Carrying device and wafer processing system

Abstract

The utility model relates to the technical field of wafer processing, and discloses a carrying device and a wafer processing system.The carrying device comprises a base, a lifting seat, a first rotating mechanism and a first adsorption piece; the lifting seat is connected to the upper end of the base; the first rotating mechanism comprises a first connecting arm and a second connecting arm, one end of the first connecting arm is rotationally connected to the lifting seat, and one end of the second connecting arm is rotationally connected to the end, away from the lifting seat, of the first connecting arm; the first adsorption part is connected to one end, far away from the lifting seat, of the first rotating mechanism and is used for adsorbing and fixing a wafer; according to the carrying device provided by the utility model, automatic carrying of the wafer between designated positions can be realized through the lifting seat and the first rotating mechanism, the carrying efficiency is improved, the wafer is prevented from being scratched and damaged, and the productivity of the wafer and the product consistency of the wafer can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a transport device and a wafer processing system. Background Art

[0002] The semiconductor manufacturing process is inseparable from the use of a large number of wafers. If the wafers need to be subjected to operations such as etching and photolithography, the wafers need to be transported and transferred between various workstations. The higher the stability and speed of the transport, the higher the processing efficiency of the wafers. The current wafer transport method is to manually operate a vacuum suction cup to fix the wafer and transfer the wafer to the discharge plug. This manual transport method has low transport efficiency and is prone to scratches and damage to the wafers, which seriously restricts the wafer production capacity improvement and product consistency. Utility Model Content

[0003] Aiming to solve at least one of the technical problems existing in the prior art, the utility model provides a transport device and a wafer processing system having the transport device, wherein the transport device helps to increase the production capacity of wafers and improve the product consistency of wafers.

[0004] In order to achieve the above-mentioned purpose, the utility model provides a handling device, including a base, a lifting seat, a first rotating mechanism and a first adsorption member; the lifting seat is connected to the upper end of the base; the first rotating mechanism includes a first connecting arm and a second connecting arm, one end of the first connecting arm is rotatably connected to the lifting seat, and one end of the second connecting arm is rotatably connected to an end of the first connecting arm away from the lifting seat; the first adsorption member is connected to an end of the first rotating mechanism away from the lifting seat and is used to adsorb and fix the wafer; wherein, the rotation axis of the first connecting arm is set as the first axis, the rotation axis of the second connecting arm is set as the second axis, and the first axis and the second axis are parallel.

[0005] In some embodiments, the first adsorption component includes an adsorption plate, which is connected to the end of the second connecting arm away from the first connecting arm, a negative pressure cavity is opened inside the adsorption plate, an air hole connected to the negative pressure cavity is opened at the end of the adsorption plate close to the second connecting arm, and an adsorption hole connected to the negative pressure cavity is opened at the end of the adsorption plate away from the second connecting arm.

[0006] In some embodiments, the first rotating mechanism also includes a third connecting arm, one end of the third connecting arm is rotatably connected to an end of the second connecting arm away from the first connecting arm, and the first adsorption component is connected to an end of the third connecting arm away from the second connecting arm; wherein the rotation axis of the third connecting arm is set to a third axis, and the third axis is parallel to the second axis.

[0007] In some embodiments, it also includes a second rotating mechanism and a second adsorption component, the second rotating mechanism includes a fourth connecting arm, a fifth connecting arm and a sixth connecting arm, one end of the fourth connecting arm is rotatably connected to the lifting seat, one end of the fifth connecting arm is rotatably connected to an end of the fourth connecting arm away from the lifting seat, one end of the sixth connecting arm is rotatably connected to an end of the fifth connecting arm away from the fourth connecting arm, and the second adsorption component is connected to an end of the sixth connecting arm away from the fifth connecting arm and is used to adsorb and fix the wafer; wherein the rotation axis of the fourth connecting arm is set as the fourth axis, the rotation axis of the fifth connecting arm is set as the fifth axis, and the rotation axis of the sixth connecting arm is set as the sixth axis, and the first axis, the fourth axis, the fifth axis and the sixth axis are parallel to each other.

[0008] In some embodiments, a scanning sensor is further included, and the first rotating mechanism and / or the second rotating mechanism is equipped with the scanning sensor.

[0009] The utility model also provides a wafer processing system, comprising the handling device described in any one of the above items, and also comprising a material collection plug for storing the wafer, a soaking device for soaking the wafer, a drying device for drying the wafer, and a material discharge plug for storing the wafer, wherein the material collection plug, the soaking device, the drying device and the material discharge plug are distributed in a preset order on the circumference of the base.

[0010] In some embodiments, the immersion device includes a water tank, a liquid level sensor, a water inlet pipe, a water inlet valve, a water outlet pipe and a water outlet valve, the water tank is used to accommodate the wafer, the liquid level sensor is installed in the water tank, the water inlet pipe is connected to the water tank, the water inlet valve is installed on the water inlet pipe, the water outlet pipe is connected to the water tank, and the water outlet valve is installed on the water outlet pipe.

[0011] In some embodiments, the drying device includes a spin-drying component, which includes a driving motor, a turntable and a plurality of limiting columns, wherein the turntable is connected to the upper end of the driving motor, the driving motor can drive the turntable to rotate around the central axis of the turntable, the limiting columns are connected to the upper surface of the turntable, and a receiving area for accommodating the wafer is formed between the plurality of limiting columns.

[0012] In some embodiments, the drying device further includes an air purifier, and the air purifier is located on one side of the turntable.

[0013] In some embodiments, a controller is further included, and the transporting device, the soaking device and the drying device are all electrically connected to the controller.

[0014] Compared with the prior art, the conveying device provided by the embodiment of the utility model has the following beneficial effects: (1) by setting a lifting seat and a first rotating mechanism, the first suction member can be lifted and lowered and translated respectively, so that the first suction member can move to the first designated position and adsorb and fix the wafer at the first designated position, and then move to the second designated position and release the wafer at the second designated position, thereby realizing automatic conveying between the first designated position and the second designated position. Therefore, the conveying device provided by the utility model can realize automatic conveying of wafers between designated positions through the lifting seat and the first rotating mechanism, thereby improving conveying efficiency, avoiding scratches and damages on the wafers, and helping to improve the wafer production capacity and improve the product consistency of the wafers.

[0015] (2) By providing the first connecting arm and the second connecting arm, the first adsorbent can have two translational degrees of freedom, thereby expanding the carrying range of the first adsorbent and facilitating its use.

[0016] Compared with the prior art, a wafer handling system provided by an embodiment of the utility model has the beneficial effect that by distributing the material collection plug, the immersion device, the drying device and the material discharge plug in a preset order on the circumference of the base, the wafer can be automatically handled between the material collection plug, the immersion device, the drying device and the material discharge plug through the handling device, thereby improving the handling efficiency of the wafer between the material collection plug, the immersion device, the drying device and the material discharge plug, and further improving the processing efficiency of the wafer, which helps to improve the wafer production capacity and improve the product consistency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a transport device provided by an embodiment of the utility model at a first angle;

[0018] Figure 2 It is a structural schematic diagram of a transport device provided by an embodiment of the utility model at a second angle;

[0019] Figure 3 It is a front view of a transport device provided by an embodiment of the utility model;

[0020] Figure 4 It is a bottom view of the first adsorption member provided in the embodiment of the utility model;

[0021] Figure 5 yes Figure 4 AA section view;

[0022] Figure 6 It is a top view of a wafer processing system provided by an embodiment of the utility model;

[0023] Figure 7It is a front view of the discharge plug provided by the embodiment of the utility model;

[0024] Figure 8 is a top view of the soaking device provided by an embodiment of the utility model;

[0025] Fig. 9 It is a front view of the spin-drying assembly provided by an embodiment of the utility model;

[0026] Fig.10 It is a top view of the spin-drying assembly provided by an embodiment of the utility model;

[0027] Fig.11 It is a control connection structure diagram of a wafer processing system provided by an embodiment of the utility model.

[0028] In the figure, 1, a transport device; 11, a base; 12, a lifting seat; 13, a first rotating mechanism; 14, a first adsorption member; 15, a second rotating mechanism; 16, a second adsorption member; 17, a scanning sensor; 131, a first connecting arm; 132, a second connecting arm; 133, a third connecting arm; 151, a fourth connecting arm; 152, a fifth connecting arm; 153, a sixth connecting arm; 141, an adsorption plate; 1411, a negative pressure chamber; 1412, an air hole; 1413, an adsorption hole;

[0029] 10, first axis; 20, second axis; 30, third axis; 40, fourth axis; 50, fifth axis; 60, sixth axis;

[0030] 2. Wafer;

[0031] 3. Material collection is blocked;

[0032] 4. Soaking device; 41. Water tank; 42. Liquid level sensor; 43. Water inlet pipe; 44. Water inlet valve; 45. Water outlet pipe; 46. Water outlet valve;

[0033] 5. Drying device; 51. Drying assembly; 52. Air purifier; 511. Driving motor; 512. Turntable; 513. Limiting column; 5121. Accommodating area;

[0034] 6. Discharging is stuck;

[0035] 7. Controller. DETAILED DESCRIPTION

[0036] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] In the description of the embodiments of the present utility model, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0042] like Figure 1-5As shown, a preferred transport device 1 of an embodiment of the utility model includes a base 11, a lifting seat 12, a first rotating mechanism 13 and a first adsorption member 14; the lifting seat 12 is connected to the upper end of the base 11; the first rotating mechanism 13 includes a first connecting arm 131 and a second connecting arm 132, one end of the first connecting arm 131 is rotatably connected to the lifting seat 12, and one end of the second connecting arm 132 is rotatably connected to an end of the first connecting arm 131 away from the lifting seat 12; the first adsorption member 14 is connected to an end of the first rotating mechanism 13 away from the lifting seat 12 and is used to adsorb and fix the wafer 2; wherein, the rotation axis of the first connecting arm 131 is set as the first axis 10, and the rotation axis of the second connecting arm 132 is set as the second axis 20, and the first axis 10 and the second axis 20 are parallel.

[0043] Based on this technical solution, by setting the lifting seat 12 and the first rotating mechanism 13, the first adsorption component 14 can be lifted and lowered and translated respectively, so that the first adsorption component 14 can move to the first designated position and adsorb and fix the wafer 2 at the first designated position, and then move to the second designated position and release the wafer 2 at the second designated position, thereby realizing automatic transportation between the first designated position and the second designated position. Therefore, the transportation device 1 provided by the utility model can realize automatic transportation of the wafer 2 between designated positions through the lifting seat 12 and the first rotating mechanism 13, improve the transportation efficiency, avoid scratches and damages on the wafer 2, and help to improve the production capacity of the wafer 2 and improve the product consistency of the wafer 2.

[0044] By providing the first connecting arm 131 and the second connecting arm 132 and making the first axis 10 and the second axis 20 parallel to each other, the first adsorbent 14 can have two translational degrees of freedom in the horizontal direction, thereby expanding the carrying range of the first adsorbent 14 and facilitating its use.

[0045] The first adsorption member 14 includes an adsorption plate 141, which is connected to the end of the second connecting arm 132 away from the first connecting arm 131, and a negative pressure cavity 1411 is provided inside the adsorption plate 141. An air hole 1412 connected to the negative pressure cavity 1411 is provided at the end of the adsorption plate 141 close to the second connecting arm 132, and an adsorption hole 1413 connected to the negative pressure cavity 1411 is provided at the end of the adsorption plate 141 away from the second connecting arm 132. The adsorption plate 141 is used to facilitate both taking out the wafer 2 from the jam and putting the wafer 2 into the jam.

[0046] The first adsorption member 14 further includes a vacuum device (not shown). The adsorption plate 141 is connected to the vacuum device via the air holes 1412 . The vacuum device can extract gas in the negative pressure cavity 1411 via the air holes 1412 , so that the adsorption holes 1413 can adsorb and fix the wafer 2 .

[0047] In some other embodiments, the adsorption plate 141 may be replaced with any structure such as a vacuum suction cup that can adsorb and fix the wafer 2 under negative pressure provided by a vacuum device, which is not limited here.

[0048] The vacuum device may be any device such as a negative pressure generator, a vacuum valve, or a vacuum device that can enable the first negative pressure member to adsorb and fix the wafer 2, and is not limited here.

[0049] The first rotating mechanism 13 also includes a third connecting arm 133, one end of which is rotatably connected to the end of the second connecting arm 132 away from the first connecting arm 131, and the first adsorbent 14 is connected to the end of the third connecting arm 133 away from the second connecting arm 132; wherein the rotation axis of the third connecting arm 133 is set to the third axis 30, and the third axis 30 is parallel to the second axis 20. By setting the first connecting arm 131, the second connecting arm 132 and the third connecting arm 133, the first adsorbent 14 and the first axis 10, the second axis 20 and the third axis 30 can be parallel to each other, and the first adsorbent 14 can have three translational degrees of freedom in the horizontal direction, thereby further expanding the carrying range of the first adsorbent 14.

[0050] The handling device 1 also includes a second rotating mechanism 15 and a second adsorption member 16. The second rotating mechanism 15 includes a fourth connecting arm 151, a fifth connecting arm 152 and a sixth connecting arm 153. One end of the fourth connecting arm 151 is rotatably connected to the lifting seat 12, one end of the fifth connecting arm 152 is rotatably connected to the end of the fourth connecting arm 151 away from the lifting seat 12, one end of the sixth connecting arm 153 is rotatably connected to the end of the fifth connecting arm 152 away from the fourth connecting arm 151, and the second adsorption member 16 is connected to the end of the sixth connecting arm 153 away from the fifth connecting arm 152 and is used to adsorb and fix the wafer 2; wherein, the rotation axis of the fourth connecting arm 151 is set to the fourth axis 40, the rotation axis of the fifth connecting arm 152 is set to the fifth axis 50, and the rotation axis of the sixth connecting arm 153 is set to the sixth axis 60, and the first axis 10, the fourth axis 40, the fifth axis 50 and the sixth axis 60 are parallel to each other. When the first rotating mechanism 13 and the first suction member 14 are transporting one wafer 2, the second rotating mechanism 15 and the second suction member 16 can simultaneously transport another wafer 2. Therefore, the use of the second rotating mechanism 15 and the second suction member 16 can further improve the transport efficiency of the transport device 1, and help to further improve the production capacity of the wafer 2.

[0051] The structure of the second adsorption member 16 is similar to that of the first adsorption member 14 , and will not be described in detail herein.

[0052] In this embodiment, the adsorption plate 141 of the first adsorption component 14 is located below the adsorption plate 141 of the second adsorption component 16 .

[0053] The transport device 1 further includes a scanning sensor 17, and the first rotating mechanism 13 and / or the second rotating mechanism 15 are equipped with the scanning sensor 17. The scanning sensor 17 can scan the stuck wafer sequence, so that the first rotating mechanism 13 and / or the second rotating mechanism 15 can know the stuck wafer sequence from which the wafer 2 transported by it comes, and effectively prevent material mixing.

[0054] In this embodiment, the second rotating mechanism 15 is equipped with a scanning sensor 17 .

[0055] In some other embodiments, the first rotating mechanism 13 may be installed with the scanning sensor 17 , or both the first rotating mechanism 13 and the second rotating mechanism 15 may be installed with the scanning sensor 17 .

[0056] Specifically, in this embodiment, the scanning sensor 17 is installed on the sixth connecting arm 153 .

[0057] In some other embodiments, the scanning sensor 17 may also be installed on any structure belonging to the second rotating mechanism 15 , such as the fourth connecting arm 151 or the fifth connecting arm 152 , which is not limited here.

[0058] See also Figure 6-Figure 11 The utility model also provides a wafer processing system, which includes any of the above-mentioned handling devices, and also includes a material taking plug 3 for storing wafers 2, a soaking device 4 for soaking wafers 2, a drying device 5 for drying wafers 2, and a material discharging plug 6 for storing wafers 2. The material taking plug 3, the soaking device 4, the drying device 5 and the material discharging plug 6 are distributed in a preset order on the circumference of the base 11 and are located within the handling range of the handling device 1. By distributing the material taking plug 3, the soaking device 4, the drying device 5 and the material discharging plug 6 in a preset order on the circumference of the base 11, the automatic handling of the wafer 2 between the material taking plug 3, the soaking device 4, the drying device 5 and the material discharging plug 6 can be realized by the handling device, thereby improving the handling efficiency of the wafer 2, and further improving the processing efficiency of the wafer 2, which is helpful to improve the production capacity of the wafer 2 and improve the product consistency of the wafer 2.

[0059] In this embodiment, the material taking plug 3, the soaking device 4, the drying device 5 and the material discharging plug 6 are sequentially distributed on the circumference of the base 11 in a clockwise direction.

[0060] In some other embodiments, the material collection plug 3, the soaking device 4, the drying device 5 and the discharge plug 6 can also be distributed in sequence in the counterclockwise direction on the circumference of the base 11, or any one or more of the material collection plug 3, the soaking device 4, the drying device 5 and the discharge plug 6 can change position and can be distributed in any direction on the circumference of the base 11. Therefore, as long as the positions of the material collection plug 3, the soaking device 4, the drying device 5 and the discharge plug 6 are within the handling range of the handling device 1, any distribution method should be regarded as the protection scope of the present utility model.

[0061] In some embodiments, an induction sensor is installed on the material taking plug 3 and / or the material discharging plug 6, and the induction sensor is used to sense whether the wafer 2 is stored in place.

[0062] The material taking plug 3 and the material discharging plug 6 are both plugs for storing wafers 2 in the prior art, and will not be described in detail here.

[0063] The immersion device 4 includes a water tank 41, a liquid level sensor 42, a water inlet pipe 43, a water inlet valve 44, a water outlet pipe 45 and a water outlet valve 46. The water tank 41 is used to accommodate the wafer 2. The liquid level sensor 42 is installed in the water tank 41. The water inlet pipe 43 is connected to the water tank 41. The water inlet valve 44 is installed on the water inlet pipe 43. The water outlet pipe 45 is connected to the water tank 41. The water outlet valve 46 is installed on the water outlet pipe 45. The water inlet pipe 43 and the water inlet valve 44 can be used to input water into the water tank 41, the water outlet pipe 45 and the water outlet valve 46 can be used to discharge the water in the water tank 41, and the liquid level sensor 42 can detect the liquid level of the water in the water tank 41 to ensure that the water in the water tank 41 can immerse the wafer 2.

[0064] The drying device 5 includes a spin-drying assembly 51, which includes a driving motor 511, a turntable 512, and a plurality of limiting posts 513. The turntable 512 is connected to the upper end of the driving motor 511, and the driving motor 511 can drive the turntable 512 to rotate around the central axis of the turntable 512. The limiting posts 513 are connected to the upper surface of the turntable 512, and a plurality of limiting posts 513 are surrounded by a receiving area 5121 for accommodating the wafer 2. The spin-drying assembly 51 can be used to spin-dry the wafer 2 to achieve drying of the wafer 2. The plurality of limiting posts 513 are used to surround the receiving area 5121, which can play a buffering and fixing role on the wafer 2 during the spin-drying process of the wafer 2 to prevent the wafer 2 from being thrown away.

[0065] The drying device 5 further includes an air purifier 52, which is located on one side of the turntable 512. The air purifier 52 can purify the surrounding environment of the spin-drying component 51 and volatilize moisture, which helps to further dry the wafer 2, so that no moisture will overflow during the next transportation process of the wafer 2.

[0066] The wafer processing system further includes a controller 7 , and the transport device 1 , the soaking device 4 and the drying device 5 are all electrically connected to the controller 7 .

[0067] Specifically, the lifting base 12 , the first rotating mechanism 13 , the first adsorption member 14 , the second rotating mechanism 15 , the second adsorption member 16 , and the scanning sensor 17 in the transport device 1 are all electrically connected to the controller 7 .

[0068] More specifically, the first connecting arm 131, the second connecting arm 132 and the third connecting arm 133 in the first rotating mechanism 13 are electrically connected to the controller 7; the fourth connecting arm 151, the fifth connecting arm 152 and the sixth connecting arm 153 in the second rotating mechanism 15 are electrically connected to the controller 7; the liquid level sensor 42, the water inlet valve 44 and the water outlet valve 46 in the immersion device 4 are electrically connected to the controller 7; the drive motor 511 and the air purifier 52 in the drying device 5 are electrically connected to the controller 7.

[0069] The working process of the wafer processing system provided by the utility model is as follows: the controller 7 controls the movement of the lifting seat 12 and the movement of the first rotating mechanism 13 to move the first suction member 14 to the first preset position of the material taking plug 3 and take away the wafer 2 at the first preset position; the controller 7 controls the movement of the lifting seat 12 and the movement of the first rotating mechanism 13 to transport the wafer 2 from the material taking plug 3 to the water tank 41, and the controller 7 controls the first suction member 14 to release the wafer 2, and the wafer 2 is immersed in the water in the water tank 41; the controller 7 controls the movement of the lifting seat 12 and the movement of the first rotating mechanism 13 to move the first suction member 14 away from the water tank 41; after the wafer 2 is immersed in the water for a first set time, the controller 7 controls the movement of the lifting seat 12 and the movement of the second rotating mechanism 15 to move the second suction member 16 to the water tank 41 and align it with the wafer 2, and the controller 7 controls the second suction member 16 to adsorb and fix the wafer 2; the controller 7 controls the lifting seat 12 and the movement of the first rotating mechanism 13 to move the first suction member 14 away from the water tank 41; after the wafer 2 is immersed in the water for a first set time, the controller 7 controls the movement of the lifting seat 12 and the movement of the second rotating mechanism 15 to move the second suction member 16 to the water tank 41 and align it with the wafer 2, and the controller 7 controls the second suction member 16 to adsorb and fix the wafer 2; The seat 12 moves and controls the second rotating mechanism 15 to move, and transports the wafer 2 from the water tank 41 to the turntable 512. The controller 7 then controls the second adsorption member 16 to release the wafer 2 and place the wafer 2 in the accommodating area 5121 of the turntable 512. The controller 7 then controls the drive motor 511 to drive the turntable 512 to rotate and dry the wafer 2. During the drying process of the wafer 2, the controller 7 simultaneously controls the air purifier 52 to purify the air around the turntable 512 and evaporate the moisture. After the wafer 2 is dried on the turntable 512 for a second set time, the controller 7 controls the drive motor 511 to stop driving the turntable 512 to rotate. The controller 7 then controls the movement of the lifting seat 12 and the movement of the second rotating mechanism 15 to transport the wafer 2 from the turntable 512 to the discharge plug 6. The controller 7 then controls the second adsorption member 16 to release the wafer 2 and place the wafer 2 in the second preset position of the discharge plug 6, thus completing a processing flow of the wafer 2.

[0070] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A transport device, characterized in that: include: Pedestal; A lifting seat connected to the upper end of the base; A first rotating mechanism, the first rotating mechanism comprising a first connecting arm and a second connecting arm, one end of the first connecting arm being rotatably connected to the lifting seat, and one end of the second connecting arm being rotatably connected to an end of the first connecting arm away from the lifting seat; A first adsorption member, the first adsorption member is connected to an end of the first rotating mechanism away from the lifting seat and is used for adsorbing and fixing the wafer; The rotation axis of the first connecting arm is set as a first axis, the rotation axis of the second connecting arm is set as a second axis, and the first axis and the second axis are parallel.

2. The transport device according to claim 1, characterized in that: The first adsorption component includes an adsorption plate, which is connected to the end of the second connecting arm away from the first connecting arm, a negative pressure cavity is opened inside the adsorption plate, an air hole connected to the negative pressure cavity is opened at the end of the adsorption plate close to the second connecting arm, and an adsorption hole connected to the negative pressure cavity is opened at the end of the adsorption plate away from the second connecting arm.

3. The transport device according to claim 1, characterized in that: The first rotating mechanism further includes a third connecting arm, one end of the third connecting arm is rotatably connected to one end of the second connecting arm away from the first connecting arm, and the first adsorption member is connected to one end of the third connecting arm away from the second connecting arm; Wherein, the rotation axis of the third connecting arm is set as a third axis, and the third axis is parallel to the second axis.

4. The transport device according to claim 1, characterized in that: It also includes a second rotating mechanism and a second suction member, the second rotating mechanism includes a fourth connecting arm, a fifth connecting arm and a sixth connecting arm, one end of the fourth connecting arm is rotatably connected to the lifting seat, one end of the fifth connecting arm is rotatably connected to an end of the fourth connecting arm away from the lifting seat, one end of the sixth connecting arm is rotatably connected to an end of the fifth connecting arm away from the fourth connecting arm, and the second suction member is connected to an end of the sixth connecting arm away from the fifth connecting arm and is used to suction and fix the wafer; Among them, the rotation axis of the fourth connecting arm is set as the fourth axis, the rotation axis of the fifth connecting arm is set as the fifth axis, the rotation axis of the sixth connecting arm is set as the sixth axis, and the first axis, the fourth axis, the fifth axis and the sixth axis are parallel to each other.

5. The transport device according to claim 4, characterized in that: It also includes a scanning sensor, and the first rotating mechanism and / or the second rotating mechanism are equipped with the scanning sensor.

6. A wafer processing system, characterized in that: It comprises the transport device according to any one of claims 1 to 5, and also comprises a material removal plug for storing the wafer, a soaking device for soaking the wafer, a drying device for drying the wafer, and a material discharge plug for storing the wafer, wherein the material removal plug, the soaking device, the drying device and the material discharge plug are distributed in a preset order on the circumference of the base.

7. The wafer processing system according to claim 6, characterized in that: The immersion device includes a water tank, a liquid level sensor, a water inlet pipe, a water inlet valve, a water outlet pipe and a water outlet valve. The water tank is used to accommodate the wafer. The liquid level sensor is installed in the water tank. The water inlet pipe is connected to the water tank. The water inlet valve is installed on the water inlet pipe. The water outlet pipe is connected to the water tank. The water outlet valve is installed on the water outlet pipe.

8. The wafer processing system according to claim 6, characterized in that: The drying device includes a spin-drying component, which includes a driving motor, a turntable and a plurality of limiting columns. The turntable is connected to the upper end of the driving motor, and the driving motor can drive the turntable to rotate around the central axis of the turntable. The limiting columns are connected to the upper surface of the turntable, and a receiving area for accommodating the wafer is formed between the plurality of limiting columns.

9. The wafer processing system according to claim 8, characterized in that: The drying device further comprises an air purifier, and the air purifier is located on one side of the rotating disk.

10. The wafer processing system according to claim 6, characterized in that: The device further comprises a controller, and the transporting device, the soaking device and the drying device are all electrically connected to the controller.

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