External rotating plate for PCBA device detection
By setting up heating coils on the probe of the external turntable, welded and cooling the welding of the pins of the coagulary component's device, the problem of difficulty fixing the hidden pins of the existing technology in China and abroad, and realizing that in a variety of states Component transfer test.
Patent Information
- Application Number
- CN202323464653.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-19
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2033-12-19
AI Technical Summary
Existing external transfer boards are difficult to connect to hidden device pins, making it difficult to test components externally.
The heating and melting method is used to set up heating coils outside the probe to weld the welding of melting component pins. After the heating stops, the weld is cooled and solidified to fix the connection probe.
The fast -fixed -connected component pins are achieved, and the transfer test is performed to solve the situation where the pin is too short or blocked.
Smart Images

Figure CN222420265U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to an external transfer board for PCBA device detection. Background Art
[0002] PCBA (Printed Circuit Board Assembly) is the entire process of a blank printed circuit board after SMT mounting or DIP plug-in. Corresponding electronic components are usually welded on PCBA. However, for some special devices in PCBA, the welding pins are blocked, and the device body has no signal processing function, and cannot be tested by optics, FCT, etc. For the detection of such devices, an external transfer board is required to lead out the test signal for processing, that is, to connect the external transfer board with the component pins, lead out the signal in the signal board to the transfer board, and design the corresponding signal processing in the transfer board according to the signal type in the board before measurement.
[0003] However, the pins of the components on the printed circuit board are long and short, and the short pins are even directly located in the solder. In addition, some components are large in size (such as large capacitors, large coils, etc.), and their pins are located at the bottom of the component body and are blocked, making it difficult to perform transfer tests through connectors, pins, etc.
[0004] Therefore, the currently commonly used external transfer board connects the device pins on the printed circuit board through connectors or pins, which makes it difficult to achieve a secure connection for the shorter pins located at the bottom of the device body or on the device body. It is easy for the pins to fall off during testing, and even difficult to fix the connection when the device pins are immersed in solder, resulting in difficulties in external testing of components. Utility Model Content
[0005] The utility model aims to provide an external transfer plate for PCBA device detection, so as to solve the technical problem in the prior art that the external transfer plate is difficult to be fixedly connected with the hidden device pins, thereby causing difficulty in external testing of components.
[0006] In order to solve the above technical problems, the utility model specifically provides the following technical solutions:
[0007] An external transfer board for PCBA device detection includes a transfer circuit board, a distributor is detachably mounted on the transfer circuit board, a plurality of three-core wires are arranged on the distributor, and each end of the three-core wires is connected to a connector;
[0008] The connector comprises an insulating core tube, a probe is arranged in the insulating core tube, a heating coil is wrapped around the outer side of the insulating core tube, and a conductive heat-insulating glue is solidified and filled in the insulating core tube;
[0009] The three-core conductor includes a transfer core wire and two heating core wires, the end of the transfer core wire and the probe are both cured in the conductive heat-insulating glue and are connected, and the two heating core wires are connected to the heating coil;
[0010] The probe can be heated by the heating coil to melt the solder of the component pin, and after the heating coil stops heating, the probe and the component pin are fixedly connected by the solder that is cooled and solidified.
[0011] As a preferred solution of the utility model, a heat-insulating operating rod is arranged at one end of the insulating core tube away from the probe.
[0012] As a preferred solution of the utility model, the end of the probe away from the insulating core tube is bent.
[0013] As a preferred solution of the utility model, an extension cable is arranged between the adapter circuit board and the distributor, and the extension cable is respectively connected to the adapter core wires and the heating core wires of the plurality of three-core conductors;
[0014] The two ends of the extension cable are detachably mounted on the adapter circuit board and the distributor respectively.
[0015] As a preferred solution of the utility model, a plurality of heating control switches are arranged in the distributor, and the heating control switches respectively control the extension cable and the two heating core wires of the three-core conductor.
[0016] As a preferred solution of the utility model, a plurality of the heating control switches are connected in parallel, and a heating power controller is provided on the adapter circuit board, and the heating power controller is connected to the extension cable connected to the heating control switch.
[0017] Compared with the prior art, the utility model has the following beneficial effects:
[0018] The utility model adopts a heating and welding method. A heating coil isolated by an insulating core tube is arranged outside the probe to heat the probe, so that the probe can melt the solder at the pin of the component. After the heating is stopped, the solder cools and solidifies to fix the probe to the pin of the component for transfer measurement, thereby realizing fast fixed connection of the pin of the component for transfer testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.
[0020] Figure 1 A schematic diagram of the structure of an external transfer board for PCBA device detection is provided for an embodiment of the utility model;
[0021] Figure 2 A schematic diagram of the structure of a distributor portion of an external transfer board for PCBA device detection is provided for an embodiment of the utility model;
[0022] Figure 3 A schematic diagram of the structure of a three-core wire portion of an external transfer board for PCBA device detection is provided for an embodiment of the utility model;
[0023] Figure 4 A schematic diagram of the structure of a connector portion of an external transfer board for PCBA device detection is provided for an embodiment of the utility model.
[0024] The numbers in the figure represent the following:
[0025] 1-adapter circuit board; 2-distributor; 3-connector; 4-three-core wire;
[0026] 11- extension cable; 12- heating power controller; 21- heating control switch; 31- insulating core tube; 32- probe; 33- heating coil; 34- conductive thermal insulation glue; 35- thermal insulation operating rod; 41- transfer core wire; 42- heating core wire. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] like Figure 1 , Figure 3 and Figure 4 As shown, the utility model provides an external transfer board for PCBA device detection, including a transfer circuit board 1, a distributor 2 is detachably mounted on the transfer circuit board 1, a plurality of three-core wires 4 are arranged on the distributor 2, and a connector 3 is connected to the end of each three-core wire 4;
[0029] The connector 3 comprises an insulating core tube 31, a probe 32 is arranged inside the insulating core tube 31, a heating coil 33 is wrapped around the outer side of the insulating core tube 31, and a conductive heat-insulating glue 34 is solidified and filled inside the insulating core tube 31;
[0030] The three-core conductor 4 includes a transfer core wire 41 and two heating core wires 42. The end of the transfer core wire 41 and the probe 32 are both cured in the conductive heat-insulating adhesive 34 and are connected. The two heating core wires 42 are connected to the heating coil 33.
[0031] The probe 32 can be heated by the heating coil 33 to melt the solder of the component pin, and after the heating coil 33 stops heating, the probe 32 and the component pin are fixedly connected by the solder that is cooled and solidified.
[0032] The external transfer board of this embodiment mainly utilizes the adapter circuit board 1 and the distributor 2 to independently control the input of the three-core wire 4, so that when the connector 3 needs to be connected to the component pin, the connector 3 to be used is heated by the two heating core wires 42, that is, the heating core wire 42 transmits electrical energy to the heating coil 33, and the heating coil 33 heats the probe 32, so that the probe 32 can contact the solder of the melted component pin. After the heating is stopped, the solder cools and solidifies, so that the component pin and the probe 32 are fixedly connected and conductive by the solidified solder, thereby realizing the signal transfer at the component to the adapter circuit board 1 for detection.
[0033] Among them, the transfer core wire 41 of the three-core conductor 4 and the probe 32 are cured and connected by the conductive heat-insulating glue 34, which can not only ensure the conduction between the transfer core wire 41 and the probe 32, but also prevent the heat of the probe 32 from being transferred to the transfer core wire 41, thereby avoiding overheating and damage of the three-core conductor 4.
[0034] In addition, the insulating core tube 31 is made of heat-insulating material to prevent the heat of the probe 32 from being transferred to the heating coil 33 and causing insulation failure of the heating coil 33 (during the winding process, each turn of the coil needs to be insulated).
[0035] The external transfer board of this embodiment does not require the printed circuit board to be tested to have a test interface designed for the components, and can utilize the welding method to heat the probe 32 to melt the solder to connect the component pins, and solidify it after the heating stops to be fixedly connected to the component pins, thereby realizing transfer testing of components in various states (pins too short, pins blocked, etc.).
[0036] During the process of connecting the probe 32 to the pin of the component, the solder of the pin needs to be manually melted by touching the probe 32. At this time, the temperature of the probe 32 is relatively high, and the insulating core tube 32 may be accidentally touched by the probe 32 and cause burns. Therefore, the following preferred embodiments are provided.
[0037] like Figure 2As shown, a heat-insulating operating rod 35 is provided at one end of the insulating core tube 31 away from the probe 32 .
[0038] The heat-insulating operating rod 35 is fixed on the insulating core tube 31 and extends outward, so as to facilitate hand-held operation. After being held, the hand is far away from the probe 32, thereby improving the safety of use.
[0039] Since some components are large and the pins are located below them (such as large capacitors), the end of the probe 32 needs to extend into the bottom of the component. If the extension distance is far, the probe 32 needs to be nearly flat to make contact. However, there may be other components near the component to be tested, resulting in the probe 32 being unable to be flat to connect the pins of the component to be tested. Therefore, the following preferred embodiments are provided.
[0040] like Figure 2 As shown, the end of the probe 32 away from the insulating core tube 31 is bent.
[0041] The end of the probe 32 is bent so that after the end of the probe 32 is inserted into the bottom of the component, the end of the probe 32 close to the insulating core tube 31 is still above the printed circuit board, thereby avoiding mutual interference between the probe 32 and other components on the printed circuit board.
[0042] During the process of connecting the printed circuit board for transfer, the area of the printed circuit board may be relatively large, resulting in the length of the three-core wire 4 being unable to ensure that the probe 32 can connect to the pin of the component. Therefore, the following preferred embodiments are provided.
[0043] like Figure 1 As shown, an extension cable 11 is provided between the adapter circuit board 1 and the distributor 2, and the extension cable 11 is respectively connected to the adapter core wires 41 and the heating core wires 42 of the plurality of three-core conductors 4;
[0044] Two ends of the extension cable 11 are detachably mounted on the adapter circuit board 1 and the distributor 2 .
[0045] The extension cable 11 can extend the coverage of the probe 32, so that the transfer connection can be performed on a large area of the printed circuit board. In addition, the extension cable 11 can be disassembled at any time, so that the appropriate extension cable 11 can be replaced according to the specifications of the printed circuit board to be tested, or the extension cable can be not used.
[0046] When the function of heating the probe 32 is used, in order to avoid the situation where multiple probes 32 are heated at the same time and affect the operation or burn components, and when all the probes 32 do not need to be connected for use, the following preferred embodiments are provided.
[0047] like Figure 2As shown, a plurality of heating control switches 21 are arranged in the distributor 2 , and the heating control switches 21 extend the flat cable 11 and the two heating core wires 42 of the three-core conductor 4 respectively.
[0048] Each heating control switch 21 can independently control the on and off of the two heating cores 42 of each three-core conductor 4, thereby independently controlling the operation of each heating coil 33 to independently control the heating state of the probe 32. That is, the probe 32 in use can be heated while the probe 32 not in use can be heated.
[0049] Each heating coil 33 needs to be provided with electric energy, so the heating core wire 42 of each three-core conductor 4 needs to be able to be connected to the power supply, and each heating control switch 21 needs to be connected to the adapter circuit board 1. However, if each heating control switch 21 is designed with a heating circuit, it will result in too many circuits and increase the cost. Therefore, the following preferred embodiments are provided.
[0050] like Figure 2 As shown, a plurality of heating control switches 21 are connected in parallel, and a heating power controller 12 is provided on the adapter circuit board 1 , and the heating power controller 12 is connected to an extension cable 11 connected to the heating control switch 21 .
[0051] Multiple heating control switches 12 are connected in parallel, and only one of the heating control switches 12 needs to be connected to the adapter circuit board 1. Then multiple heating circuits share the same power supply circuit, but each adapter core wire 41 needs to be connected to the adapter circuit board 1 to ensure the accuracy of the measurement.
[0052] In addition, a heating power controller 12 is provided on the adapter circuit board 1, so as to provide corresponding heating power according to the number of heating circuits used to ensure that each circuit has sufficient heating power, that is, each probe 32 can be heated to a set temperature to melt the solder.
[0053] Therefore, it is possible to connect components with parallel pins with relatively low difficulty by adopting the method of synchronous heating and welding of multiple probes 32 (the probes 32 are brought into contact with the solder at the pins side by side, i.e., multiple heat-insulating operating rods 35 are held and operated synchronously).
[0054] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.
Claims
1. An external transfer board for PCBA device detection, characterized in that: It comprises a switching circuit board (1), a distributor (2) is detachably mounted on the switching circuit board (1), a plurality of three-core wires (4) are arranged on the distributor (2), and each end of the three-core wires (4) is connected to a connector (3); The connector (3) comprises an insulating core tube (31), a probe (32) is arranged inside the insulating core tube (31), a heating coil (33) is wrapped around the outer side of the insulating core tube (31), and a conductive heat-insulating glue (34) is solidified and filled inside the insulating core tube (31); The three-core conductor (4) comprises a transfer core wire (41) and two heating core wires (42), the end of the transfer core wire (41) and the probe (32) are both cured in the conductive heat-insulating adhesive (34) and are conductive, and the two heating core wires (42) are connected to the heating coil (33); The probe (32) can be heated by the heating coil (33) to melt the solder of the component pin, and after the heating coil (33) stops heating, the probe (32) and the component pin are fixedly connected by the solder that is cooled and solidified.
2. The external transfer board for PCBA device detection according to claim 1, characterized in that: A heat-insulating operating rod (35) is provided at one end of the insulating core tube (31) away from the probe (32).
3. The external transfer board for PCBA device detection according to claim 1, characterized in that: The end of the probe (32) away from the insulating core tube (31) is bent.
4. An external transfer board for PCBA device detection according to any one of claims 1 to 3, characterized in that: An extension cable (11) is provided between the adapter circuit board (1) and the distributor (2), and the extension cable (11) is respectively connected to the adapter core wires (41) and the heating core wires (42) of the plurality of three-core conductors (4). The two ends of the extension cable (11) are detachably mounted on the adapter circuit board (1) and the distributor (2), respectively.
5. The external transfer board for PCBA device detection according to claim 4, characterized in that: A plurality of heating control switches (21) are arranged in the distributor (2), and the heating control switches (21) respectively control the extension cable (11) and the two heating core wires (42) of the three-core conductor (4).
6. The external transfer board for PCBA device detection according to claim 5, characterized in that: A plurality of the heating control switches (21) are connected in parallel, and a heating power controller (12) is provided on the adapter circuit board (1), and the heating power controller (12) is connected to the extension cable (11) connected to the heating control switch (21).