High-temperature-resistant chip module

Abstract

The utility model discloses a high-temperature-resistant chip module which comprises a chip body and an installation heat dissipation mechanism. The installation heat dissipation mechanism comprises a fixing plate, the upper end of the fixing plate is provided with an installation position in signal connection with the chip body, a heat dissipation plate capable of making surface contact with the chip body is arranged above the installation position, the edge of the heat dissipation plate is provided with a fixing column penetrating through the fixing plate, and a heat dissipation fan is fixed to the side, away from the chip body, of the heat dissipation plate. The side, opposite to the heat dissipation fan, of the heat dissipation plate is provided with heat dissipation fins arranged at intervals. According to the chip module, the heat dissipation plate is used for guiding out heat generated when the chip runs, the heat dissipation plate is provided with the heat dissipation fins, the heat dissipation area can be increased, meanwhile, the heat dissipation fan is used for dissipating heat in the heat dissipation fins and the heat conduction coating, and the heat dissipation efficiency of the chip body can be effectively improved; the chip can timely dissipate heat when operating at a high temperature, so that the operating stability of the chip at the high temperature is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a high temperature resistant chip module. Background Art

[0002] The existing automotive CAN bus chip cannot better play a role of high temperature resistance and durability during use. When the vehicle is running under high ambient temperature conditions, the temperature inside the vehicle will further increase. Long-term exposure to high temperature may cause problems such as damage to the inner wall parts of the chip, thereby affecting the service life of the chip; therefore, a durable and high temperature resistant chip is proposed to address the above problems. Utility Model Content

[0003] In view of the defects in the prior art, the purpose of the utility model is to provide a high temperature resistant chip module to solve the shortcomings of the chip in terms of poor heat dissipation effect and poor high temperature resistance.

[0004] The technical solution adopted by the utility model is: a high-temperature resistant chip module, including a chip body and a mounting heat dissipation mechanism; the mounting heat dissipation mechanism includes a fixing plate, a mounting position connected to the chip body signal is provided at the upper end of the fixing plate, a heat dissipation plate capable of surface contact with the chip body is provided above the mounting position, a fixing column passing through the fixing plate is provided at the edge of the heat dissipation plate, a heat dissipation fan is fixed on the side of the heat dissipation plate away from the chip body, and heat dissipation fins arranged at intervals are provided on the side of the heat dissipation plate opposite to the heat dissipation fan.

[0005] In this technical solution, the chip body is installed on the mounting position of the fixed plate to conduct the heat generated by the chip during operation through the heat sink. The heat sink has heat dissipation fins, which can increase the heat dissipation area. At the same time, the heat dissipation fan is used to dissipate the heat in the heat dissipation fins and the thermal conductive coating, which can effectively improve the heat dissipation efficiency of the chip body. The chip can dissipate heat in time when running at high temperature, ensuring the stability of the chip operation at high temperature.

[0006] Preferably, a hollowed-out heat conducting sheet is provided between the heat sink and the chip body, and heat dissipating silicone grease is coated on the heat conducting sheet.

[0007] Preferably, fixing buckles for fixing the chip body are provided on both sides of the installation position, and the two fixing buckles are arranged symmetrically.

[0008] Preferably, a mounting plate is hinged on the upper end of the fixing plate, an air guide port is provided on the mounting plate, the heat dissipation fan is fixed on the inner side of the air guide port, a torsion spring is provided at the hinged end between the mounting plate and the fixing plate, and the other end of the mounting plate is provided for clamping and fixing with the edge of the fixing plate.

[0009] Preferably, the mounting plate is hollowed out, and the inner side of the mounting plate is provided with reinforcing ribs arranged outwardly along the guide port.

[0010] Preferably, a fixing hole for the fixing column to pass through is provided on the outer side of the fixing plate corresponding to the mounting position, and a fixing screw threadedly connected to the fixing hole is provided in the fixing hole.

[0011] Preferably, a connection terminal electrically connected to the mounting position is provided on the outer side of the fixing plate.

[0012] The beneficial effects of the utility model are as follows: the chip module in the utility model adopts a heat sink to dissipate the heat generated when the chip is running, the heat sink has heat fins, which can increase the heat dissipation area, and at the same time utilizes a heat dissipation fan to dissipate the heat in the heat fins and the thermal conductive coating, which can effectively improve the heat dissipation efficiency of the chip body; the chip can dissipate heat in time when running at high temperature, ensuring the stability of the chip operation at high temperature; it has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0014] Figure 1 This is a three-dimensional diagram of the assembly of the high temperature resistant chip module provided in the embodiment of the utility model.

[0015] Figure 2 It is a cross-sectional view of a high temperature resistant chip module provided in an embodiment of the utility model.

[0016] Reference numerals: chip body 100 , fixing plate 200 , mounting position 210 , fixing hole 220 , heat sink 300 , fixing column 310 , heat dissipation fan 400 , heat conductive sheet 500 , fixing buckle 600 , mounting plate 700 , connection terminal 800 . DETAILED DESCRIPTION

[0017] The following embodiments of the technical solution of the utility model are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the utility model, and are therefore only used as examples, and cannot be used to limit the protection scope of the utility model.

[0018] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which the utility model belongs.

[0019] like Figure 1 and Figure 2As shown, a specific embodiment of the utility model provides a high temperature resistant chip module, which has a high temperature resistance function to ensure the stability of operation in a high temperature environment, and specifically includes a chip body 100 and an installed heat dissipation mechanism; the installed heat dissipation mechanism includes a fixed plate 200, and an installation position 210 connected to the chip body 100 signal is provided at the upper end of the fixed plate 200, and a heat sink 300 capable of surface contact with the chip body 100 is provided above the installation position 210, and a fixing column 310 passing through the fixing plate 200 is provided at the edge of the heat sink 300, and a heat dissipation fan 400 is fixed on the side of the heat sink 300 away from the chip body, and spaced heat dissipation fins are provided on the side of the heat sink 300 opposite to the heat dissipation fan 400.

[0020] like Figure 1 and Figure 2 As shown, through the above settings, the fixing plate 200 in this embodiment is used to install the chip body 100. After the chip body 100 is embedded in the mounting position 210, the heat sink 300 is fixed on the outer surface of the chip body 100. The heat generated when the chip is running is conducted out by the heat sink 300. Since the surface of the heat sink 300 has heat dissipation fins, the heat dissipation area can be increased. At the same time, the heat dissipation fan is used to dissipate the heat in the heat dissipation fins and the thermal conductive coating, which can effectively improve the heat dissipation efficiency of the chip body 100. When the chip is running at high temperature, the heat can be dissipated in time to ensure the stability of the chip running at high temperature. In addition, in order to ensure the stability of the chip body 100 installed on the fixing plate 200, the fixing buckles 600 for fixing the chip body 100 are provided on both sides of the mounting position 210 in this embodiment, and the two fixing buckles 600 are arranged symmetrically. When the chip body 100 is inserted into the mounting position 210, the fixing buckles 600 are fixed to prevent the chip body 100 structure from falling off.

[0021] like Figure 1 and Figure 2 As shown, in order to improve the heat dissipation efficiency of the heat sink 300 to the chip body 100, this embodiment is provided with a hollow heat conducting sheet 500 between the heat sink 300 and the chip body 100, and the heat conducting sheet 500 is coated with heat dissipation silicone grease. In this way, the heat generated by the operation of the chip body 100 is quickly discharged from the chip body 100 by the heat dissipation silicone grease on the heat conducting sheet 500, further improving the heat dissipation efficiency.

[0022] As mentioned above, the heat dissipation fan 400 for dissipating the heat of the chip is installed on the outside of the heat dissipation plate 300. In order to install the heat dissipation fan 400 structure, a mounting plate 700 is hinged on the upper end of the fixed plate 200 in this embodiment. The mounting plate 700 is provided with a guide port. The heat dissipation fan 400 is fixed inside the guide port. The mounting plate 700 is provided with a torsion spring at the hinged end of the fixing plate 200. The other end of the mounting plate 700 is provided with a clamping and fixing with the edge of the fixing plate 200. In this way, the mounting plate 700 can install the heat dissipation fan 400 inside the guide port. After the mounting plate 700 is fixed on the fixing plate 200, the torsion spring accumulates elastic force. When the mounting plate 700 is opened, it automatically rotates outward, which is convenient for opening the mounting plate 700 to repair the internal heat dissipation structure. In order to avoid the mounting plate 700 from affecting the heat dissipation plate 300, the mounting plate 700 in this embodiment is hollowed out, and the inner side of the mounting plate 700 is provided with reinforcing ribs arranged outward along the guide port. The hollow layout ensures heat dissipation efficiency.

[0023] like Figure 1 and Figure 2 As shown, in this embodiment, the fixing plate 200 and the heat sink 300 are fixed by plug-in cooperation. In this embodiment, a fixing hole 220 for the fixing column 310 to pass through is provided on the outer side of the fixing plate 200 corresponding to the mounting position 210, and a fixing screw screwed with the fixing hole 220 is provided in the fixing hole 220. In this way, when the fixing column 310 of the heat sink 300 is inserted into the fixing hole 220, the heat sink 300 is fixed by the fixing screw; after the chip is assembled on the control board, it needs to be connected with the circuit for control. In this embodiment, a connection terminal 800 electrically connected to the mounting position 210 is provided on the outer side of the fixing plate 200. The connection terminal 800 can be installed by welding.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model, and they should all be included in the scope of the claims and specification of the utility model.

Claims

1. A high temperature resistant chip module, characterized in that: It comprises a chip body (100) and a heat dissipation mechanism; The installation and heat dissipation mechanism comprises a fixing plate (200), a fixing position (210) connected to a chip body (100) by signal is provided at the upper end of the fixing plate (200), a heat dissipation plate (300) capable of surface contact with the chip body (100) is provided above the fixing position (210), a fixing column (310) passing through the fixing plate (200) is provided at the edge of the heat dissipation plate (300), a heat dissipation fan (400) is fixed on the side of the heat dissipation plate (300) facing away from the chip body, and heat dissipation fins arranged at intervals are provided on the side of the heat dissipation plate (300) opposite to the heat dissipation fan (400).

2. The high temperature resistant chip module according to claim 1, characterized in that: A hollowed-out heat conducting sheet (500) is provided between the heat dissipation plate (300) and the chip body (100), and heat dissipation silicone grease is coated on the heat conducting sheet (500).

3. The high temperature resistant chip module according to claim 1, characterized in that: Fixing buckles (600) for fixing the chip body (100) are provided on both sides of the installation position (210), and the two fixing buckles (600) are symmetrically arranged.

4. The high temperature resistant chip module according to claim 1, characterized in that: The upper end of the fixing plate (200) is hingedly connected to a mounting plate (700), the mounting plate (700) is provided with an air guide port, the heat dissipation fan (400) is fixed inside the air guide port, a torsion spring is provided at the hinged end between the mounting plate (700) and the fixing plate (200), and the other end of the mounting plate (700) is provided with a spring that is engaged and fixed with the edge of the fixing plate (200).

5. The high temperature resistant chip module according to claim 4, characterized in that: The mounting plate (700) is hollowed out, and a reinforcing rib arranged outwardly along the guide port is provided on the inner side of the mounting plate (700).

6. The high temperature resistant chip module according to claim 1, characterized in that: The fixing plate (200) is provided with a fixing hole (220) for the fixing column (310) to pass through on the outer side of the corresponding installation position (210), and a fixing screw threadedly connected to the fixing hole (220) is provided in the fixing hole (220).

7. The high temperature resistant chip module according to claim 1, characterized in that: A connection terminal (800) electrically connected to the mounting position (210) is provided on the outer side of the fixing plate (200).

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