramic body is provided with a lead-in port for leading in the semiconductor chip. The lead-in port and the accommodating cavity are arranged in a matched manner, and the semiconductor chip can be quickly led into the accommodating cavity by utilizing the lead-in port, so that quick and accurate alignment of a patch welding pin and a welding disc is realized, the installation of the semiconductor chip is more stable, and convenience is brought to the installation of the semiconductor chip; meanwhile, a waterproof sealing ring is arranged, heat-conducting glue can be poured into the containing cavity through the through hole in a matched mode, the waterproof function between the semiconductor chip and the ceramic substrate is achieved, the use requirement is met, heat generated by the semiconductor chip can be rapidly conducted to the ceramic body through the heat-conducting glue, and the heat dissipation performance of the semiconductor chip is better.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to a ceramic substrate which is convenient for installing semiconductor chips. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength. It can be etched with various patterns like PCB boards and has a large current carrying capacity. Therefore, ceramic substrate has become the basic material for high-power power electronic circuit structure technology and interconnection technology.

[0003] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. Currently, semiconductor chips are generally installed on ceramic substrates to form an electrical component. In the prior art, the main structure of the ceramic substrate used for semiconductor chip installation includes a ceramic body and a conductive circuit. The ceramic body is a flat structure. The conductive circuit is formed and fixed on the surface of the ceramic body. The conductive circuit has multiple pads, and the multiple pads are exposed on the surface of the ceramic body. When installing, the semiconductor chip is placed on the surface of the ceramic body so that each patch solder foot of the semiconductor chip is respectively bonded and welded with the corresponding pad. When using this ceramic substrate to carry out semiconductor chips, it is necessary to first align the patch solder feet and the pads. Due to the lack of necessary auxiliary structures, it is difficult to achieve precise alignment, which brings inconvenience to the installation of semiconductor chips. At the same time, the semiconductor chip is exposed on the ceramic substrate as a whole. There is no waterproof function between the semiconductor chip and the ceramic substrate, which cannot meet the needs of use. In addition, the contact area between the semiconductor chip and the ceramic substrate is small, and the heat generated by the semiconductor chip cannot be quickly transferred to the ceramic substrate, and the heat dissipation performance of the semiconductor chip is poor. Therefore, it is necessary to improve the current ceramic substrate. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a ceramic substrate that is convenient for installing semiconductor chips. It can effectively solve the problems that the existing ceramic substrate is not convenient for installing semiconductor chips and has poor waterproofing and heat dissipation effects on semiconductor chips.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A ceramic substrate for facilitating the installation of semiconductor chips comprises a ceramic body, a conductive circuit and a waterproof sealing ring; the ceramic body is provided with a housing cavity adapted to the semiconductor chip, the upper surface of the ceramic body is provided with an introduction port for introducing the semiconductor chip, the introduction port is located above the housing cavity and communicated with the housing cavity, the introduction port and the housing cavity are coaxially arranged, the inner diameter of the introduction port is smaller than the inner diameter of the housing cavity, the lower surface of the ceramic body is provided with a through hole for exhausting air and injecting thermal conductive glue, the through hole is communicated with the housing cavity; the conductive circuit is arranged in the ceramic body, the conductive circuit has a plurality of pads, and the plurality of pads are all located on the inner bottom surface of the housing cavity; the waterproof sealing ring is sleeved on the periphery of the introduction port and is sealed with the outer wall of the semiconductor chip.

[0007] As a preferred embodiment, the ceramic body includes a lower ceramic layer and an upper ceramic layer; the conductive circuit is formed on the upper surface of the lower ceramic layer, and the through hole is located on the lower ceramic layer; the upper ceramic layer is superimposed and fixed on the upper surface of the lower ceramic layer, and a concave cavity is concavely provided on the lower surface of the upper ceramic layer. The lower ceramic layer seals the opening of the concave cavity to form the aforementioned accommodating cavity, and the aforementioned inlet is opened on the upper surface of the upper ceramic layer. The structure is simple and easy to manufacture.

[0008] As a preferred solution, the upper ceramic layer and the lower ceramic layer are bonded and fixed together by an adhesive layer, which is easy to manufacture and has a stable combination.

[0009] As a preferred solution, the conductive circuit is embedded in the upper surface of the lower ceramic layer, and multiple soldering pads protrude from the upper surface of the lower ceramic layer, so that the conductive circuit is more firmly combined with the lower ceramic layer and is not easily separated. At the same time, the soldering pads can be reliably in contact with the patch soldering feet of the semiconductor chip and welded firmly. The semiconductor chip can also be suspended in the air to better perform the injection of thermal conductive adhesive. The heat generated by the semiconductor chip is conducted to the ceramic body through the thermal conductive adhesive, thereby better achieving the heat dissipation effect.

[0010] As a preferred solution, the peripheries of the upper ceramic layer and the lower ceramic layer are covered with a reinforcing frame to prevent the upper ceramic layer and the lower ceramic layer from separating, thereby effectively enhancing the overall structural strength of the ceramic body.

[0011] As a preferred solution, the reinforced frame is made of carbon fiber material, which has a stable structure and is light in weight.

[0012] As a preferred solution, the introduction port is trumpet-shaped to better enable the semiconductor chip to be introduced into the accommodating cavity.

[0013] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0014] By setting up an introduction port and a receiving cavity in combination, the semiconductor chip can be quickly introduced into the receiving cavity using the introduction port, thereby achieving fast and accurate alignment of the chip solder feet and the solder pads, and the installation of the semiconductor chip is more stable, which brings convenience to the installation of the semiconductor chip; at the same time, by setting a waterproof sealing ring and pouring thermal conductive glue into the receiving cavity through the through hole, the waterproof function between the semiconductor chip and the ceramic substrate is achieved to meet the needs of use, and the heat generated by the semiconductor chip can be quickly conducted to the ceramic body through the thermal conductive glue, which has better heat dissipation performance for the semiconductor chip.

[0015] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of a preferred embodiment of the utility model;

[0017] Figure 2 It is a cross-sectional schematic diagram of the preferred embodiment of the utility model in use.

[0018] Description of the accompanying drawings:

[0019] 10. Ceramic body 11. Lower ceramic layer

[0020] 12. Upper ceramic layer 121. Concave cavity

[0021] 13. Adhesive layer 14. Strengthen the frame

[0022] 101, accommodating chamber 102, introduction port

[0023] 103, through hole 20, conductive circuit

[0024] 21. Solder pad 30. Waterproof sealing ring

[0025] 40. Semiconductor chip 41. SMD solder pin

[0026] 50. Thermal conductive adhesive. DETAILED DESCRIPTION

[0027] Please refer to Figure 1 and Figure 2 As shown, it shows the specific structure of a preferred embodiment of the utility model, including a ceramic body 10, a conductive circuit 20 and a waterproof sealing ring 30.

[0028] The ceramic body 10 has a receiving cavity 101 adapted to the semiconductor chip 40. The upper surface of the ceramic body 10 is provided with an introduction port 102 for introducing the semiconductor chip 40. The introduction port 102 is located above the receiving cavity 101 and communicates with the receiving cavity 101. The introduction port 102 is coaxially arranged with the receiving cavity 101. The inner diameter of the introduction port 102 is smaller than the inner diameter of the receiving cavity 101. The lower surface of the ceramic body 10 is provided with a through hole 103 for exhausting air and injecting the thermal conductive adhesive 50. The through hole 103 is communicated with the receiving cavity 101. Specifically:

[0029] The ceramic body 10 includes a lower ceramic layer 11 and an upper ceramic layer 12; the through hole 103 is located on the lower ceramic layer 11, and there are multiple through holes 103, which are respectively located at the two side edges of the accommodating cavity 101; the upper ceramic layer 12 is superimposed and fixed on the upper surface of the lower ceramic layer 11, and a concave cavity 121 is concavely provided on the lower surface of the upper ceramic layer 12. The lower ceramic layer 11 seals the opening of the concave cavity 121 to form the aforementioned accommodating cavity 101, and the aforementioned introduction port 102 is opened on the upper surface of the upper ceramic layer 12, which has a simple structure and is easy to manufacture. The upper ceramic layer 12 and the lower ceramic layer 11 are bonded and fixed together by an adhesive layer 13, which is easy to manufacture and has a stable combination. The introduction port 102 is horn-shaped to better allow the semiconductor chip 40 to be introduced into the accommodating cavity 101. In addition, the periphery of the upper ceramic layer 12 and the lower ceramic layer 11 is covered with a reinforcing frame 14 to prevent the upper ceramic layer 12 and the lower ceramic layer 11 from separating, effectively enhancing the overall structural strength of the ceramic body 10. Moreover, the reinforced frame 14 is made of carbon fiber, which has a stable structure and light weight. In addition, the lower ceramic layer 11 and the upper ceramic layer 12 are made of two different ceramic materials, and different ceramic materials can be selected according to the strength requirements, thereby reducing the production cost of the product while ensuring the product performance.

[0030] The conductive circuit 20 is arranged in the ceramic body 10, and the conductive circuit 20 has a plurality of pads 21, and the plurality of pads 21 are all located on the inner bottom surface of the accommodating cavity 101. In the present embodiment, the conductive circuit 20 is formed on the upper surface of the lower ceramic layer 11 by electroplating. In addition, the conductive circuit 20 is embedded in the upper surface of the lower ceramic layer 11, and the plurality of pads 21 protrude from the upper surface of the lower ceramic layer 11, so that the conductive circuit 20 is more firmly combined with the lower ceramic layer 11, and it is not easy to separate. At the same time, the pads 21 and the patch solder feet 41 of the semiconductor chip 40 are reliably contacted and firmly welded, and the semiconductor chip 40 can also be suspended in the air, so that the thermal conductive adhesive 50 can be better poured, and the heat generated by the semiconductor chip 40 is transferred to the ceramic body 10 through the thermal conductive adhesive 50, so as to better achieve the heat dissipation effect.

[0031] The waterproof seal ring 30 is sleeved on the periphery of the inlet 102 and seals with the outer wall of the semiconductor chip 40 to prevent external water vapor from entering the accommodating cavity 101 and achieve a better waterproof effect. In this embodiment, the waterproof seal ring 30 is made of high temperature resistant silicone material, which has better durability.

[0032] The installation process of this embodiment is described in detail as follows:

[0033] During installation, first, solder paste is applied on each patch solder foot 41 of the semiconductor chip 40, and then the semiconductor chip 40 is embedded into the accommodating cavity 101 from top to bottom through the introduction port 102. During the embedding process, the through hole 103 is used for exhaust, so that the semiconductor chip 40 can be better and faster embedded in the accommodating cavity 101. After being embedded in place, each patch solder foot 41 is respectively attached to the surface of the corresponding pad 21. Then, the combined semiconductor chip 40 and the product are reflowed together, so that the semiconductor chip 40 and the product are welded and installed together and connected. Then, the thermal conductive glue 50 is poured into the accommodating cavity 101 through a part of the through holes 103, and the other part of the through holes 103 is used for exhaust, so that the thermal conductive glue 50 is more easily poured into the accommodating cavity 101, until the thermal conductive glue 50 fills the gap of the entire accommodating cavity 101 (such as Figure 2 shown).

[0034] When in use, the conductive circuit 20 is connected to the external circuit. After power is turned on, the semiconductor chip 40 starts to work. During operation, the heat generated by the semiconductor chip 40 is quickly conducted to the ceramic body 10 through the thermal conductive adhesive 50, and then quickly diffused to the outside from the ceramic body 10, achieving a good heat dissipation effect.

[0035] The design focus of the utility model is: by coordinating the provision of an introduction port and a receiving cavity, the semiconductor chip can be quickly introduced into the receiving cavity by using the introduction port, thereby realizing the rapid and accurate alignment of the patch solder pin and the solder pad, and the installation of the semiconductor chip is also more stable, which brings convenience to the installation of the semiconductor chip; at the same time, by providing a waterproof sealing ring and cooperating with the thermal conductive adhesive that can be poured into the receiving cavity through the through hole, the waterproof function between the semiconductor chip and the ceramic substrate is achieved to meet the needs of use, and the heat generated by the semiconductor chip can be quickly conducted to the ceramic body through the thermal conductive adhesive, which has a better heat dissipation performance for the semiconductor chip.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A ceramic substrate for facilitating semiconductor chip mounting, characterized in that: The invention comprises a ceramic body, a conductive circuit and a waterproof sealing ring; the ceramic body is provided with a housing cavity matched with a semiconductor chip, the upper surface of the ceramic body is provided with an introduction port for introducing the semiconductor chip, the introduction port is located above the housing cavity and is connected with the housing cavity, the introduction port and the housing cavity are coaxially arranged, the inner diameter of the introduction port is smaller than the inner diameter of the housing cavity, the lower surface of the ceramic body is provided with a through hole for exhausting air and injecting thermal conductive glue, the through hole is connected with the housing cavity; the conductive circuit is arranged in the ceramic body, the conductive circuit has a plurality of pads, and the plurality of pads are all located on the inner bottom surface of the housing cavity; the waterproof sealing ring is sleeved on the periphery of the introduction port and is sealed with the outer wall of the semiconductor chip.

2. The ceramic substrate for facilitating semiconductor chip mounting according to claim 1, characterized in that: The ceramic body includes a lower ceramic layer and an upper ceramic layer; the aforementioned conductive circuit is formed on the upper surface of the lower ceramic layer, and the through hole is located on the lower ceramic layer; the upper ceramic layer is superimposed and fixed on the upper surface of the lower ceramic layer, and a concave cavity is concavely provided on the lower surface of the upper ceramic layer. The lower ceramic layer seals the opening of the concave cavity to form the aforementioned accommodating cavity, and the aforementioned inlet is opened on the upper surface of the upper ceramic layer.

3. The ceramic substrate for facilitating semiconductor chip mounting according to claim 2, characterized in that: The upper ceramic layer and the lower ceramic layer are bonded and fixed together by an adhesive layer.

4. The ceramic substrate for facilitating semiconductor chip mounting according to claim 2, characterized in that: The conductive circuit is embedded in the upper surface of the lower ceramic layer, and a plurality of pads protrude from the upper surface of the lower ceramic layer.

5. The ceramic substrate for facilitating semiconductor chip mounting according to claim 2, characterized in that: The peripheries of the upper ceramic layer and the lower ceramic layer are covered with a reinforced frame.

6. The ceramic substrate for facilitating semiconductor chip mounting according to claim 5, characterized in that: The reinforced frame is made of carbon fiber material.

7. The ceramic substrate for facilitating semiconductor chip mounting according to claim 1, characterized in that: The introduction port is in a trumpet shape.

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