Semiconductor clamp

Abstract

The utility model discloses a semiconductor clamp which comprises a bearing disc, a plurality of mounting grooves are formed in the bearing disc, and the cross section of each mounting groove is in an inverted trapezoid shape. And a clamping unit which is installed in the installation groove so as to fix the semiconductor placed in the installation groove. Through the technical scheme provided by the invention, the wafer fixing device has the effects of stably fixing a large batch of wafers and improving the production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip manufacturing, in particular to a semiconductor clamp. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon dissolves and infiltrates into silicon crystal seeds, and then slowly pulls out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, also known as a wafer.

[0003] The main processing methods for wafers are piece processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size has increased the impact of the number of particles in the air in the wafer processing room on the quality reliability of wafer processing.

[0004] Wafer processing also requires cleaning and coating processes to ensure the quality of the wafer after processing. As the characteristic size of wafers is getting smaller and smaller, wafers are generally processed in batches in subsequent processing operations to improve work efficiency. Semiconductor fixtures are needed for subsequent wafer processing. Most of the semiconductor fixtures currently on the market cannot uniformly process batches of wafers, resulting in low production efficiency. Utility Model Content

[0005] One advantage of the utility model is that it provides a semiconductor fixture that can stably fix large quantities of wafers and improve production efficiency.

[0006] In order to achieve at least one of the above advantages of the present invention, the present invention provides a semiconductor clamp, including a carrying plate, on which a plurality of mounting grooves are formed, and the cross-sectional shape of the mounting grooves is an inverted trapezoid; and a clamping unit, which is installed in the mounting groove to fix the semiconductor placed in the mounting groove.

[0007] Through the above technical solution, the wafer that needs to be cleaned or coated is placed in the mounting groove of the carrier plate, and the clamping unit fixes the wafer, making it easier to clean or coat the wafer.

[0008] According to one embodiment of the utility model, the clamping unit includes a support plate, a plurality of suction holes and an air pump, wherein the support plate is installed at one end of the installation slot away from the surface of the carrier plate, the plurality of suction holes are opened on the support plate, and the air pump is connected to the plurality of suction holes.

[0009] Through the above technical solution, the support plate is used to support the wafer, the vacuum pump can generate suction, and the suction hole is opened on the support plate, which can adsorb the wafer on the support plate and fix the wafer to facilitate subsequent cleaning or coating work.

[0010] According to an embodiment of the utility model, the clamping unit further comprises a blower, the blower is connected to the plurality of suction holes, and the vacuum pump and the blower have opposite working hours.

[0011] Through the above technical solution, the clamping unit also includes a blower, which can generate a blowing force to prevent the wafer on the mounting groove from being pushed out of the mounting groove to facilitate disassembly.

[0012] According to an embodiment of the present invention, the semiconductor fixture includes an elastic member, and the elastic member is installed in the installation groove and abutted by the support plate.

[0013] Through the above technical solution, the elastic member can undergo elastic deformation, and can better fix the wafer installed in the installation groove.

[0014] According to an embodiment of the utility model, the elastic member includes a rubber pad, and a side of the rubber pad close to the support plate is arranged in a grid shape.

[0015] Through the above technical solution, the side of the rubber pad close to the support plate is set in a grid shape to facilitate ventilation of the suction holes.

[0016] According to an embodiment of the present invention, the rubber pad includes a metal frame, and the metal frame is installed in the grid shape of the rubber pad.

[0017] Through the above technical solution, the metal skeleton can prevent the grid-shaped rubber pad from breaking and the like, thereby increasing the service life of the rubber pad earrings.

[0018] According to an embodiment of the present invention, the metal skeleton includes a plurality of metal bars, and the plurality of metal bars are arranged in a predetermined arrangement order to form a plurality of quadrilaterals.

[0019] Through the above technical solution, the metal frame includes a plurality of metal strips, and the metal strips are staggered to form a quadrilateral to enhance the supporting force.

[0020] According to an embodiment of the present invention, the rubber pad further includes a lap edge, which is annular and abuts against the surface of the carrier plate.

[0021] Through the above technical solution, the overlap is ring-shaped and is installed on the rubber pad, which is convenient for operators to buckle the rubber pad and replace the rubber pad.

[0022] According to an embodiment of the present invention, the depth of the mounting groove is less than the thickness of the semiconductor.

[0023] Through the above technical solution, the depth of the mounting groove is less than the thickness of the semiconductor wafer, which facilitates cleaning or coating of the wafer surface.

[0024] According to an embodiment of the present invention, the semiconductor fixture includes a label plate, and the label plate is installed on the side wall of the carrier plate.

[0025] Through the above technical solution, the semiconductor teaching aid includes a label plate, which is installed on the side wall of the carrier plate, so that operators can easily record and observe the specifications of the semiconductor placed on the carrier plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The overall structural schematic diagram of the semiconductor fixture of the utility model is shown.

[0027] Figure 2 A front view of the semiconductor fixture of the present invention is shown.

[0028] Figure 3 The schematic diagram of the elastic member structure of the semiconductor clamp of the utility model is shown.

[0029] Figure 4 A structural schematic diagram showing a partial structure of the semiconductor fixture of the utility model.

[0030] Description of the drawings: 10. Carrying plate; 11. Mounting groove; 20. Clamping unit; 21. Suction assembly; 211. Support plate; 212. Suction hole; 213. Air pump; 214. Blower; 30. Elastic member; 31. Rubber pad; 32. Metal frame; 33. Overlap; 40. Label. DETAILED DESCRIPTION

[0031] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0032] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0033] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0034] refer to Figures 1 to 4 A semiconductor clamp according to a preferred embodiment of the utility model will be described in detail below. The semiconductor clamp includes a carrier plate 10 and a clamping unit 20. The carrier plate 10 is provided with a plurality of mounting grooves 11. The semiconductor is placed in the mounting grooves 11. The clamping unit 20 is installed in the mounting grooves 11 for fixing the semiconductor installed in the mounting grooves 11.

[0035] Specifically, the cross-sectional shape of the mounting groove 11 is an inverted trapezoid, that is, the diameter of the mounting groove 11 gradually decreases from top to bottom. This arrangement can adapt to semiconductor wafers of more specifications. It is worth mentioning that the depth of the mounting groove 11 is less than the thickness of the wafer, which is convenient for subsequent cleaning and lamination.

[0036] Specifically, the clamping unit 20 includes a suction component 21 , and the suction component 21 is installed in the mounting groove 11 , that is, the suction component 21 generates suction to adsorb and fix the wafer placed in the mounting groove 11 .

[0037] Preferably, the suction assembly 21 includes a support plate 211, a plurality of suction holes 212, and an air pump 213, wherein the support plate 211 is mounted on the mounting slot 11, the support plate 211 is arranged in parallel, and is used to support the wafer; the suction holes 212 are opened on the support plate 211, and the air pump 213 is connected to the suction holes 212. In this way, when the air pump 213 is working, the air pump 213 generates suction, so that the wafer placed on the support plate 211 can be stably adsorbed on the support plate 211.

[0038] Specifically, the semiconductor fixture includes an elastic member 30, and the elastic member 30 is installed in the mounting groove 11. It is worth mentioning that the elastic member 30 includes a rubber pad 31, and the rubber pad 31 is adapted to the mounting groove 11. It is worth mentioning that the side of the rubber pad 31 connected to the support plate 211 is set in a grid shape.

[0039] That is, when the vacuum pump 213 is working, suction is generated to adsorb the wafer to the side close to the support plate 211, and the wafer is pressed against the rubber pad 31. After the rubber pad 31 is deformed, the wafer is more stably fixed on the support plate 211.

[0040] It is worth mentioning that the elastic member 30 also includes a metal frame 32, the shape of the metal frame 32 is the same as the grid shape of the rubber pad 31, and is used to support the grid shape of the rubber pad 31 to prevent the grid-shaped part of the rubber pad 31 from breaking and damaging due to continuous backlog during use.

[0041] Specifically, the metal skeleton 32 includes a plurality of metal bars, which are arranged in a predetermined order to form a plurality of quadrilaterals. In this way, the grid shape of the rubber pad 31 will not affect the wind force generated by the suction hole 212 , and the metal skeleton 32 can increase the service life of the rubber pad 31 .

[0042] Preferably, the rubber pad 31 includes a lap 33, the lap 33 is annular and connected to the side of the rubber pad 31 away from the grid shape, and the lap 33 is connected to the upper surface of the carrier plate 10. In this way, when the rubber pad 31 needs to be replaced, the operator can replace the rubber pad 31 by taking the lap 33.

[0043] Specifically, the suction assembly 21 also includes a blower 214, which is installed in the suction hole 212. In the present embodiment, the blower 214 and the vacuum pump 213 work at opposite working hours. The blower 214 can generate wind force on the suction hole 212, and can push the wafer installed in the mounting groove 11 out of the mounting groove 11, so as to facilitate the operator to disassemble.

[0044] Specifically, a label plate 40 is provided on the carrier tray 10 , and the label plate 40 is installed on the side wall of the carrier tray 10 , so that an operator can know the specifications of the semiconductor chips on the carrier tray 10 through the label plate 40 .

[0045] In summary, the operator places the wafers to be cleaned or coated in the mounting groove 11 of the carrier plate 10 in accordance with the specifications, and turns on the vacuum pump 213, so that the wafers are stably fixed in the mounting groove 11, and the upper surface of the wafer protrudes from the carrier plate 10, and the cleaning or coating work can be performed. When the wafer is cleaned or coated, the vacuum pump 213 stops working, and the blower 214 is turned on at this time, so that the wafer can be easily taken out of the mounting groove 11.

[0046] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The advantages of the present invention have been fully and effectively realized. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A semiconductor fixture, characterized in that: include A carrier plate, on which a plurality of mounting grooves are formed, and the cross-sectional shape of the mounting grooves is an inverted trapezoid; and A clamping unit is installed in the mounting groove to fix the semiconductor placed in the mounting groove.

2. The semiconductor fixture according to claim 1, characterized in that The clamping unit includes a support plate, a plurality of suction holes and an air pump, wherein the support plate is installed at one end of the installation slot away from the surface of the carrier plate, the plurality of suction holes are opened on the support plate, and the air pump is connected to the plurality of suction holes.

3. The semiconductor fixture according to claim 2, characterized in that The clamping unit further comprises a blower, which is connected to the plurality of suction holes, and the suction pump and the blower have opposite working times.

4. The semiconductor fixture according to claim 2, characterized in that: The semiconductor fixture comprises an elastic member, which is installed in the installation groove and abutted by the support plate.

5. The semiconductor fixture according to claim 4, characterized in that: The elastic member includes a rubber pad, and a side of the rubber pad close to the support plate is arranged in a grid shape.

6. The semiconductor fixture according to claim 5, characterized in that The rubber pad includes a metal frame, and the metal frame is installed in the grid shape of the rubber pad.

7. The semiconductor fixture according to claim 6, characterized in that: The metal skeleton includes a plurality of metal bars, and the plurality of metal bars are arranged in a predetermined arrangement order to form a plurality of quadrilaterals.

8. The semiconductor fixture according to claim 6, wherein: The rubber pad also includes a lap edge, which is annular and abuts against the surface of the carrying plate.

9. The semiconductor fixture according to claim 1, wherein: The depth of the mounting groove is smaller than the thickness of the semiconductor.

10. The semiconductor fixture according to claim 1, wherein: The semiconductor fixture includes a label plate, and the label plate is installed on the side wall of the carrier plate.

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