Molding device and injection molding system

Abstract

A molding apparatus includes a first mold, a second mold, a mold cavity, and a position control mechanism attached to the first mold and the second mold, where the first mold and the second mold are individually movable with the position control mechanism.

Description

Technical Field

[0001] The invention relates to a molding device and an injection molding system, in particular to a molding device and an injection molding system for forming a product including more than one part with different physical or functional characteristics. Background Art

[0002] Foamed polymer materials have the advantages of high strength, light weight, impact resistance, and heat insulation. Foamed products can be manufactured by injection molding or extrusion molding. For example, after the polymer material is melted and mixed with a foaming agent to form a mixture, force or pressure is applied to the mixture to inject or extrude the mixture into the cavity of a mold, and the mixture is foamed and cooled in the mold cavity to form a foamed product.

[0003] However, it is necessary to improve the properties of foamed products manufactured by injection molding systems, such as making different parts of foamed products have different properties. Therefore, it is necessary to improve the structure of injection molding systems and methods for manufacturing foamed products. Utility Model Content

[0004] An object of the present invention is to provide a molding device, an injection molding system and an injection molding method.

[0005] According to one embodiment of the present invention, a molding device is provided. The molding device includes a first mold, a second mold, a first mold cavity defined by the first mold and the second mold when the first mold is arranged relative to the second mold, and a position control mechanism attached to the first mold and the second mold. The first mold and the second mold can be moved separately using the position control mechanism.

[0006] According to one embodiment of the present invention, an injection molding system is provided. The injection molding system includes a carrier having a plurality of molding stations; a molding device disposed in one of the molding stations, comprising a position control mechanism, a first mold, a second mold, and a third mold clamped by the position control mechanism; and a first injection station disposed adjacent to the carrier, configured to inject a first polymer material into a first molding cavity of the molding device, the first mold and the second mold defining the first molding cavity. The position control mechanism is configured to move the first mold, the second mold, and the third mold separately.

[0007] According to one embodiment of the present invention, a molding method is provided. The molding method includes: providing a molding device having a first mold, a second mold, and a third mold; joining the first mold to the second mold to form a first mold cavity, the first mold and the second mold defining the first mold cavity; and injecting a first polymer material into the first mold cavity to form a first layer in the first mold cavity using the first polymer material. The molding method further includes using a position control mechanism to disengage the first mold from the second mold; joining the third mold to the second mold to form a second mold cavity, the second mold and the third mold defining the second mold cavity; injecting a second polymer material into the second mold cavity and covering the first layer to form a product having a first layer and a second layer using the second polymer material; and using a position control mechanism to disengage the third mold from the second mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] When read in conjunction with the accompanying drawings, various aspects of the present disclosure can be best understood from the following detailed description. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, for the sake of clarity of discussion, the size of the various features can be increased or decreased arbitrarily.

[0009] Figure 1 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0010] Figure 2 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0011] Figure 3 is a schematic top view of a portion of a molding device according to some embodiments of the present invention.

[0012] Figure 4 is a schematic cross-sectional view of a portion of a molding device according to some embodiments of the present invention.

[0013] Figure 5 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0014] Figure 6 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0015] Figure 7 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0016] Figure 8 is a schematic perspective view of a molding device according to some embodiments of the present invention.

[0017] Fig. 9 is a schematic cross-sectional view of a portion of a molding device according to some embodiments of the present invention.

[0018] Fig.10 is a schematic cross-sectional view of a portion of a molding device according to some embodiments of the present invention.

[0019] Fig.11 is a schematic top view of an injection molding system according to some embodiments of the present invention.

[0020] Fig.12 is a schematic perspective view of an injection molding system according to some embodiments of the present invention.

[0021] Fig.13 is a flow chart illustrating a molding method according to some embodiments of the present invention.

[0022] Fig.14 is a flow chart illustrating a molding method according to some embodiments of the present invention.

[0023] Figure 15-16 , 18-20, 23 and 24 are schematic perspective views of a portion of an injection molding system used in a method of manufacturing an article according to some embodiments of the present invention.

[0024] Fig.17 , Fig.21 , Fig. 22 is a schematic cross-sectional view illustrating exemplary operations in a molding method according to an embodiment of the present invention.

[0025] Fig.25 is a schematic perspective view of a product manufactured by a method for manufacturing a product according to some embodiments of the present invention. Implementation

[0026] [CROSS-REFERENCE TO RELATED APPLICATIONS]

[0027] The present invention claims priority to U.S. Patent Application No. 18 / 582,693 filed on February 21, 2024, which claims priority to U.S. Provisional Patent Application No. 63 / 498,265 filed on April 25, 2023 and U.S. Provisional Patent Application No. 63 / 585,970 filed on September 28, 2023, all of which are incorporated herein by reference in their entirety.

[0028] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and settings are described below to simplify the present invention. Of course, these are merely examples and are not intended to be limiting. For example, forming a first feature on or above a second feature described below may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an attachment feature may be formed between the first feature and the second feature so that the first and second features may not be in direct contact. In addition, the present invention may repeat figure numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself dictate the relationship between the various embodiments and / or configurations discussed.

[0029] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "down," "above," and "upper" may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptions used herein should be interpreted accordingly.

[0030] Although the numerical ranges and parameters describing the wide range of the present invention are approximate, the numerical values ​​described in the specific embodiments are reported as accurately as possible. However, any numerical value inherently contains certain errors, which are necessarily caused by the standard deviation found in the corresponding test measurements. In addition, as used herein, the term "about" generally means within 10%, 5%, 1% or 0.5% of a known value or range. Alternatively, the term "about" refers to within an acceptable standard error of the mean value when considered by a person of ordinary skill in the art. Except in the operating / working examples, or unless otherwise explicitly stated, all numerical ranges, amounts, values ​​and percentages, such as the amount of material disclosed herein, the duration of time, temperature, operating conditions, the ratio of amounts, etc., should be understood to be modified by the term "about" in all cases. Therefore, unless otherwise indicated, the numerical parameters described in the present invention and the appended claims are approximate values ​​that can be changed as needed. At least, each numerical parameter should be interpreted according to the number of reported significant digits and applying general rounding techniques. The range can be expressed in this article as from one endpoint to another or between two endpoints. Unless otherwise stated, all ranges disclosed herein include endpoints.

[0031] Figure 1 is a schematic perspective view of a molding apparatus 100 in a closed configuration according to some embodiments of the present invention, and Figure 2 is a schematic perspective view of the molding device 100 in an open configuration.

[0032] In some embodiments, the molding device 100 includes a first mold 11a and a second mold 14, a first mold cavity 19a, and a position control mechanism 20. The first mold 11a serves as an upper mold, and the second mold 14 includes a lower mold 13 and an external intermediate mold 15, and the external intermediate mold 15 is disposed between the first mold 11a and the lower mold 13. When the first mold 11a is disposed relative to the second mold 14, a first mold cavity 19a for forming an article (not shown) is defined by the first mold 11a and the second mold 14. The position control mechanism 20 is attached to the first mold 11a and the second mold 14, and the first mold 11a and the second mold 14 can be moved individually through the position control mechanism.

[0033] In some embodiments, the upper mold 11, the lower mold 13, and the outer intermediate mold 15 define a first mold cavity 19a. In some embodiments, the first mold 11a corresponds to the second mold 14 in some configurations (e.g., size, shape, etc.). The first mold 11a can be placed on the outer intermediate mold 15 and engaged with the outer intermediate mold 15. In some embodiments, the provision of the molding device 100 includes conveying the outer intermediate mold 15 to the lower mold 13, and then arranging the first mold 11a above the outer intermediate mold 15. In some embodiments, the first mold 11a is aligned with the lower mold 13. In the example Figure 2 In some embodiments shown, the molding device 100 is in an open configuration. In some embodiments, the first mold 11a is disposed above the outer intermediate mold 15 and is movable relative to and engageable with the outer intermediate mold 15, and the outer intermediate mold 15 is disposed above the lower mold 13 and is movable relative to and engageable with the lower mold 13.

[0034] Figure 3 A schematic top view of a portion of the forming apparatus 100 is shown in a closed configuration. Figure 4 It is along Figure 3 A cross-sectional view of a portion of the molding device 100 taken along line IV-IV'. In some embodiments, the outer intermediate mold 15 of the second mold 14 includes a first portion 151 and a second portion 152 that are adjacent to and engageable with each other. In some embodiments, the first portion 151 and the second portion 152 are movable and detachable from each other. The first portion 151 and the second portion 152 are movable toward or away from each other. In some embodiments, an extension component 151a of the first portion 151 and an extension component 152a of the second portion 152 surround the lower mold 13. The lower mold 13 is fixed relative to the first portion 151 and the second portion 152. In some embodiments, when the molding device 100 is in a closed configuration, the first portion 151 and the second portion 152 are attached to and engageable with each other to seal the first mold cavity 19a. In some embodiments, when the molding device 100 is in an open configuration (such as Figure 2In some embodiments, the first portion 151 is spaced apart from the second portion 152 to extend the first cavity 19a. In some embodiments, when the molding device 100 is in the open configuration, the first cavity 19a is extended.

[0035] In some embodiments, reference is also made to Figure 1 and Figure 2 , the first mold 11a can rotate around the first axis C1 through the hinge 24 of the position control mechanism 20. In some embodiments, the first mold 11a can be tilted by rotating around the first axis C1. In some embodiments, when the first mold 11a is tilted (e.g. Figure 2 As shown in FIG. 1 , there is a first angle σ1 between the bottom surface of the first mold 11a and the top surface 131 of the lower mold 13. In some embodiments, the first angle σ1 ranges from 0 degrees to 90 degrees. In some embodiments, the first angle σ1 ranges from 10 degrees to 80 degrees. In some embodiments, the first mold 11a can rotate around the first axis C1 and along the first direction R1. The first direction R1 is a clockwise direction or a counterclockwise direction.

[0036] In some embodiments, the second mold 14 can be linearly moved along the track 25 of the position control mechanism 20. In some embodiments, the external intermediate mold 15 and the lower mold 13 are disposed on the platform 23 and can be linearly moved along the track 25 of the position control mechanism 20, so that the position control mechanism 20 can control the first distance D1 between the first mold 11a and the second mold 14. In some embodiments, when the molding device 100 is in a closed configuration, the platform 23 can press the second mold 14 toward the first mold 11a, for example, press the external intermediate mold 15 and the lower mold 13 toward the first mold 11a.

[0037] Figure 5 , Figure 6 , Figure 7 and Figure 8 is a schematic perspective view of a molding apparatus 200 according to some embodiments of the present invention. Fig. 9 2 is a schematic perspective view of a portion of a molding device 200 according to some embodiments of the present invention. For ease of explanation, reference numerals having similar or identical functions and characteristics are repeated in different embodiments and drawings.

[0038] In some embodiments, reference Figure 5 , Figure 6 , Figure 7 and Figure 8, the molding device 200 is similar to the molding device 100, and further includes a third mold 11c attached to the position control mechanism 20 and movable through the position control mechanism 20. The third mold 11c can be placed on the external intermediate mold 15 and engaged with the external intermediate mold 15. In some embodiments, the provision of the molding device 200 includes conveying the external intermediate mold 15 to the lower mold 13, and then disposing the first mold 11a or the third mold 11c above the external intermediate mold 15. In some embodiments, the third mold 11c can be aligned with the lower mold 13. The third mold 11c can rotate around the first axis C1 through the hinge 24 of the position control mechanism 20, and rotate around the second axis C2 orthogonal to the first axis C1 through the pivot 26 of the position control mechanism 20. The first mold 11a and the third mold 11c can rotate together around the second axis C2. In some embodiments, the first mold 11a can rotate around the second axis C2 through the pivot 26 of the position control mechanism 20.

[0039] In some embodiments, the molding device 200 includes a first mold 11a, a second mold 14, a third mold 11c, a fourth mold 17a, a fifth mold 17b, and a position control mechanism 20. In some embodiments, the first mold 11a and the third mold 11c are attached to the position control mechanism 20, and the second mold 14 includes an outer middle mold 15 and a lower mold 13, and is disposed on a platform 23 of the position control mechanism 20.

[0040] In some embodiments, the molding device 100 (eg Figure 2 Each of the molding devices 200 and the molding apparatus 200 also includes a fourth mold 17a attached to the first mold 11a. In some embodiments, the first mold cavity 19a is defined by the first mold 11a, the second mold 14, and the fourth mold 17a. When the first mold 11a is arranged relative to the second mold 14, and the fourth mold 17a is surrounded by the first mold cavity 19a. In some embodiments, the fourth mold 17a includes a last.

[0041] In some embodiments, the molding device 200 further includes a fifth mold 17b attached to the third mold 11c. In some embodiments, the fifth mold 17b includes a last. The position control mechanism 20 is configured to move the first mold 11a and the fourth mold 17a relative to the second mold 14, and is configured to move the third mold 11c and the fifth mold 17b relative to the second mold 14. Due to the operation of the position control mechanism 20, the first mold 11a and the third mold 11c are movably connected to the second mold 14.

[0042] In some embodiments, the position control mechanism 20 drives or actuates the first mold 11a and the third mold 11c to move toward or away from the second mold 14. It can be understood that the maximum displacement of the first mold 11a and the external intermediate mold 15 and the maximum displacement of the third mold 11c and the external intermediate mold 15 are limited by the position control mechanism 20. In some embodiments, the first distance D1 between the first mold 11a and the second mold 14 is controlled by the position control mechanism 20.

[0043] In some embodiments, the position control mechanism 20 is used to drive or actuate the first mold 11a to move upward when the molding device 200 is in the open configuration, so as to generate a first distance D1 between the second mold 14 and the first mold 11a. In some embodiments, the position control mechanism 20 is configured to generate relative movement between the first mold 11a and the second mold 14. Figure 8 As shown, the molding device 200 is in the open configuration, and the first distance D1 reaches its maximum value. In some embodiments, the position control mechanism 20 is used to drive or actuate the third mold 11c to move upward. Thus, when the molding device 200 is in the open configuration, a gap (not shown) is generated between the second mold 14 and the third mold 11c. In some embodiments, the position control mechanism 20 is configured to generate relative movement between the third mold 11c and the second mold 14.

[0044] In some embodiments, the position control mechanism 20 can rotate around the second axis C2 and along the second direction R2. As the position control mechanism 20 rotates around the second axis C2, the first mold 11a and the third mold 11c can be sequentially located above the second mold 14. The second direction R2 is a clockwise direction or a counterclockwise direction. In some embodiments, see Figure 7 and Figure 8 , when the first mold 11a is disposed above and aligned with the second mold 14 including the lower mold 13 and the outer intermediate mold 15 in a top view, the third mold 11c is laterally offset from the second mold 14 in a top view. In some embodiments, when the third mold 11c is disposed above and aligned with the second mold 14 in a top view, the first mold 11a and the second mold 14 are laterally offset from a top view (not shown).

[0045] In some embodiments, the first mold 11a and the third mold 11c are rotatable about the first axis C1 and in the first direction R1. In some embodiments, during the rotation of the first mold 11a and the third mold 11c about the first axis C1, the third angle σ3 is fixed. In some embodiments, the position control mechanism 20 is attached to the first end 11d of the first mold 11a and is configured to tilt the first mold 11a relative to the second mold 14. In some embodiments, the position control mechanism 20 is configured to tilt the first mold 11a relative to the lower mold 13 and the outer intermediate mold 15 to move the second end 11e of the first mold 11a to a position higher than the first end 11d of the first mold 11a (such as Figure 5 and Figure 6 ). When the first distance D1 between the first mold 11a and the external intermediate mold 15 is greater than or equal to 0, the first mold 11a can be tilted through the position control mechanism 20. In some embodiments, before the fourth mold 17a is tilted, the bottom surface of the first mold 11a is parallel to the top surface of the external intermediate mold 15. In some embodiments, the position control mechanism 20 is used to cause a relative tilt between the fourth mold 17a and the external intermediate mold 15. In some embodiments, when the first mold 11a and the fourth mold 17a are tilted (as shown in FIG. Figure 5 and Figure 6 As shown in FIG. 1 , there is a first angle σ1 between the first mold 11a and the second mold 14. In some embodiments, the first angle σ1 ranges from 0 degrees to 90 degrees. In some embodiments, the first angle σ1 ranges from 20 degrees to 70 degrees. In some embodiments, when the position control mechanism 20 rotates around the second axis C2, the first angle σ1 is 45 degrees.

[0046] In some embodiments, the position control mechanism 20 is connected to the first end 11f of the third mold 11c and is configured to tilt the third mold 11c relative to the second mold 14. In some embodiments, the position control mechanism 20 is configured to tilt the third mold 11c relative to the second mold 14 to move the second end 11g of the third mold 11c to be higher than the first end 11f of the third mold 11c. When the gap (not shown) between the third mold 11c and the second mold 14 is greater than or equal to 0, the third mold 11c can be tilted through the position control mechanism 20. In some embodiments, before the third mold 11c is tilted, the bottom surface of the third mold 11c is parallel to the top surface of the external intermediate mold 15. In some embodiments, the position control mechanism 20 is used to generate a relative tilt between the third mold 11c and the external intermediate mold 15. In some embodiments, when the third mold 11c and the fifth mold 17b are tilted, there is a second angle σ2 between the third mold 11c and the second mold 14. In some embodiments, the range of the second angle σ2 is between 0 degrees and 90 degrees. In some embodiments, the range of the second angle σ2 is between 20 degrees and 70 degrees. In some embodiments, when the position control mechanism 20 rotates around the second axis C2, the second angle σ2 is 45 degrees.

[0047] In some embodiments, see Figure 5 and Figure 6 The fourth mold 17a includes a first end 173 and a second end 174 opposite to the first end 173, and the position control mechanism 20 is used to tilt the fourth mold 17a relative to the second mold 14 so that the second end 174 of the fourth mold 17a moves to a position higher than the first end 173 of the fourth mold 17a.

[0048] In some embodiments, when the first mold 11a and the third mold 11c are attached to the position control mechanism 20, there is a third angle σ3 between the first mold 11a and the third mold 11c. In some embodiments, the range of the third angle σ3 is between 0 degrees and 180 degrees. In some embodiments, the range of the third angle σ3 is between 40 degrees and 140 degrees. In some embodiments, when the position control mechanism 20 rotates around the second axis C2, the third angle σ3 is 90 degrees. In some embodiments, the third angle σ3 is fixed during the rotation of the first mold 11a and the third mold 11c around the second axis C2. In some embodiments, the third angle σ3 changes during the rotation of the first mold 11a and the third mold 11c around the second axis C2. In other words, during the rotation of the first mold 11a and the third mold 11c around the second axis C2, at least one of the first mold 11a and the third mold 11c can rotate around the first axis C1.

[0049] Fig. 9 and Fig.10is a partial cross-sectional view of the molding device 200. In some embodiments, the first mold 11a and the third mold 11c have different configurations. In some embodiments, the first mold 11a and the third mold 11c have similar configurations. In some embodiments, see Fig. 9 , the first mold cavity 19a is defined by the first mold 11a, the outer intermediate mold 15, the fourth mold 17a and the lower mold 13. When the first mold 11a is disposed relative to the second mold 14 and the fourth mold 17a is surrounded by the first mold cavity 19a, the molding device 200 is in the first closed configuration. In some embodiments, when the first mold 11a is disposed relative to the second mold 14, the third mold 11c is substantially offset at a right angle to the first mold 11a.

[0050] In some embodiments, the first feed port 12a extends through the first mold 11a. In some embodiments, the first mold 11a includes the first feed port 12a. The first feed port 12a has an opening 121a disposed on the first mold 11a. In some embodiments, the second mold 14 includes the first feed port 12a. In some embodiments, the outer intermediate mold 15 or the lower mold 13 includes the first feed port 12a. In some embodiments, when the molding device 200 is in the state as Fig. 9 In the first closed configuration shown, the first feed port 12a can communicate with the first mold cavity 19a.

[0051] Alternatively, in some embodiments, the first mold cavity 19a may be entered via a plurality of first feed ports 12a. For simplicity and clarity, two first feed ports 12a are shown, however, it is understood that any suitable number of first feed ports 12a may be configured at the first mold 11a. In some embodiments, the first feed ports 12a are not disposed at the first mold 11a, but are disposed at the lower mold 13 or the external intermediate mold 15 to connect to the first mold cavity 19a. In some embodiments, each first feed port 12a may be disposed at the first mold 11a, the top surface 131 of the lower mold 13, the inner side wall 153 of the external intermediate mold 15, or any other suitable location. As long as the first feed port 12a can be connected to the first mold cavity 19a.

[0052] In some embodiments, the molding device 200 further includes one or more pressure regulating systems 16. In some embodiments, the pressure regulating system 16 is attached to the second mold 14. In some embodiments, the pressure regulating system 16 is attached to the lower mold 13 or the outer intermediate mold 15. In some embodiments, when the first mold 11a is set relative to the second mold 14, the pressure regulating system 16 includes a gas conduit 161 and a junction 167, and the junction 167 is connected to the first mold cavity 19a and the gas conduit 161. In some embodiments, a plurality of junctions 167 are arranged at the second mold 14 and connected to the first mold cavity 19a. In some embodiments, the junction 167 is configured to allow a fluid or gas to enter or leave the first mold cavity 19a. The position, shape, and number of the junctions 167 are not particularly limited and can be adjusted as needed. In some embodiments, each junction 167 is a hole. In some embodiments, the junction 167 is configured to supply gas or exhaust gas.

[0053] In some embodiments, the pressure regulating system 16 also includes a pressure sensing unit (not shown) configured to sense the pressure in the first mold cavity 19a. The pressure sensing unit (not shown) is not limited to any specific type, as long as it can sense the pressure and provide pressure information after sensing the pressure in the first mold cavity 19a. The pressure regulating system 16 changes the state of gas leaving / entering the first mold cavity 19 according to the pressure information provided by the pressure sensing unit (not shown), and then adjusts the pressure in the first mold cavity 19a, so that the composite material obtained thereby has a desired predetermined shape and performance. In some embodiments, the pressure sensing unit (not shown) is disposed in the first mold cavity 19a.

[0054] In some embodiments, one end of the first gas conduit 161 is connected to the junction 167, and the other end of the first gas conduit 161 is connected to the gas controller 163. In some embodiments, the gas controller 163 is used to supply or exhaust fluid or gas, wherein a suitable fluid or gas can be supplied or exhausted as needed. The fluid or gas can be, for example, air, an inert gas, etc., but the invention is not limited thereto.

[0055] In some embodiments, see Fig.10 When the molding device 200 is in the second closed configuration, the third mold 11c, the outer intermediate mold 15, the lower mold 13 and the fifth mold 17b define a second mold cavity 19b. In some embodiments, when the third mold 11c is disposed relative to the second mold 14, the first mold 11a is substantially offset from the third mold 11c at a right angle.

[0056] In some embodiments, the second feed port 12b extends through the third mold 11c. In some embodiments, the third mold 11c includes the second feed port 12b. The second feed port 12b has an opening 121b set on the third mold 11c. In some embodiments, the second mold 14 includes the second feed port 12b. In some embodiments, when the third mold 11c is arranged relative to the second mold 14, and the fifth mold 17b is surrounded by the second mold cavity 19b, and the molding device 200 is in the state as shown in FIG. Fig.10 In the second closed configuration shown, the second feed port 12b is in communication with the second mold cavity 19b.

[0057] Alternatively, in some embodiments, the second mold cavity 19b can be entered via multiple second feed ports 12b. For simplicity and clarity, two second feed ports 12b are shown, however, it is understood that any suitable number of second feed ports 12b can be configured at the third mold 11c. In some embodiments, the second feed port 12b is not provided at the third mold 11c, but is provided at the lower mold 13 or the outer middle mold 15 for entering the second mold cavity 19b. In some embodiments, each second feed port 12b can be provided at the third mold 11c, the top surface 131 of the lower mold 13, the inner side wall 153 of the outer middle mold 15, or any other suitable position, as long as the second feed port 12b can be communicated with the second mold cavity 19b.

[0058] In some embodiments, when the third mold 11c is disposed relative to the second mold 14, the pressure regulating system 16 includes a gas conduit 161 and a junction 167, and the second mold cavity 19b is in communication with the gas conduit 161. In some embodiments, a plurality of junctions 167 are set at the second mold 14 and connected to the second mold cavity 19b. In some embodiments, the junctions 167 are configured to allow fluid or gas to enter or leave the second mold cavity 19b.

[0059] In some embodiments, the pressure regulating system 16 also includes a pressure sensing unit (not shown) configured to sense the pressure in the second mold cavity 19b. The pressure sensing unit (not shown) is not limited to any specific type, as long as it can sense the pressure and provide pressure information after sensing the pressure in the second mold cavity 19b. The pressure regulating system 16 changes the conditions for the gas to leave / enter the second mold cavity 19b according to the pressure information provided by the pressure sensing unit (not shown), and then adjusts the pressure in the second mold cavity 19b so that the composite material obtained thereby has a desired predetermined shape and properties. In some embodiments, the pressure sensing unit (not shown) is set in the second mold cavity 19b.

[0060] Fig.11 is a top view of an injection molding system 300 according to some embodiments of the present invention. Fig.12is a schematic perspective view of an injection molding system 300 according to some embodiments of the present invention.

[0061] In some embodiments, see Fig.11 and Fig.12 The injection molding system 300 includes a carrier 101 having a plurality of molding stations 400, each molding station 400 being used to carry a molding device 100 or a molding device 200. In some embodiments, Figures 5 to 8 The molding device 200 shown is disposed in one of the molding stations 400, and includes a position control mechanism 20, a first mold 11a, a third mold 11c, and a second mold 14 clamped by the position control mechanism 20. The position control mechanism 20 is configured to move the first mold 11a, the second mold 14, and the third mold 11c individually.

[0062] The first injection station 21 is disposed adjacent to the carrier 101 and is configured to inject the first polymer material into the first mold cavity 19a of the molding device 200, and the first mold cavity 19a is defined by the first mold 11a and the second mold 14, and the second mold 14 includes an outer middle mold 15 and a lower mold 13. In some embodiments, the second injection station 22 is disposed adjacent to the carrier 101 and separated from the first injection station 21, and the second injection station 22 is configured to inject the second polymer material into the second mold cavity 19b of the molding device 200, and the second mold cavity 19b is defined by the second mold 14 and the third mold 11c.

[0063] In some embodiments, the molding station 400 is disposed on the carrier 101, and the plurality of molding devices 200 are disposed above the carrier 101 and respectively disposed in the molding station 400. In some embodiments, the first injection station 21 and the second injection station 22 are disposed adjacent to the carrier 101 and above the two molding stations 400.

[0064] In some embodiments, the first injection station 21 includes a first extrusion system (not shown) and a first discharge channel (not shown) arranged above one of the molding stations 400. In some embodiments, the first polymeric material manufactured by the first injection station 21 is a mixture of a first polymeric material and a first foaming agent. In some embodiments, the first discharge channel may be connected to the first extrusion system and include a first outlet disposed away from the first extrusion system, and is configured to discharge the first polymeric material to the molding device 200 via a first feed port 12a. In some embodiments, the molding device 200 is configured to receive the first polymeric material from the first outlet of the first discharge channel. In some embodiments, the first feed port 12a may be in communication with the first mold cavity 19a and may be connected to the first outlet. In some embodiments, the first polymeric material is non-foamable or slightly foamable.

[0065] In some embodiments, the second injection station 22 includes a second extrusion system (not shown) and a second discharge channel (not shown) disposed above one of the molding stations 400. In some embodiments, the second polymeric material manufactured by the second injection station 22 is a mixture of a second polymeric material and a second foaming agent. In some embodiments, the second discharge channel may be connected to the second extrusion system and include a second outlet disposed away from the second extrusion system, and is configured to discharge the second polymeric material to the molding device 200 via a second feed port 12b. In some embodiments, the molding device 200 is configured to receive the second polymeric material from the second outlet of the second discharge channel. In some embodiments, the second feed port 12b may be in communication with the second mold cavity 19b and may be engaged with the second outlet. In some embodiments, the second polymeric material is non-foamable or slightly foamable.

[0066] In some embodiments, the carrier 101 is annular. In some embodiments, the carrier 101 may rotate around the third center C3 and along the third direction R3. In some embodiments, the carrier 101 may rotate clockwise or counterclockwise. In some embodiments, the carrier 101 rotates at predetermined intervals.

[0067] In some embodiments, the first injection station 21 and the second injection station 22 are separated from each other. In some embodiments, there is a predetermined distance between the first injection station 21 and the second injection station 22. In some embodiments, the first injection station 21 and the second injection station 22 can be automatically operated and controlled. In some embodiments, the first injection station 21 and the second injection station 22 can communicate with each other via any appropriate communication protocol, such as a programmable logic control (PLC) protocol, etc.

[0068] This creation also discloses a molding method M10. Fig.13 2 is a flowchart showing a method M10 of a molding method according to some embodiments of the present invention. The method M10 includes several operations: (O101) providing a molding device having a first mold, a second mold, and a third mold; (O102) engaging the first mold with the second mold to form a first mold cavity defined by the first mold and the second mold; (O103) injecting a first polymer material into the first mold cavity to form a first layer in the first mold cavity by the first polymer material; (O104) disengaging the first mold from the second mold through a position control mechanism; (O105) engaging the third mold with the second mold to form a second mold cavity defined by the second mold, the third mold, and the fourth mold; (O106) injecting a second polymer material into the second mold cavity and covering the first layer to form an article including the first layer and the second layer using the second polymer material; (O107) disengaging the third mold from the second mold through a position control mechanism. In some embodiments, the method M10 includes using a molding device 200.

[0069] In this creation, a molding method M20 is also disclosed. Fig.14 : is a flowchart showing a method M20 of a molding method according to some embodiments of the present invention. The method M20 includes several operations: (O201) providing a molding device having a first mold, a second mold, and a third mold; (O202) joining the first mold with the second mold to form a first mold cavity defined by the first mold and the second mold; (O203) injecting a first polymer material into the first mold cavity to form a first layer in the first mold cavity from the first polymer material; (O204) injecting a second polymer material into the first mold cavity to form a second layer in the first mold cavity from the second polymer material; (O205) controlling the first mold and the second mold through a position control mechanism. (O206) placing the component on a fifth mold connected to the third mold; (O207) joining the third mold to the second mold to form a second mold cavity defined by the second mold, the third mold and the fifth mold; (O208) injecting a third polymer material into the second mold cavity and covering the first layer and the second layer to form a product including the first layer, the second layer and the third layer from the third polymer material; (O209) separating the third mold from the second mold through a position control mechanism; (O210) obtaining a product including the first layer, the second layer and the component from the molding device.

[0070] In some embodiments, the molding method M20 includes using the molding apparatus 200. This method includes multiple operations, and the description and illustration are not to be construed as limiting the order of the operations. Figures 15 to 25 is a schematic perspective view of one or more operations of a molding method M20 according to some embodiments of the present invention.

[0071] In some embodiments, the injection molding system 300 of operation O201 of method M20 of some embodiments of the present invention is Fig.11 and Fig.12 In some embodiments, the molding method M20 includes an operation O201, which includes providing a molding device 200 having a first mold 11a, a second mold 14, a third mold 11c, and a position control mechanism 20. In some embodiments, the second mold 14 includes a lower mold 13 and an outer intermediate mold 15, and the fourth mold 17a is attached to the first mold 11a. In some embodiments, as Figure 5 , 6 , 7 and 8 are provided or received as a molding device 200. In some embodiments, the molding device 200 is configured to mold an article. In some embodiments, a molding device 200 including a pressure regulating system 16 having a joint 167, a gas conduit 161 and a pressure sensing unit (not shown) is provided or received.

[0072] In some embodiments, reference Fig.15During operation O201, the molding device 200 is in an open configuration. In some embodiments, during operation O201, the first mold 11a and the second mold 14 are separated from each other. In some embodiments, the first mold 11a is vertically moved to a first position above the second mold 14. In the first position, the first mold 11a is aligned with the second mold 14 of the molding device 200. In some embodiments, the first distance D1 between the first mold 11a and the second mold 14 is greater than 0.

[0073] In some embodiments, the position control mechanism 20 moves the first mold 11a toward or away from the second mold 14. In some embodiments, the position control mechanism 20 moves the second mold 14 disposed on the platform 23 toward or away from the first mold 11a. In some embodiments, the position control mechanism 20 clamps the third mold 11c away from the second mold 14. In some embodiments, the molding method M20 includes hingedly rotating the first mold 11a toward the second mold 14, or linearly moving the second mold 14 toward the first mold 11a to engage the first mold 11a with the second mold 14. In some embodiments, the molding method M20 includes pivoting the first mold 11a and the third mold 11c to dispose the first mold 11a or the third mold 11c above the second mold 14.

[0074] In some embodiments, see Fig.16 , a carrier 101 having a plurality of molding stations 400 is provided, and each molding station 400 includes a molding device 200. In some embodiments, the molding device 200 is set in one of the molding stations 400 of the carrier 101. In some embodiments, the first injection station 21 is configured to inject a first polymer material into the molding device 200, and the second injection station 22 is configured to inject a second polymer material into the molding device 200, and the first injection station 21 and the second injection station 22 are arranged adjacent to the carrier 101.

[0075] In some embodiments, the molding method M20 includes an operation O202 , which includes joining the first mold 11 a with the second mold 14 to form a first mold cavity 19 a defined by the first mold 11 a and the second mold 14 .

[0076] In some embodiments, the position control mechanism 20 pivots the first mold 11a around the first axis C1 and along the first direction R1 toward the second mold 14, or linearly moves the second mold 14 toward the first mold 11a, so that the first mold 11a is engaged with the second mold 14. The first direction R1 is clockwise or counterclockwise.

[0077] In some embodiments, the position control mechanism 20 pivots the first mold 11a and the third mold 11c around the second axis C2 and in the second direction R2 to place the first mold 11a or the third mold 11c above the second mold 14. The second direction R2 is a clockwise direction or a counterclockwise direction. In some embodiments, the pivoting rotation and the articulating rotation are implemented sequentially and separately.

[0078] In some embodiments, see Fig.17 , the first mold 11a, the lower mold 13, the outer middle mold 15 and the fourth mold 17a of the molding device 200 are in a first closed configuration, and the third mold 11c is clamped by the position control mechanism 20. In some embodiments, the third mold 11c and the second mold 14 are laterally offset from a top view.

[0079] In some embodiments, the second angle σ2 between the third mold 11c and the second mold 14 ranges from 0 to 90 degrees. In some embodiments, when the molding device 200 is in the first closed configuration, the second angle σ2 is 90 degrees. In some embodiments, the third angle σ3 between the first mold 11a and the third mold 11c ranges from 0 to 180 degrees. In some embodiments, when the molding device 200 is in the first closed configuration, the third angle σ3 is 90 degrees.

[0080] In some embodiments, the molding method M20 includes an operation O203 including injecting a first polymeric material into the first mold cavity 19a to form a first layer M1 from the first polymeric material in the first mold cavity 19a.

[0081] Still refer to Fig.17 , the first polymeric material is ejected into the first mold cavity 19a through one of the first feed ports 12a. In some embodiments, the first polymeric material comprises thermoplastic polyurethane (TPU), polyurethane (PU), plastic or any other suitable material. In some embodiments, the first polymeric material comprises a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the first polymeric material is foamable, non-foamable or slightly foamable. In some embodiments, the first polymeric material comprises a first dye. In some embodiments, the first polymeric material forms a first layer M1 in the first mold cavity 19a. In some embodiments, the first layer M1 is formed between the first mold 11a and the lower mold 13. In some embodiments, the first layer M1 is formed between the fourth mold 17a and the lower mold 13.

[0082] In some embodiments, the pressure in the first mold cavity 19a is sensed before the first polymeric material is injected. In some embodiments, before the first polymeric material is injected, a first gas (not shown) is injected into the first mold cavity 19a via the joint 167 until the first mold cavity 19a is sensed to have a first predetermined pressure.

[0083] In some embodiments, the method further comprises sensing the pressure in the first cavity 19a and filling the first polymer material from the first feed port 12a into the first cavity 19a having the first predetermined pressure. In some embodiments, the method further comprises exhausting a portion of the first gas (not shown) from the first cavity 19a through the junction 167.

[0084] In some embodiments, when the molding apparatus 200 is in the first closed configuration, a first force is applied to the second mold 14 toward the first mold 11a to facilitate engagement of the first mold 11a and the second mold 14. In some embodiments, the first force is applied to the second mold 14 before the first gas is injected into the first mold cavity 19a or before the first polymeric material is injected into the first mold cavity 19a. In some embodiments, the first force is applied to the second mold 14 during the injection of the first gas into the first mold cavity 19a or during the injection of the first polymeric material into the first mold cavity 19a. In some embodiments, the platform 23 provides the first force to the second mold 14.

[0085] In some embodiments, the molding device 200 is disposed on the carrier 101, the first extrusion system (not shown) and the molding device 200 are disposed in the first injection station 21, and the first polymer material is injected from the first extrusion system into the molding device 200 in the first injection station 21. In some embodiments, the first polymer material is injected into the molding device 200 through the first mold 11a.

[0086] In some embodiments, at the first injection station 21, the first die 11a is attached to the external intermediate die 15, and the third die 11c clamped by the position control mechanism 20 is arranged away from the external intermediate die 15. In some embodiments, the first die 11a is arranged below the first extrusion system. In some embodiments, the third die 11c is arranged above the position control mechanism 20.

[0087] In some embodiments, the molding method M20 includes an operation O204 , which includes injecting a second polymeric material into the first mold cavity 19 a to form a second layer M2 from the second polymeric material in the first mold cavity 19 a .

[0088] Still refer to Fig.17, the second polymeric material is injected into the first mold cavity 19a via one of the first feed ports 12a. In some embodiments, the first polymeric material and the second polymeric material are injected into the first mold cavity 19a. In some embodiments, the second polymeric material comprises thermoplastic polyurethane (TPU), polyurethane (PU), plastic, or any other suitable material. In some embodiments, the second polymeric material comprises a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the second polymeric material is foamable, non-foamable, or slightly foamable. In some embodiments, the second polymeric material comprises a second dye. The second dye may be similar to or different from the first dye. In some embodiments, the first polymeric material and the second polymeric material are non-foamable. In some embodiments, the first polymeric material and the second polymeric material are slightly foamable. In some embodiments, the composition of the second polymeric material is similar to or different from the composition of the first polymeric material. In some embodiments, the first polymeric material and the second polymeric material have different physical properties, such as different densities.

[0089] In some embodiments, the second polymeric material forms a second layer M2 adjacent to the first layer M1. In some embodiments, the second layer M2 connects the first layer M1. In some embodiments, the second layer M2 is spaced apart from the first layer M1. In some embodiments, the second layer M2 is formed between the first mold 11a and the lower mold 13. In some embodiments, the second layer M2 is formed between the fourth mold 17a and the lower mold 13. In some embodiments, the first polymeric material and the second polymeric material are ejected simultaneously. In some embodiments, the first layer M1 and the second layer M2 are formed simultaneously. In some embodiments, the first layer M1 and the second layer M2 have different physical properties, such as different densities. The first layer M1 and the second layer M2 may be the same or different colors.

[0090] In some embodiments, the pressure in the first mold cavity 19a is sensed before the second polymeric material is injected. In some embodiments, a second gas (not shown) is injected into the first mold cavity 19a through the junction 167 before the second polymeric material is injected until the first mold cavity 19a is sensed to have a second predetermined pressure.

[0091] In some embodiments, the molding method M20 further includes sensing the pressure in the first mold cavity 19a and filling the second polymeric material from the first feed port 12a into the first mold cavity 19a having a second predetermined pressure. In some embodiments, the molding method M20 also includes exhausting a portion of the second gas (not shown) from the first mold cavity 19a via the junction 167. In some embodiments, the second predetermined pressure is the same as the first predetermined pressure.

[0092] In some embodiments, the second force is applied to the second mold 14 before the second gas is injected into the first mold cavity 19a or before the second polymeric material is injected into the first mold cavity 19a. In some embodiments, the second force is applied to the second mold 14 during the injection of the second gas into the first mold cavity 19a or during the injection of the second polymeric material into the first mold cavity 19a.

[0093] In some embodiments, the molding device 200 is disposed on the carrier 101, the first extrusion system (not shown) and the molding device 200 are disposed in the first injection station 21, and the second polymer material is injected from the first extrusion system into the molding device 200 in the first injection station 21. In some embodiments, the second polymer material is injected into the molding device 200 through the first mold 11a.

[0094] In some embodiments, after forming the first layer M1 and the second layer M2, a third cavity 19c is formed in the molding device 200. In some embodiments, the volume of the third cavity 19c is smaller than the volume of the first cavity 19a. In some embodiments, the volume of the third cavity 19c is greater than 0.

[0095] In some embodiments, the molding method M20 includes an operation O205 , which includes separating the first mold 11 a from the second mold 14 through the position control mechanism 20 .

[0096] In some embodiments, reference Fig.18 After the first layer M1 and the second layer M2 are formed in the molding device 200, the first mold 11a is separated from the second mold 14, the first layer M1 and the second layer M2. In some embodiments, the second mold 14, the first layer M1 and the second layer M2 are transferred together with the rotation of the carrier 101.

[0097] In some embodiments, after forming the first layer M1 and the second layer M2, the molding device 200 is opened. In some embodiments, before the first mold 11a is separated from the second mold 14, the second force is stopped from being applied to the molding device 200. In some embodiments, after forming the first layer M1 and the second layer M2, the first mold 11a is separated from the second mold 14, and the first layer M1 and the second layer M2 are exposed.

[0098] In some embodiments, during the movement, the molding device 200 is in an open configuration, such as Fig.18As shown. In some embodiments, during the movement, the first mold 11a and the second mold 14 are separated from each other. In some embodiments, the first mold 11a moves vertically back to the first position above the second mold 14. In the first position, the first mold 11a is aligned with the second mold 14 of the molding device 200. In some embodiments, the first distance D1 between the first mold 11a and the second mold 14 is greater than 0. In some embodiments, the position control mechanism 20 moves the first mold 11a away from the second mold 14. In some embodiments, by moving the platform 23 along the track 25, the position control mechanism 20 moves the second mold 14 disposed on the platform 23 away from the first mold 11a.

[0099] In some embodiments, referring back to Fig.16 After forming the first layer M1 and the second layer M2, the molding device 200 moves from the first injection station 21 to the second injection station 22. In some embodiments, the carrier 101 rotates around the third center C3 and along the third direction R3 to move the molding device 200 from the first injection station 21 to the second injection station 22.

[0100] In some embodiments, see Fig.19 After the first mold 11a and the second mold 14 are separated from each other, the position control mechanism 20 tilts the first mold 11a and the third mold 11c. In some embodiments, the first mold 11a and the third mold 11c may rotate about the first axis C1 and in the first direction R1.

[0101] In some embodiments, there is a first angle σ1 between the bottom surface of the first mold 11a and the top surface of the second mold 14, there is a second angle σ2 between the bottom surface of the third mold 11c and the top surface of the second mold 14, and there is a third angle σ3 between the first mold 11a and the third mold 11c. In some embodiments, the first angle σ1 and the second angle σ2 are both 45 degrees, and the third angle σ3 is 90 degrees.

[0102] In some embodiments, the first mold 11a and the third mold 11c are tilted through the position control mechanism 20, and the position control mechanism 20 rotates around the second axis C2 to move the third mold 11c toward the second mold 14 and move the first mold 11a away from the second mold 14. Fig.19 shown.

[0103] In some embodiments, the molding method M20 includes an operation O206 including setting the assembly 175 in the fifth mold 17b attached to the third mold 11c.

[0104] In some embodiments, component 175 is attached to fifth mold 17b. In some embodiments, component 175 is placed in fifth mold 17b. In some embodiments, component 175 is conformal to fifth mold 17b. In some embodiments, component 175 comprises a third polymeric material. In some embodiments, component 175 is permeable to a gas or fluid (e.g., air, a supercritical fluid, an inert gas, nitrogen, carbon dioxide, etc.). In some embodiments, component 175 comprises a fabric. In some embodiments, component 175 is an insole, an upper, or any other suitable component of footwear.

[0105] In some embodiments, a barrier layer (not shown) is set between the component 175 and the fifth mold 17b. In some embodiments, before the component 175 is placed in the fifth mold 17b, the barrier layer (not shown) is attached to the inner surface of the component 175. After the component 175 is placed in the fifth mold 17b, the inner surface of the component 175 and the barrier layer (not shown) are placed over the fifth mold 17b. In some embodiments, the barrier layer (not shown) is conformal to the component 175. In some embodiments, the barrier layer (not shown) is a TPU film.

[0106] In some embodiments, see Fig. 20 , after the position control mechanism 20 rotates about the second axis C2 to move the third mold 11c toward the second mold 14, the first mold 11a and the third mold 11c rotate about the first axis C1 and along the first direction R1 until the third mold 11c is set at a second position above the second mold 14, and the first mold 11a is set above the position control mechanism 20. At the second position, the third mold 11c is aligned with the second mold 14 of the molding device 200. In some embodiments, the second distance D2 between the third mold 11c and the second mold 14 is greater than 0. In some embodiments, the second angle σ2 and the third angle σ3 are each 90 degrees.

[0107] In some embodiments, the position control mechanism 20 moves the third mold 11c toward the second mold 14. In some embodiments, the position control mechanism 20 moves the second mold 14 disposed on the platform 23 toward the third mold 11c.

[0108] In some embodiments, the molding device 200 including the lower mold 13, the outer middle mold 15, the first layer M1 and the second layer M2 is transferred and set in the second injection station 22. In some embodiments, the second extrusion system (not shown) and the molding device 200 are set in the second injection station 22 after the carrier 101 is rotated.

[0109] In some embodiments, the fifth mold 17b and the assembly 175 are moved to a predetermined position above the first layer M1 and the second layer M2, such as Fig. 20As shown, the first die 11a, the fifth die 17b and the assembly 175 are then moved toward the first layer M1 and the second layer M2 until the fifth die 17b engages with the second die 14. In some embodiments, the molding device 200 is disposed below the second extrusion system.

[0110] In some embodiments, the molding method M20 includes an operation O207 , which includes engaging the third mold 11 c with the second mold 14 to form a second mold cavity 19 b defined by the second mold 14 , the third mold 11 c , and the fifth mold 17 b .

[0111] In some embodiments, the position control mechanism 20 causes the third mold 11c to hingedly rotate about the first axis C1 toward the second mold 14 and moves the second mold 14 toward the third mold 11c along the first direction R1 or linearly to engage the third mold 11c with the second mold 14.

[0112] In some embodiments, the position control mechanism 20 pivots the first mold 11a and the third mold 11c about the second axis C2 and in the second direction R2 to dispose the third mold 11c above the second mold 14. In some embodiments, the pivoting rotation and the articulating rotation are performed sequentially and separately.

[0113] In some embodiments, see Fig.21 , the third mold 11c and the fifth mold 17b are joined to the second mold 14, and a second mold cavity 19b is formed. In some embodiments, the molding device 200 including the second mold cavity 19b is in a second closed configuration. In some embodiments, the component 175 is disposed in the second mold cavity 19b. In some embodiments, the component 175 surrounds the fifth mold 17b and is located above the first layer M1 and the second layer M2. In some embodiments, the component 175 is surrounded by the second mold 14. In some embodiments, the component 175 is disposed between the fifth mold 17b and the second mold 14. In some embodiments, the second mold cavity 19b is defined by the component 175, the first layer M1, and the second layer M2.

[0114] In some embodiments, both ends 176, 177 of the assembly 175 are attached to the outer intermediate mold 15. In some embodiments, a barrier layer (not shown) is used to prevent the gas or fluid in the second mold cavity 19b from escaping from the second mold cavity 19b.

[0115] In some embodiments, the molding method M20 includes operation O208, which includes injecting a third polymer material into the second mold cavity 19b and above the first layer M1 and the second layer M2 to form an article 178 made of the third polymer material including the first layer M1, the second layer M2 and the third layer M3.

[0116] In some embodiments, see Fig. 22, the third polymer material is injected from the second extrusion system into the molding device 200 in the second injection station 22. In some embodiments, the third polymer material is injected into the molding device 200 through the third die 11c.

[0117] In some embodiments, the third polymeric material is injected into the second mold cavity 19b through one of the second feed ports 12b. In some embodiments, the third polymeric material comprises thermoplastic polyurethane (TPU), polyurethane (PU), plastic, or any other suitable material. In some embodiments, the third polymeric material comprises a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the third polymeric material is foamable or slightly foamable. In some embodiments, the composition of the third polymeric material is similar to or different from the composition of the first polymeric material or the composition of the second polymeric material.

[0118] In some embodiments, the third layer M3 is attached to the assembly 175, the first layer M1, and the second layer M2. In some embodiments, the third layer M3 is disposed above the first layer M1 and the second layer M2, and the assembly 175 is disposed above the third layer M3. In some embodiments, the assembly 175, the first layer M1, the second layer M2, and the third layer M3 form an article 178. In some embodiments, the article 178 is a shoe. In some embodiments, the density of the third layer M3 is substantially less than the density of the first layer M1. In some embodiments, the density of the third layer M3 is substantially less than the density of the second layer M2.

[0119] In some embodiments, the pressure in the second mold cavity 19b is sensed before the third polymeric material is injected. In some embodiments, before the third polymeric material is injected, a third gas (not shown) is then injected into the second mold cavity 19b through the joint 167 until the second mold cavity 19b is sensed to have a third predetermined pressure.

[0120] In some embodiments, the method further comprises sensing the pressure in the second cavity 19b and filling the third polymer material from the second feed port 12b into the second cavity 19b having a third predetermined pressure. In some embodiments, the method further comprises exhausting a portion of the third gas (not shown) from the second cavity 19b through the junction 167.

[0121] In some embodiments, when the molding apparatus 200 is in the second closed configuration, a third force is applied to the second mold 14 toward the third mold 11c to promote the engagement of the third mold 11c and the second mold 14. In some embodiments, the third force is applied to the second mold 14 before the third gas is injected into the second mold cavity 19b or before the third polymer material is injected into the second mold cavity 19b. In some embodiments, the third force is applied to the second mold 14 during the process of injecting the third gas into the second mold cavity 19b or during the process of injecting the third polymer material into the second mold cavity 19b. In some embodiments, the platform 23 provides the third force to the second mold 14. In some embodiments, the fourth force is configured to press the first layer M1 and the second layer M2 toward the third layer M3 and the assembly 175. The fourth force is provided to promote the bonding of the first layer M1, the second layer M2, the third layer M3 and the assembly 175.

[0122] In some embodiments, the third polymeric material is ejected from a second extrusion system (not shown) into the molding device 200 at the second ejection station 22, such as Fig.16 shown.

[0123] In some embodiments, the molding method M20 includes an operation O209, which includes separating the third mold 11c from the second mold 14 through the position control mechanism 20. In some embodiments, before the third mold 11c is separated from the second mold 14, the fourth force is stopped from being applied to the molding device 200.

[0124] In some embodiments, see Fig.23 After forming the first layer M1, the second layer M2, and the third layer M3, the first layer M1, the second layer M2, the third layer M3, and the assembly 175 are removed from the second mold cavity 19b. In some embodiments, after the product 178 is formed in the molding device 200, the product 178 is removed from the second mold cavity 19b. In some embodiments, the molding device 200 is in an open configuration when the product 178 is removed.

[0125] In some embodiments, after the product 178 is formed, the third mold 11c is separated from the second mold 14, so that the product 178 having the first layer M1, the second layer M2, the third layer M3 and the assembly 175 can be taken out from the second mold 14. In some embodiments, the product 178 having the first layer M1, the second layer M2, the assembly 175 and the barrier layer can be taken out from the molding device 200.

[0126] In some embodiments, the third mold 11c, the fifth mold 17b, and the product 178 are separated from the second mold 14. In some embodiments, the position control mechanism 20 moves the third mold 11c and the fifth mold 17b away from the second mold 14, and also moves the product 178 attached to the fifth mold 17b away from the second mold 14. The second distance D2 after the third mold 11c and the fifth mold 17b are moved away from the second mold 14 is greater than 0.

[0127] In some embodiments, before the third mold 11c, the fifth mold 17b and the product 178 are moved away from the second mold 14, the first part 151 and the second part 152 of the outer intermediate mold 15 are removed to form a gap between the first part 151 and the second part 152. Figure 2 The gap G2 is shown, whereby the product 178 can be separated from the outer intermediate mold 15 and easily removed from the second mold cavity 19b.

[0128] In some embodiments, due to the creation of the gap G2 , the molding device 200 is transformed from the second closed configuration to the open configuration.

[0129] In some embodiments, the molding method M20 includes an operation O210, which includes obtaining an article 178 including a first layer M1, a second layer M2, and a component 175 from a molding device 200.

[0130] In some embodiments, reference Fig.24 , after the third mold 11c, the fifth mold 17b and the product 178 are removed from the second mold 14, the product 178 is removed from the fifth mold 17b. In some embodiments, the product 178 can be removed from the fifth mold 17b. In some embodiments, the product 178 having the first layer M1, the second layer M2, the third layer M3, the component 175 and the barrier layer can be removed from the fifth mold 17b. In some embodiments, the product 178 is removed from the fifth mold 17b by a person or a robot arm (not shown). In some embodiments, before removing the product 178 from the fifth mold 17b, the third mold 11c and the fifth mold 17b are tilted. In some embodiments, the third mold 11c and the fifth mold 17b are tilted through the position control mechanism 20, and the first mold 11a is also tilted.

[0131] In some embodiments, after forming the article 178 and before removing the article 178 from the molding apparatus 200, the molding apparatus 200 is removed from the second injection station 22, for example, by rotating the carrier 101. In some embodiments, the article 178 is removed from the molding apparatus 200 and the carrier 101.

[0132] In some embodiments, when the third mold 11c and the fifth mold 17b are tilted, there is a second angle σ2 between the bottom surface of the fifth mold 17b and the second mold 14. In some embodiments, the range of the second angle σ2 is between 0 degrees and 90 degrees. In some embodiments, the range of the second angle σ2 is between 20 degrees and 70 degrees. In some embodiments, when the product 178 is removed from the molding device 200, the second angle σ2 is 45 degrees.

[0133] In some embodiments, see Fig.25 , article 178 includes a first layer M1, a second layer M2, a third layer M3, and an assembly 175. In some embodiments, the barrier layer is removed from article 178. The first layer M1 has a first density, the second layer M2 has a second density, and the third layer M3 has a third density. The first density, the second density, and the third density may be the same or different. In some embodiments, the first interface is located between the first layer M1 and the third layer M3 and has a first density gradient, and the second interface is located between the second layer M2 and the third layer M3 and has a second density gradient. The first density gradient and the second density gradient may be the same or different.

[0134] According to an embodiment of the present invention, the position control mechanism is connected to the first mold 11a, the second mold 14, and the third mold 11c. The first mold 11a and the third mold 11c can rotate around the first axis C1 through the hinge 24 of the position control mechanism 20, and rotate around the second axis C2 orthogonal to the first axis C1 through the pivot 26 of the position control mechanism 20, and the second mold 14 can move linearly along the track 25 of the position control mechanism 20. The position control mechanism 20 allows the first mold 11a to move relative to the second mold 14, or allows the third mold 11c to move relative to the second mold 14. When the first mold 11a is set relative to the second mold 14, the third mold 11c is substantially offset at a right angle to the first mold 11a.

[0135] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present invention. Those skilled in the art should understand that they can easily use the present invention as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present invention, and that they can make various changes, substitutions, and modifications without departing from the spirit and scope of the present invention.

[0136] Furthermore, the scope of the present invention is not intended to be limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, devices, methods, and steps described in the specification. A person of ordinary skill in the art will readily understand from the disclosure of the present invention that processes, machines, manufactures, compositions of matter, means, methods, or steps currently existing or to be developed in the future, according to the present invention, can use embodiments that perform substantially the same functions or achieve substantially the same results as the corresponding embodiments described herein. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, devices, methods, and steps within their scope.

[0137] Explanation of symbols

[0138] 10: Molding device

[0139] 11: Upper mold

[0140] 11a: First mold

[0141] 11b: First mold

[0142] 11c: The third mold

[0143] 11d: First end

[0144] 11e: Second end

[0145] 11f: First end

[0146] 11g: Second end

[0147] 12a: First feed port

[0148] 12b: Second feed port

[0149] 13: Lower mold

[0150] 14: Second mold

[0151] 15: External middle mold

[0152] 16: Pressure regulation system

[0153] 17a: Fourth mold

[0154] 17b: Fifth mold

[0155] 19a: First cavity

[0156] 19b: Second cavity

[0157] 19c: The third cavity

[0158] 20: Position control mechanism

[0159] 21: First injection station

[0160] 22: Second injection station

[0161] 23: Platform

[0162] 24: Hinge

[0163] 25: Track

[0164] 26: Pivot

[0165] 100: Molding device

[0166] 101: Carrier

[0167] 121a: Opening

[0168] 121b: Opening

[0169] 131: Top

[0170] 151: Part 1

[0171] 151a: Extension assembly

[0172] 152: Part 2

[0173] 152a: Extension assembly

[0174] 153: Inner wall

[0175] 161: Gas duct

[0176] 163: Gas Controller

[0177] 167: Junction

[0178] 173: First End

[0179] 174: Second End

[0180] 175: Components

[0181] 176: End

[0182] 177: End

[0183] 178: Products

[0184] 200: Molding device

[0185] 300: Injection molding system

[0186] 400: Forming station

[0187] C1: First axis

[0188] C2: Second axis

[0189] C3: The Third Center

[0190] D1: First distance

[0191] D2: Second distance

[0192] G2: Gap

[0193] IV-IV': Line

[0194] M1: First layer

[0195] M2: Second layer

[0196] M3: The third layer

[0197] M10: Molding method

[0198] M20: Forming method

[0199] O101: Operation

[0200] O102: Operation

[0201] O103: Operation

[0202] O104: Operation

[0203] O105: Operation

[0204] O106: Operation

[0205] O107: Operation

[0206] O201: Operation

[0207] O202: Operation

[0208] O203: Operation

[0209] O204: Operation

[0210] O205: Operation

[0211] O206: Operation

[0212] O207: Operation

[0213] O208: Operation

[0214] O209: Operation

[0215] O210: Operation

[0216] R1: First direction

[0217] R2: Second direction

[0218] R3: Third direction

[0219] σ1: first angle

[0220] σ2: Second angle

[0221] σ3: The third angle.

Claims

1. A molding device, characterized in that: include: First mold; Second mold; a first mold cavity, the first mold and the second mold defining the first mold cavity when the first mold is disposed relative to the second mold, the first mold cavity being configured to receive polymeric material and components; as well as a position control mechanism attached to the first mold and the second mold, The first mold and the second mold can be moved independently by utilizing the position control mechanism.

2. The molding device according to claim 1, characterized in that: The first mold is rotated around a first axis using the hinge of the position control mechanism, and is rotated around a second axis using the pivot of the position control mechanism, the second axis being perpendicular to the first axis.

3. The molding device according to claim 2, characterized in that: Further included is a third mold attached to the position control mechanism and moved by the position control mechanism.

4. The molding device according to claim 3, characterized in that: The third mold is rotated around a first axis using the hinge of the position control mechanism, and is rotated around a second axis using the pivot of the position control mechanism, the second axis being orthogonal to the first axis.

5. The molding device according to claim 3, characterized in that: Further comprising: when the third mold is disposed relative to the second mold, a second mold cavity is defined by the second mold and the third mold, and the first mold is offset at approximately a right angle to the third mold.

6. The molding device according to claim 1, characterized in that: It also includes a fourth mold attached to the first mold. When the first mold is arranged opposite to the second mold and the fourth mold is surrounded by the second mold, the first mold cavity is defined by the first mold, the second mold and the fourth mold.

7. The molding device according to claim 6, characterized in that: The fourth mold includes a first end and a second end opposite to the first end. The position control mechanism is used to tilt the fourth mold relative to the second mold so that the second end of the fourth mold moves to a position higher than the first end.

8. An injection molding system, characterized in that: include: a carrier having a plurality of forming stations; a molding device disposed at one of the plurality of molding stations and comprising a position control mechanism, a first mold, a second mold, and a third mold, the position control mechanism clamping the third mold; and a first injection station disposed adjacent to the carrier and configured to inject a first material into a first mold cavity of the molding device, the first mold cavity being defined by the first mold and the second mold, The position control mechanism is configured to move the first mold, the second mold and the third mold individually.

9. The injection molding system according to claim 8, characterized in that: The first mold and the third mold can rotate around the hinge and pivot of the position control mechanism, and the second mold can move linearly along the track of the position control mechanism, the hinge and the pivot are configured to cover the track, and the track can extend along a first axis, the hinge is configured to rotate the first mold and the third mold around a second axis, and the first axis is orthogonal to the second axis.

10. The injection molding system according to claim 8, characterized in that: Further including: A second injection station is disposed adjacent to the carrier and away from the first injection station, The second injection station is configured to inject a second material into a second cavity of the molding device, and the second cavity is defined by the second mold and the third mold.

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