Base material bonding tool

Abstract

The utility model discloses a base material bonding tool which comprises an upper base plate, a lower base plate and a gasket, the gasket is located between the upper base plate and the lower base plate, the upper base plate is used for placing an upper base material, the lower base plate is used for placing a lower base material, the upper base plate is provided with a guide hole, the lower base plate is provided with a guide column corresponding to the guide hole, and the guide column is connected with the gasket. According to the utility model, the upper substrate is fixed on the upper substrate through the fixing screws and the fixing blocks, and the upper substrate and the lower substrate are closed through the guide pillars to ensure that the central points of the upper substrate and the lower substrate are consistent, so that the consistency of the central points of the upper substrate and the lower substrate is ensured. The upper substrate is provided with the plurality of upper positioning grooves for fixing the upper base material, and the lower substrate is provided with the plurality of lower positioning grooves for fixing the lower base material, so that the bonding operation of a plurality of samples can be realized, the working efficiency is improved, and the required bonding glue thickness is controlled through the gaskets with different thicknesses.

Description

Technical Field

[0001] The utility model relates to the field of substrate processing, in particular to a substrate bonding tool. Background Art

[0002] In view of the application scenario requirements of low-stress glue, it is necessary to evaluate the UV bonding strength of glue in the gap structure. The current method is to use 0.15mm tape to control the thickness, draw a rectangular wire frame in the center of the LCP96AC substrate, and gently attach another LCP96AC substrate to the glue line. Press with your hands to ensure that the substrate is attached flat and evenly glued. The above method can only work on a single piece, with extremely low efficiency, and the thickness of the glue for each sample cannot be accurately controlled. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a substrate bonding tool, including an upper substrate, a lower substrate and a gasket, the gasket is located between the upper substrate and the lower substrate, the upper substrate is used to place the upper substrate, the lower substrate is used to place the lower substrate, the upper substrate is provided with a guide hole, the lower substrate is provided with a guide column corresponding to the guide hole, the guide column passes through the guide hole to ensure that the center points of the upper substrate and the lower substrate are consistent.

[0004] Preferably, the upper substrate is provided with a plurality of upper positioning grooves corresponding to the upper base material, and the plurality of upper positioning grooves are arranged at equal intervals.

[0005] Preferably, an upper positioning column is arranged in the upper positioning groove, and an upper arc groove is opened at the corner of the upper positioning groove.

[0006] Preferably: a fixing block groove is arranged on one side of the upper positioning groove, and the fixing block groove is used for placing a fixing block.

[0007] Preferably, a fixing screw is installed on the side end of the upper base plate close to the fixing block groove, and a threaded hole is provided on the upper base plate corresponding to the fixing screw.

[0008] Preferably, a plurality of lower positioning grooves are provided on the lower substrate corresponding to the upper positioning grooves, and the plurality of lower positioning grooves are arranged at equal intervals.

[0009] Preferably, the spacing between each of the lower positioning grooves is the same as the spacing between each of the upper positioning grooves.

[0010] Preferably, a lower positioning column is arranged in the lower positioning groove, a lower arc groove is opened at the corner of the lower positioning groove, and a side groove is arranged on the side of the lower positioning groove.

[0011] Preferably, the upper substrate and the lower substrate are metal molds.

[0012] Preferably, the gasket is a metal gasket.

[0013] Technical effects and advantages of the utility model:

[0014] In the utility model, the upper substrate is fixed on the upper base plate by fixing screws and fixing blocks, and the upper and lower base plates are closed by guide pillars to ensure that the center points of the upper and lower base plates are consistent. The upper substrate is fixed by opening a plurality of upper positioning grooves on the upper base plate, and the lower substrate is fixed by opening a plurality of lower positioning grooves on the lower base plate. This enables bonding operations of multiple samples to be realized, improves work efficiency, and controls the required thickness of the bonding glue by using gaskets of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the substrate bonding tooling provided in the embodiment of the present application;

[0016] Figure 2 It is a structural schematic diagram of an upper substrate in a substrate bonding tool provided in an embodiment of the present application;

[0017] Figure 3 The substrate bonding tool provided in the embodiment of the present application Figure 2 A schematic diagram of the structure enlargement at the center A;

[0018] Figure 4 It is a structural schematic diagram of a lower substrate in a substrate bonding tool provided in an embodiment of the present application;

[0019] Figure 5 The substrate bonding tool provided in the embodiment of the present application Figure 4 A magnified schematic diagram of the structure at point B in the middle.

[0020] In the figure: 1. upper base plate; 11. guide hole; 12. upper positioning groove; 13. fixing block groove; 14. upper arc groove; 15. upper positioning column; 2. lower base plate; 21. lower positioning groove; 22. lower positioning column; 23. lower arc groove; 24. side groove; 3. guide column; 4. gasket; 5. lower base material; 6. upper base material; 7. fixing block; 8. fixing screw. DETAILED DESCRIPTION

[0021] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.

[0022] See also Figure 1As shown, in this embodiment, a substrate bonding tool is provided, including an upper substrate 1, a lower substrate 2 and a gasket 4, the upper substrate 1 and the lower substrate 2 are metal molds, the gasket 4 is a metal gasket, the gasket 4 is located between the upper substrate 1 and the lower substrate 2, the upper substrate 1 is provided with a guide hole 11, the lower substrate 2 is provided with a guide column 3 corresponding to the guide hole 11, the gasket 4 is provided with a through hole corresponding to the guide column 3, the upper substrate 1 is used to place an upper substrate 6, and the lower substrate 2 is used to place a lower substrate 5, when the upper substrate 1 is connected to the lower substrate 2, the gasket 4 is installed on the guide column 3, the bottom end surface of the gasket 4 is attached to the lower substrate 2, after the guide column 3 passes through the guide hole 11, the upper end surface of the gasket 4 is attached to the upper substrate 1, the guide column 3 passes through the guide hole 11 to ensure that the center points of the upper substrate 1 and the lower substrate 2 are consistent, so that the center points of the lower substrate 5 and the upper substrate 6 are consistent, which is used to bond the lower substrate 5 and the upper substrate 6 together.

[0023] In this embodiment, gaskets 4 of different thicknesses can be selected and placed between the upper substrate 1 and the lower substrate 2 to adjust the distance between the upper substrate 1 and the lower substrate 2, thereby conveniently controlling the thickness of the adhesive between the upper substrate 6 and the lower substrate 5.

[0024] See also Figure 2-3 As shown, in the present embodiment, the upper substrate 1 is provided with a plurality of upper positioning grooves 12 corresponding to the upper substrate 6, and the plurality of upper positioning grooves 12 are arranged at equal intervals, an upper positioning column 15 is arranged in the upper positioning groove 12, a fixing block groove 13 is arranged on one side of the upper positioning groove 12, and the fixing block groove 13 is used to place the fixing block 7, a fixing screw 8 is installed at the side end of the upper substrate 1 close to the fixing block groove 13, and a threaded hole is provided on the upper substrate 1 corresponding to the fixing screw 8, and an upper arc groove 14 is provided at the corner of the upper positioning groove 12.

[0025] Specifically, the upper substrate 6 is placed in the upper positioning groove 12, and the upper positioning column 15 enters the through hole of the upper substrate 6 to facilitate the positioning of the upper substrate 6. The upper arc groove 14 is set to prevent the upper substrate 6 from touching the corners of the upper positioning groove 12 when placing the upper substrate 6, thereby preventing the corners of the upper substrate 6 from being damaged. The fixing screw 8 is tightened to push the fixing block 7 to move in the fixing block groove 13 toward the upper substrate 6 until the upper substrate 6 is clamped. Through this design, the upper substrate 6 is fixed on the upper base plate 1.

[0026] See also Figure 4-5 As shown, in the present embodiment, a plurality of lower positioning grooves 21 are provided on the lower substrate 2 corresponding to the upper positioning grooves 12, the plurality of lower positioning grooves 21 are arranged at equal intervals, and the interval between each lower positioning groove 21 is the same as the interval between each upper positioning groove 12, a lower positioning column 22 is provided in the lower positioning groove 21, a lower arc groove 23 is provided at the corner of the lower positioning groove 21, and a side groove 24 is provided on the side of the lower positioning groove 21.

[0027] Specifically, the lower substrate 5 is placed in the lower positioning groove 21, and the lower positioning column 22 enters the through hole of the lower substrate 5 to facilitate the positioning of the lower substrate 5. The lower arc groove 23 is set to prevent the lower substrate 5 from touching the corners of the lower positioning groove 21 when placing the lower substrate 5, thereby preventing the corners of the lower substrate 5 from being damaged.

[0028] The working principle of the utility model is:

[0029] The upper substrate 6 is fixed to the upper substrate 1 by fixing screws 8 and fixing blocks 7. The upper substrate 1 and the lower substrate 2 are closed by the guide pillars 3 to ensure that the center points of the upper substrate 1 and the lower substrate 2 are consistent. The upper substrate 6 is fixed by opening a plurality of upper positioning grooves 12 on the upper substrate 1, and the lower substrate 5 is fixed by opening a plurality of lower positioning grooves 21 on the lower substrate 2. This enables the bonding operation of multiple samples to be realized, thereby improving work efficiency. The required thickness of the bonding glue can be controlled by using gaskets 4 of different thicknesses.

[0030] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims

1. A substrate bonding tool, characterized in that: The invention comprises an upper substrate (1), a lower substrate (2) and a gasket (4), wherein the gasket (4) is located between the upper substrate (1) and the lower substrate (2), the upper substrate (1) is used to place an upper substrate (6), and the lower substrate (2) is used to place a lower substrate (5), the upper substrate (1) is provided with a guide hole (11), and the lower substrate (2) is provided with a guide column (3) corresponding to the guide hole (11), and the guide column (3) passes through the guide hole (11) to ensure that the center points of the upper substrate (1) and the lower substrate (2) are consistent.

2. A substrate bonding tool according to claim 1, characterized in that: The upper substrate (1) is provided with a plurality of upper positioning grooves (12) corresponding to the upper base material (6), and the plurality of upper positioning grooves (12) are arranged at equal intervals.

3. A substrate bonding tool according to claim 2, characterized in that: An upper positioning column (15) is arranged in the upper positioning groove (12), and an upper arc groove (14) is opened at the corner of the upper positioning groove (12).

4. A substrate bonding tool according to claim 3, characterized in that: A fixing block groove (13) is provided on one side of the upper positioning groove (12), and the fixing block groove (13) is used for placing a fixing block (7).

5. A substrate bonding tool according to claim 4, characterized in that: A fixing screw (8) is installed on the side end of the upper base plate (1) close to the fixing block groove (13), and a threaded hole is provided on the upper base plate (1) corresponding to the fixing screw (8).

6. A substrate bonding tool according to claim 1, characterized in that: The lower base plate (2) is provided with a plurality of lower positioning grooves (21) corresponding to the upper positioning grooves (12), and the plurality of lower positioning grooves (21) are arranged at equal intervals.

7. A substrate bonding tool according to claim 6, characterized in that: The spacing between each of the lower positioning grooves (21) is the same as the spacing between each of the upper positioning grooves (12).

8. A substrate bonding tool according to claim 7, characterized in that: A lower positioning column (22) is arranged in the lower positioning groove (21), a lower arc groove (23) is opened at the corner of the lower positioning groove (21), and a side groove (24) is arranged on the side of the lower positioning groove (21).

9. The substrate bonding tool according to claim 1, characterized in that: The upper substrate (1) and the lower substrate (2) are metal molds.

10. The substrate bonding tool according to claim 1, characterized in that: The gasket (4) is a metal gasket.

Images