Monocrystalline silicon wafer cutting and chip removing equipment
By designing single -crystal silicon chip cutting equipment, the use of filtering and spray components solves the problem of invalidation into the cutting port during the cutting process, and improves the cutting effect and the efficiency of the equipment.
Patent Information
- Application Number
- CN202421133941.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-01-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the cutting process of existing single crystal silicon wafers, fine waste chips will enter the cutting port, affecting the cutting effect.
A single crystal silicon chip cutting equipment is designed, including the box, the water knife cutting machine, the spray component, and the holding component. In the device, a filter frame, activated carbon plate, and PP fiber filter plate are set to intercept waste dandruff, and clean the surface of the single crystal silicon wafer by spraying components.
Effectively remove the waste scrap generated during the cutting process, improve the cutting effect, reduce the effect of the water knife cutting machine, and improve the efficiency of the equipment through filtering and purifying the water source.
Smart Images
Figure CN222406575U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single crystal silicon slice cutting and chip removal equipment, in particular to single crystal silicon slice cutting and chip removal equipment. Background Art
[0002] With the aggravation of environmental pollution and energy crisis, people pay more and more attention to the research and development of new energy. Among them, solar cell modules that use sunlight to generate electricity have inevitably become the focus of people's attention. As a key component in solar cell modules, cells bear the important responsibility of converting solar energy into electrical energy.
[0003] Currently, most of the single crystal silicon wafers on the market are cut by water jet cutting machines, so as to reduce the quality and precision of the single crystal silicon wafer cutting. In the process of cutting the single crystal silicon wafer by the water jet cutting machine, the fine waste chips generated during the cutting will be introduced into the inside of the cutting port of the single crystal silicon wafer after the cutting is completed. The fallen waste chips will affect the effect of the water jet cutting machine on the cutting of the single crystal silicon wafer. Utility Model Content
[0004] The utility model provides a single crystal silicon wafer cutting and chip removal device, which aims to solve the problem that most of the existing single crystal silicon wafer cutting is carried out by a water jet cutting machine to cut the single crystal silicon wafer, so as to reduce the quality and precision of the single crystal silicon wafer cutting. In the process of cutting the single crystal silicon wafer by the water jet cutting machine, the fine waste chips generated during the cutting will be introduced into the inside of the cutting port of the single crystal silicon wafer after the cutting is completed, and the fallen waste chips will affect the effect of the water jet cutting machine on the cutting of the single crystal silicon wafer, thereby affecting the effect of radiotherapy.
[0005] The utility model is implemented as follows: a single crystal silicon wafer cutting and chip removal device comprises a box body, a water jet cutting machine body is arranged inside the box body, a spraying assembly is arranged inside the box body, a clamping assembly is arranged inside the box body, a first plug-in slot, a second plug-in slot and a third plug-in slot are provided on the front side of the box body, a filter grid is clamped inside the first plug-in slot, an activated carbon plate is clamped inside the second plug-in slot, a PP fiber filter plate is clamped inside the third plug-in slot, and an adjustment hole is provided on the rear side of the box body;
[0006] The spray assembly includes an electric telescopic rod body, a hollow plate is fixedly connected to the bottom of the electric telescopic rod body, a plurality of spray heads are connected to the front side of the hollow plate, a connecting hose is connected to the rear side of the hollow plate, a side of the connecting hose away from the hollow plate is connected to a water pump body, and a connecting pipe is connected to the bottom of the water pump body.
[0007] In order to achieve the effect of clamping the single crystal silicon wafer, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, the clamping assembly includes a support plate, the top of the support plate is fixedly connected to a fixed block, the top of the support plate is provided with a plurality of holes, the top of the support plate is provided with an adjustment groove, the front side of the support plate is provided with an adjustment handle, the rear side of the adjustment handle is fixedly connected to a threaded rod, the surface of the threaded rod is threadedly connected to a threaded block, and the top of the threaded block is fixedly connected to a clamping plate.
[0008] In order to facilitate the user to observe the interior of the box, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, the front side of the box is rotatably connected to a protective door, and the interior of the protective door is fixedly connected to transparent glass.
[0009] In order to facilitate the user to disassemble the filter frame, activated carbon plate and PP fiber filter plate, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, the left and right sides of the inner walls of the first plug-in slot, the second plug-in slot and the third plug-in slot are provided with slide grooves, and the left and right sides of the filter frame, activated carbon plate and PP fiber filter plate are fixedly connected with sliders used in conjunction with the slide grooves.
[0010] In order to achieve the effect of reducing the position deviation of the structure, as a preferred single crystal silicon wafer cutting and chip removal device of the present invention, the bottom of the box is fixedly connected with an anti-skid pad, and the material of the anti-skid pad is rubber.
[0011] In order to achieve the effect of supporting the water pump body, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, the front side of the water pump body is fixedly connected to a mounting block, and the front side of the mounting block is fixedly connected to the rear side of the box.
[0012] In order to facilitate the adjustment of the clamping plate on the top of the supporting plate, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, an auxiliary groove is opened on the top of the supporting plate, and an auxiliary block is fixedly connected to the bottom of the clamping plate. The auxiliary block is arranged inside the auxiliary groove, and the auxiliary block contacts the inner wall of the auxiliary groove once it is away from the clamping plate.
[0013] In order to facilitate the clamping of the single crystal silicon wafer, as a preferred single crystal silicon wafer cutting and chip removal device of the utility model, the fixed block and the clamping plate are fixedly connected to the opposite side with a protective pad, and the material of the protective pad is silicone.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] The single crystal silicon wafer cutting and chip removal device can achieve the effect of placing the water jet cutting machine body by setting the box body, can achieve the effect of cleaning the cut single crystal silicon wafer by setting the spraying assembly, can achieve the effect of limiting the single crystal silicon wafer by setting the clamping assembly, can achieve the effect of placing the filter rack, the activated carbon plate and the PP fiber filter plate respectively by setting the first plug-in slot, the second plug-in slot and the third plug-in slot, can achieve the effect of intercepting waste chips and filtering the water source by setting the filter rack, the activated carbon plate and the PP fiber filter plate, can achieve the effect of facilitating the movement of the connecting hose by setting the adjustment hole, can achieve the effect of adjusting the height of the hollow plate by setting the electric telescopic rod body, can achieve the effect of guiding the water source inside the connecting pipe into the inside of the connecting hose through the water pump body, then guiding the water source into the inside of the hollow plate, and then cleaning the surface of the cut single crystal silicon wafer through the plurality of spraying heads. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is the overall structure diagram of the single crystal silicon wafer cutting and chip removal equipment of the utility model;
[0017] Figure 2 It is a structural schematic diagram of the spraying component and the clamping component in the utility model;
[0018] Figure 3 It is a schematic diagram of the disassembly of the local components in the utility model;
[0019] Figure 4 It is a schematic diagram of the cut-away of the local components in the utility model;
[0020] Figure 5 For this utility model Figure 3 A magnified schematic diagram of center A.
[0021] In the figure, 1, box body; 2, water jet cutting machine body; 3, spraying assembly; 301, electric telescopic rod body; 302, hollow plate; 303, spraying head; 304, connecting hose; 305, water pump body; 306, connecting pipe; 4, clamping assembly; 401, support plate; 402, fixing block; 403, hole; 404, adjusting slot; 405, adjusting handle; 406, threaded rod; 407, threaded block; 408, clamping plate; 5, first plug-in slot; 6, second plug-in slot; 7, third plug-in slot; 8, filter rack; 9, activated carbon plate; 10, PP fiber filter plate; 11, adjusting hole; 12, protective door; 13, transparent glass; 14, slide slot; 15, slider; 16, anti-slip pad; 17, mounting block; 18, auxiliary slot; 19, auxiliary block; 20, protective pad. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0023] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.
[0024] See also Figure 1-5 The utility model provides a technical solution: a single crystal silicon wafer cutting and chip removal device, comprising a box body 1, a water jet cutting machine body 2 is arranged inside the box body 1, a spraying assembly 3 is arranged inside the box body 1, a clamping assembly 4 is arranged inside the box body 1, a first plug-in slot 5, a second plug-in slot 6 and a third plug-in slot 7 are opened on the front side of the box body 1, a filter grid frame 8 is clamped inside the first plug-in slot 5, an activated carbon plate 9 is clamped inside the second plug-in slot 6, a PP fiber filter plate 10 is clamped inside the third plug-in slot 7, and an adjustment hole 11 is opened on the rear side of the box body 1;
[0025] The spray assembly 3 includes an electric telescopic rod body 301, the bottom of which is fixedly connected to a hollow plate 302, the front side of the hollow plate 302 is connected to a plurality of spray heads 303, the back side of the hollow plate 302 is connected to a connecting hose 304, the side of the connecting hose 304 away from the hollow plate 302 is connected to a water pump body 305, and the bottom of the water pump body 305 is connected to a connecting pipe 306.
[0026] In this embodiment: by setting the box body 1, the effect of placing the water jet cutting machine body 2 can be achieved; by setting the spraying component 3, the effect of cleaning the cut single crystal silicon wafer can be achieved; by setting the clamping component 4, the effect of limiting the single crystal silicon wafer can be achieved; by setting the first plug-in slot 5, the second plug-in slot 6 and the third plug-in slot 7, the effect of placing the filter rack 8, the activated carbon plate 9 and the PP fiber filter plate 10 can be achieved respectively; by setting the filter rack 8, the activated carbon plate 9 and the PP fiber filter plate 10, the effect of intercepting waste and filtering the water source can be achieved. By providing the adjustment hole 11, the effect of facilitating the movement of the position of the connecting hose 304 can be achieved. By providing the electric telescopic rod body 301, the effect of adjusting the height of the hollow plate 302 can be achieved. By providing the hollow plate 302, a plurality of spray heads 303, a connecting hose 304, a water pump body 305 and a connecting pipe 306, the effect of guiding the water source inside the connecting pipe 306 into the inside of the connecting hose 304 through the water pump body 305, and then guiding the water source into the inside of the hollow plate 302, and then cleaning the surface of the cut single crystal silicon wafer through the plurality of spray heads 303 can be achieved.
[0027] As a technical optimization solution of the utility model, the clamping assembly 4 includes a support plate 401, a fixed block 402 is fixedly connected to the top of the support plate 401, a plurality of holes 403 are opened on the top of the support plate 401, an adjustment groove 404 is opened on the top of the support plate 401, an adjustment handle 405 is provided on the front side of the support plate 401, a threaded rod 406 is fixedly connected to the rear side of the adjustment handle 405, a threaded block 407 is threadedly connected to the surface of the threaded rod 406, and a clamping plate 408 is fixedly connected to the top of the threaded block 407.
[0028] In this embodiment: by providing a support plate 401, the effect of supporting the fixed block 402 can be achieved; by providing a plurality of holes 403, the effect of facilitating the introduction of waste chips and used water jet liquid into the interior of the box body 1 can be achieved; by providing an adjustment groove 404, an adjustment handle 405, a threaded rod 406, a threaded block 407 and a clamping plate 408, the user can manipulate the adjustment handle 405 to allow the threaded rod 406 to adjust the threaded block 407 inside the adjustment groove 404, and then adjust the position of the clamping plate 408, and then limit the single crystal silicon wafer to be processed.
[0029] As a technical optimization solution of the utility model, a protective door 12 is rotatably connected to the front side of the box body 1, and a transparent glass 13 is fixedly connected to the inside of the protective door 12.
[0030] In this embodiment, by providing the protection door 12 and the transparent glass 13 , it is possible to facilitate the user to observe the interior of the box 1 .
[0031] As a technical optimization solution of the utility model, slide grooves 14 are opened on the left and right sides of the inner walls of the first plug-in groove 5, the second plug-in groove 6 and the third plug-in groove 7, and sliders 15 used in conjunction with the slide grooves 14 are fixedly connected to the left and right sides of the filter frame 8, the activated carbon plate 9 and the PP fiber filter plate 10.
[0032] In this embodiment, by providing the slider 15 and the slide groove 14 , it is possible to facilitate the user to disassemble the filter frame 8 , the activated carbon plate 9 and the PP fiber filter plate 10 .
[0033] As a technical optimization solution of the present invention, an anti-skid pad 16 is fixedly connected to the bottom of the box body 1, and the material of the anti-skid pad 16 is rubber.
[0034] In this embodiment, the anti-slip pad 16 is provided to reduce the position deviation of the structure.
[0035] As a technical optimization solution of the present invention, a mounting block 17 is fixedly connected to the front side of the water pump body 305 , and the front side of the mounting block 17 is fixedly connected to the rear side of the box body 1 .
[0036] In this embodiment, by providing the mounting block 17, the water pump body 305 can be supported.
[0037] As a technical optimization solution of the utility model, an auxiliary groove 18 is opened on the top of the support plate 401, and an auxiliary block 19 is fixedly connected to the bottom of the clamping plate 408. The auxiliary block 19 is arranged inside the auxiliary groove 18, and the auxiliary block 19 contacts the inner wall of the auxiliary groove 18 once away from the clamping plate 408.
[0038] In this embodiment, by providing the auxiliary block 19 and the auxiliary groove 18 , it is possible to facilitate the adjustment of the clamping plate 408 on the top of the support plate 401 .
[0039] As a technical optimization solution of the present invention, the fixing block 402 and the clamping plate 408 are fixedly connected to opposite sides thereof with a protective pad 20 , and the material of the protective pad 20 is silicone.
[0040] In this embodiment, by providing the protection pad 20, it is possible to facilitate clamping of the single crystal silicon wafer.
[0041] Working principle: First, the user places the single crystal silicon wafer to be cut on the top of the support plate, then the user controls the adjustment handle 405, then the threaded rod 406 controls the threaded block 407, then the threaded block 407 is adjusted on the inner wall of the adjustment groove 404, then the position of the clamping plate 408 is moved, then the protective pad 20 is brought into contact with the silicone single wafer, then the user controls the water jet cutting machine body 2 to make the water jet cutting machine body 2 cut the single crystal silicon wafer, then during the process of cutting the single crystal silicon wafer, the user controls the water pump body 305 to make the water pump body 305 guide the water source inside the box 1 into the connecting soft The water source is then introduced into the hollow plate 302 through the connecting hose 304, and then the surface of the cut single crystal silicon wafer is sprayed with water through several spray heads 303 connected to the inside of the hollow plate 302, and then the waste chips on the surface of the single crystal silicon wafer are cleaned. In the process of cleaning the single crystal silicon wafer, the water source and the waste chips fall out of the top of the support plate 401 through several holes 403, and then the waste chip particles are collected by the filter rack 8, and then the water source is filtered and purified by the activated carbon plate 9 and the PP fiber filter plate 10, and then drips into the bottom of the inner wall of the box body 1, so as to reduce the waste of water source and facilitate the use of the water jet cutting machine body 2.
[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A single crystal silicon wafer cutting and chip removal device, comprising a housing (1), characterized in that: A water jet cutting machine body (2) is arranged inside the box (1), a spraying assembly (3) is arranged inside the box (1), a clamping assembly (4) is arranged inside the box (1), a first plug-in slot (5), a second plug-in slot (6) and a third plug-in slot (7) are provided on the front side of the box (1), a filter frame (8) is clamped inside the first plug-in slot (5), an activated carbon plate (9) is clamped inside the second plug-in slot (6), a PP fiber filter plate (10) is clamped inside the third plug-in slot (7), and an adjustment hole (11) is provided on the rear side of the box (1); The spray assembly (3) comprises an electric telescopic rod body (301), the bottom of the electric telescopic rod body (301) is fixedly connected to a hollow plate (302), the front side of the hollow plate (302) is connected to a plurality of spray heads (303), the rear side of the hollow plate (302) is connected to a connecting hose (304), the side of the connecting hose (304) away from the hollow plate (302) is connected to a water pump body (305), and the bottom of the water pump body (305) is connected to a connecting pipe (306).
2. The single crystal silicon wafer cutting and chip removal device according to claim 1, characterized in that: The clamping assembly (4) comprises a support plate (401), the top of the support plate (401) is fixedly connected to a fixing block (402), the top of the support plate (401) is provided with a plurality of holes (403), the top of the support plate (401) is provided with an adjustment slot (404), the front side of the support plate (401) is provided with an adjustment handle (405), the rear side of the adjustment handle (405) is fixedly connected to a threaded rod (406), the surface of the threaded rod (406) is threadedly connected to a threaded block (407), and the top of the threaded block (407) is fixedly connected to a clamping plate (408).
3. The single crystal silicon wafer cutting and chip removal device according to claim 1, characterized in that: The front side of the box body (1) is rotatably connected to a protective door (12), and the interior of the protective door (12) is fixedly connected to a transparent glass (13).
4. The single crystal silicon wafer cutting and chip removal device according to claim 1, characterized in that: The left and right sides of the inner walls of the first plug-in slot (5), the second plug-in slot (6) and the third plug-in slot (7) are provided with slide grooves (14), and the left and right sides of the filter rack (8), the activated carbon plate (9) and the PP fiber filter plate (10) are fixedly connected with sliders (15) for use with the slide grooves (14).
5. The single crystal silicon wafer cutting and chip removal device according to claim 1, characterized in that: The bottom of the box body (1) is fixedly connected with an anti-skid pad (16), and the material of the anti-skid pad (16) is rubber.
6. The single crystal silicon wafer cutting and chip removal equipment according to claim 1, characterized in that: The front side of the water pump body (305) is fixedly connected to a mounting block (17), and the front side of the mounting block (17) is fixedly connected to the rear side of the box body (1).
7. The single crystal silicon wafer cutting and chip removal equipment according to claim 2, characterized in that: An auxiliary groove (18) is provided on the top of the support plate (401), and an auxiliary block (19) is fixedly connected to the bottom of the clamping plate (408). The auxiliary block (19) is arranged inside the auxiliary groove (18), and the auxiliary block (19) is away from the clamping plate (408) and contacts the inner wall of the auxiliary groove (18).
8. The single crystal silicon wafer cutting and chip removal equipment according to claim 2, characterized in that: The fixing block (402) and the clamping plate (408) are both fixedly connected to a protective pad (20) on one side opposite to the other. The material of the protective pad (20) is silicone.