Heat insulation device and laser annealing equipment
By designing the insulation device with internal hovering, the problem of uneven hot and cold distribution of thermal insulation devices in the existing technologies is solved, and the uniform heating of the workpiece table and the uniformity of the surface temperature of the silicon wafer surface, which improves the uniformity of annealing. Essence
Patent Information
- Application Number
- CN202420274868.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-02-04
AI Technical Summary
In existing laser annealing equipment, the insulation device cannot use metal materials with strong thermal conductivity, resulting in uneven heat distribution of the heat insulation device, affecting the uniform heating of the workpiece table, and thus affecting the uniformity of the surface temperature of the silicon wafer.
Design a kind of heat insulation device, the main plate -shaped main body has the internal runner, the inlet and outlet port, and the internal runways circulate along the two opposite direction. sex.
Through the design of the thermal insulation device, the uniformity of the hot and cold distribution is achieved, reducing the impact of the heating uniformity of the workpiece, the uniformity of the surface temperature of the silicon wafer, thereby improving the uniformity of the annealing.
Smart Images
Figure CN222411997U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a heat insulation device and laser annealing equipment. Background Art
[0002] In laser annealing equipment, a heat insulation device is usually added to isolate the workpiece stage from the optical elements above to prevent the optical elements from being damaged due to the increase in the workpiece stage heating temperature. However, due to the particle contamination requirements of the annealing equipment, the heat insulation device cannot use metal materials such as Al and Cu with strong thermal conductivity. If stainless steel is used, the heat insulation device itself will have uneven hot and cold distribution due to its poor thermal conductivity, which will affect the uniformity of the surface temperature of the silicon wafer uniformly heated by the workpiece stage, thereby affecting the annealing uniformity. Utility Model Content
[0003] The purpose of the utility model is to provide a heat insulation device and a laser annealing device to solve one or more problems existing in the prior art.
[0004] In order to solve the above technical problems, the utility model provides a heat insulation device, comprising: a plate-shaped main body;
[0005] The plate-shaped body has an internal flow channel, a liquid inlet and a liquid outlet, the liquid inlet is communicated with the inlet of the internal flow channel, and the liquid outlet is communicated with the outlet of the internal flow channel;
[0006] In the cross-sectional direction of the plate-like body, the internal flow channel spirals successively along the first spiral direction and the second spiral direction opposite to the first spiral direction, so that the multi-circle flow channel branches of the internal flow channel in the first spiral direction and the multi-circle flow channel branches in the second spiral direction are arranged alternately.
[0007] Optionally, in the thermal insulation device, the flow channel branches of the internal flow channel in the first spiral direction and the flow channel branches in the second spiral direction alternate at least three times, and the residence time of the liquid in the internal flow channel is more than 0.5 s.
[0008] Optionally, in the thermal insulation device, the internal flow channel starts from the liquid inlet, and after winding at least twice along the first winding direction, it winds along the second winding direction until it reaches the liquid outlet, and each circle of flow channel branches winding along the second winding direction is located between two adjacent circles of flow channel branches winding along the first winding direction, so that the two circles of flow channel branches with the largest temperature difference in the internal flow channel are adjacent.
[0009] Optionally, in the thermal insulation device, an optically transparent component is provided; the plate-like body is provided with corresponding openings at the top and bottom in the same height direction, and the optically transparent component seals the openings at the top and bottom of the plate-like body so that the plate-like body has a sealed inner cavity and can transmit light along its height direction.
[0010] Optionally, in the thermal insulation device, the plate-like main body includes two connectable plate-like structures, and each of the plate-like structures has an internal flow channel, the liquid inlet and the liquid outlet.
[0011] Optionally, in the thermal insulation device, the liquid inlets and the liquid outlets of the two plate-like structures are respectively arranged close to each other.
[0012] Optionally, in the thermal insulation device, the bottom wall of the plate-like body has an air layer.
[0013] Optionally, in the thermal insulation device, the inner surface of the top wall of the air interlayer is a high reflectivity surface.
[0014] Optionally, in the heat insulation device, the heat insulation device also includes a heat insulation board, and the heat insulation board is arranged around the plate-like body.
[0015] The utility model also provides a laser annealing device, comprising: an optical element, a workpiece stage and a heat insulation device as described in any of the preceding items, wherein the heat insulation device is arranged between the optical element and the workpiece stage.
[0016] Optionally, in the laser annealing equipment, the heat insulation device includes an optical transmission component arranged on the plate-like body, the optical transmission component enables the light of the optical element to pass through the plate-like body along the height direction of the plate-like body, and the material of the optical transmission component is selected according to the characteristics of the optical element.
[0017] Optionally, in the laser annealing equipment, the distance between the heat insulation device and the workpiece table ranges from 10 to 40 mm.
[0018] In summary, in the thermal insulation device and laser annealing equipment provided by the utility model, the thermal insulation device comprises: a plate-like body; the plate-like body has an internal flow channel, a liquid inlet and a liquid outlet, the liquid inlet is connected to the inlet of the internal flow channel, and the liquid outlet is connected to the outlet of the internal flow channel; in the cross-sectional direction of the plate-like body, the internal flow channel successively spirals along a first spiral direction and a second spiral direction opposite to the first spiral direction, so that the multi-circle flow channel branches of the internal flow channel in the first spiral direction and the multi-circle flow channel branches in the second spiral direction are arranged alternately. When the thermal insulation device provided by the utility model is used for thermal insulation, the thermal insulation device has a uniform distribution of cold and heat, which reduces the influence of the workpiece table caused by the thermal insulation device on the heating uniformity of the silicon wafer, improves the surface temperature uniformity of the silicon wafer, and thus improves the annealing uniformity. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A schematic diagram of the structure of a laser annealing device provided in an embodiment of the utility model;
[0020] Figure 2 A schematic diagram of the top view of the heat insulation device provided in an embodiment of the utility model;
[0021] Figure 3 A schematic diagram of the internal flow channel arrangement of the heat insulation device provided in an embodiment of the utility model;
[0022] Figure 4 A schematic diagram of the longitudinal cross-sectional structure of the heat insulation device provided in an embodiment of the utility model;
[0023] Figure 5 A schematic diagram of the three-dimensional structure of the heat insulation device provided in an embodiment of the utility model;
[0024] Figure 6 A temperature distribution simulation diagram of the heat insulation device provided by the embodiment of the utility model;
[0025] The descriptions of the reference numerals are as follows:
[0026] 10-heat insulation device; 20-workpiece table; 30-optical element;
[0027] 101- plate-shaped body; 102- liquid inlet; 103- liquid outlet; 104- optical transmission component; 105- air interlayer; 106- heat insulation board;
[0028] a-transition section; b-high reflectivity surface. DETAILED DESCRIPTION
[0029] In order to make the purpose, advantages and features of the utility model clearer, the utility model is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different proportions are used. It should also be understood that, unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are only used to distinguish between the various components, elements, steps, etc. in the specification, and are not used to represent the logical relationship or sequential relationship between the various components, elements, steps, etc.
[0030] See also Figure 1 The embodiment of the utility model provides a heat insulation device 10, which is used to be arranged between the optical element 30 and the workpiece stage 20 to prevent the optical element 30 from being damaged due to the increase in temperature when the workpiece stage 20 is heated.
[0031] See also Figures 2 to 4 The heat insulation device 10 includes a plate-shaped body 101, and the plate-shaped body 101 has an internal flow channel, a liquid inlet 102 and a liquid outlet 103. The liquid inlet 102 is connected to the entrance of the internal flow channel, and the liquid outlet 103 is connected to the outlet of the internal flow channel; in the cross-sectional direction of the plate-shaped body 101, the internal flow channel successively spirals along a first spiral direction and a second spiral direction opposite to the first spiral direction, so that the multi-circle flow channel branches of the internal flow channel in the first spiral direction and the multi-circle flow channel branches in the second spiral direction are alternately arranged.
[0032] Understandably, Figure 3 The direction indicated by the middle arrow is the liquid flow direction of the current flow channel branch, and is also the spiral direction of the current flow channel branch. The direction in which the flow channel branches in the first spiral direction and the flow channel branches in the second spiral direction are alternately arranged is a direction perpendicular to the spiral direction of the flow channel branches. In addition, it can be understood that in order to facilitate the connection with the liquid inlet 102 and / or the liquid outlet 103, the internal flow channel extends a transition section a along a certain direction, and then along the first spiral direction, and / or, the internal flow channel extends a transition section a along a certain direction after completing the spiral in the second spiral direction. Therefore, the flow channel branch of the internal flow channel described in the present application may not include the transition section a that is extended to facilitate the connection with the liquid inlet 102 and / or the liquid outlet 103. The transition section a is preferably arranged parallel to the connecting edge of the plate-like body 101 close to it.
[0033] The heat insulation device 10 provided in the embodiment of the utility model, after the cold liquid is introduced into the internal flow channel through the liquid inlet 102, the temperature of the liquid in the internal flow channel gradually increases from the inlet to the outlet along the direction of the flow channel extension due to the heating of the workpiece table 20. Therefore, the liquid inlet 102 introduces cold liquid (for example, cooling water, or other liquids), and the liquid outlet 103 discharges hot liquid. By spirally extending the internal flow channel in two opposite spiral directions, and arranging multiple turns of flow channel branches in two directions alternately, the liquid in the internal flow channel is alternately distributed between cold and warm, so that when the heat insulation device 10 provided in the embodiment of the utility model is used for heat insulation, the heat insulation device 10 has a uniform distribution of cold and hot, reducing the influence of the workpiece table 20 on the heating uniformity of the silicon wafer caused by the heat insulation device 10, improving the uniformity of the surface temperature of the silicon wafer, and thus improving the annealing uniformity.
[0034] Preferably, the flow channel branches in the first spiral direction of the internal flow channel alternate with the flow channel branches in the second spiral direction at least three times, and the residence time of the liquid in the internal flow channel is more than 0.5 s to ensure uniformity of temperature distribution.
[0035] See also Figure 2 and Figure 3 The specific spiraling method of the internal flow channel can be: starting from the liquid inlet 102, after spiraling at least twice along the first spiraling direction, spiraling along the second spiraling direction until reaching the outlet, and each circle of flow channel branches along the second spiraling direction is located between two adjacent circles of flow channel branches spiraled along the first spiraling direction, so as to make the two circles of flow channel branches with the largest temperature difference in the internal flow channel adjacent to each other as much as possible, so as to ensure that the temperature difference treatment level of the plate-like body 101 itself is relatively low.
[0036] Better, such as Figure 2 As shown, the heat insulation device also includes an optical transmission component 104. The plate-like body 101 is provided with corresponding openings at the top and bottom in the same height direction. The optical transmission component 104 seals the openings at the top and bottom of the plate-like body 101, so that the plate-like body 101 has a sealed inner cavity and can transmit light along its height direction. The optical transmission component 104 is arranged according to the position and number of the optical element 30, as shown below. The optical transmission component 104 allows the light of the optical element 30 to pass through the heat insulation device 10 to complete its original function, and also isolates the hot air from the optical element 30. It also has a certain effect of reducing radiation heat transfer, so that heat cannot be directly transferred from the opening to the optical element 30. The material selection of the optical transmission component 104 should be selected according to the characteristics of the optical element 30, for example, it should allow the light wavelength of the optical element 30 to pass through, and block the transmission of far infrared, etc.
[0037] Better, such as Figure 4 As shown, the plate-like body 101 can be thickened so that an air layer 105 can be provided at its bottom. Further preferably, the inner surface of the top wall of the air layer 105 is a high reflectivity surface b. The design of the air layer 105 increases the thermal resistance between the heat source (for heating the workpiece table 20) and the heat insulation device 10, and greatly reduces heat radiation.
[0038] In addition, better Figure 5 As shown, the heat insulation device 10 further includes a heat insulation board 106, and the heat insulation board 106 is arranged around the plate-shaped body 101. The heat insulation board 106 blocks the heat radiation of the heat source and protects the components above the plate-shaped body 101 to a certain extent.
[0039] like Figure 1 As shown, an embodiment of the utility model further provides a laser annealing device, which includes: an optical element 30, a workpiece stage 20 and a heat insulation device 10 as described in this embodiment, wherein the heat insulation device 10 is arranged between the optical element 30 and the workpiece stage 20.
[0040] As mentioned above, the optical transmission component 104 enables the light of the optical element 30 to pass through the plate-like body 101 along the height direction of the plate-like body 101, and the material of the optical transmission component 104 is selected according to the characteristics of the optical element 30. The optical transmission component 104 should be correspondingly arranged in the light path direction of the optical element 30. If the number of the optical elements 30 is 2, the plate-like body 101 should be provided with two optical transmission components 104, which are respectively arranged in the light path directions of the two optical elements 30. Each optical transmission component 104 includes two optical transmission parts, and the two optical transmission parts are respectively arranged at the top and bottom of the plate-like body 101 along the same height direction of the plate-like body 101.
[0041] Preferably, the gap between the heat insulation device 10 and the workpiece stage 20 is small, which plays a role of heat preservation to a certain extent, reduces the power of the heat source, increases the air temperature inside the gap, and further homogenizes the uniformity of the heat source. Specifically, the distance between the heat insulation device 10 and the workpiece stage 20 can be set to a range of 10 to 40 mm.
[0042] The working principle of the thermal insulation device 10 is as follows: cooling water enters from the liquid inlet 102 and passes through the internal flow channel so that the thermal insulation device 10 maintains a relatively low temperature, and can cool the surrounding air, especially the environment where the optical element 30 above is located. Since the thermal insulation device 10 is designed to alternate between cold and warm, its surface temperature is relatively uniform, which largely avoids the impact of large temperature differences on high-temperature heat sources and ensures the core indicators of the product. The thermal insulation device 10 is put into operation by cooling water after the whole machine is powered on, and provides thermal insulation and cooling functions before and after exposure. Figure 6 As shown, under simulation conditions, the water inlet flow rate is 1.5L / min, the extreme temperature difference of the heat source surface is 13°C, which is very small compared with the natural convection condition of the heat source, and the overall temperature of the heat source is increased by about 5%. The temperature of the optical element 30 above the insulation device 10 is all below 50°C, meeting the working environment requirements.
[0043] Please see further Figure 5 In order to facilitate the installation of the thermal insulation device 10, preferably, the plate-like body 101 includes two connectable plate-like structures, each of which has an internal flow channel, the liquid inlet 102 and the liquid outlet 103. After the two plate-like structures are spliced and formed, they have an installation channel to facilitate the installation of the thermal insulation device 10 around other devices. In some other applications, the plate-like body 101 may also have other installation methods, or the plate-like body 101 includes more than two connectable plate-like structures, which will not be described in detail here.
[0044] Further preferably, the liquid inlets 102 of the two plate-like structures are arranged close to each other, and the liquid outlets 103 of the two plate-like structures are also arranged close to each other, so that it is convenient to simultaneously introduce cold liquid and recover hot liquid.
[0045] In summary, the thermal insulation device and laser annealing equipment provided by the utility model, the thermal insulation device comprises: a plate-like body; the plate-like body has an internal flow channel, a liquid inlet and a liquid outlet, the liquid inlet is connected to the inlet of the internal flow channel, and the liquid outlet is connected to the outlet of the internal flow channel; in the cross-sectional direction of the plate-like body, the internal flow channel successively spirals along a first spiral direction and a second spiral direction opposite to the first spiral direction, so that the multi-circle flow channel branches of the internal flow channel in the first spiral direction and the multi-circle flow channel branches in the second spiral direction are arranged alternately. When the thermal insulation device provided by the utility model is used for thermal insulation, the thermal insulation device has a uniform distribution of cold and heat, which reduces the influence of the workpiece table caused by the thermal insulation device on the heating uniformity of the silicon wafer, improves the surface temperature uniformity of the silicon wafer, and thus improves the annealing uniformity.
[0046] In addition, it should be recognized that although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.
Claims
1. A heat insulation device, characterized in that: include: plate-like body; The plate-shaped body has an internal flow channel, a liquid inlet and a liquid outlet, the liquid inlet is communicated with the inlet of the internal flow channel, and the liquid outlet is communicated with the outlet of the internal flow channel; In the cross-sectional direction of the plate-like body, the internal flow channel spirals successively along a first spiral direction and a second spiral direction opposite to the first spiral direction, so that the multi-circle flow channel branches of the internal flow channel in the first spiral direction and the multi-circle flow channel branches in the second spiral direction are arranged alternately.
2. The heat insulation device according to claim 1, characterized in that The flow channel branches of the internal flow channel in the first spiral direction and the flow channel branches in the second spiral direction are alternated at least three times, and the residence time of the liquid in the internal flow channel is more than 0.5 s.
3. The heat insulation device according to claim 1, characterized in that The internal flow channel takes the liquid inlet as a starting point, and after winding at least twice along the first spiral direction, it spirals along the second spiral direction until it reaches the liquid outlet, and each circle of flow channel branches spiraling along the second spiral direction is located between two adjacent circles of flow channel branches spiraling along the first spiral direction, so that the two circles of flow channel branches with the largest temperature difference in the internal flow channel are adjacent.
4. The heat insulation device according to claim 1, characterized in that Also includes: Optical transmission component; the plate-like body is provided with corresponding openings at the top and bottom in the same height direction, and the optical transmission component seals the openings at the top and bottom of the plate-like body so that the plate-like body has a sealed inner cavity and can transmit light along its height direction.
5. The heat insulation device according to claim 1, characterized in that The plate-like body comprises two connectable plate-like structures, each of which has an internal flow channel, a liquid inlet and a liquid outlet.
6. The heat insulation device according to claim 5, characterized in that The liquid inlets and the liquid outlets of the two plate-like structures are respectively arranged close to each other.
7. The thermal insulation device according to claim 1, characterized in that The bottom of the plate-shaped body has an air layer.
8. The heat insulation device according to claim 7, characterized in that The inner surface of the top wall of the air sandwich is a high reflectivity surface.
9. The heat insulation device according to claim 1, characterized in that: The heat insulation device further comprises a heat insulation plate, and the heat insulation plate is arranged around the plate-shaped body.
10. A laser annealing device, characterized in that: include: An optical element, a workpiece stage, and a heat insulating device as claimed in any one of claims 1 to 9, wherein the heat insulating device is arranged between the optical element and the workpiece stage.
11. The laser annealing equipment according to claim 10, characterized in that: The heat insulation device further includes an optical transmission component disposed on the plate-like body, and the optical transmission component enables the light of the optical element to pass through the plate-like body along a height direction of the plate-like body.
12. The laser annealing equipment according to claim 10, characterized in that: The distance between the heat insulation device and the workpiece platform ranges from 10 to 40 mm.