Heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a heat dissipation assembly and an electronic device, and relates to the technical field of electronic device heat management, the heat dissipation assembly comprises a PCB, a plurality of heating devices and a flexible cooling fin, the plurality of heating devices are arranged on one side of the PCB in the thickness direction and are arranged in an array; the flexible cooling fin comprises a flexible base layer and graphene arranged on the flexible base layer, and the flexible cooling fin is arranged on one side of the PCB in the thickness direction and is attached to the multiple heating devices; the flexible cooling fin provided by the utility model is good in flexibility, can be in contact with a plurality of heating devices, further can meet the heat dissipation of the plurality of heating devices in a large-size electronic product at the same time, and is larger in area and better in heat dissipation effect compared with a graphene cooling fin which can only carry out heat dissipation on a single heating device.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device thermal management, in particular to a heat dissipation component and electronic equipment. Background Art

[0002] At present, heat dissipation capacity is still an important factor affecting the performance and shape of electronic products. In order to ensure the stability and service life of electronic products, electronic products need to be cooled.

[0003] The most commonly used heat sink in the industry is aluminum profile heat sink, which is large in size and high in cost. Some products also use graphene heat sinks, which are pasted to the surface of a single heating device to achieve heat dissipation of a single heating device, but cannot simultaneously meet the heat dissipation needs of multiple heating devices in large-size electronic products. Utility Model Content

[0004] The main purpose of the utility model is to provide a heat dissipation component and an electronic device, aiming to solve the problem that the existing graphene heat sink cannot simultaneously meet the heat dissipation requirements of multiple heating devices.

[0005] To achieve the above-mentioned purpose, the heat dissipation assembly proposed by the utility model includes:

[0006] PCB board;

[0007] A plurality of heating devices are disposed on one side of the PCB in the thickness direction and arranged in an array; and,

[0008] The flexible heat sink comprises a flexible base layer and graphene arranged on the flexible base layer. The flexible heat sink is arranged on one side of the PCB board in the thickness direction and is bonded to a plurality of heating devices on the PCB board.

[0009] In one embodiment, the flexible heat sink comprises a first side and a second side which are arranged opposite to each other along the thickness direction of the PCB board, and the first side is used to be attached to the heating device;

[0010] The heat dissipation assembly further includes a pressed piece, which is disposed on the second side of the flexible heat dissipation sheet.

[0011] In one embodiment, a first side of the flexible heat sink is formed with a plurality of contact portions arranged at intervals, and the plurality of contact portions are correspondingly attached to the plurality of heating elements;

[0012] A plurality of the pressing members are provided, and the plurality of the pressing members are arranged at intervals on the second side of the flexible heat sink and correspond one-to-one to the plurality of the contact portions.

[0013] In one embodiment, the PCB board is provided with a through hole, each of the heating devices is provided with a via hole, and the via hole is arranged corresponding to the through hole;

[0014] The heat dissipation assembly also includes a connecting screw, the screw end of which passes through the through hole, the via hole and the penetration hole of the flexible heat sink to cooperate with the threaded connection hole on the pressed part to fix the pressed part relative to the PCB board.

[0015] In one embodiment, the pressed part includes a plate body and a flange formed by bending an end of the plate body in a direction away from the flexible heat sink.

[0016] In one embodiment, a first thermal conductive adhesive layer is disposed on the first side of the flexible heat sink.

[0017] In one embodiment, a second heat-conducting adhesive layer is disposed on a side of the pressed part facing the flexible heat sink.

[0018] In one embodiment, the flexible heat sink includes a first heat sink segment and a second heat sink segment sequentially arranged along the width direction of the PCB board, and a plurality of notches are provided at one end of the second heat sink segment facing away from the first heat sink segment. The plurality of notches are spaced apart along the length direction of the flexible heat sink to form a heat-conducting contact portion between two adjacent notches, and the heat-conducting contact portion is used to be attached to the heating device.

[0019] In one embodiment, an adhesive layer is provided on a side of each of the heating components facing away from the PCB board, so as to relatively fix the heating component and the heat-conducting contact portion.

[0020] The utility model also provides an electronic device, the electronic device comprising a heat dissipation component, the heat dissipation component comprising:

[0021] PCB board;

[0022] A plurality of heating devices are disposed on one side of the PCB in the thickness direction and arranged in an array; and,

[0023] The flexible heat sink comprises a flexible base layer and graphene arranged on the flexible base layer. The flexible heat sink is arranged on one side of the PCB board in the thickness direction and is bonded to the plurality of heating devices.

[0024] In the technical solution of the utility model, the heat dissipation assembly includes a PCB board, a plurality of heating devices and a flexible heat sink, wherein the plurality of heating devices are arranged on one side of the PCB board in the thickness direction and are arranged in an array; the flexible heat sink includes a flexible base layer and graphene arranged on the flexible base layer, wherein the flexible heat sink is arranged on one side of the PCB board in the thickness direction and is bonded to the plurality of heating devices. The flexible heat sink has good flexibility and can contact with the plurality of heating devices, thereby simultaneously meeting the heat dissipation of the plurality of heating devices in large-sized electronic products. Compared with the graphene heat sink that can only dissipate heat for a single heating device, the flexible heat sink has a larger area and a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0026] Figure 1 A schematic structural diagram of an embodiment of a heat dissipation assembly provided by the utility model;

[0027] Figure 2 for Figure 1 Exploded view of the heat dissipation component;

[0028] Figure 3 for Figure 1 A cross-sectional view of a heat dissipation component;

[0029] Figure 4 A structural schematic diagram of another embodiment of the heat dissipation assembly provided by the utility model;

[0030] Figure 5 This is a structural schematic diagram of another embodiment of the heat dissipation component provided by the utility model.

[0031] Description of Figure Numbers:

[0032] 100. heat dissipation component; 1. PCB board; 1a. through hole; 2. heating element; 2a. via; 3. flexible heat sink; 3a. first thermal conductive adhesive layer; 31. first heat dissipation section; 32. second heat dissipation section; 321. notch; 322. thermal contact portion; 4. pressed part; 4a. second thermal conductive adhesive layer; 41. board body; 42. flange.

[0033] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0037] At present, heat dissipation capacity is still an important factor affecting the performance and shape of electronic products. In order to ensure the stability and service life of electronic products, electronic products need to be cooled.

[0038] The most commonly used heat sink in the industry is aluminum profile heat sink, which is large in size and high in cost. Some products also use graphene heat sinks, which are pasted to the surface of a single heating device to achieve heat dissipation of a single heating device, but cannot simultaneously meet the heat dissipation needs of multiple heating devices in large-size electronic products.

[0039] The utility model proposes a heat dissipation component, wherein the flexible heat sink has good flexibility and can be in contact with a plurality of the heat generating devices, thereby being able to simultaneously meet the heat dissipation needs of a plurality of the heat generating devices in large-size electronic products. Compared with a graphene heat sink that can only dissipate heat for a single heat generating device, the flexible heat sink has a larger area and a better heat dissipation effect. Figures 1 to 3 , is an embodiment of the heat dissipation assembly proposed by the utility model; Figure 4A structural schematic diagram of another embodiment of the heat dissipation assembly provided by the utility model; Figure 5 This is a structural schematic diagram of another embodiment of the heat dissipation component provided by the utility model.

[0040] See also Figure 1 In one embodiment of the utility model, the heat dissipation assembly 100 includes a PCB board 1, a plurality of heating devices 2 and a flexible heat sink 3. The plurality of heating devices 2 are arranged on one side of the PCB board 1 in the thickness direction and are arranged in an array; the flexible heat sink 3 includes a flexible base layer and graphene arranged on the flexible base layer. The flexible heat sink 3 is arranged on one side of the PCB board 1 in the thickness direction and is bonded to the plurality of heating devices 2.

[0041] In the technical solution of the utility model, the heat dissipation assembly 100 includes a PCB board 1, a plurality of heating devices 2 and a flexible heat sink 3. The plurality of heating devices 2 are arranged on one side of the PCB board 1 in the thickness direction and are arranged in an array; the flexible heat sink 3 includes a flexible base layer and graphene arranged on the flexible base layer. The flexible heat sink 3 is arranged on one side of the PCB board 1 in the thickness direction and is attached to the plurality of heating devices 2. The flexible heat sink 3 has good flexibility and can contact with the plurality of heating devices 2, thereby simultaneously meeting the heat dissipation of the plurality of heating devices 2 in large-sized electronic products. Compared with the graphene heat sink that can only dissipate heat for a single heating device 2, the flexible heat sink 3 has a larger area and a better heat dissipation effect.

[0042] The flexible heat sink 3 is attached to multiple heating devices 2, thereby dissipating heat from the multiple heating devices 2 at the same time. In order to make the flexible heat sink 3 fit better with each heating device 2, a pressing piece 4 is provided on the flexible heat sink 3. Figures 1 to 3 The flexible heat sink 3 includes a first side and a second side which are arranged opposite to each other along the thickness direction of the PCB board 1, and the first side is attached to the plurality of heating devices 2; the heat dissipation assembly 100 also includes a pressing piece 4, and the pressing piece 4 is arranged on the second side of the flexible heat sink 3. In this way, under the action of gravity of the pressing piece 4, the flexible heat sink 3 can be pressed tightly, so that the flexible heat sink 3 and each heating device 2 are closely attached to improve the heat dissipation effect.

[0043] The specific arrangement of the pressing member 4 is not limited. It can be an integral arrangement, that is, a pressing member 4 is used to press the flexible heat sink 3 so that the flexible heat sink 3 and each heating device 2 are closely fitted. It can also be a split arrangement, that is, a plurality of pressing members 4 are used so that each heating device 2 is closely fitted with the flexible heat sink 3. In the embodiment of the utility model, please refer to Figure 4The first side of the flexible heat sink 3 is formed with a plurality of contact portions arranged at intervals, and the plurality of contact portions are correspondingly attached to the plurality of heating devices 2; a plurality of pressing pieces 4 are provided, and the plurality of pressing pieces 4 are arranged at intervals on the second side of the flexible heat sink 3, and correspond one-to-one to the plurality of contact portions. Since the plurality of contact portions correspond to the plurality of heating devices 2, and the plurality of pressing pieces 4 are arranged at intervals on the second side of the flexible heat sink 3, and correspond one-to-one to the plurality of contact portions, each contact portion can be closely attached to the corresponding heating device 2, thereby improving the heat dissipation effect, and the pressing piece 4 is designed as a single body to realize the standardization of parts, forming a standard part, which is not restricted by arrangement and quantity, and has stronger versatility.

[0044] In the embodiments of the present invention, please refer to Figures 1 to 3 , the PCB board 1 is provided with a through hole 1a, each heating device 2 is provided with a through hole 2a, and the through hole 2a is arranged corresponding to the through hole 1a; the heat dissipation assembly 100 also includes a connecting screw, the screw end of the connecting screw passes through the through hole 1a, the through hole 2a and the through hole of the flexible heat sink 3, and is used to cooperate with the threaded connection hole on the pressing piece 4, so that the pressing piece 4 and the PCB board 1 are relatively fixed. In this way, through the joint action of the PCB board 1, the pressing piece 4 and the connecting screw, the flexible heat sink 3 and the multiple heating devices 2 are clamped and fixed, so that the flexible heat sink 3 and the multiple heating devices 2 are better fitted, and the heat dissipation effect is further improved.

[0045] In the embodiments of the present invention, please refer to Figure 1 The pressed part 4 includes a plate body 41 and a flange 42 formed by bending the end of the plate body 41 in a direction away from the flexible heat sink 3. By forming the flange 42 on the pressed part 4, the stability and anti-deformation ability of the pressed part 4 are improved to ensure that the flexible heat sink 3 and the heating device 2 are closely fitted.

[0046] In the embodiment of the present utility model, please refer to Figure 2 A first heat conductive adhesive layer 3a is provided on the first side of the flexible heat sink 3. In this way, the flexible heat sink 3 can be pre-pasted and installed on the surface of multiple heat dissipation devices, and the first heat conductive adhesive layer 3a has a certain flexibility, which can make the flexible heat sink 3 and the heat-generating device 2 fit better, and the heat conduction effect can be better.

[0047] In the embodiments of the present invention, please refer to Figure 2 , a second heat conductive adhesive layer 4a is provided on one side of the pressed piece 4 facing the flexible heat sink 3. In this way, the flexible heat sink 3 and the pressed piece 4 can be relatively fixed, which is convenient for installation on the PCB board 1, and at the same time, the heat of the flexible heat sink 3 can be better transferred to the pressed piece 4, so as to assist in heat dissipation through the pressed piece 4.

[0048] In another embodiment of the utility model, a first thermally conductive adhesive layer 3a is provided on a first side of the flexible heat sink 3 for fixing the plurality of heating devices 2 relative to the flexible heat sink 3, and a second thermally conductive adhesive layer 4a is provided on a side of the pressed piece 4 facing the flexible heat sink 3, and the second thermally conductive adhesive layer 4a is used to fix the pressed piece 4 relative to the flexible heat sink 3.

[0049] In the embodiments of the present invention, please refer to Figure 5 The flexible heat sink 3 includes a first heat sink section 31 and a second heat sink section 32 sequentially arranged along the width direction of the PCB board 1. A plurality of notches 321 are provided at one end of the second heat sink section 32 away from the first heat sink section 31. The plurality of notches 321 are arranged at intervals along the length direction of the flexible heat sink 3 to form a heat-conducting contact portion 322 between two adjacent notches 321. The heat-conducting contact portion 322 is used to be attached to the heating device 2. Since the flexible heat sink 3 is attached to the plurality of heating devices 2, and the heights of the plurality of heating devices 2 are different, deformation stress is generated inside the flexible heat sink 3, which affects its service life. By setting a plurality of notches 321, the deformation stress inside the flexible heat sink 3 can be eliminated, and the heat-conducting contact portion 322 is in contact with the corresponding heating device 2 to meet the heat dissipation requirements, and can better adapt to the height of the heating device 2 when used.

[0050] In the embodiment of the utility model, each heating device 2 is provided with an adhesive layer on the side facing away from the PCB board 1, so as to relatively fix the heating device 2 and the heat-conducting contact portion 322. In this way, the heating device 2 and the heat sink are fitted and fixed. It should be noted that in order to prevent the adhesive layer from affecting the heat conduction effect between the heating device 2 and the heat sink, the adhesive layer is also set as a thermally conductive adhesive layer with thermal conductivity and adhesion properties.

[0051] The utility model also proposes an electronic device, including a heat dissipation component 100. The specific structure of the heat dissipation component 100 refers to the above embodiment. Since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0052] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation component, characterized in that: include: PCB board; A plurality of heating devices are arranged on one side of the PCB in the thickness direction and are arranged in an array; and, The flexible heat sink comprises a flexible base layer and graphene arranged on the flexible base layer. The flexible heat sink is arranged on one side of the PCB board in the thickness direction and is bonded to the plurality of heating devices.

2. The heat dissipation assembly according to claim 1, characterized in that: The flexible heat sink comprises a first side and a second side which are arranged opposite to each other along the thickness direction of the PCB board, and the first side is in contact with the plurality of heating components; The heat dissipation assembly further includes a pressed piece, which is disposed on the second side of the flexible heat dissipation sheet.

3. The heat dissipation assembly according to claim 2, characterized in that: A plurality of contact portions are formed on the first side of the flexible heat sink, and the plurality of contact portions are in contact with the plurality of heating elements correspondingly; A plurality of the pressing members are provided, and the plurality of the pressing members are arranged at intervals on the second side of the flexible heat sink and correspond one-to-one to the plurality of the contact portions.

4. The heat dissipation assembly according to claim 2 or 3, characterized in that: The PCB board is provided with a through hole, each of the heating components is provided with a via hole, and the via hole is arranged corresponding to the through hole; The heat dissipation assembly also includes a connecting screw, the screw end of which passes through the through hole, the via hole and the penetration hole of the flexible heat sink to cooperate with the threaded connection hole on the pressed part to fix the pressed part relative to the PCB board.

5. The heat dissipation assembly according to claim 2, characterized in that: The pressed part comprises a plate body and a flange formed by bending from an end of the plate body in a direction away from the flexible heat sink.

6. The heat dissipation assembly according to claim 2, characterized in that: A first heat-conducting adhesive layer is disposed on the first side of the flexible heat sink.

7. The heat dissipation assembly according to claim 2, characterized in that: A second heat-conducting adhesive layer is disposed on a side of the pressed part facing the flexible heat sink.

8. The heat dissipation assembly according to claim 1, wherein: The flexible heat sink includes a first heat sink section and a second heat sink section which are sequentially arranged along the width direction of the PCB board. A plurality of notches are provided at one end of the second heat sink section which is away from the first heat sink section. The plurality of notches are spaced apart along the length direction of the flexible heat sink to form a heat-conducting contact portion between two adjacent notches. The heat-conducting contact portion is used to be attached to the heating device.

9. The heat dissipation assembly according to claim 8, characterized in that: An adhesive layer is provided on a side of each heating element facing away from the PCB board, so as to relatively fix the heating element and the heat-conducting contact portion.

10. An electronic device, characterized in that: Comprising a heat dissipation assembly as claimed in any one of claims 1 to 9.

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