Large-current chip inductor
Through the design of large current patching inductances, the flat coil and the relatively set magnetic core structure are used to solve the problem of severe thermal fever at the existing inductance at large currents, and realize the reduction of DC impedance and power improvement of the inductance.
Patent Information
- Application Number
- CN202421079208.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-17
AI Technical Summary
The existing inductors generate severe heat when working under high currents, resulting in large DC impedance and low core window utilization.
Design a large current patch electrostatic, use the first magnetic core and the second magnetic core setting, and install it on the magnetic cover. The coil sleeve is set in the first magnetic core and the second magnetic core. The layers are adhered to each other to reduce the gap between the turns and the turns and the layer.
Under the same size conditions, the DC impedance of the inductance decreases, reduces fever, reduces DC loss, increases power, and the utilization rate of the effective wrapped window of the magnetic core increases.
Smart Images
Figure CN222421604U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic components, in particular to a large current chip inductor. Background Art
[0002] Switching power supply is the most common power supply for electronic devices. It has many advantages such as small size, high efficiency, energy saving, environmental protection, etc., and has been widely used in various electronic products. The power inductor plays a vital role in the switching power supply circuit topology structure, such as boosting, bucking, choking, filtering, freewheeling, and voltage stabilization. The electrical performance of the power inductor directly affects the size and output efficiency of the switching power supply.
[0003] As semiconductors such as gallium nitride and silicon carbide are gradually applied to various design solutions, switching losses and frequencies are greatly improved, so the volume and efficiency requirements of electronic products are further increased, which also heralds the arrival of the era of high power density of electronic products.
[0004] In the prior art, the coil of the inductor is wound with a round enameled wire, the utilization rate of the magnetic core window is low, and the DCR (direct current resistance) of the inductor is large, which leads to the problem of serious heating when working under large current. Utility Model Content
[0005] Based on this, it is necessary to provide a high-current chip inductor, which aims to solve the problem that the coil of the inductor in the prior art is wound with round enameled wire, the core window utilization rate is low, and the DCR (DC resistance) of the inductor is large, which leads to serious heat generation when working under high current.
[0006] The utility model provides a high-current chip inductor, which comprises a magnetic cover, a first magnetic core, a second magnetic core and a coil. The first magnetic core and the second magnetic core are arranged opposite to each other and are respectively installed on the magnetic cover. The coil is sleeved with the first magnetic core and the second magnetic core. The coil is flat, and the layers of the coil are adhered to each other.
[0007] In one embodiment, the first magnetic core includes a first center column and a first baffle connected to the first center column, the second magnetic core includes a second center column and a second baffle connected to the second center column, and the coil is sleeved on the first center column and the second center column, and placed on the first baffle and the second baffle.
[0008] In one embodiment, the magnetic cover is provided with a placement groove, and the placement groove is used for placing the second magnetic core.
[0009] In one embodiment, the magnetic cover is further provided with a positioning boss, and the positioning boss is used to position the second magnetic core.
[0010] In one embodiment, the coil includes a body and pins connected to the body, and the magnetic cover is further provided with a lead-out groove, and the lead-out groove is used to expose the pins to the outside of the magnetic cover.
[0011] In one embodiment, the high current chip inductor further includes a terminal, the magnetic cover is further provided with a mounting groove, the terminal is installed in the mounting groove and connected to the pin, and the terminal is electrically connected to an external component.
[0012] In one embodiment, the terminal includes a positioning buckle and an electrode connected to the positioning buckle, the positioning buckle is arranged in the mounting groove, the positioning buckle engages the edge of the magnetic cover and is used to locate the position of the first baffle, the electrode engages the edge of the second baffle and is used to be electrically connected to external components.
[0013] In one embodiment, the terminal further includes a connecting buckle, and the connecting buckle is connected to the pin.
[0014] In one embodiment, the connecting buckle is bent to form a connecting cavity, and the pin passes through the connecting cavity.
[0015] In one embodiment, the first magnetic core may be elliptical, rectangular or polygonal, and the second magnetic core may be elliptical, rectangular or polygonal.
[0016] Implementing the embodiments of the present utility model will have the following beneficial effects:
[0017] The high-current chip inductor of the utility model is adopted, the first magnetic core and the second magnetic core of the high-current chip inductor are arranged opposite to each other and are respectively installed on the magnetic cover, the coil is sleeved on the first magnetic core and the second magnetic core, the coil is flat, and the layers of the coil are adhered to each other, so that the gaps between turns and turns and layers of the coil are reduced, and the effective winding window area utilization rate of the magnetic core is increased. Under the same size conditions, the DCR of the inductor is reduced, the heat is reduced, the DC loss is reduced, and the power is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] in:
[0020] Figure 1 FIG. 4 is an isometric diagram of a high current chip inductor according to an embodiment.
[0021] Figure 2 for Figure 1 Another angle axonometric diagram of the high current chip inductor shown.
[0022] Figure 3 for Figure 2 An exploded diagram of a high current chip inductor is shown.
[0023] Figure 4 for Figure 3 Schematic diagram of the magnetic cover in the high current chip inductor shown.
[0024] Figure 5 for Figure 3 The following is a partial enlarged schematic diagram of part A of the high current chip inductor shown.
[0025] Reference numerals:
[0026] 1. Magnetic cover; 11. Placement slot; 12. Positioning boss; 13. Lead-out slot; 14. Installation slot;
[0027] 2. first magnetic core; 21. first center column; 22. first baffle;
[0028] 3. second magnetic core; 31. second center column; 32. second baffle;
[0029] 4. Coil; 41. Body; 42. Pin;
[0030] 5. Terminal; 51. Positioning buckle; 52. Electrode; 53. Connecting buckle; 531. Connecting cavity. DETAILED DESCRIPTION
[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0033] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.
[0034] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.
[0035] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.
[0036] Please combine Figures 1 to 5 , the high current chip inductor provided by the utility model is now described.
[0037] The high current chip inductor includes a magnetic cover 1, a first magnetic core 2, a second magnetic core 3 and a coil 4. The first magnetic core 2 and the second magnetic core 3 are arranged opposite to each other and are respectively installed on the magnetic cover 1. The coil 4 is sleeved with the first magnetic core 2 and the second magnetic core 3. The coil 4 is flat, and the layers of the coil 4 are adhered to each other.
[0038] It can be understood that the first magnetic core 2 and the second magnetic core 3 of the high-current chip inductor are arranged opposite to each other and are respectively installed on the magnetic cover 1. The coil 4 is sleeved on the first magnetic core 2 and the second magnetic core 3. The coil 4 is flat, and the layers of the coil 4 are adhered to each other, so that the gaps between the turns and the layers of the coil 4 are reduced, and the effective winding window area utilization of the magnetic core is increased. Under the same size conditions, the DCR of the inductor is reduced, the heat is reduced, the DC loss is reduced, and the power is thereby improved.
[0039] In addition, the coil 4 is flat, and the layers of the coil 4 are adhered to each other, so that the coil 4 is fixed and not loose, and the audio is not easy to vibrate and make noise.
[0040] The coil 4 is flat, and the layers of the coil 4 are adhered to each other. The AC loss (loss) caused by the skin effect in high-frequency applications is effectively reduced, the AC loss is reduced, and the product power is further improved.
[0041] The coil 4 is flat, and the layers of the coil 4 are adhered to each other. The coil 4 is arranged neatly and regularly, the inductance accuracy can be controlled to be smaller, and the product consistency is improved. In addition, the coil 4 can be automatically produced, the production efficiency is improved, and the production cost is reduced.
[0042] It should be noted that for switching frequencies above 1MHz: the magnetic core is made of nickel-zinc ferrite, and the magnetic cover 1 is made of nickel-zinc ferrite, which has low core loss and excellent magnetic shielding effect, and is suitable for designing low inductance values (below 6.8uH) and applied to high-frequency solutions.
[0043] For switching frequencies below 1MHz: the core is made of nickel-zinc ferrite, and the magnetic cover 1 is made of manganese-zinc ferrite. The design has a small and medium inductance value (below 15uH), low core loss, and excellent magnetic shielding effect. Compared with the core made of iron silicon aluminum material, the magnetic cover 1 uses nickel-zinc ferrite, which has better anti-saturation ability.
[0044] For a switching frequency of about 500KHz: the magnetic core is made of iron silicon aluminum, and the magnetic cover 1 is made of nickel-zinc ferrite. Compared with the magnetic core made of iron nickel material, the magnetic cover 1 made of nickel-zinc ferrite has relatively better DC bias characteristics.
[0045] For a switching frequency of about 500KHz: the core is made of iron-nickel material, and the magnetic cover 1 is made of nickel-zinc ferrite. Compared with the core made of iron-silicon material, the magnetic cover 1 made of nickel-zinc ferrite has lower core loss and the most outstanding DC bias characteristics.
[0046] For switching frequencies below 200KHz: the magnetic core is made of iron silicon, and the magnetic cover 1 is made of nickel-zinc ferrite, which has excellent DC bias characteristics and cost advantages.
[0047] In this embodiment, the first magnetic core 2 includes a first center column 21 and a first baffle 22 connected to the first center column 21, the second magnetic core 3 includes a second center column 31 and a second baffle 32 connected to the second center column 31, and the coil 4 is sleeved on the first center column 21 and the second center column 31, and is placed on the first baffle 22 and the second baffle 32. By setting the first magnetic core 2 and the second magnetic core 3, the inductance value can be increased. In implementation, the first magnetic core 2 and the second magnetic core 3 can both be T-type magnetic core structures, or the first magnetic core 2 can be a T-type structure and the second magnetic core 3 can be an I-type structure, or the first magnetic core 2 can be an I-type structure and the second magnetic core 3 can be a T-type structure. The first magnetic core 2 can be elliptical, rectangular or polygonal, and the second magnetic core 3 can be elliptical, rectangular or polygonal.
[0048] In one embodiment, if Figure 3 and Figure 4 As shown, the magnetic cover 1 is provided with a placement groove 11, and the placement groove 11 is used to place the second magnetic core 3. In this way, the second magnetic core 3 can be installed.
[0049] In this embodiment, the magnetic cover 1 is further provided with a positioning boss 12, and the positioning boss 12 is used to position the second magnetic core 3. In this way, the second magnetic core 3 can be positioned.
[0050] In one embodiment, if Figures 3 to 5 As shown, the coil 4 includes a body 41 and a pin 42 connected to the body 41. The magnetic cover 1 is also provided with a lead-out groove 13, and the lead-out groove 13 is used to expose the pin 42 to the outside of the magnetic cover 1. By providing the lead-out groove 13, the pin 42 can be led out from the lead-out groove 13, so that the pin 42 can be connected to the outside.
[0051] In this embodiment, the high current chip inductor further includes a terminal 5, and the magnetic cover 1 is further provided with a mounting groove 14. The terminal 5 is installed in the mounting groove 14 and connected to the pin 42, and the terminal 5 is electrically connected to the external components. By providing the mounting groove 14, the terminal 5 can be installed, and the terminal 5 is connected to the pin 42, so that it can be electrically connected to the external components, for example, the terminal 5 is connected to the PCB pad for electrical performance.
[0052] Furthermore, the terminal 5 includes a positioning buckle 51 and an electrode 52 connected to the positioning buckle 51. The positioning buckle 51 is arranged in the mounting groove 14. The positioning buckle 51 engages the edge of the magnetic cover 1 and is used to locate the position of the first baffle 22. The electrode 52 engages the edge of the second baffle 32 and is used to be electrically connected to external components. By providing the positioning buckle 51 and the electrode 52, the positioning buckle 51 can engage the first baffle 22, and the electrode 52 can engage the second baffle 32, so that the first battery cell and the second battery cell can be installed on the magnetic cover 1.
[0053] Of course, in other embodiments, the positioning buckle 51 is disposed in the mounting groove 14 and abuts against the first baffle 22 , and the electrode 52 abuts against the second baffle 32 , so that the first battery cell and the second battery cell can be installed on the magnetic cover 1 .
[0054] Furthermore, the terminal 5 further includes a connection buckle 53, and the connection buckle 53 is connected to the pin 42. The connection buckle 53 is welded to the pin 42, so that the terminal 5 can be connected to the pin 42.
[0055] Specifically, the connection buckle 53 is bent to form a connection cavity 531, and the pin 42 passes through the connection cavity 531. By providing the connection cavity 531, the pin 42 can be more easily connected to the connection buckle 53, and the pin 42 is not easy to separate from the connection cavity 531, thereby improving the stability of the welding process of the pin 42 and the connection buckle 53.
[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0057] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope covered by the present invention.
Claims
1. A high current chip inductor, characterized in that: The high current chip inductor includes a magnetic cover, a first magnetic core, a second magnetic core and a coil. The first magnetic core and the second magnetic core are arranged opposite to each other and are respectively installed on the magnetic cover. The coil is sleeved with the first magnetic core and the second magnetic core. The coil is flat, and the layers of the coil are adhered to each other.
2. The high current chip inductor according to claim 1, characterized in that: The first magnetic core includes a first center column and a first baffle connected to the first center column, the second magnetic core includes a second center column and a second baffle connected to the second center column, the coil is sleeved on the first center column and the second center column, and placed on the first baffle and the second baffle.
3. The high current chip inductor according to claim 2, characterized in that: The magnetic cover is provided with a placement groove, and the placement groove is used for placing the second magnetic core.
4. The high current chip inductor according to claim 3, characterized in that: The magnetic cover is also provided with a positioning boss, and the positioning boss is used to position the second magnetic core.
5. The high current chip inductor according to claim 2, characterized in that: The coil comprises a body and pins connected to the body. The magnetic cover is also provided with a lead-out groove, and the lead-out groove is used to expose the pins to the outside of the magnetic cover.
6. The high current chip inductor according to claim 5, characterized in that: The high-current chip inductor also includes a terminal, and the magnetic cover is also provided with a mounting groove. The terminal is installed in the mounting groove and connected to the pin, and the terminal is electrically connected to an external component.
7. The high current chip inductor according to claim 6, characterized in that: The terminal includes a positioning buckle and an electrode connected to the positioning buckle, the positioning buckle is arranged in the mounting groove, the positioning buckle engages the edge of the magnetic cover and is used to locate the position of the first baffle, the electrode engages the edge of the second baffle and is used to be electrically connected to external components.
8. The high current chip inductor according to claim 7, characterized in that: The terminal also includes a connecting buckle, and the connecting buckle is connected to the pin.
9. The high current chip inductor according to claim 8, characterized in that: The connecting buckle is bent to form a connecting cavity, and the pin passes through the connecting cavity.
10. The high current chip inductor according to claim 1, characterized in that: The first magnetic core may be elliptical, rectangular or polygonal, and the second magnetic core may be elliptical, rectangular or polygonal.