Pressure adjusting mechanism for precise polishing of wafer

Abstract

The utility model relates to the technical field of wafer processing, in particular to a pressure regulating mechanism for precise polishing of wafers, which comprises a fixed disc, a motor arranged at the bottom of the fixed disc, a driving gear coaxially connected to an output shaft of the motor, a driven gear rotatably connected to the top of the fixed disc, and a screw coaxially connected to the top end of a rotating shaft of the driven gear. The outer wall of the lead screw is in threaded connection with an inner threaded pipe, the top end of the inner threaded pipe is fixedly connected with a connecting disc, and a detachable bottom disc is arranged at the top of the connecting disc. According to the pressure adjusting mechanism for precise polishing of the wafer, a motor drives a driving gear to rotate, the driving gear drives a driven gear to rotate, the driven gear drives a lead screw to rotate, four circular vertical rods are slidably connected into four circular sleeves respectively, when the lead screw rotates, an inner threaded pipe moves upwards or downwards relative to a fixed disc, and therefore the inner threaded pipe can move upwards or downwards relative to the fixed disc; therefore, the distance between the connecting disc and the fixing disc is adjusted, the pressure between the polishing head and the base disc is adjusted, and pressure adjustment between the base disc and the wafer is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a pressure regulating mechanism for wafer precision polishing. Background Art

[0002] The pressure regulating mechanism for wafer precision polishing refers to the equipment used to control the pressure applied to the wafer during the chemical mechanical polishing process. This mechanism is essential to maintaining uniformity and accuracy during wafer polishing. Chemical mechanical polishing technology is a means to achieve global flatness in integrated circuit manufacturing. This process is specially designed to enable the wafer to have a surface that is both flat and free of scratches and impurities. The polishing head carries the wafer on a rotating polishing disk and polishes it with abrasive slurry for chemical mechanical polishing.

[0003] The patent with publication number CN215317969U discloses a chemical mechanical polishing device that is easy to adjust, including a chassis, an outer side wall of the bottom end of the chassis is provided with an annular groove, and a fixed ring is slidably connected inside the annular groove. The utility model sets a reset mechanism, a clamping mechanism, a protective structure and a boosting mechanism. When the pressure between the chassis and the polishing head needs to be adjusted for polishing different wafer surfaces, the expansion degree of the airbag can be adjusted, and the pressure between the polishing head pressed on the chassis and the chassis can be adjusted. The pressure between the upper surface of the chassis and the wafer can be adjusted to avoid affecting the polishing effect on the surface of the wafer when polishing different wafers. By setting the clamping mechanism, the reset mechanism and the protective mechanism, when the chassis needs to be inspected or replaced, the disassembly operation is simple, and after the replacement is completed, the installation operation is simple, which is convenient for inspecting and replacing the chassis and easy to use.

[0004] In the specific use of the above-mentioned prior art, the booster pump inflates the airbag through the air inlet pipe or extracts the internal gas of the airbag through the vacuum pump, so as to adjust the expansion degree of the airbag, thereby adjusting the distance between the fixed plate and the chassis, adjusting the pressure between the polishing head pressed on the chassis and the chassis, and then adjusting the pressure between the upper surface of the chassis and the wafer. However, during the repeated inflation and deflation of the airbag, the surface of the airbag will rub against the top of the fixed plate and the bottom of the chassis. After long-term use, the airbag will rupture due to wear, which is not conducive to long-term use. Secondly, the structure used to connect the chassis in the above-mentioned prior art is very complicated, which is not conducive to the disassembly, assembly and replacement of the chassis. In view of this, we propose a pressure regulating mechanism for precision polishing of wafers. Utility Model Content

[0005] The purpose of the utility model is to provide a pressure regulating mechanism for wafer precision polishing to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The pressure regulating mechanism for wafer precision polishing comprises a fixed plate, wherein a motor is arranged at the bottom and near the middle of the fixed plate, and the motor works by an external power supply, and a power supply compartment can be arranged at the bottom of the fixed plate, and a rechargeable battery pack is arranged in the power supply compartment, so as to avoid the influence of the wire connected to the motor on the rotation of the fixed plate, the output shaft of the motor passes through the bottom of the fixed plate and is coaxially connected with a driving gear, the middle part of the top of the fixed plate is rotatably connected with a driven gear meshing with the driving gear, the top end of the driven gear rotating shaft is coaxially connected with a lead screw, the outer wall of the lead screw is threadedly connected with an internally threaded tube, the top end of the internally threaded tube is fixedly connected with a connecting plate, and the fixed plate The top of the connecting plate is provided with four circular vertical rods arranged in a matrix, the bottom of the connecting plate is provided with four circular sleeves arranged in a matrix, the four circular vertical rods are respectively slidably connected in the four circular sleeves, and a detachable chassis is provided on the top of the connecting plate. The driving gear is driven by the motor to rotate, so that the driving gear drives the driven gear to rotate, and the driven gear drives the lead screw to rotate. Since the four circular vertical rods are respectively slidably connected in the four circular sleeves, when the lead screw rotates, the internal threaded tube will move upward or downward relative to the fixed plate, thereby adjusting the distance between the connecting plate and the fixed plate, adjusting the pressure between the polishing head and the chassis, and then realizing the pressure adjustment between the chassis and the wafer.

[0008] Preferably, a rotating shaft is provided in the middle of the bottom of the fixed disk, and the rotating shaft is connected to the output shaft of the mechanical polishing device, so that the mechanical polishing device drives the fixed disk to rotate.

[0009] Preferably, the diameter of the driving gear is smaller than that of the driven gear, and the transmission ratio between the driving gear and the driven gear is 10:1, so that the motor indirectly drives the driven gear to rotate slowly, which is conducive to the screw driving the internal threaded tube to fine-tune the distance up and down, and avoid the chassis from exerting excessive pressure on the wafer.

[0010] Preferably, the top of the connecting plate is provided with two rectangular holes which are arranged symmetrically in the front and back, and the bottom of the chassis is provided with two rectangular plugs which are arranged symmetrically in the front and back. The two rectangular plugs pass through the two rectangular holes respectively, so that the chassis is initially positioned on the connecting plate.

[0011] Preferably, a rectangular solid block is provided at the bottom of the connecting disk and near the front and rear ends, the opposite sides of the two rectangular solid blocks are threadedly connected with bolts, the threaded ends of the two bolts are provided with circular insertion rods, and circular holes b are opened on the opposite sides of the two rectangular insertion blocks and near the bottom. The two circular insertion rods are respectively inserted into the two circular holes b, and the circular insertion rods are driven to move forward and backward by the bolts. When the circular insertion rods are inserted into the circular holes b, the relative positions of the rectangular insertion blocks and the rectangular solid blocks can be fixed, so that the chassis is fixed on the top of the connecting disk. When the circular insertion rods are completely removed from the circular holes b, the positioning of the rectangular insertion blocks can be released, so that the chassis can move upward and separate from the connecting disk, thereby realizing the disassembly of the chassis.

[0012] Preferably, four circular holes a arranged in a matrix are provided at the top of the connecting plate and near the outer edge, and four circular positioning protrusions arranged in a matrix are provided at the bottom of the chassis. The four circular positioning protrusions are respectively inserted into the four circular holes a to improve the stability of the connection between the chassis and the connecting plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The pressure regulating mechanism for wafer precision polishing drives the active gear to rotate through a motor, so that the active gear drives the driven gear to rotate, and the driven gear drives the lead screw to rotate. Since the four circular vertical rods are respectively slidably connected to the four circular sleeves, when the lead screw rotates, the internal threaded tube will move up or down relative to the fixed plate, thereby adjusting the distance between the connecting plate and the fixed plate, and then adjusting the pressure between the polishing head and the chassis, thereby realizing the pressure regulation between the chassis and the wafer.

[0015] 2. The pressure adjustment mechanism of the wafer precision polishing drives the circular insert rod to move forward and backward through the bolt. When the circular insert rod is inserted into the circular hole b, the relative position of the rectangular insert block and the rectangular solid block can be fixed, so that the chassis is fixed on the top of the connecting plate. When the circular insert rod is completely removed from the circular hole b, the positioning of the rectangular insert block can be released, so that the chassis can move upward and separate from the connecting plate, thereby realizing the disassembly of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall first-view structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the overall structure of the utility model from a second viewing angle;

[0018] Figure 3 It is a partial structural schematic diagram of the utility model;

[0019] Figure 4It is a schematic diagram of the assembly structure of the internal threaded pipe, the connecting plate and the bolts in the utility model;

[0020] Figure 5 This is a schematic diagram of the connecting disk structure in the utility model;

[0021] Figure 6 It is a schematic diagram of the chassis structure in the utility model.

[0022] In the figure: 1, fixed plate; 10, rotating shaft; 11, circular pole; 2, motor; 3, driving gear; 4, driven gear; 5, screw rod; 6, internal threaded pipe; 7, connecting plate; 70, circular sleeve; 71, rectangular hole; 72, rectangular solid block; 73, circular hole a; 8, chassis; 80, rectangular plug block; 800, circular hole b; 81, circular positioning protrusion; 9, bolt; 90, circular plug rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] See also Figure 1-Figure 6 , the utility model provides a technical solution:

[0026] The pressure regulating mechanism for wafer precision polishing comprises a fixed disk 1, a motor 2 is arranged at the bottom and near the middle of the fixed disk 1, the motor 2 works with an external power supply, a power supply compartment can be arranged at the bottom of the fixed disk 1, a rechargeable battery pack is arranged in the power supply compartment, so that the wire connected to the motor 2 can be prevented from affecting the rotation of the fixed disk 1, the output shaft of the motor 2 passes through the bottom of the fixed disk 1 and is coaxially connected with a driving gear 3, the middle of the top of the fixed disk 1 is rotatably connected with a driven gear 4 meshing with the driving gear 3, the top of the driven gear 4 rotating shaft is coaxially connected with a lead screw 5, the outer wall of the lead screw 5 is threadedly connected with an internally threaded tube 6, the top of the internally threaded tube 6 is fixedly connected with a connecting disk 7, and the top of the fixed disk 1 is provided with four The circular vertical rods 11 are arranged in a matrix, and four circular sleeves 70 arranged in a matrix are provided at the bottom of the connecting plate 7. The four circular vertical rods 11 are respectively slidably connected in the four circular sleeves 70. A detachable chassis 8 is provided on the top of the connecting plate 7. The driving gear 3 is driven to rotate by the motor 2, so that the driving gear 3 drives the driven gear 4 to rotate, and the driven gear 4 drives the screw rod 5 to rotate. Since the four circular vertical rods 11 are respectively slidably connected in the four circular sleeves 70, when the screw rod 5 rotates, the internal threaded tube 6 will move upward or downward relative to the fixed plate 1, thereby adjusting the distance between the connecting plate 7 and the fixed plate 1, adjusting the pressure between the polishing head and the chassis 8, and then realizing the pressure adjustment between the chassis 8 and the wafer.

[0027] In this embodiment, a rotating shaft 10 is provided in the middle of the bottom of the fixed plate 1 , and the rotating shaft 10 is connected to the output shaft of the mechanical polishing device, so that the mechanical polishing device drives the fixed plate 1 to rotate.

[0028] Specifically, the diameter of the driving gear 3 is smaller than that of the driven gear 4, and the transmission ratio between the driving gear 3 and the driven gear 4 is 10:1, so that the motor 2 indirectly drives the driven gear 4 to rotate slowly, which is conducive to the screw rod 5 driving the internal threaded tube 6 to fine-tune the distance up and down, avoiding excessive pressure on the wafer caused by the chassis 8.

[0029] Furthermore, two rectangular holes 71 are arranged symmetrically in the front and back directions on the top of the connecting plate 7, and two rectangular plug-ins 80 are arranged symmetrically in the front and back directions on the bottom of the chassis 8. The two rectangular plug-ins 80 pass through the two rectangular holes 71 respectively, so that the chassis 8 is initially positioned on the connecting plate 7.

[0030] Furthermore, rectangular solid blocks 72 are provided at the bottom of the connecting disk 7 and near the front and rear ends. Bolts 9 are threadedly connected to the opposite sides of the two rectangular solid blocks 72. Circular insert rods 90 are provided at the threaded ends of the two bolts 9. Circular holes b800 are provided on the opposite sides of the two rectangular insert blocks 80 and near the bottom. The two circular insert rods 90 are respectively inserted into the two circular holes b800, and the circular insert rods 90 are driven to move forward and backward by the bolts 9. When the circular insert rods 90 are inserted into the circular holes b800, the relative positions of the rectangular insert blocks 80 and the rectangular solid blocks 72 can be fixed, so that the chassis 8 is fixed on the top of the connecting disk 7. When the circular insert rods 90 are completely removed from the circular holes b800, the positioning of the rectangular insert blocks 80 can be released, so that the chassis 8 can move upward and be separated from the connecting disk 7, thereby realizing the disassembly of the chassis 8.

[0031] Furthermore, four circular holes a73 arranged in a matrix are provided at the top of the connecting plate 7 and near the outer edge, and four circular positioning protrusions 81 arranged in a matrix are provided at the bottom of the chassis 8. The four circular positioning protrusions 81 are respectively inserted into the four circular holes a73 to improve the stability of the connection between the chassis 8 and the connecting plate 7.

[0032] When the pressure regulating mechanism for wafer precision polishing of this embodiment is in use, the rotating shaft 10 is connected to the output shaft of the mechanical polishing equipment, and the polishing head carries the wafer and abuts against the upper surface of the chassis 8. When the pressure between the chassis 8 and the polishing head needs to be adjusted for polishing different wafer surfaces, the staff starts the motor 2, and the motor 2 drives the active gear 3 to rotate, so that the active gear 3 drives the driven gear 4 to rotate, and the driven gear 4 drives the screw rod 5 to rotate. Since the four circular vertical rods 11 are respectively slidably connected to the four circular sleeves 70, when the screw rod 5 rotates, the internal threaded tube 6 will move upward or downward relative to the fixed plate 1, thereby adjusting the distance between the connecting plate 7 and the fixed plate 1, and then adjusting the distance between the connecting plate 7 and the fixed plate 1. The pressure between the polishing head and the chassis 8 is adjusted to achieve pressure regulation between the chassis 8 and the wafer, so as to avoid affecting the polishing effect on the wafer surface when polishing different wafers; when the chassis 8 needs to be replaced, the staff will screw the two bolts 9 outward so that the two bolts 9 respectively drive the two circular insertion rods 90 to move, until the two circular insertion rods 90 are completely removed from the two circular holes b800 respectively, so as to release the positioning of the two rectangular plug blocks 80, so that the chassis 8 can move upward and separate from the connecting plate 7, so as to realize the disassembly of the chassis 8, and then install the new chassis 8 on the top of the connecting plate 7, and tighten the two bolts 9 to fix the relative position of the chassis 8 and the connecting plate 7.

[0033] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A pressure regulating mechanism for wafer precision polishing, comprising a fixed plate (1), characterized in that: A motor (2) is provided at the bottom and near the middle of the fixed disk (1); the output shaft of the motor (2) passes through the bottom of the fixed disk (1) and is coaxially connected to a driving gear (3); a driven gear (4) meshing with the driving gear (3) is rotatably connected to the middle of the top of the fixed disk (1); a screw rod (5) is coaxially connected to the top of the rotating shaft of the driven gear (4); an internally threaded tube (6) is threadedly connected to the outer wall of the screw rod (5); a connecting disk (7) is fixedly connected to the top of the internally threaded tube (6); four circular vertical rods (11) arranged in a matrix are provided at the top of the fixed disk (1); four circular sleeves (70) arranged in a matrix are provided at the bottom of the connecting disk (7); the four circular vertical rods (11) are slidably connected to the four circular sleeves (70) respectively; and a detachable chassis (8) is provided at the top of the connecting disk (7).

2. The pressure regulating mechanism for wafer precision polishing according to claim 1, characterized in that: A rotating shaft (10) is provided in the middle of the bottom of the fixed plate (1), and the rotating shaft (10) is connected to the output shaft of the mechanical polishing equipment.

3. The pressure regulating mechanism for wafer precision polishing according to claim 1, characterized in that: The diameter of the driving gear (3) is smaller than the diameter of the driven gear (4), and the transmission ratio between the driving gear (3) and the driven gear (4) is 10:

1.

4. The pressure regulating mechanism for wafer precision polishing according to claim 1, characterized in that: The top of the connection plate (7) is provided with two rectangular holes (71) arranged symmetrically in the front and back directions, and the bottom of the chassis (8) is provided with two rectangular plug-in blocks (80) arranged symmetrically in the front and back directions, and the two rectangular plug-in blocks (80) pass through the two rectangular holes (71) respectively.

5. The pressure regulating mechanism for wafer precision polishing according to claim 4, characterized in that: A rectangular solid block (72) is provided at the bottom of the connection plate (7) and near the front and rear ends; bolts (9) are threadedly connected to the opposite sides of the two rectangular solid blocks (72); circular insertion rods (90) are provided at the threaded ends of the two bolts (9); circular holes b (800) are provided at the opposite sides of the two rectangular insertion blocks (80) and near the bottom; the two circular insertion rods (90) are respectively inserted into the two circular holes b (800).

6. The pressure regulating mechanism for wafer precision polishing according to claim 1, characterized in that: Four circular holes a (73) arranged in a matrix are provided at the top of the connection plate (7) and near the outer edge, and four circular positioning protrusions (81) arranged in a matrix are provided at the bottom of the base plate (8), and the four circular positioning protrusions (81) are respectively inserted into the four circular holes a (73).

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