Cutting device for semiconductor lighting manufacturing

Abstract

The utility model relates to the technical field of semiconductors, in particular to a cutting device for semiconductor lighting manufacturing, which comprises a cutting motor, a mounting plate is fixed on the left side of the cutting motor through bolts, the left side of the mounting plate is connected with a connecting frame, and the lower end of the connecting frame is connected with a circulating mechanism for recycling deionized water. An adjusting mechanism used for adjusting the cutting height is installed at the upper end of the connecting frame, and a protection mechanism used for protecting cutting is installed on the outer wall of the cutting motor. According to the semiconductor wafer cutting device, through the arranged circulating mechanism, semiconductor wafers can be cooled during cutting, sprayed deionized water can flow into a water storage tank, large impurities in water are filtered through a filter plate, recycling is achieved, when the deionized water passes through a fine filter part, the deionized water can flow into a fine filter pipe from the outside, and the deionized water can flow into the fine filter pipe from the inside of the fine filter part. And therefore, small impurities in the deionized water are further filtered, and the situation that the impurities affect the cutting effect is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a cutting device for manufacturing semiconductor lighting. Background Art

[0002] Wafer cutting devices in semiconductor lighting manufacturing refer specifically to devices used to cut semiconductor silicon wafers. These devices play a vital role in the semiconductor manufacturing process because they determine the size, shape, and precision of semiconductor devices, which in turn affects the performance and reliability of the entire product. Wafer cutting devices are one of the indispensable key equipment in the semiconductor manufacturing process. They provide strong support for the manufacturing of semiconductor lighting products through high-precision and high-efficiency cutting technology.

[0003] The existing wafer cutting device cannot position the cutting blade, which may cause the wafer to deviate when cutting, affecting the cutting effect;

[0004] The existing patent (Announcement No.: CN210850879U) discloses a semiconductor wafer cutting device, which includes a base. The diamond cutting knife is controlled within the cutting range through the positioning hole to ensure the cutting stability, and a water pump and a water pipe are set to achieve the effect of cooling through the water pipe.

[0005] In response to the above problems, the solution provided by the existing patent controls the cutting knife within the cutting range through positioning holes to ensure the stability of cutting, and dissipates heat when cutting the wafer by spraying deionized water, but it cannot recycle the deionized water, resulting in excessive waste and reducing the practicality of the cutting device. Summary of the invention

[0006] The purpose of the utility model is to provide a cutting device for semiconductor lighting manufacturing, which can cool the semiconductor wafer during cutting. The sprayed deionized water will flow into the water storage tank, filter the larger impurities in the water through the filter plate, and realize recycling. When the deionized water passes through the fine filter, it will flow from the outside of the fine filter tube into the inside, thereby further filtering the smaller impurities in the deionized water, thereby preventing these impurities from affecting the cutting effect, so as to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cutting device for semiconductor lighting manufacturing, comprising a cutting motor, a mounting plate is fixed to the left side of the cutting motor by bolts, a connecting frame is connected to the left side of the mounting plate, a circulation mechanism for recycling deionized water is connected to the lower end of the connecting frame, an adjustment mechanism for adjusting the cutting height is installed at the upper end of the connecting frame, and a protective mechanism for cutting protection is installed on the outer wall of the cutting motor;

[0008] The circulation mechanism includes a water tank, a filter plate is arranged in the horizontal direction inside the water tank, both ends of the filter plate are fixed with blocks slidably connected to the water tank, the outer wall of the water tank is connected to a fine filter, the inner wall of the fine filter is installed with a fine filter tube, the inner wall of the fine filter is rotatably connected to a transmission rod through a bearing, one end of the transmission rod is fixed with a water impeller, and the other end of the transmission rod is fixed with two cleaning brushes that fit tightly with the outer surface of the fine filter tube.

[0009] Preferably, one side of the fine filter is connected to a water pump, and the output end of the water pump is connected to a delivery hose.

[0010] Preferably, the adjusting mechanism comprises an adjusting electric cylinder, which is fixed to the upper end of the connecting frame by bolts, and a movable block is fixed to the telescopic end of the adjusting electric cylinder which passes through the connecting frame.

[0011] Preferably, the movable block and the mounting plate are an integrated fixed structure, and the outer wall of the movable block is slidably connected to a connecting groove provided in the connecting frame.

[0012] Preferably, the protection mechanism comprises a protection member, the protection member is fixed to the outer wall of the cutting motor, and a fixing block is fixed to one side of the protection member.

[0013] Preferably, a connection port communicating with the delivery hose is provided on the upper surface of the fixing block, and a nozzle communicating with the connection port is installed on the lower surface of the fixing block.

[0014] Preferably, two limit rods are installed on the other side of the protective member, and a cutting blade is fixed to the power output shaft of the cutting motor.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. Through the circulation mechanism, the semiconductor wafer can be cooled during cutting. The sprayed deionized water will flow into the water storage tank, and the larger impurities in the water will be filtered through the filter plate to achieve recycling. When the deionized water passes through the fine filter, it will flow from the outside of the fine filter tube into the inside, thereby further filtering the smaller impurities in the deionized water, thereby preventing these impurities from affecting the cutting effect;

[0017] 2. The movable block is driven to move vertically by adjusting the electric cylinder, thereby driving the cutting motor on the mounting plate to move. The limit rod can play a limiting role to prevent the cutting motor from falling too much. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a three-dimensional structural view of the utility model;

[0020] Figure 2 It is a three-dimensional structural schematic diagram of the water storage tank of the utility model;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the water storage tank of the utility model;

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the fine filter element of the utility model.

[0023] Description of reference numerals:

[0024] 1. Cutting motor; 2. Mounting plate; 3. Connecting frame; 4. Water storage tank; 41. Filter plate; 42. Block; 43. Fine filter; 44. Water pump; 45. Fine filter tube; 46. Transmission rod; 47. Water impeller; 48. Cleaning brush; 49. Delivery hose; 5. Adjusting electric cylinder; 51. Movable block; 52. Connecting groove; 6. Protective part; 61. Fixed block; 62. Connecting port; 63. Nozzle; 7. Limit rod; 8. Cutting disc. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The utility model provides a technical solution:

[0027] See also Figures 1 to 4 , a cutting device for semiconductor lighting manufacturing, comprising a cutting motor 1, a mounting plate 2 is fixed to the left side of the cutting motor 1 by bolts, a connecting frame 3 is connected to the left side of the mounting plate 2, a circulation mechanism for recycling deionized water is connected to the lower end of the connecting frame 3, an adjusting mechanism for adjusting the cutting height is installed at the upper end of the connecting frame 3, and a protective mechanism for cutting protection is installed on the outer wall of the cutting motor 1;

[0028] The circulation mechanism includes a water tank 4, a filter plate 41 is arranged horizontally inside the water tank 4, both ends of the filter plate 41 are fixed with blocks 42 slidably connected to the water tank 4, the outer wall of the water tank 4 is connected to a fine filter 43, the inner wall of the fine filter 43 is installed with a fine filter tube 45, the inner wall of the fine filter tube 45 is rotatably connected to a transmission rod 46 through a bearing, one end of the transmission rod 46 is fixed with a water impeller 47, and the other end of the transmission rod 46 is fixed with two cleaning brushes 48 that fit tightly with the outer surface of the fine filter tube 45, one side of the fine filter 43 is connected to a water pump 44, and the output end of the water pump 44 is connected to a delivery hose 49.

[0029] By adopting the above technical solution, before using the cutting device for semiconductor lighting manufacturing, the water tank 4 is first placed in a suitable position, and then the semiconductor wafer to be processed is placed in the water tank 4, and a clamping structure can be set in the water tank 4, so as to facilitate clamping the semiconductor wafer. The set cutting motor 1 is started to drive the cutting blade 8 to rotate so as to cut the semiconductor wafer. During cutting, the water pump 44 extracts the deionized water in the water tank 4 and sends it to the connection port 62 on the fixed block 61 through the delivery hose 49, so that the deionized water can be sprayed to the cutting position of the semiconductor wafer through the nozzle 63, which can effectively cool the semiconductor wafer, and the sprayed deionized water will flow into the water tank 4, and the deionized water in the water will be filtered through the filter plate 41. Larger impurities are filtered out to facilitate subsequent use. When the recycled water is pumped out again, the deionized water will flow from the outside of the fine filter tube 45 into the inside when passing through the fine filter element 43, thereby further filtering the smaller impurities in the deionized water, thereby preventing these impurities from affecting the cutting effect. When the deionized water flows through the inside of the fine filter tube 45, it will push the water impeller 47 to rotate, so that the water impeller 47 drives the transmission rod 46 to rotate, and then drives the two external cleaning brushes 48 to move. The two cleaning brushes 48 clean the smaller impurities blocked on the outer surface of the fine filter tube 45, thereby ensuring that the deionized water can flow faster and reducing the possibility of blockage. The filter plate 41 can be disassembled through the set block 42 for easy cleaning.

[0030] Specifically, Figure 1-Figure 4As shown, the adjusting mechanism includes an adjusting electric cylinder 5, which is fixed to the upper end of the connecting frame 3 by bolts, and the telescopic end of the adjusting electric cylinder 5 passes through the connecting frame 3 and is fixed with a movable block 51, and the movable block 51 and the mounting plate 2 are an integrated fixed structure, and the outer wall of the movable block 51 is slidably connected with a connecting groove 52 provided in the connecting frame 3, and the protective mechanism includes a protective member 6, and the protective member 6 is fixed to the outer wall of the cutting motor 1, and a fixed block 61 is fixed on one side of the protective member 6, and a connecting port 62 which is interconnected with the conveying hose 49 is provided on the upper surface of the fixed block 61, and a nozzle 63 which is interconnected with the connecting port 62 is installed on the lower surface of the fixed block 61, and two limit rods 7 are installed on the other side of the protective member 6, and a cutting blade 8 is fixed to the power output shaft of the cutting motor 1.

[0031] By adopting the above technical solution, the adjusting electric cylinder 5 arranged on the connecting frame 3 drives the movable block 51 to move vertically. With the cooperation of the connecting groove 52, the movable block 51 can drive the mounting plate 2 to move vertically, thereby driving the cutting motor 1 on the mounting plate 2 to move, so that the cutting blade 8 contacts the semiconductor wafer, and the limiting rod 7 arranged on the protective member 6 can play a limiting role, thereby preventing the cutting motor 1 from dropping too much.

[0032] Working principle: The adjusting electric cylinder 5 set on the connecting frame 3 drives the movable block 51 to move vertically, drives the cutting motor 1 on the mounting plate 2 to move, makes the cutting blade 8 contact with the semiconductor wafer, and the set cutting motor 1 drives the cutting blade 8 to rotate to cut the semiconductor wafer. The water pump 44 extracts the deionized water in the water tank 4 and sends it to the connection port 62 on the fixed block 61 through the delivery hose 49. The deionized water can be sprayed to the cutting position of the semiconductor wafer through the nozzle 63. The sprayed deionized water will flow into the water tank 4 and filter the larger particles in the water through the filter plate 41. Impurities are filtered out. When the deionized water passes through the fine filter element 43, it will flow into the inside of the fine filter tube 45 from the outside, and further filter the smaller impurities in the deionized water, so as to prevent these impurities from affecting the cutting effect. When the deionized water flows through the fine filter tube 45, it will push the water impeller 47 to rotate, so that the water impeller 47 drives the transmission rod 46 to rotate, and then drives the two external cleaning brushes 48 to move. The two cleaning brushes 48 clean the smaller impurities blocked on the outer surface of the fine filter tube 45, so as to ensure that the deionized water can flow faster and reduce the possibility of blockage.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A cutting device for semiconductor lighting manufacturing, comprising a cutting motor (1), characterized in that: The left side of the cutting motor (1) is fixed with a mounting plate (2) by bolts, the left side of the mounting plate (2) is connected with a connecting frame (3), the lower end of the connecting frame (3) is connected with a circulation mechanism for recovering deionized water, the upper end of the connecting frame (3) is installed with an adjustment mechanism for adjusting the cutting height, and the outer wall of the cutting motor (1) is installed with a protection mechanism for cutting protection; The circulation mechanism comprises a water storage tank (4), a filter plate (41) is arranged in a horizontal direction inside the water storage tank (4), both ends of the filter plate (41) are fixed with a clamping block (42) which is slidably connected to the water storage tank (4), the outer wall of the water storage tank (4) is connected with a fine filter element (43), the inner wall of the fine filter element (43) is installed with a fine filter tube (45), the inner wall of the fine filter tube (45) is rotatably connected with a transmission rod (46) through a bearing, one end of the transmission rod (46) is fixed with a water impeller (47), and the other end of the transmission rod (46) is fixed with two cleaning brushes (48) which are tightly fitted with the outer surface of the fine filter tube (45).

2. A cutting device for semiconductor lighting manufacturing according to claim 1, characterized in that: One side of the fine filter (43) is connected to a water pump (44), and the output end of the water pump (44) is connected to a delivery hose (49).

3. A cutting device for semiconductor lighting manufacturing according to claim 1, characterized in that: The adjusting mechanism comprises an adjusting electric cylinder (5), the adjusting electric cylinder (5) being fixed to the upper end of the connecting frame (3) by means of bolts, and the telescopic end of the adjusting electric cylinder (5) passing through the connecting frame (3) being fixed with a movable block (51).

4. A cutting device for semiconductor lighting manufacturing according to claim 3, characterized in that: The movable block (51) and the mounting plate (2) are an integral fixed structure, and the outer wall of the movable block (51) is slidably connected to a connecting groove (52) provided in the connecting frame (3).

5. The cutting device for semiconductor lighting manufacturing according to claim 1, characterized in that: The protection mechanism comprises a protection member (6), the protection member (6) is fixed to the outer wall of the cutting motor (1), and a fixing block (61) is fixed to one side of the protection member (6).

6. A cutting device for semiconductor lighting manufacturing according to claim 5, characterized in that: The upper surface of the fixed block (61) is provided with a connection port (62) which is in communication with the delivery hose (49), and the lower surface of the fixed block (61) is provided with a nozzle (63) which is in communication with the connection port (62).

7. A cutting device for semiconductor lighting manufacturing according to claim 5, characterized in that: Two limiting rods (7) are installed on the other side of the protective member (6), and a cutting blade (8) is fixed to the power output shaft of the cutting motor (1).

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