Chemical copper deposition device

Abstract

The utility model relates to a chemical copper deposition device, which comprises a rack, the multiple deposition tanks are sequentially installed on the rack in the conveying direction of the coiled materials, and deposition liquid is contained in the deposition tanks; the plurality of guide rollers are arranged in the deposition tank and are staggered at intervals along a coiled material conveying path, at least one guide roller is immersed in the deposition liquid in the deposition tank, and the two ends of each guide roller penetrate through the side wall of the deposition tank and are rotationally mounted on the rack; the circulation mechanism is arranged on the side face of each deposition tank and comprises a plurality of circulation power devices and circulation pipelines, the circulation power devices are connected with the circulation pipelines, and the circulation pipelines are communicated with the interiors of the deposition tanks; and the plurality of auxiliary treatment tanks are mounted on the rack, are sequentially arranged in the arrangement direction of the deposition tanks and are used for carrying out pretreatment and post-treatment on the deposition liquid in the deposition tanks. According to the utility model, the plurality of deposition tanks are arranged, so that the copper deposition work is carried out in multiple steps, the deposition rate of copper is convenient to control, a more uniform copper layer can be obtained, and meanwhile, the circulation mechanism is arranged, so that the flowability of deposition liquid is increased, the deposition liquid is uniformly mixed, the deposition efficiency and the deposition uniformity of the copper layer are improved, and the copper deposition effect and quality are improved; in addition, through the multiple auxiliary treatment tanks matched with the deposition tank, the deposition liquid is pretreated, and the machining efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lithium battery production equipment, in particular to a chemical copper deposition device. Background Art

[0002] Currently, in the production of aluminum batteries, copper foil is usually used as a component of the negative electrode because of its strong conductivity, soft texture, and non-reaction with lithium.

[0003] Chemical copper deposition is a common method for preparing composite copper foil. It is to contact the activated substrate with a chemical solution containing copper ions, and use chemical reactions to reduce the copper ions and deposit them on the surface of the substrate. Existing chemical copper deposition equipment is usually equipped with a deposition tank containing deposition liquid. Through a roller structure, the coil is driven to immerse in the deposition liquid and taken out after a certain period of time to complete the copper deposition work. However, the deposition rate during the copper deposition process is difficult to control, resulting in uneven thickness of the copper layer. Secondly, due to the static deposition liquid in the deposition tank, the components inside it are prone to local over-high or over-low concentrations, affecting the deposition efficiency, and also causing deviations in the deposition thickness of each part of the coil, affecting the uniformity of the copper layer; in addition, the deposition liquid needs to be filtered, stirred and other pre-treatment processes before being loaded into the deposition tank. Such processes are usually carried out on other equipment, so a certain transfer time is required, affecting the processing efficiency. Utility Model Content

[0004] In view of this, the utility model provides a chemical copper deposition device which has high uniformity of copper layer and can improve processing efficiency.

[0005] A chemical copper deposition device comprises: a frame; a plurality of deposition troughs, which are sequentially installed on the frame along the conveying direction of the coil, and the deposition troughs contain deposition liquid; a plurality of guide rollers, which are arranged in the deposition troughs and are staggered along the conveying path of the coil, at least one of the guide rollers is immersed in the deposition liquid in the deposition trough, and both ends of the guide rollers pass through the side walls of the deposition troughs and are rotatably installed on the frame; a circulation mechanism, which is arranged on the side of each of the deposition troughs, and comprises a plurality of circulation power devices and circulation pipelines, the circulation power devices are connected to the circulation pipelines, and the circulation pipelines are connected to the interior of the deposition troughs; a plurality of processing sub-troughs, which are all installed on the frame and sequentially arranged along the arrangement direction of the deposition troughs, and are used for pre-processing and post-processing the deposition liquid in the deposition troughs.

[0006] In the above technical scheme, multiple deposition tanks are independent of each other and are arranged on the frame in sequence according to the conveying direction of the coil. A deposition liquid for chemical copper deposition is placed in each deposition tank. When the deposition work is carried out, the coil is guided by the guide roller and passes through each deposition tank in sequence. At least one guide roller in each deposition tank is immersed in the deposition liquid, so that the coil can be immersed in the deposition liquid in each deposition tank in sequence to complete the copper deposition on the surface of the coil; a circulation power device and a circulation pipeline are provided on the side of each deposition tank, and the deposition liquid in the deposition tank can be pumped into the circulation pipeline by the circulation power device and then re-injected into the deposition tank, so that the deposition liquid forms a circulation flow; the processing sub-tank can filter, stir and other pre-treatment work on the deposition liquid before the deposition liquid is placed in the deposition tank. At the same time, after the copper deposition is completed, the used deposition liquid can also be subjected to corresponding post-treatment work. It should be noted that the deposition tank and the processing sub-tank are connected by a pipeline structure to facilitate the transfer of the deposition liquid.

[0007] Among them, multiple deposition tanks are arranged independently of each other, and the components of the deposition liquid in the deposition tank can be adjusted according to actual needs, so as to form different solution components and reaction conditions in different deposition tanks, so that the copper deposition process is carried out in steps, which is convenient for controlling the deposition rate and deposition thickness of copper, so that copper is deposited layer by layer on the surface of the roll tank, which helps to obtain a copper layer with a more uniform thickness; secondly, through the circulation power device and the circulation pipeline, the deposition liquid in the deposition tank forms a circulation flow, which increases the fluidity, and makes the various components in the deposition liquid evenly mixed, thereby improving the deposition efficiency and the uniformity of the copper layer; in addition, a corresponding processing sub-tank is provided on one side of the deposition tank to perform pre-treatment and post-treatment on the deposition liquid, and there is no need to transfer it to other equipment for treatment, which saves time and improves processing efficiency.

[0008] Therefore, the chemical copper deposition device of the utility model divides the copper deposition work into multiple steps by setting up multiple deposition tanks, which is convenient for controlling the copper deposition rate, so that the copper layer is deposited in steps, and a more uniform copper layer can be obtained, thereby improving the effect and quality of copper deposition; by setting up a circulation mechanism, the fluidity of the deposition liquid is increased, the deposition liquid is mixed evenly, and the deposition efficiency and the uniformity of the copper layer deposition are improved; by setting up a processing sub-tank, the deposition liquid is pre-treated and post-treated, saving transfer time and improving efficiency.

[0009] It should be noted that the deposition liquid in some deposition tanks is mainly used for surface treatment of the coil, so as to activate the surface of the coil and enhance the adhesion effect of copper ions.

[0010] Furthermore, a plurality of columns are spaced apart on both sides of the frame, wherein a first adjustment unit is installed on each column on one side, and a second adjustment unit is installed on each column on the other side, and both ends of the guide roller are rotatably connected to the first adjustment unit and the second adjustment unit respectively.

[0011] In the above technical solution, each guide roller is connected to a first adjustment unit and a second adjustment unit. The first adjustment unit is used to adjust the left and right position of the guide roller in the horizontal direction, and the second adjustment unit is used to adjust the up and down position of the guide roller in the vertical direction. The position of the guide roller can be adjusted through the first adjustment unit and the second adjustment unit to ensure that the coil is transported normally along the path and prevent deviation.

[0012] Furthermore, at least one guide roller is provided above the interval between adjacent deposition troughs.

[0013] In the above technical solution, guide rollers are provided above the intervals between adjacent deposition troughs to provide guidance for the coiled material when the coiled material is transferred between the deposition troughs.

[0014] Furthermore, the first adjustment unit includes a connecting block and a mounting seat, the connecting block is provided with a connecting hole, the end of the guide roller is connected to the connecting block through the connecting hole, the connecting block is slidably mounted on the mounting seat and can slide in a horizontal direction along the mounting seat, and first fasteners for fixing the connecting block are provided on both sides of the mounting seat.

[0015] In the above technical solution, the connecting block can slide left and right along the mounting seat in the horizontal direction, wherein the direction of the connecting block sliding left and right is perpendicular to the central axis direction of the guide roller, and can only slide along this direction, and the first fasteners are provided on both sides of the mounting seat to limit and fix the connecting block.

[0016] Furthermore, the second adjustment unit includes a sliding block and a sliding seat, the sliding block is connected to the end of the guide roller, the sliding block is slidably installed on the sliding seat, and can slide up and down along the sliding seat, and the upper and lower sides of the sliding seat are provided with second fasteners for fixing the sliding block.

[0017] In the above technical solution, the sliding block can only move up and down along the sliding seat, and the upper and lower sides of the sliding seat are provided with second fasteners to limit and fix the sliding block.

[0018] Furthermore, a clamping unit is provided on one side of the guide roller located above the interval of the deposition trough, and the clamping unit includes a pressure roller and a movable rod. The pressure roller abuts against the guide roller, the movable rod is installed on the frame, and both ends of the pressure roller are installed on the movable rod.

[0019] In the above technical scheme, a pressure roller is provided on one side of the guide roller located at the interval of the deposition troughs. Both ends of the pressure roller are rotatably connected to a movable rod. The movable rod is installed on the frame. The pressure roller abuts against the guide roller, so the coil that has just been soaked in the deposition liquid can be pressed in time. The pressure shell applied can make the newly formed copper layer fit more closely to the surface of the coil, and the adhesion effect is better. At the same time, since some liquid remains on the surface of the coil, the coil is prone to slipping. Applying a certain pressure through the pressure roller can reduce the occurrence of slipping.

[0020] Furthermore, baffles are provided on both sides of the sedimentation tank, the baffles are inclined to the side walls of the sedimentation tank, and the sedimentation liquid is contained between the baffles.

[0021] In the above technical solution, the baffle is arranged obliquely to the side wall of the sedimentation trough, and the top of the baffle is connected to the side wall of the sedimentation trough. Through the baffles arranged obliquely on both sides, cavities can be formed on both sides of the sedimentation trough. Under the premise of not affecting the contact between the coil and the sedimentation liquid, the volume of the sedimentation trough can be appropriately reduced, thereby effectively reducing the consumption of the sedimentation liquid and saving costs.

[0022] Furthermore, the circulation power devices are arranged on both side surfaces of the sedimentation tank, and at least two are arranged on each side. The circulation power devices are distributed at intervals, and each of the circulation power devices is connected to at least one circulation pipeline.

[0023] In the above technical solution, at least two circulation power devices are provided on both sides of the sedimentation tank, the circulation power devices are distributed at intervals, and each circulation power device is connected to at least one circulation pipeline. By arranging the circulation power devices and the circulation pipelines at intervals on both sides of the sedimentation tank, the sedimentation liquid can be drawn out from different positions of the sedimentation tank for circulation, avoiding the local concentration of the sedimentation liquid being too high or too low, and making the sedimentation liquid more uniform; wherein, the number of the circulation power devices is mainly set according to the length of the sedimentation tank.

[0024] Furthermore, the processing sub-tank includes a sub-tank body and a processing unit. The sub-tank body is arranged below the sedimentation tank and is used to contain the sedimentation liquid to be processed. The processing unit is arranged on one side of the sub-tank body and includes several filtering devices and a power pump.

[0025] In the above technical solution, a cavity is provided inside the auxiliary tank body for containing the sedimentation liquid. Several filtering devices and a power pump are provided on one side of the auxiliary tank body. The filtering device is used to filter impurities in the sedimentation liquid when it enters and exits the auxiliary tank body. The power pump is used to provide power to send the sedimentation liquid into or out of the auxiliary tank body.

[0026] Furthermore, it also includes a material receiving mechanism, which is arranged on one side of the deposition trough at the front end of the coil conveying path, and the material receiving mechanism includes a traction roller, a drive motor and at least one loading roller, the traction roller is connected to the output end of the drive motor, and the loading roller is arranged on the side of the traction roller close to the deposition trough.

[0027] In the above technical solution, the material receiving mechanism is arranged on one side of the first deposition trough entered on the coil conveying path, the traction roller is used to receive the delivered coil, and the loading roller is located between the traction roller and the deposition trough, and is used to guide the coil and adjust the coil to enter the deposition trough along a suitable path. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional diagram of a chemical copper deposition device according to an embodiment.

[0029] Figure 2 for Figure 1 Enlarged view of position A in the middle.

[0030] Figure 3 for Figure 1 Enlarged view of position B in the middle.

[0031] Figure 4 for Figure 1 Enlarged view of position C in the middle.

[0032] Figure 5 This is a front view of the chemical copper deposition device of the present application.

[0033] Figure 6 for Figure 5 Enlarged view of position D in the middle.

[0034] Figure 7 for Figure 5 Enlarged view of position E in the middle

[0035] Figure 8 Schematic diagram of the internal structure of two adjacent sedimentation tanks.

[0036] Description of reference numerals in the figures:

[0037] 1-frame; 11-column; 2-sedimentation tank; 21-baffle; 22-sealing structure; 3-guide roller; 4-first adjusting unit; 41-connecting block; 42-mounting seat; 43-first fastener; 5-second adjusting unit; 51-sliding block; 52-sliding seat; 53-second fastener; 6-pressing unit; 61-pressing roller; 62-movable rod; 7-circulation mechanism; 71-circulation power device; 72-circulation pipeline; 8-processing sub-tank; 81-sub-tank body; 82-filtering device; 83-power pump; 9-material receiving mechanism; 91-support box; 92-traction roller; 93-drive motor; 94-feeding roller. DETAILED DESCRIPTION

[0038] The following will further describe the chemical copper deposition device of the utility model in combination with specific embodiments and drawings. The drawings are only used for exemplary descriptions, and only show schematic diagrams, not actual drawings, and cannot be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0039] Reference Figures 1 to 8 The present embodiment provides a chemical copper deposition device, comprising: a frame 1; a plurality of deposition tanks 2, which are sequentially installed on the frame 1 along the conveying direction of the coil, and the deposition tanks 2 contain deposition liquid; a plurality of guide rollers 3, which are arranged in the deposition tanks 2 and are staggered along the conveying path of the coil, at least one of the guide rollers 3 is immersed in the deposition liquid in the deposition tank 2, and both ends of the guide rollers 3 pass through the side walls of the deposition tank 2 and are rotatably installed on the frame 1; a circulation mechanism 7, which is arranged on the side of each of the deposition tanks 2, and comprises a plurality of circulation power devices 71 and circulation pipelines 72, wherein the circulation power device 71 is connected to the circulation pipeline 72, and the circulation pipeline 72 is connected to the interior of the deposition tank 2; a plurality of processing sub-tanks 8, which are all installed on the frame 1 and sequentially arranged along the arrangement direction of the deposition tanks 2, and are used for pre-processing and post-processing the deposition liquid in the deposition tank 2.

[0040] In this embodiment, a plurality of deposition tanks 2 are independent of each other and are arranged on the frame 1 in sequence according to the conveying direction of the coil. A deposition liquid for chemical copper deposition is placed in each deposition tank 2. When the deposition is performed, the coil is guided by the guide roller 3 and passes through each deposition tank 2 in sequence. At least one guide roller 3 in each deposition tank 2 is immersed in the deposition liquid, so that the coil can be immersed in the deposition liquid in each deposition tank 2 in sequence to complete the copper deposition on the surface of the coil. A circulating power device 71 and a circulating power device 72 are provided on the side of each deposition tank 2. The pipeline 72 can pump the sedimentation liquid in the sedimentation tank 2 to the circulation pipeline 72 through the circulation power device 71 and then re-inject it into the sedimentation tank 2, so that the sedimentation liquid forms a circulation flow; the processing sub-tank 8 can filter, stir and other pre-treatment work on the sedimentation liquid before the sedimentation liquid is placed in the sedimentation tank 2. At the same time, after the copper deposition is completed, the used sedimentation liquid can also be subjected to corresponding post-treatment work. It should be noted that the sedimentation tank 2 and the processing sub-tank 8 are connected by a pipeline structure (not shown in the figure), which facilitates the transfer of the sedimentation liquid between the sedimentation tank 2 and the processing sub-tank 8.

[0041] Among them, multiple deposition tanks 2 are independently arranged, and the components of the deposition liquid in the deposition tank 2 can be adjusted according to actual needs, so that different solution components and reaction conditions are formed in different deposition tanks 2, so that the copper deposition process is carried out in steps, which is convenient for controlling the deposition rate and deposition thickness of copper, so that copper is evenly attached layer by layer on the surface of the coil, which helps to obtain a more uniform copper layer; secondly, through the circulation power device 71 and the circulation pipeline 72, the deposition liquid in the deposition tank 2 forms a circulation flow, which increases the fluidity, makes the various components in the deposition liquid evenly mixed, and improves the deposition efficiency; in addition, a corresponding processing sub-tank 8 is provided on one side of the deposition tank 2 to perform pre-treatment and post-treatment on the deposition liquid, and there is no need to transfer it to other equipment for processing, which saves time and improves processing efficiency.

[0042] Therefore, the chemical copper deposition device of the utility model divides the copper deposition work into multiple steps by setting up multiple deposition tanks 2, which is convenient for controlling the copper deposition rate and making copper deposited in steps, so as to obtain a more uniform copper layer and improve the effect and quality of copper deposition; by setting up a circulation mechanism 7, the fluidity of the deposition liquid is increased, the deposition liquid is mixed evenly, and the deposition efficiency and the uniformity of the copper layer deposition are improved; by setting up a processing sub-tank 8, the deposition liquid is pre-treated and post-treated, which saves transfer time and improves efficiency.

[0043] It should be noted that the deposition liquid in the partial deposition tank 2 is mainly used for surface treatment of the coil, so as to activate the surface of the coil and enhance the adhesion effect of copper ions.

[0044] It should be noted that the number of guide rollers 3 can be set according to processing requirements such as the running speed of the coil and the soaking time, and accordingly, the length of each deposition trough 2 can also be set according to the processing requirements of the section.

[0045] Please refer to Figure 2 , Figure 3 , Figure 6 and Figure 7 In this embodiment, a plurality of columns 11 are spaced apart on both sides of the frame 1, wherein a first adjusting unit 4 is installed on each of the columns 11 on one side, and a second adjusting unit 5 is installed on each of the columns 11 on the other side, and both ends of the guide roller 3 are rotatably connected to the first adjusting unit 4 and the second adjusting unit 5 respectively.

[0046] Each guide roller 3 is connected to a first adjustment unit 4 and a second adjustment unit 5. The first adjustment unit 4 is used to adjust the left and right position of the guide roller 3 in the horizontal direction, and the second adjustment unit 5 is used to adjust the up and down position of the guide roller 3 in the vertical direction. The position of the guide roller 3 can be adjusted by the first adjustment unit 4 and the second adjustment unit 5 to ensure that the coil is normally transported along the path to prevent deviation. Specifically, the left and right referred to in this embodiment are perpendicular to the central axis of the guide roller 3 and are located in the horizontal direction. For details, please refer to Figure 6 The left and right direction in .

[0047] Please refer to Figures 6 to 8 In this embodiment, a guide roller 3 is provided above the interval between the adjacent deposition slots 2, and the guide roller 3 is used to provide guidance for the coil when the coil is transferred between the deposition slots 2; it is not limited that a plurality of guide rollers 3 may be provided between the adjacent deposition slots 2, and the number is determined according to actual needs.

[0048] Please refer to Figure 2 , Figure 6 and Figure 7 In this embodiment, the first adjusting unit 4 includes a connecting block 41 and a mounting seat 42. The connecting block 41 has a connecting hole, and the end of the guide roller 3 is connected to the connecting block 41 through the connecting hole. The connecting block 41 is slidably mounted on the mounting seat 42 and can slide in the horizontal direction along the mounting seat 42. Both sides of the mounting seat 42 are provided with first fasteners 43 for fixing the connecting block 41; preferably, a bearing member is provided in the connecting hole, and the end of the guide roller 3 passes through the center hole of the bearing member and is rotatably connected to the connecting hole through the bearing member. The bearing member can reduce friction and alleviate wear between components, and at the same time, it can also make the rotation of the guide roller 3 more stable.

[0049] The connecting block 41 slides left and right in a direction perpendicular to the central axis of the guide roller 3 and can only slide in this direction. The first fasteners 43 are provided on both sides of the mounting seat 42 to limit and fix the connecting block 41.

[0050] Specifically, the first fastener 43 is a bolt, and vertical plates are provided on the left and right sides of the mounting seat 42. The first fastener 43 is vertically penetrated through the vertical plates and is threadedly connected to the vertical plates. The first fastener 43 can be adjusted to abut against the connecting block 41, thereby clamping the connecting block 41, and the connecting block 41 can also be loosened by adjustment.

[0051] Please refer to Figure 3 , Figure 6 and Figure 7In this embodiment, the second adjustment unit 5 includes a sliding block 51 and a sliding seat 52. The sliding block 51 is connected to the end of the guide roller 3. The sliding block 51 is slidably installed on the sliding seat 52 and can slide up and down along the sliding seat 52. The upper and lower sides of the sliding seat 52 are provided with second fasteners 53 for fixing the sliding block 51.

[0052] Among them, the sliding block 51 can only move up and down along the sliding seat 52. Second fasteners 53 are provided on the upper and lower sides of the sliding seat 52 to limit and fix the sliding block 51. The second fasteners 53 are bolts. Vertical plates are provided on the upper and lower sides of the sliding seat 52. The second fasteners 53 are vertically penetrated through the vertical plates and are threadedly connected with the vertical plates. By adjusting the second fasteners 53, the second fasteners 53 can be abutted against the sliding block 51, thereby clamping the sliding block 51, and the sliding block 51 can also be loosened by adjustment.

[0053] Specifically, the connection relationship between the sliding block 51 and the sliding seat 52 is as follows: Figure 3 As shown in the example, a protruding bump is provided on the sliding seat 52, and a groove matching the bump is provided on the sliding block 51. Through the cooperation between the bump and the groove, the sliding block 51 can only slide up and down along the sliding seat 52. In addition to the above-mentioned connection method, other connection methods can also be used, as long as the sliding block 51 can only slide in the up and down directions.

[0054] Reference Figure 6 and Figure 8 In this embodiment, a clamping unit 6 is provided on one side of the guide roller 3 located above the interval of the deposition trough 2, and the clamping unit 6 includes a pressure roller 61 and a movable rod 62. The pressure roller 61 abuts against the guide roller 3, and the movable rod 62 is installed on the frame 1. Both ends of the pressure roller 61 are installed on the movable rod 62.

[0055] A pressure roller 61 is provided on one side of the guide roller 3 located at the interval of the deposition trough 2. Both ends of the pressure roller 61 are rotatably connected to a movable rod 62. The movable rod 62 is installed on the frame 1. The pressure roller 61 abuts against the guide roller 3, and the coil that has just been soaked in the deposition liquid can be pressed in time. The pressure shell applied can make the newly formed copper layer fit more closely to the surface of the coil, and the adhesion effect is better. At the same time, since some liquid remains on the surface of the coil, the coil is prone to slipping. Applying a certain pressure through the pressure roller 61 can reduce the occurrence of slipping.

[0056] Specifically, in this embodiment, Figure 6 and Figure 7As shown, the movable rod 62 includes a cross bar that can slide up and down, and the end of the pressure roller 61 is placed on the cross bar. The height of the pressure roller 61 can be adjusted by sliding the cross bar so that the pressure roller 61 abuts against the guide roller 3, which is convenient for installing pressure rollers 61 of different sizes.

[0057] Reference Figure 8 In this embodiment, baffles 21 are provided on both sides of the sedimentation tank 2 , and the baffles 21 are inclined to the side walls of the sedimentation tank 2 , and the sedimentation liquid is contained between the baffles 21 .

[0058] In this embodiment, the baffle 21 is arranged obliquely to the side wall of the sedimentation tank 2, and the top of the baffle 21 is connected to the side wall of the sedimentation tank 2. Through the baffles 21 arranged obliquely on both sides, cavities can be formed on both sides of the sedimentation tank 2. Under the premise of not affecting the contact between the coil and the sedimentation liquid, the volume of the sedimentation tank 2 can be appropriately reduced, thereby effectively reducing the consumption of the sedimentation liquid and saving costs.

[0059] It should be noted that, refer to Figure 8 As shown, in this embodiment, in order to facilitate the installation of the guide roller 3, baffles 21 are arranged on the two side walls perpendicular to the end faces of the guide roller 3 in the sedimentation trough 2, and no baffles 21 are arranged on the two side walls parallel to the end faces of the guide roller 3, which are used to make way for the guide roller 3 and facilitate the installation of the guide roller 3; wherein, both ends of the guide roller 3 located inside the sedimentation trough 2 pass through the side walls of the sedimentation trough 2, and a sealing structure 22 is arranged at the penetration point to prevent liquid leakage.

[0060] Reference Figure 6 In this embodiment, the circulation power device 71 is arranged on both side surfaces of the sedimentation tank 2, and two are arranged on each side. The two circulation power devices 71 are spaced apart, and each of the circulation power devices 71 is connected to a circulation pipeline 72. Two circulation power devices 71 are arranged on both sides of the sedimentation tank 2, and the two circulation power devices 71 are spaced apart on the left and right sides of the side of the sedimentation tank 2, and each of the circulation power devices 71 is connected to a circulation pipeline 72. By arranging the circulation power devices 71 and the circulation pipeline 72 at intervals, the sedimentation liquid can be drawn out from different positions of the sedimentation tank 2 for circulation, so as to avoid the local concentration of the sedimentation liquid being too high or too low, and make the sedimentation liquid more uniform.

[0061] Reference Figure 7In another embodiment, three circulation power devices 71 are arranged on both side surfaces of the sedimentation tank 2 at intervals, wherein the circulation power devices 71 on both sides are connected to a circulation pipeline 72, and the circulation power device 71 in the middle is provided with two circulation pipelines 72, and the two circulation pipelines 72 are respectively connected to the circulation pipelines 72 on both sides. During specific operation, the circulation power device 71 in the middle can extract the sedimentation liquid and send it to the circulation pipelines 72 on both sides through the two connected circulation pipelines 72, and the circulation power devices 71 and circulation pipelines 72 on both sides normally extract the sedimentation liquid and send it back to the sedimentation tank 2. By setting in this way, the mixing effect of the sedimentation liquid at each position in the sedimentation tank 2 can be enhanced, the formation of local concentration gradients can be effectively prevented, and the sedimentation liquid can be made more uniform.

[0062] Reference Figure 1 and Figure 5 In this embodiment, the processing sub-tank 8 includes a sub-tank body 81 and a processing unit. The sub-tank body 81 is arranged below the sedimentation tank 2 and is used to hold the sedimentation liquid to be treated. The processing unit is arranged on one side of the sub-tank body 81. The processing unit includes a plurality of filtering devices 82 and a power pump 83.

[0063] A cavity is provided inside the auxiliary tank body 81 for containing the sedimentation liquid. Several filtering devices 82 and a power pump 83 are provided on one side of the auxiliary tank body 81. The filtering device 82 is used to filter impurities in the sedimentation liquid when it enters and exits the auxiliary tank body 81. The power pump 83 is used to provide power to send the sedimentation liquid into or out of the auxiliary tank body 81.

[0064] It should be noted that the processing sub-tank 8 and the sedimentation tank 2 are not arranged one-to-one. According to the components of the sedimentation liquid in the sedimentation tank 2, there is a situation where one processing sub-tank 8 corresponds to multiple sedimentation tanks 2, such as Figure 1 and Figure 5 As shown in , it is set according to actual needs during specific implementation; at the same time, the number of filtering devices 82 and power pumps 83 is also allocated and set according to actual needs.

[0065] Reference Figure 1 , Figure 4 and Figure 5In this embodiment, a material receiving mechanism 9 is provided on one side of the first deposition trough 2 on the coil conveying path, and the material receiving mechanism 9 includes a supporting box 91, a traction roller 92, a driving motor 93 and two loading rollers 94, the traction roller 92 and the loading roller 94 are both provided on the supporting box 91, the output end of the driving motor 93 is connected to the end of the traction roller 92, and the two loading rollers 94 are spaced apart on the side of the traction roller 92 close to the deposition trough 2, the traction roller 92 is used to receive the delivered coil, and the loading roller 94 is located between the traction roller 92 and the deposition trough 2, and is used to guide the coil and adjust the coil to enter the deposition trough 2 along a suitable path, wherein, specifically, an additional guide roller 3 is provided between the material receiving mechanism 9 and the first deposition trough 2, and is used to guide the coil into the deposition trough 2, and correspondingly, an additional guide roller 3 is also provided on one side of the last deposition trough 2, and is used to guide the finished coil that has completed copper deposition to the winding position.

[0066] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0067] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A chemical copper deposition device, characterized in that: include: frame; A plurality of deposition tanks are sequentially installed on the frame along the conveying direction of the coil, and the deposition tanks contain deposition liquid; A plurality of guide rollers are arranged in the deposition tank and staggered along the web conveying path, at least one of the guide rollers is immersed in the deposition liquid in the deposition tank, and both ends of the guide rollers pass through the side walls of the deposition tank and are rotatably mounted on the frame; A circulation mechanism is arranged on the side of each of the sedimentation tanks, and includes a plurality of circulation power devices and circulation pipelines, wherein the circulation power devices are connected to the circulation pipelines, and the circulation pipelines are connected to the interior of the sedimentation tanks; A plurality of processing sub-tanks are installed on the frame and are arranged in sequence along the arrangement direction of the sedimentation tanks, and are used for pre-processing and post-processing the sedimentation liquid in the sedimentation tanks.

2. The chemical copper deposition device according to claim 1, characterized in that: A plurality of columns are arranged at intervals on both sides of the frame, wherein a first adjustment unit is installed on each column on one side, and a second adjustment unit is installed on each column on the other side, and both ends of the guide roller are rotatably connected to the first adjustment unit and the second adjustment unit respectively.

3. The chemical copper deposition device according to claim 2, characterized in that: At least one guide roller is arranged above the interval between adjacent deposition troughs.

4. The chemical copper deposition device according to claim 3, characterized in that: The first adjustment unit includes a connecting block and a mounting seat, the connecting block is provided with a connecting hole, the end of the guide roller is connected to the connecting block through the connecting hole, the connecting block is slidably mounted on the mounting seat and can slide in a horizontal direction along the mounting seat, and first fasteners for fixing the connecting block are provided on both sides of the mounting seat.

5. The chemical copper deposition device according to claim 3, characterized in that: The second adjustment unit includes a sliding block and a sliding seat. The sliding block is connected to the end of the guide roller. The sliding block is slidably installed on the sliding seat and can slide up and down along the sliding seat. Second fasteners for fixing the sliding block are provided on the upper and lower sides of the sliding seat.

6. The chemical copper deposition device according to claim 3, characterized in that: A clamping unit is provided on one side of the guide roller located above the interval of the deposition trough. The clamping unit includes a pressure roller and a movable rod. The pressure roller abuts against the guide roller. The movable rod is installed on the frame. Both ends of the pressure roller are installed on the movable rod.

7. The chemical copper deposition device according to claim 1, characterized in that: Baffles are arranged on both sides of the sedimentation tank, the baffles are inclined to the side walls of the sedimentation tank, and the sedimentation liquid is contained between the baffles.

8. The chemical copper deposition device according to claim 1, characterized in that: The circulating power devices are arranged on both side surfaces of the sedimentation tank, and at least two are arranged on each side. The circulating power devices are distributed at intervals, and each of the circulating power devices is connected to at least one circulating pipeline.

9. The chemical copper deposition device according to claim 1, characterized in that: The processing auxiliary tank includes an auxiliary tank body and a processing unit. The auxiliary tank body is arranged below the sedimentation tank and is used to contain the sedimentation liquid to be processed. The processing unit is arranged on one side of the auxiliary tank body and includes several filtering devices and a power pump.

10. The chemical copper deposition device according to claim 1, characterized in that: It also includes a material receiving mechanism, which is arranged on one side of the deposition trough at the front end of the coil conveying path. The material receiving mechanism includes a traction roller, a drive motor and at least one loading roller. The traction roller is connected to the output end of the drive motor, and the loading roller is arranged on one side of the traction roller close to the deposition trough.

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