Ultrasonic guided wave defect detection control circuit and detection equipment

Abstract

The utility model discloses an ultrasonic guided wave defect detection control circuit and detection equipment. The control circuit comprises an MCU (Microprogrammed Control Unit) control module, a power supply module, a signal processing module and a data acquisition module, the power supply module supplies power to the MCU control module, the signal processing module and the data acquisition module; the signal processing module comprises eight signal excitation units, and the data acquisition module comprises eight signal acquisition units; the MCU control module is respectively connected with the eight-path signal excitation unit and the eight-path signal acquisition unit; the detection equipment comprises an ultrasonic guided wave defect detection control circuit, an upper computer and a sensor; the ultrasonic guided wave defect detection control circuit is respectively connected with the upper computer and the sensor, the upper computer is connected with the MCU control module, eight paths of signals of the signal processing module excite unit signals, and eight paths of signal acquisition units of the data acquisition module are respectively connected with the sensor; the integrated multi-excitation and multi-reception ultrasonic guided wave defect detection control circuit and the integrated multi-excitation and multi-reception ultrasonic guided wave defect detection control equipment are realized.

Description

Technical Field

[0001] The utility model relates to the technical field of defect detection, and more specifically to an ultrasonic guided wave defect detection control circuit and detection equipment. Background Art

[0002] Ultrasonic guided wave detection equipment is crucial in the process of using ultrasonic guided waves to detect by exciting ultrasonic guided waves and collecting echo signals.

[0003] At present, researchers often use computers, function generators, oscilloscopes, power amplifiers, and sensors to build detection systems.

[0004] However, the combined detection system has many devices and complicated wiring. It is unstable in actual use and can only be excited in one or two channels. The detection efficiency is low and it is not suitable for long-distance industrial pipeline detection.

[0005] Therefore, how to provide an integrated multi-excitation and multi-reception ultrasonic guided wave defect detection control circuit and equipment is a problem that technical personnel in this field urgently need to solve. Utility Model Content

[0006] In view of this, the utility model provides an ultrasonic guided wave defect detection control circuit and a detection device to solve some of the technical problems mentioned in the background technology.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] An ultrasonic guided wave defect detection control circuit comprises an MCU control module, a power supply module, a signal processing module and a data acquisition module;

[0009] The power module supplies power to the MCU control module, signal processing module and data acquisition module;

[0010] The signal processing module includes 8 signal excitation units, and the data acquisition module includes 8 signal acquisition units;

[0011] The MCU control module is connected to the 8-channel signal excitation unit and the 8-channel signal acquisition unit respectively.

[0012] Preferably, for the 8 signal excitation units, each signal excitation unit includes a DA converter, a first filtering circuit and a power amplifier circuit; the MCU control module, the DA converter, the first filtering circuit and the power amplifier circuit are connected in sequence.

[0013] Preferably, for 8 signal acquisition units, each signal acquisition unit includes a second filtering circuit and a programmable amplifier circuit; the MCU control module has a built-in AD converter; the second filtering circuit, the programmable amplifier circuit and the built-in AD converter of the MCU control module are connected in sequence.

[0014] Preferably, the ultrasonic guided wave defect detection control circuit further includes a voltage stabilizing circuit module; the power supply module is connected to the MCU control module via the voltage stabilizing circuit module.

[0015] Preferably, the ultrasonic guided wave defect detection control circuit further includes a communication module, and the communication module is bidirectionally connected to the MCU control module.

[0016] Preferably, the signal processing module further includes a mechanical switch, and the mechanical switch is respectively connected to the 8-way signal excitation units.

[0017] Preferably, the excitation signal output pins PD14, PD15, PD0, PD1, PE7, PE8, PE9, PE10, PE11, PE12, PE13, and PE14 of the MCU control module are respectively connected to the excitation signal input pins DB0, DB1, DB2, DB3, DB4, DB5, DB6, DB7, DB8, DB9, DB10, and DB11 of the eight DA converters;

[0018] The control signal output pins PB10, PB11, PB12, PB13, PB14, PB15, PF12, PF13, PF14, PF15, PG0, PG1, PC0, PC1, PC2, and PC3 of the MCU control module are connected to the write enable signal pin WR# and the chip select signal pin CS# of the eight DA converters respectively.

[0019] Preferably, the signal output interfaces of the programmable amplifier circuits of the 8-channel signal acquisition units are respectively connected to the acquisition signal input interfaces PA0, PA1, PA2, PA3, PF7, PF8, PF9, and PF10 pins of the built-in AD converter of the MCU control module.

[0020] Preferably, the VREF reference voltage input pin of the DA converter U3 is connected to the inductor L2 and is grounded through the capacitor C11, the common end of the inductor L2 and the capacitor C11 is connected to the +5V voltage input, the reverse input end of the amplifier U4 is connected to the capacitor C12 and is connected to the RFB feedback resistor pin of U3 through the resistor R2, the same-direction input end of U4 is connected to the analog ground, the common end of R2 and C12 is connected to the output end of U4, the output end of U4 is connected to a mechanical switch, and the mechanical switch is connected to the filtering circuit.

[0021] An ultrasonic guided wave defect detection device comprises: an ultrasonic guided wave defect detection control circuit, a host computer and a sensor; the ultrasonic guided wave defect detection control circuit is connected to the host computer and the sensor respectively;

[0022] The host computer is connected to the MCU control module, and the 8-channel signal excitation unit signals of the signal processing module and the 8-channel signal acquisition units of the data acquisition module are connected to the sensors respectively.

[0023] It can be seen from the above technical scheme that compared with the prior art, the utility model discloses an ultrasonic guided wave defect detection control circuit and detection equipment, writes the waveform data of the excitation signal to the single-chip microcomputer, sends a chip select signal through the single-chip microcomputer, and then sends the excitation signal to the 8-channel DA, controls the 8-channel DA to convert the digital signal into an analog signal, and transmits the signal to the excitation sensor through the filtering circuit, the power amplifier circuit, and the transformer, and excites 8 channels at the same time; the collected electrical signal is filtered out by the filtering module to filter the clutter interference, and then amplified by the process control amplifier, and the 8-channel signal is collected. Finally, the analog signal is converted into a digital signal through the built-in 8-channel ADC of the single-chip microcomputer and stored in the single-chip microcomputer, realizing integrated multi-excitation and multi-reception ultrasonic guided wave defect detection, the detection system has less equipment and simple wiring, stable performance in actual use, high detection efficiency, which is helpful for long-distance industrial pipeline detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0025] Figure 1 The accompanying drawing is a schematic diagram of an ultrasonic guided wave defect detection control circuit provided by the utility model;

[0026] Figure 2 The accompanying drawing is a schematic diagram of a connection circuit of a voltage stabilizing circuit module provided by the utility model;

[0027] Figure 3 The accompanying drawing is a schematic diagram of the MCU control module connection circuit provided by the utility model;

[0028] Figure 4 The accompanying drawing is a schematic diagram of a DA converter connection circuit provided by the utility model;

[0029] Figure 5 The accompanying drawing is a schematic diagram of a first filtering circuit provided by the utility model;

[0030] Figure 6 The accompanying drawing is a schematic diagram of a power amplifier circuit provided by the utility model. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] The utility model discloses an ultrasonic guided wave defect detection control circuit. Figure 1 , including MCU control module, power module, signal processing module and data acquisition module;

[0033] The power module supplies power to the MCU control module, signal processing module and data acquisition module;

[0034] The signal processing module includes 8 signal excitation units, and the data acquisition module includes 8 signal acquisition units;

[0035] The MCU control module is connected to the 8-channel signal excitation unit and the 8-channel signal acquisition unit respectively.

[0036] In order to further implement the above technical solution, for the 8 signal excitation units, each signal excitation unit includes a DA converter, a first filtering circuit and a power amplifier circuit; the MCU control module, the DA converter, the first filtering circuit and the power amplifier circuit are connected in sequence.

[0037] In order to further implement the above technical solution, for the 8 signal acquisition units, each signal acquisition unit includes a second filtering circuit and a programmable amplifier circuit; the MCU control module has a built-in AD converter; the second filtering circuit, the programmable amplifier circuit and the built-in AD converter of the MCU control module are connected in sequence.

[0038] In order to further implement the above technical solution, an ultrasonic guided wave defect detection control circuit also includes a voltage stabilizing circuit module; the power supply module is connected to the MCU control module through the voltage stabilizing circuit module.

[0039] In this embodiment, the connection circuit of the voltage stabilizing circuit module is specifically as follows:

[0040] The positive 5V input is connected to the input of U1 through diode D1, the input of U1 is grounded through capacitor C1, the output of U1 is connected in parallel with capacitors C2, C3, and C4 and grounded, one end of the power inductor L1 is connected to the output of U1, and the other end is connected to the positive 3.3V output, such as Figure 2 .

[0041] In order to further implement the above technical solution, an ultrasonic guided wave defect detection control circuit also includes a communication module, and the communication module is bidirectionally connected to the MCU control module.

[0042] In this embodiment, the communication module includes a USB to serial port, and the communication module is connected to the MCU control module via the USB to serial port.

[0043] In order to further implement the above technical solution, the signal processing module also includes a mechanical switch, which is respectively connected to the 8 signal excitation units and is used to control the opening or closing of the DA converter of a certain signal excitation unit.

[0044] In order to further implement the above technical solution, Figure 3 , the excitation signal output pins PD14, PD15, PD0, PD1, PE7, PE8, PE9, PE10, PE11, PE12, PE13, and PE14 of the MCU control module are respectively connected to the excitation signal input pins DB0, DB1, DB2, DB3, DB4, DB5, DB6, DB7, DB8, DB9, DB10, and DB11 of the eight DA converters;

[0045] The control signal output pins PB10, PB11, PB12, PB13, PB14, PB15, PF12, PF13, PF14, PF15, PG0, PG1, PC0, PC1, PC2, and PC3 of the MCU control module are connected to the write enable signal pin WR# and the chip select signal pin CS# of the eight DA converters respectively.

[0046] In order to further implement the above technical solution, the signal output interface of the programmable amplifier circuit of the 8-channel signal acquisition unit is respectively connected to the acquisition signal input interface PA0, PA1, PA2, PA3, PF7, PF8, PF9, and PF10 pins of the built-in AD converter of the MCU control module.

[0047] In order to further implement the above technical solution, the connection circuit of the DA converter is specifically as follows: Figure 4 , the VREF reference voltage input pin of the DA converter U3 is connected to the inductor L2 and grounded through the capacitor C11, the common terminal of the inductor L2 and the capacitor C11 is connected to the +5V voltage input, the inverting input terminal of the amplifier U4 is connected to the capacitor C12 and connected to the RFB feedback resistor pin of U3 through the resistor R2, the same-direction input terminal of U4 is connected to the analog ground, the common terminal of R2 and C12 is connected to the output terminal of U4, the output terminal of U4 is connected to a mechanical switch, and the output DOUT1 of the mechanical switch is connected to the input of the first filter circuit, such as Figure 5 , the output LOUT1 of the first filter circuit is connected to the power amplifier circuit, such as Figure 6 ; Manually turn on this signal excitation unit through the mechanical switch.

[0048] In practical applications, the MCU control module uses the STM32F103ZET6 chip and the DA converter uses the AD7945BRZ model.

[0049] The working principle of the ultrasonic guided wave defect detection control circuit is as follows: write waveform data to the MCU, convert the digital signal into an analog signal through the DA module, and then pass through the first filtering circuit, the power amplifier circuit, and the transformer to make the voltage amplitude of the excitation signal reach a value that can drive the sensor; for the collected echo signal, after filtering, the programmable amplification circuit uses the built-in ADC of the microcontroller MCU control module to convert the analog signal into a digital signal, which is then stored in the microcontroller.

[0050] An ultrasonic guided wave defect detection device comprises: an ultrasonic guided wave defect detection control circuit, a host computer and a sensor; the ultrasonic guided wave defect detection control circuit is connected to the host computer and the sensor respectively;

[0051] The host computer is connected to the MCU control module, and the 8-channel signal excitation unit signals of the signal processing module and the 8-channel signal acquisition units of the data acquisition module are connected to the sensors respectively.

[0052] In this embodiment, the MCU control module of the ultrasonic guided wave defect detection control circuit is connected to the host computer through the communication module, the power amplifier circuit of each signal excitation unit and the second filter circuit of each signal acquisition unit are connected to the external sensor. After the acquisition is completed, the host computer reads the stored data, analyzes it, and completes the defect detection.

[0053] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0054] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ultrasonic guided wave defect detection control circuit, characterized in that: Including MCU control module, power module, signal processing module and data acquisition module; The power module supplies power to the MCU control module, signal processing module and data acquisition module; The signal processing module includes 8 signal excitation units, and the data acquisition module includes 8 signal acquisition units; The MCU control module is connected to the 8-channel signal excitation unit and the 8-channel signal acquisition unit respectively; For the 8 signal excitation units, each signal excitation unit includes a DA converter, a first filtering circuit and a power amplifier circuit; the MCU control module, the DA converter, the first filtering circuit and the power amplifier circuit are connected in sequence; For the 8-channel signal acquisition unit, each signal acquisition unit includes a second filter circuit and a program-controlled amplifier circuit; the MCU control module has a built-in AD converter; The second filter circuit, the program-controlled amplifier circuit and the AD converter built into the MCU control module are connected in sequence; Each signal excitation unit also includes a mechanical switch, and the DA converter is connected to the filter circuit through the mechanical switch; The excitation signal output pins PD14, PD15, PD0, PD1, PE7, PE8, PE9, PE10, PE11, PE12, PE13, and PE14 of the MCU control module are respectively connected to the excitation signal input pins DB0, DB1, DB2, DB3, DB4, DB5, DB6, DB7, DB8, DB9, DB10, and DB11 of the eight DA converters; The control signal output pins PB10, PB11, PB12, PB13, PB14, PB15, PF12, PF13, PF14, PF15, PG0, PG1, PC0, PC1, PC2, and PC3 of the MCU control module are connected to the write enable signal pin WR# and the chip select signal pin CS# of the eight DA converters respectively; The signal output interfaces of the program-controlled amplifier circuit of the 8-channel signal acquisition unit are respectively connected to the acquisition signal input interfaces PA0, PA1, PA2, PA3, PF7, PF8, PF9, and PF10 pins of the built-in AD converter of the MCU control module; The connection circuit of the DA converter is as follows: The VREF reference voltage input pin of the DA converter U3 is connected to the inductor L2 and is grounded through the capacitor C11. The common end of the inductor L2 and the capacitor C11 is connected to the +5V voltage input. The reverse input end of the amplifier U4 is connected to the capacitor C12 and is connected to the RFB feedback resistor pin of U3 through the resistor R2. The same-direction input end of U4 is connected to the analog ground. The common end of R2 and C12 is connected to the output end of U4. The output end of U4 is connected to a mechanical switch, and the mechanical switch is connected to the filter circuit.

2. The ultrasonic guided wave defect detection control circuit according to claim 1, characterized in that: It also includes a voltage stabilizing circuit module; the power supply module is connected to the MCU control module through the voltage stabilizing circuit module.

3. The ultrasonic guided wave defect detection control circuit according to claim 1, characterized in that: It also includes a communication module, which is bidirectionally connected to the MCU control module.

4. An ultrasonic guided wave defect detection device, characterized in that: include: An ultrasonic guided wave defect detection control circuit as claimed in any one of claims 1 to 3, a host computer and a sensor; the ultrasonic guided wave defect detection control circuit is connected to the host computer and the sensor respectively; The host computer is connected to the MCU control module, and the 8-channel signal excitation unit signals of the signal processing module and the 8-channel signal acquisition units of the data acquisition module are connected to the sensors respectively.

Images