Wafer adsorption heating device of APCVD equipment

Abstract

The utility model discloses a wafer adsorption heating device of APCVD equipment, and relates to the technical field of atmospheric pressure chemical deposition. The bottom of the shell is open; the vacuum adsorption system comprises a vacuum generator; the movement mechanism comprises a vacuum generator fixing ring and a guide ring; the guide ring is arranged around the vacuum generator fixing ring, and the vacuum generator fixing ring is arranged around the vacuum generator; the heater assembly is arranged at the bottom of the shell. According to the wafer adsorption heating device of the APCVD equipment, the wafer is adsorbed in a suck-back manner, so that pollution of impurities such as dust to the wafer can be effectively reduced; the moving mechanism can drive the vacuum generator and the vacuum generator fixing ring to move up and down, so that the maintenance difficulty of the vacuum generator and the vacuum generator fixing ring is reduced, the cleaning convenience of the vacuum generator and the vacuum generator fixing ring is improved, the equipment maintainability is improved, and the later maintenance cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of atmospheric pressure chemical deposition, in particular to a wafer adsorption heating device for APCVD equipment. Background Art

[0002] APCVD, or atmospheric pressure chemical vapor deposition, refers to the process of spraying process gas 01 at a uniform speed onto the surface of a heated solid substrate in an environment where the pressure is close to atmospheric pressure, so that the reaction source undergoes a chemical reaction on the substrate surface, and the reaction product is deposited on the substrate surface to form a thin film. The conventional heating method is to use a graphite base to hold the wafer on which the thin film is to be deposited, and move it on a conveyor belt 02; the conveyor belt 02 space is surrounded by an induction coil 03 or a resistance heater 05 is provided under the graphite base, and a graphite substrate and a coil 04 are provided. The graphite base is heated by radio frequency induction or by a resistance heater, and the wafer on which the thin film is to be deposited is heated by the heated graphite base. This mobile deposition method under atmospheric pressure is prone to the introduction of external impurities and contaminants; the magnetic field inhomogeneity of the induction coil 03 will lead to variability and inconsistency of the deposited film, and ordinary resistance heaters also have uneven heating, which will also lead to variability and inconsistency of the deposited film. Summary of the invention

[0003] In order to solve the above technical problems, the utility model provides a wafer adsorption and heating device for APCVD equipment, which adopts reverse suction adsorption heating, can effectively reduce the contamination of dust and other impurities to the wafer, and enhance the uniformity of the thin film on the deposition surface of the wafer; increase the space for maintenance and replacement of components to reduce the difficulty and cost of maintenance.

[0004] To achieve the above purpose, the utility model provides the following solutions:

[0005] The utility model provides a wafer adsorption and heating device for APCVD equipment, comprising a shell, a heater assembly, a vacuum adsorption system and a motion mechanism; the bottom of the shell is open; the vacuum adsorption system comprises a vacuum generator; the motion mechanism comprises a vacuum generator fixing ring and a guide ring; the guide ring is arranged around the vacuum generator fixing ring, and the vacuum generator fixing ring is arranged around the vacuum generator; the heater assembly is arranged at the bottom of the shell and is located above the vacuum generator.

[0006] Optionally, the heater assembly includes a heating body, an insulating plate, an upper fixed plate, a lower fixed plate and a thermal insulation material; the insulating plate is arranged on the upper part of the heating body, the lower fixed plate is arranged on the lower part and around the heating body, the upper fixed plate is arranged above the insulating plate and extends to above the lower fixed plate; the thermal insulation material is arranged in a cavity between the upper fixed plate, the lower fixed plate and the shell.

[0007] Optionally, the heater is a resistive heater with a heating range of room temperature to 450°C and a temperature uniformity of ±4°C.

[0008] Optionally, the vacuum adsorption system also includes a vacuum pipeline, a spring, an air nozzle and a vacuum pump; the inlet of the vacuum pump is connected to the air nozzle through the vacuum pipeline; the air nozzle is arranged above the heating body in the heater assembly, and the heating body and the middle part of the vacuum generator are correspondingly provided with through air holes, and the air nozzle is located directly above the through air holes; the spring is sleeved on the vacuum pipeline and located above the air nozzle.

[0009] Optionally, the motion mechanism also includes a first cylinder, a second cylinder, a first mounting plate, a second mounting plate, a third mounting plate, a fourth mounting plate and a cylinder mounting plate; the fourth mounting plate is located above the shell, and the fourth mounting plate is connected to the top of the shell through a guide shaft, the third mounting plate is located above the shell and above the fourth mounting plate, and the third mounting plate is connected to the top of the shell through a guide shaft; the second mounting plate is arranged above the third mounting plate, and the third mounting plate is connected to the second mounting plate through a guide shaft; the first mounting plate is located above the second mounting plate, and the first mounting plate and the second mounting plate are connected through a support shaft; the cylinder mounting plate is a Z-shaped structure, the cylinder mounting plate is located above the fourth mounting plate, the cylinder body of the first cylinder is connected to the cylinder mounting plate, and the cylinder rod of the first cylinder is connected to the first mounting plate; the cylinder body of the second cylinder is connected to the cylinder mounting plate, and the cylinder rod of the second cylinder is connected to the fourth mounting plate.

[0010] Optionally, external springs are provided between the second mounting plate and the shell, and between the third mounting plate and the shell, and the external springs are used to reset the second mounting plate and the third mounting plate.

[0011] Optionally, the vacuum generator and the vacuum generator fixing ring are both made of high-purity SiC or Si or Al2O3 or quartz.

[0012] Compared with the prior art, the utility model has achieved the following technical effects:

[0013] The wafer adsorption and heating device of the APCVD equipment in the utility model adsorbs the wafer in a reverse suction manner and heats the wafer. The impurity particles are carried away by the airflow after falling due to gravity, which can effectively reduce the pollution of impurities such as dust to the wafer; the motion mechanism can drive the vacuum generator and the vacuum generator fixing ring to move up and down, which reduces the maintenance difficulty of the vacuum generator and the vacuum generator fixing ring, improves the convenience of cleaning the vacuum generator and the vacuum generator fixing ring, improves the maintainability of the equipment, and reduces the later maintenance cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 is a schematic structural diagram of an embodiment of the present invention;

[0016] Figure 2 is a structural schematic diagram of a motion mechanism of an embodiment of the present invention in a position for maintaining and replacing components;

[0017] Figure 3 Schematic diagram of the structure of the motion mechanism of the embodiment of the present invention in the position of introducing the maintenance tool

[0018] Figure 4 This is a schematic diagram of the conventional APCVD induction heating process.

[0019] Figure 5 This is a schematic diagram of the conventional APCVD resistance heating process.

[0020] Description of reference numerals: 01, process gas; 02, conveyor belt; 03, induction coil; 04, graphite substrate and coil; 05, heater;

[0021] 1. Heater assembly; 101. Heating body; 102. Insulating plate; 103. Upper fixing plate; 104. Lower fixing plate; 105. Insulating material; 2. Vacuum adsorption system; 201. Vacuum pipeline; 202. Spring; 203. Air nozzle; 204. Vacuum pump; 205. Vacuum generator; 3. Motion mechanism; 301. First cylinder; 302. Second cylinder; 303. First mounting plate; 304. Second mounting plate; 305. Third mounting plate; 306. Fourth mounting plate; 307. Cylinder mounting plate; 308. Vacuum generator fixing ring; 309. Guide ring; 4. Shell; 5. External spring; 6. Guide shaft; 7. Support shaft; 8. Wafer; 9. Maintenance tooling. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figures 1 to 5 As shown, this embodiment provides a wafer adsorption and heating device for APCVD equipment, including a shell 4, a heater assembly 1, a vacuum adsorption system 2 and a moving mechanism 3; the bottom of the shell 4 is open; the vacuum adsorption system 2 includes a vacuum generator 205; the moving mechanism 3 includes a vacuum generator fixing ring 308 and a guide ring 309; the guide ring 309 is arranged around the vacuum generator fixing ring 308, and the vacuum generator fixing ring 308 is arranged around the vacuum generator 205; the heater assembly 1 is arranged at the bottom of the shell 4 and is located above the vacuum generator 205.

[0024] In this specific embodiment, the heater assembly 1 includes a heating body 101, an insulating plate 102, an upper fixing plate 103, a lower fixing plate 104 and a thermal insulation material 105; the insulating plate 102 is arranged on the upper part of the heating body 101, the lower fixing plate 104 is arranged on the lower part and around the heating body 101, the upper fixing plate 103 is arranged above the insulating plate 102 and extends to above the lower fixing plate 104; the thermal insulation material 105 is arranged in the cavity between the upper fixing plate 103 and the lower fixing plate 104 and the shell 4.

[0025] The heating body 101 is a resistive heater with a heating range from room temperature to 450°C and a temperature uniformity of ±4°C.

[0026] The vacuum adsorption system 2 also includes a vacuum pipeline 201, a spring 202, an air nozzle 203 and a vacuum pump 204; the inlet of the vacuum pump 204 is connected to the air nozzle 203 through the vacuum pipeline 201; the air nozzle 203 is arranged above the heating body 101 in the heater assembly 1, and the heating body 101 and the middle part of the vacuum generator 205 are correspondingly provided with through air holes, and the air nozzle 203 is located directly above the through air holes; the spring 202 is sleeved on the vacuum pipeline 201 and is located above the air nozzle 203.

[0027] The motion mechanism 3 further includes a first cylinder 301, a second cylinder 302, a first mounting plate 303, a second mounting plate 304, a third mounting plate 305, a fourth mounting plate 306 and a cylinder mounting plate 307; the fourth mounting plate 306 is located above the housing 4, and the fourth mounting plate 306 is connected to the top of the housing 4 via a guide shaft 6; the third mounting plate 305 is located above the housing 4 and above the fourth mounting plate 306, and the third mounting plate 305 is connected to the top of the housing 4 via a guide shaft 6; the second mounting plate 304 is arranged above the third mounting plate 305, and the third mounting plate 307 is arranged above the third mounting plate 306. 05 is connected to the second mounting plate 304 through a guide shaft 6; the first mounting plate 303 is located above the second mounting plate 304, and the first mounting plate 303 and the second mounting plate 304 are connected through a support shaft 7; the cylinder mounting plate 307 is a Z-shaped structure, and the cylinder mounting plate 307 is located above the fourth mounting plate 306. The cylinder body of the first cylinder 301 is connected to the cylinder mounting plate 307, and the cylinder rod of the first cylinder 301 is connected to the first mounting plate 303; the cylinder body of the second cylinder 302 is connected to the cylinder mounting plate 307, and the cylinder rod of the second cylinder 302 is connected to the fourth mounting plate 306. External springs 5 ​​are provided between the second mounting plate 304 and the housing 4, and between the third mounting plate 305 and the housing 4, and the external springs 5 ​​are used to reset the second mounting plate 304 and the third mounting plate 305.

[0028] The motion mechanism 3 can fix the vacuum generator 205 and the vacuum generator fixing ring 308 at three positions respectively according to the cylinder state, so that the equipment maintenance personnel can clean or replace the vacuum generator 205 and the vacuum generator fixing ring 308 periodically.

[0029] The vacuum generator 205 and the vacuum generator fixing ring 308 are both made of high-purity SiC or Si or Al2O3 or quartz to prevent contamination of the wafer 8.

[0030] Heating use status position: the rod chambers of the first cylinder 301 and the second cylinder 302 are exhausted, and the rodless chambers are intaken, and the piston rods of both remain extended; the vacuum generator fixing ring 308 and the vacuum generator 205 thereon are pulled up and fixed upward into the shell 4, and the lower end surface of the vacuum generator fixing ring 308 does not exceed the bottom surface of the shell 4.

[0031] Maintenance and replacement parts position: the rod chamber of the first cylinder 301 is inlet, and the rodless chamber is exhausted; the second cylinder 302 keeps the rod chamber exhausted and the rodless chamber inlet; the piston rod of the first cylinder 301 changes from the extended state to the retracted state, driving the first mounting plate 303, the second mounting plate 304, the third mounting plate 305, the vacuum generator fixing ring 308 and the vacuum generator 205 to move downward by the stroke amount of the first cylinder 301. The vacuum generator fixing ring 308 and the vacuum generator 205 thereon are now out of the range of the housing 4, and the upper end surface of the vacuum generator fixing ring 308 exceeds the bottom surface of the housing 4 by a certain distance.

[0032] The maintenance tool 9 is introduced into the position: the rod chambers of the first cylinder 301 and the second cylinder 302 are inlet, and the rodless chambers are exhausted, and the piston rods of both remain retracted; the first mounting plate 303, the second mounting plate 304, the third mounting plate 305, the vacuum generator fixing ring 308 and the vacuum generator 205 are integrally displaced downward by a distance equal to the sum of the strokes of the first cylinder 301 and the second cylinder 302, and the distance by which the upper end surface of the vacuum generator fixing ring 308 exceeds the bottom surface of the shell 4 is greater than the corresponding distance in the maintenance replacement component state.

[0033] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

[0034] This specification uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A wafer adsorption heating device for APCVD equipment, characterized in that: It comprises a shell, a heater assembly, a vacuum adsorption system and a moving mechanism; the bottom of the shell is open; the vacuum adsorption system comprises a vacuum generator; the moving mechanism comprises a vacuum generator fixing ring and a guide ring; the guide ring is arranged around the vacuum generator fixing ring, and the vacuum generator fixing ring is arranged around the vacuum generator; the heater assembly is arranged at the bottom of the shell and is located above the vacuum generator.

2. The wafer adsorption heating device of the APCVD equipment according to claim 1, characterized in that: The heater assembly includes a heating body, an insulating plate, an upper fixing plate, a lower fixing plate and a thermal insulation material; the insulating plate is arranged on the upper part of the heating body, the lower fixing plate is arranged on the lower part and around the heating body, the upper fixing plate is arranged above the insulating plate and extends to above the lower fixing plate; the thermal insulation material is arranged in a cavity between the upper fixing plate, the lower fixing plate and the shell.

3. The wafer adsorption heating device of the APCVD equipment according to claim 2, characterized in that: The heating body is a resistive heater with a heating range from room temperature to 450°C and a temperature uniformity of ±4°C.

4. The wafer adsorption heating device of the APCVD equipment according to claim 1, characterized in that: The vacuum adsorption system also includes a vacuum pipeline, a spring, an air nozzle and a vacuum pump; the inlet of the vacuum pump is connected to the air nozzle through the vacuum pipeline; the air nozzle is arranged above the heating body in the heater assembly, and the heating body and the middle part of the vacuum generator are correspondingly provided with through air holes, and the air nozzle is located directly above the through air holes; the spring is sleeved on the vacuum pipeline and located above the air nozzle.

5. The wafer adsorption heating device of the APCVD equipment according to claim 1, characterized in that: The motion mechanism also includes a first cylinder, a second cylinder, a first mounting plate, a second mounting plate, a third mounting plate, a fourth mounting plate and a cylinder mounting plate; the fourth mounting plate is located above the shell, and the fourth mounting plate is connected to the top of the shell through a guide shaft, the third mounting plate is located above the shell and above the fourth mounting plate, and the third mounting plate is connected to the top of the shell through a guide shaft; the second mounting plate is arranged above the third mounting plate, and the third mounting plate is connected to the second mounting plate through a guide shaft; the first mounting plate is located above the second mounting plate, and the first mounting plate and the second mounting plate are connected through a support shaft; the cylinder mounting plate is a Z-shaped structure, the cylinder mounting plate is located above the fourth mounting plate, the cylinder body of the first cylinder is connected to the cylinder mounting plate, and the cylinder rod of the first cylinder is connected to the first mounting plate; the cylinder body of the second cylinder is connected to the cylinder mounting plate, and the cylinder rod of the second cylinder is connected to the fourth mounting plate.

6. The wafer adsorption heating device of the APCVD equipment according to claim 5, characterized in that: External springs are arranged between the second mounting plate and the shell, and between the third mounting plate and the shell, and the external springs are used to reset the second mounting plate and the third mounting plate.

7. The wafer adsorption heating device of the APCVD equipment according to claim 1, characterized in that: The vacuum generator and the vacuum generator fixing ring are both made of high-purity SiC or Si or Al2O3 or quartz.

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