Bernoulli chuck device and wafer back cleaning device
By setting up a clustered isolation device on the bearing drive on the back of the wafer back, the problem of air pollution pollution during the cleaning process of the automatic chamber can be solved, and more efficient cleaning and lower human costs are achieved.
Patent Information
- Application Number
- CN202420283660.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-06
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-02-06
AI Technical Summary
The existing wafer back cleaning device can easily cause contamination of the air pores on the bearing plate during the automatic chamber cleaning process, which in turn causes particle contamination during the subsequent cleaning process, affecting the quality of wafer testing and chip testing.
Design a Bernunley card device containing a disc, which is a disk -shaped bearing drive and a quarantine device that can be launched. When the automatic chamber is cleaned, the isolation device is expanded to block the air holes to prevent pollution; when the wafer back is cleaned, the isolation device is gathered to expose the air pores, allowing the insulating gases to spray from the pores.
Effectively avoid the pollution during the cleaning of the pores in the automatic chamber, improve the cleaning efficiency, save labor costs, and reduce the risk of granular pollution.
Smart Images
Figure CN222421942U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a Bernoulli chuck device and a wafer backside cleaning device. Background Art
[0002] During the manufacturing process of semiconductor integrated circuit devices, the surface of the semiconductor wafer needs to be kept clean at all times. Not only the front side of the wafer needs to be kept clean at all times, but also the back side of the wafer needs to be kept clean at all times to avoid cross contamination during the transmission of the wafer.
[0003] Figure 1 This is a schematic diagram of the structure of a wafer backside cleaning device in the prior art. Figure 1 As shown, the wafer backside cleaning device comprises a cup-shaped isolation tank 1 located in a chamber, and a carrier plate 2 located in the isolation tank 1, wherein the carrier plate 2 is used to carry a wafer 3 to be cleaned. The front side of the wafer 3 is close to the carrier plate 2, and the back side is away from the carrier plate 2. The cleaning liquid is sprayed from the top of the isolation tank 1 to the back side of the wafer 3 to clean the back side of the wafer 3 to be cleaned.
[0004] Figure 2 This is a schematic diagram of the structure of the carrier plate in the prior art. Figure 2 As shown, a plurality of air holes 21 are provided on the carrier plate 2 , and N2 is introduced from the bottom of the carrier plate 2 through the air holes 21 to the top of the carrier plate 2 .
[0005] The cleaning liquid used in wafer back cleaning is a mixture of HF and HNO3. The use of high-concentration chemical liquid in the wafer back cleaning device for a long time will cause crystals to accumulate on the isolation groove 1. The crystals accumulated on the sidewalls of the isolation groove 1 are very likely to return to the edge of the wafer through backsplash during the subsequent cleaning process, thereby causing particle contamination and affecting the subsequent wafer test (WAT) and chip test (CP). Therefore, after the wafer back cleaning device has been used for a period of time, it is necessary to perform automatic chamber cleaning (ACC), such as using deionized water (DIW) for cleaning, to remove the crystals.
[0006] However, since the pores 21 on the carrier plate 2 are exposed, the residual DIW on the surface of the carrier plate 2 after ACC is completed may enter the pores 21. When the back side of the wafer is subsequently cleaned, the residual DIW in the pores 21 may cause particle contamination of the wafer during cleaning.
[0007] Currently, the problem of particle contamination is mainly alleviated by manually opening ACC during equipment maintenance (PM) to clean the isolation tank 1 and avoid DIW residue on the carrier plate 2 as much as possible, or by removing the carrier plate 2 when opening ACC. However, this method not only wastes manpower, but also has limited effect on improving the problem of wafer particle contamination caused by backsplash. Utility Model Content
[0008] The utility model aims to provide a Bernoulli chuck device and a wafer back side cleaning device, wherein an isolation device is arranged on a carrier plate, so as to shield the air holes when automatic chamber cleaning is performed to avoid contamination of the air holes during cleaning, and to expose the air holes when the wafer back side is cleaned, thereby spraying insulating gas from the air holes to the top of the carrier plate.
[0009] In order to solve the above technical problems, the utility model provides a Bernoulli chuck device, including a disc-shaped carrier disk, wherein a plurality of air holes are arranged circumferentially on the upper surface of the carrier disk away from the center, and also including an isolation device, wherein the isolation device is located on the carrier disk, and the isolation device has two states, namely, an expanded state and a folded state, and can be switched between the expanded state and the folded state; when the isolation device is in the expanded state, the isolation device is expanded along the radial direction of the carrier disk to form a first disc, and the first disc blocks the air holes of the carrier disk; when the isolation device is in the folded state, the isolation device is folded toward the center to form a second disc with a diameter smaller than the first disc, and the isolation device exposes the air holes.
[0010] Optionally, the isolation device includes a center plate, a plurality of fan-shaped plates and a plurality of strip plates; when the isolation device is in an expanded state, the center plate is located in the center, and the fan-shaped plates and the strip plates are arranged at intervals around the center plate to together form a first disc; when the isolation device is in a folded state, the center plate is located at the bottom layer, the strip plates are folded and located on the center plate, and the fan-shaped plates are folded to form the second disc located on the strip plates.
[0011] Optionally, the thickness of the central plate, the fan-shaped plate and the strip plate is not higher than 2 mm.
[0012] Optionally, the center plate, the fan-shaped plate and the strip plate are all made of polyvinylidene fluoride.
[0013] Optionally, the wafer back side cleaning device further includes a moving device, and the moving device is used to fold or unfold various parts of the isolation device.
[0014] Optionally, a support column is further provided on the carrying plate to support the isolation device.
[0015] Correspondingly, the utility model also provides a wafer back side cleaning device, including the Bernoulli chuck device as described above; when the wafer back side cleaning device performs automatic chamber cleaning, the isolation device is in an expanded state to cover the air holes of the carrier plate, and when the wafer back side cleaning device performs wafer back side cleaning, the isolation device is in a retracted state to expose the air holes.
[0016] Optionally, when the isolation device is in a retracted state, the wafer to be cleaned is located on the isolation device, with the front side of the wafer facing the isolation device so that the back side of the wafer can be cleaned.
[0017] Optionally, the wafer back side cleaning device further includes a cup-shaped isolation groove, and the carrier plate and the isolation device are located in the isolation groove.
[0018] Compared with the prior art, in the Bernoulli chuck device provided by the utility model, an isolation device is arranged on the carrier disc, and the isolation device has two states, namely, an expanded state and a retracted state, and can be switched between the expanded state and the retracted state; when the isolation device is in the expanded state, the isolation device is radially expanded along the carrier disc to form a first disc, and the first disc blocks the air holes of the carrier disc; when the isolation device is in the retracted state, the isolation device is retracted toward the center to form a second disc with a diameter smaller than the first disc, and the isolation device exposes the air holes. The Bernoulli chuck device provided by the utility model is provided with an isolation device on the carrier disc, and when the isolation device is in the expanded state, the air holes on the carrier disc are blocked to protect the air holes, and when the isolation device is in the retracted state, the air holes on the carrier disc are exposed, and the efficacy of the air holes is not affected. The isolation device is switched between the expanded state and the retracted state as needed, and the operation is simple and convenient.
[0019] The utility model provides a wafer backside cleaning device, including the above-mentioned Bernoulli chuck device, which can avoid contamination of the pores when performing automatic chamber cleaning, and can expose the pores when performing wafer backside cleaning, so that insulating gas is sprayed from the pores to the top of the carrier plate. Compared with the manual automatic chamber cleaning and removal of the carrier plate in the prior art, the wafer backside cleaning device provided by the utility model can perform automatic chamber cleaning according to the set interval time, saving labor costs and improving cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.
[0021] Figure 1 The invention is a schematic structural diagram of a wafer backside cleaning device in the prior art.
[0022] Figure 2 It is a structural schematic diagram of a carrier plate in the prior art.
[0023] Figure 3 It is a top view of the isolation device provided by one embodiment of the utility model when it is unfolded.
[0024] Figure 4 It is a cross-sectional view of an isolation device provided by an embodiment of the utility model when it is unfolded.
[0025] Figure 5 It is a top view of the isolation device provided by one embodiment of the utility model when it is folded.
[0026] Figure 6 It is a cross-sectional view of an isolation device provided by an embodiment of the utility model when it is folded.
[0027] Description of reference numerals:
[0028] 1-isolation groove; 2-carrying plate; 21-air hole; 3-wafer; 4-isolation device; 41-center plate; 42-fan-shaped plate; 43-strip plate. DETAILED DESCRIPTION
[0029] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.
[0030] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense that includes "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense that includes "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features.
[0031] The utility model provides a Bernoulli chuck device, comprising a disc-shaped carrier disk, wherein a plurality of air holes are arranged circumferentially on the upper surface of the carrier disk away from the center, and further comprising an isolating device, wherein the isolating device is located on the carrier disk, and the isolating device has two states, namely, an expanded state and a folded state, and can be switched between the expanded state and the folded state; when the isolating device is in the expanded state, the isolating device is expanded along the radial direction of the carrier disk to form a first disc, and the first disc blocks the air holes of the carrier disk; when the isolating device is in the folded state, the isolating device is folded toward the center to form a second disc with a diameter smaller than that of the first disc, and the isolating device exposes the air holes.
[0032] The utility model arranges an isolation device on a carrier plate. When the isolation device is in an expanded state, the air holes on the carrier plate are blocked to protect the air holes. When the isolation device is in a folded state, the air holes on the carrier plate are exposed without affecting the effectiveness of the air holes. The isolation device switches between the expanded state and the folded state as needed, and the operation is simple and convenient.
[0033] In this embodiment, the isolation device may include multiple structures (the multiple structures here refer to multiple different structures, each structure may have one or more), for example, two or three. When the pores need to be covered, the various structures are unfolded to form a first disk. When the pores need to be exposed, the various structures are gathered toward the center to form a second disk with a diameter smaller than the first disk. The utility model does not limit the number of structural types of the isolation device.
[0034] Exemplarily, the isolation device includes two structures, for example, a plurality of sector plates and a circular plate, wherein the plurality of sector plates surround the circular plate to form a first disk, and the circular plate itself serves as a second disk.
[0035] Exemplarily, the isolation device includes three structures, for example, a central plate, a plurality of sector plates and a plurality of strip plates, the sector plates and the strip plates are arranged at intervals around the central plate to form a first disk, and the plurality of sector plates form a second disk.
[0036] The following description will be made by taking the isolation device including three structures as an example.
[0037] Figure 3 is a top view of an isolation device provided by an embodiment of the utility model when it is unfolded, Figure 4 is a cross-sectional view of an isolation device provided by an embodiment of the utility model when it is unfolded, Figure 5 is a top view of the isolation device provided by one embodiment of the utility model when it is folded. Figure 6 This is a cross-sectional view of the folded isolation device provided by an embodiment of the utility model. Figures 3 to 6As shown, the Bernoulli chuck device provided in this embodiment includes a disc-shaped carrier plate 2 and an isolation device 4 located on the carrier plate 2. A plurality of air holes 21 are arranged axially on the upper surface of the carrier plate 2 away from the center. The isolation device 4 includes a center plate 41, a plurality of sector plates 42, and a plurality of strip plates 43. When the isolation device 4 is in an expanded state, the center plate 41 is located at the center, and the sector plates 42 and the strip plates 43 are arranged at intervals around the center plate 41 to form a first disc (such as Figure 3 , 4 When the isolation device is in the folded state, the center plate 41 is located at the bottom layer, the strip plates 43 are folded and located on the center plate 41, and the fan-shaped plates 42 are folded to form the second disk located on the strip plates 43 (as shown in FIG. Figure 5 , 6 shown).
[0038] Please refer to Figure 5, the upper surface of the carrier plate 2 is provided with a plurality of air holes 21 along the circumferential direction away from the center, the air holes 21 are close to the edge of the carrier plate 2, and the plurality of air holes 21 are evenly arranged on the carrier plate 2. For example, the radius of the carrier plate 2 is R1, and the plurality of air holes 21 are evenly arranged on the circumference of the radius R2, and R2 is smaller than R1. In one embodiment, please refer to Figure 6 As shown, the pores 21 are through holes that penetrate the upper and lower surfaces of the carrier plate 2, and the insulating gas is introduced from the lower surface (i.e., the bottom) of the carrier plate 2, and is ejected from the upper surface (i.e., the top) of the carrier plate 2 through the pores 21. In another embodiment, the pores 21 may be located only in the upper part of the carrier plate 2, and a gas channel may be provided inside the carrier plate 2, and the gas channel is connected to the pores 21 to eject the insulating gas, or the carrier plate 2 may be a hollow structure connected to the pores 21, and the insulating gas is introduced into the interior thereof, and the insulating gas is ejected through the pores 21. The insulating gas is, for example, N2.
[0039] Please continue to refer to Figure 5 As shown, the radius R3 of the second disk is smaller than the distance from the air hole 21 to the center of the carrier disk 2, that is, R3 is smaller than R2, so that when the isolation device 4 is folded, the second disk exposes the air hole 21. Figure 3 and Figure 5 As shown, the radius R4 of the first disk is greater than the distance from the air hole 21 to the center of the supporting plate 2, and is less than or equal to the radius of the supporting plate 2, that is, R4 is greater than R2 and less than or equal to R1, so that when the isolation device 4 is unfolded, the first disk covers the air hole 21.
[0040] In this embodiment, the isolation device 4 includes a central plate 41, six sector plates 42 and six strip plates 43, but is not limited thereto. At the position where the strip plates 43 and the central plate 41 are spliced, the strip plates 43 are convex and the central plate 41 is concave, so that the strip plates 43 and the central plate 41 are better fitted. The sector plates 42, the strip plates 43 and the central plate 41 all have contact areas.
[0041] In an embodiment of the present invention, the thickness of the central plate 41 , the sector plate 42 and the strip plate 43 are all no greater than 2 mm, but the present invention is not limited thereto.
[0042] In an embodiment of the present invention, the materials of the central plate 41 , the fan-shaped plates 42 and the strip plates 43 are all made of polyvinylidene fluoride (PVDF), but the present invention is not limited thereto.
[0043] In one embodiment of the utility model, the Bernoulli chuck device further includes a moving device (not shown), which is used to fold or unfold the parts of the isolation device 4. Exemplarily, the moving device may include a moving motor and a connecting rod, the connecting rod is used to connect the center plate 41, the fan plate 42 or the strip plate 43, and the moving motor drives the connecting rod to complete the folding and unfolding of the center plate 41, the fan plate 42 or the strip plate 43.
[0044] In an embodiment of the present invention, a support column (not shown) is further disposed on the carrier plate 2 , and the support column is used to support the isolation device 4 .
[0045] Correspondingly, the utility model also provides a wafer backside cleaning device, comprising the Bernoulli chuck device as described above. When the wafer backside cleaning device performs automatic chamber cleaning, the isolation device is in an extended state, and when the wafer backside cleaning device performs wafer backside cleaning, the isolation device is in a retracted state.
[0046] When the isolation device is in a retracted state, the wafer to be cleaned is located on the isolation device, and the front side of the wafer faces the isolation device so that the back side of the wafer can be cleaned.
[0047] In one embodiment of the utility model, the wafer backside cleaning device further comprises a cup-shaped isolation groove, and the Bernoulli chuck device is located in the isolation groove. Figure 1 The isolation groove 1 is shown.
[0048] In this utility model, please refer to Figures 3 to 6 As shown, an isolation device 4 is provided on the carrier plate 2. When the wafer back cleaning device cleans the back of the wafer, the isolation device 4 is folded to form a Figure 6In the structure shown in FIG. 1 , the isolation device 4 exposes the air hole 21, and the wafer to be cleaned is placed face down on the isolation device 4, and the cleaning liquid is sprayed to the back of the wafer to be cleaned, and the insulating gas is sprayed from the air hole 21 to the top of the carrier plate 2. The existence of the isolation device 4 does not affect the cleaning of the back of the wafer. When the wafer back cleaning device performs automatic chamber cleaning, the isolation device 4 is unfolded to form a Figure 4 In the structure shown, the isolation device 4 blocks the air hole 21, automatically cleans the chamber to remove the crystals on the isolation groove, alleviates the backsplash problem caused by crystallization, and does not cause contamination of the air hole 21. Therefore, the automatic chamber cleaning can be performed at the set interval time, and there is no need to manually start the automatic chamber cleaning, and there is no need to remove the carrier plate, thereby saving labor costs and improving cleaning efficiency.
[0049] In summary, in the Bernoulli chuck device provided by the utility model, an isolation device is arranged on the carrier disk, and the isolation device has two states, namely, an expanded state and a retracted state, and can be switched between the expanded state and the retracted state; when the isolation device is in the expanded state, the isolation device is radially expanded along the carrier disk to form a first disk, and the first disk blocks the air holes of the carrier disk; when the isolation device is in the retracted state, the isolation device is retracted toward the center to form a second disk with a diameter smaller than the first disk, and the isolation device exposes the air holes. The Bernoulli chuck device provided by the utility model is provided with an isolation device on the carrier disk, and when the isolation device is in the expanded state, the air holes on the carrier disk are blocked to protect the air holes, and when the isolation device is in the retracted state, the air holes on the carrier disk are exposed, and the efficacy of the air holes is not affected. The isolation device switches between the expanded state and the retracted state as needed, and the operation is simple and convenient.
[0050] The utility model provides a wafer backside cleaning device, including the above-mentioned Bernoulli chuck device, which can avoid contamination of the pores when performing automatic chamber cleaning, and can expose the pores when performing wafer backside cleaning, so that insulating gas is sprayed from the pores to the top of the carrier plate. Compared with the manual automatic chamber cleaning and removal of the carrier plate in the prior art, the wafer backside cleaning device provided by the utility model can perform automatic chamber cleaning according to the set interval time, saving labor costs and improving cleaning efficiency.
[0051] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.
Claims
1. A Bernoulli chuck device, comprising a disc-shaped carrier plate, wherein a plurality of air holes are arranged on the upper surface of the carrier plate away from the center along the circumferential direction, characterized in that: It also includes an isolation device, which is located on the carrier plate and has two states: an expanded state and a folded state, and can be switched between the expanded state and the folded state; When the isolation device is in an expanded state, the isolation device expands radially along the supporting disk to form a first disk, and the first disk blocks the air hole of the supporting disk; when the isolation device is in a collapsed state, the isolation device collapses toward the center to form a second disk with a diameter smaller than the first disk, and the isolation device exposes the air hole.
2. The Bernoulli chuck device according to claim 1, characterized in that: The isolation device includes a center plate, a plurality of fan-shaped plates and a plurality of strip plates; when the isolation device is in an expanded state, the center plate is located in the center, and the fan-shaped plates and the strip plates are arranged at intervals around the center plate to form a first disc together; when the isolation device is in a folded state, the center plate is located at the bottom layer, the strip plates are folded and located on the center plate, and the fan-shaped plates are folded to form the second disc located on the strip plates.
3. The Bernoulli chuck device according to claim 2, characterized in that: The thickness of the central plate, the fan-shaped plate and the strip plate is no greater than 2 mm.
4. The Bernoulli chuck device according to claim 2, characterized in that: The materials of the central plate, the fan-shaped plates and the strip plates are all polyvinylidene fluoride.
5. The Bernoulli chuck device according to claim 1, characterized in that: The Bernoulli chuck device also includes a moving device, which is used to fold or unfold the parts of the isolation device.
6. The Bernoulli chuck device according to claim 1, characterized in that: The carrying plate is also provided with a supporting column to support the isolating device.
7. A wafer backside cleaning device, characterized in that: It comprises the Bernoulli chuck device as described in any one of claims 1 to 6; when the wafer back side cleaning device performs automatic chamber cleaning, the isolation device is in an expanded state to cover the air holes of the carrier plate, and when the wafer back side cleaning device performs wafer back side cleaning, the isolation device is in a retracted state to expose the air holes.
8. The wafer backside cleaning device according to claim 7, characterized in that: When the isolation device is in a retracted state, the wafer to be cleaned is located on the isolation device, and the front side of the wafer faces the isolation device so that the back side of the wafer can be cleaned.
9. The wafer backside cleaning device according to claim 7, characterized in that: The wafer back side cleaning device also includes a cup-shaped isolation groove, and the Bernoulli chuck device is located in the isolation groove.