Field effect transistor capable of preventing pin deformation

Abstract

The utility model discloses a field effect transistor capable of preventing pin deformation, which comprises a transistor main body, the bottom end of the transistor main body is fixedly connected with a pin main body, and the top end of the transistor main body is fixedly connected with a connecting plate. According to the field effect transistor capable of preventing pin deformation, the protection shell, the elastic block, the limiting clamping block, the fixing block and the limiting clamping groove are arranged, the protection shell is arranged outside the pin body, so that the pin body can be protected, the pin body is prevented from being bent and deformed when the field effect transistor is transported, and when the field effect transistor needs to be used, the top end of one side of the elastic block is pressed; the limiting clamping blocks are separated from the interiors of the limiting clamping grooves, so that the fixing blocks are not fixed, the protection shell can be disassembled after the fixing blocks are not fixed, the field effect transistor can be used after the protection shell is disassembled, and the problems that pins are prone to deformation and damage during transportation, and use of the field effect transistor is prone to being affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a field effect transistor capable of preventing pin deformation. Background Art

[0002] A field effect transistor is a type of transistor that uses an electric field to control the flow of current in a semiconductor. A field effect transistor is also called a unipolar transistor. It has the advantages of high input resistance, low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown, and a wide safe operating area. The pins of a field effect transistor are easily deformed and damaged during transportation, which can easily affect the use of the field effect transistor. Therefore, we propose a field effect transistor with anti-pin deformation to improve the above-mentioned problems. Utility Model Content

[0003] The utility model aims to provide a field effect transistor with anti-pin deformation, so as to solve the problem in the background art that the pins are easily deformed and damaged during transportation, which easily affects the use of the field effect transistor.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a field effect transistor for preventing pin deformation, comprising a transistor body, the bottom end of the transistor body is fixedly connected to a pin body, the top end of the transistor body is fixedly connected to a connecting plate, the top ends of both sides of the connecting plate are provided with grooves, the inside of the connecting plate is provided with through holes, a protective shell is arranged on the outside of the pin body, fixed blocks are welded on the top ends of both sides of the inside of the protective shell, a limiting card slot is arranged inside the fixed block, the bottom ends of both sides of the transistor body are fixedly connected to elastic blocks, both sides of the elastic block are fixedly connected to limiting card blocks, and a heat sink is arranged on the front end of the transistor body.

[0005] Preferably, the limiting card block is embedded in the limiting card slot, and the limiting card block and the limiting card slot cooperate with each other.

[0006] Preferably, the protective shell is installed on the bottom end of the outside of the transistor body through a limiting block and a fixing block, and the pin body is provided with three groups.

[0007] Preferably, thermally conductive silicone sheets are provided on both sides of the outside of the transistor body, and the thermally conductive silicone sheets are symmetrically distributed about a vertical center line of the transistor body.

[0008] Preferably, the heat dissipation plate is provided with heat dissipation holes inside, and the heat dissipation holes are provided in a plurality of groups, and the heat dissipation holes are arranged at equal intervals inside the heat dissipation plate.

[0009] Preferably, a dustproof net is provided at one end of the heat dissipation plate, mounting holes are provided at four corners inside the heat dissipation plate and the dustproof net, and mounting bolts are provided inside the mounting holes.

[0010] Preferably, the mounting bolts are symmetrically distributed about a vertical center line of the heat dissipation plate, and the dustproof net is arranged at the front end of the heat dissipation hole.

[0011] Preferably, the mounting bolts and the mounting holes cooperate with each other, and the dustproof net is installed on the front end of the heat dissipation plate through the mounting bolts and the mounting holes.

[0012] Compared with the prior art, the utility model has the beneficial effects that: the field effect transistor with anti-pin deformation not only realizes the protection of the pins of the transistor during transportation, improves the heat dissipation effect, but also realizes the convenience of disassembling the dustproof net;

[0013] By providing a protective shell, an elastic block, a limiting card block, a fixed block and a limiting card slot, the protective shell is arranged outside the pin body, so as to protect the pin body and prevent the pin body from bending and deforming during transportation of the field effect transistor. When it is needed to be used, the top of one side of the elastic block is pressed to make the limiting card block disengage from the inside of the limiting card slot, so that the fixing block loses its fixation. After the fixing block loses its fixation, the protective shell can be disassembled, and after the protective shell is disassembled, the field effect transistor can be used;

[0014] By providing a heat-conducting silicone sheet, a heat sink and heat dissipation holes, the heat-conducting silicone sheet can conduct heat to the inside of the transistor body to cool the inside of the transistor body, and multiple groups of heat dissipation holes are opened inside the heat sink. The heat dissipation holes can ventilate the inside of the transistor body, which can further improve the heat dissipation effect. Improving the heat dissipation effect inside the transistor body can prevent the temperature inside the transistor body from being too high, causing damage to components;

[0015] By providing mounting bolts, dustproof nets and mounting holes, the dustproof net can filter the air entering the interior of the transistor body through the heat dissipation holes, thereby preventing dust and impurities from entering the interior of the transistor body and affecting the components inside the transistor body. When it is necessary to clean the dust and impurities on the surface of the dustproof net, the mounting bolts are screwed into the mounting holes to make the dustproof net lose its fixation. After the dustproof net loses its fixation, the dustproof net can be removed from the front end of the heat sink, thereby making it convenient to clean the surface of the dustproof net and the dust and impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of a partially enlarged side view of the transistor body of the utility model;

[0018] Figure 3 It is a schematic diagram of an enlarged front cross-sectional structure of the heat dissipation plate of the utility model;

[0019] Figure 4 For the utility model Figure 1 Schematic diagram of the enlarged cross-section structure at point A in the middle.

[0020] In the figure: 1. Pin body; 2. Protective shell; 3. Transistor body; 4. Thermal conductive silicone sheet; 5. Heat sink; 6. Connecting plate; 7. Perforation; 8. Groove; 9. Mounting bolt; 10. Dustproof net; 11. Mounting hole; 12. Heat dissipation hole; 13. Elastic block; 14. Limiting block; 15. Fixing block; 16. Limiting slot. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example 1: Please refer to Figure 1-4 , a field effect transistor for preventing pin deformation, comprising a transistor body 3, a pin body 1 being fixedly connected to the bottom end of the transistor body 3, a connecting plate 6 being fixedly connected to the top end of the transistor body 3, grooves 8 being provided at the top ends of both sides of the connecting plate 6, a through hole 7 being provided inside the connecting plate 6, a protective shell 2 being provided outside the pin body 1, fixing blocks 15 being welded at the top ends of both sides of the inside of the protective shell 2, a limiting card slot 16 being provided inside the fixing block 15, elastic blocks 13 being fixedly connected to the bottom ends of both sides of the transistor body 3, limiting card blocks 14 being fixedly connected to both sides of the elastic block 13, and a heat sink 5 being provided at the front end of the transistor body 3;

[0023] The limit block 14 is embedded in the limit slot 16, and the limit block 14 and the limit slot 16 cooperate with each other;

[0024] Specifically, Figure 1 and Figure 4 As shown, the protective shell 2 is arranged on the outside of the pin body 1, so as to protect the pin body 1 and prevent the pin body 1 from bending and deforming during transportation of the field effect transistor. When it is needed, the top of one side of the elastic block 13 is pressed to make the limiting card block 14 disengage from the inside of the limiting card slot 16, so that the fixing block 15 can lose its fixation. After the fixing block 15 loses its fixation, the protective shell 2 can be disassembled, and the field effect transistor can be used after the protective shell 2 is disassembled.

[0025] Embodiment 2: The protective shell 2 is installed at the bottom end of the outside of the transistor body 3 through the limiting block 14 and the fixing block 15, the pin body 1 is provided with three groups, and the two sides of the outside of the transistor body 3 are provided with thermal conductive silicone sheets 4, and the thermal conductive silicone sheets 4 are symmetrically distributed about the vertical center line of the transistor body 3. The heat dissipation holes 12 are opened inside the heat dissipation plate 5, and the heat dissipation holes 12 are provided with multiple groups, and the heat dissipation holes 12 are arranged at equal intervals inside the heat dissipation plate 5;

[0026] Specifically, Figure 1 and Figure 3 As shown, the thermally conductive silicone sheet 4 can conduct heat to the interior of the transistor body 3 to cool the interior of the transistor body 3. A plurality of heat dissipation holes 12 are opened inside the heat sink 5. The heat dissipation holes 12 can ventilate the interior of the transistor body 3 and further improve the heat dissipation effect. Improving the heat dissipation effect inside the transistor body 3 can prevent the temperature inside the transistor body 3 from being too high, causing damage to components.

[0027] Embodiment 3: A dustproof net 10 is provided at one end of the heat sink 5, and mounting holes 11 are provided at four corners inside the heat sink 5 and the dustproof net 10. Mounting bolts 9 are provided inside the mounting holes 11, and the mounting bolts 9 are symmetrically distributed about the vertical center line of the heat sink 5. The dustproof net 10 is provided at the front end of the heat dissipation hole 12, and the mounting bolts 9 and the mounting holes 11 cooperate with each other. The dustproof net 10 is installed at the front end of the heat sink 5 through the mounting bolts 9 and the mounting holes 11;

[0028] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, the dustproof net 10 can filter the air entering the interior of the transistor body 3 through the heat dissipation holes 12, thereby preventing dust and impurities from entering the interior of the transistor body 3 and affecting the components inside the transistor body 3. When it is necessary to clean the dust and impurities on the surface of the dustproof net 10, the mounting bolts 9 are screwed into the mounting holes 11 to make the dustproof net 10 lose its fixation. After the dustproof net 10 loses its fixation, the dustproof net 10 can be removed from the front end of the heat dissipation plate 5, thereby making it convenient to clean the surface of the dustproof net 10 and the dust and impurities.

[0029] Working principle: When the utility model is in use, the thermally conductive silicone sheet 4 can conduct heat to the inside of the transistor body 3 to cool down the inside of the transistor body 3. A plurality of heat dissipation holes 12 are provided inside the heat dissipation plate 5. The heat dissipation holes 12 can ventilate the inside of the transistor body 3, which can further improve the heat dissipation effect. Improving the heat dissipation effect inside the transistor body 3 can prevent the temperature inside the transistor body 3 from being excessive and causing damage to the components, thereby increasing the service life of the transistor body 3. The dustproof net 10 can filter the air entering the inside of the transistor body 3 through the heat dissipation holes 12, thereby preventing dust and impurities from entering the inside of the transistor body 3 and affecting the components inside the transistor body 3. When it is necessary to clean the dust and impurities on the surface of the dustproof net 10, screw the mounting bolts 9 from the inside of the mounting holes 11 to make the dustproof net 10 lose its fixation. After the dustproof net 10 loses its fixation, the dustproof net 10 can be removed from the heat dissipation plate 11. The front end of the plate 5 is removed, so that the surface of the dustproof net 10 and dust and impurities can be easily cleaned. The protective shell 2 is arranged on the outside of the pin body 1, so that the pin body 1 can be protected to prevent the pin body 1 from bending and deforming during transportation of the field effect transistor. When it is needed, the top of one side of the elastic block 13 is pressed to make the limit card block 14 disengage from the inside of the limit card slot 16, so that the fixing block 15 can lose its fixation. After the fixing block 15 loses its fixation, the protective shell 2 can be removed. After the protective shell 2 is removed, the field effect transistor can be used. When the protective shell 2 needs to be installed on the pin body 1, press the elastic block 13, and then put the protective shell 2 on the outside of the pin body 1. When putting on the protective shell 2, align the limit card block 14 with the limit card slot 16. After alignment, release the elastic block 13, and the elastic block 13 drives the limit card block 14 to be embedded in the inside of the limit card slot 16 to complete the installation of the protective shell 2.

[0030] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A field effect transistor for preventing pin deformation, comprising a transistor body (3), characterized in that: The bottom end of the transistor body (3) is fixedly connected to a pin body (1), the top end of the transistor body (3) is fixedly connected to a connecting plate (6), the top ends of both sides of the connecting plate (6) are provided with grooves (8), the inside of the connecting plate (6) is provided with a through hole (7), a protective shell (2) is arranged outside the pin body (1), the top ends of both sides of the protective shell (2) are welded with fixing blocks (15), the inside of the fixing blocks (15) is provided with a limit slot (16), the bottom ends of both sides of the transistor body (3) are fixedly connected to elastic blocks (13), the two sides of the elastic block (13) are respectively fixedly connected to limit blocks (14), and the front end of the transistor body (3) is provided with a heat sink (5).

2. The field effect transistor with anti-pin deformation according to claim 1, characterized in that: The limit card block (14) is embedded in the limit card slot (16), and the limit card block (14) and the limit card slot (16) cooperate with each other.

3. The field effect transistor with anti-lead deformation according to claim 1, characterized in that: The protective shell (2) is installed at the bottom end outside the transistor body (3) via a limiting clamp block (14) and a fixing block (15), and the pin body (1) is provided with three groups.

4. The field effect transistor with anti-lead deformation according to claim 1, characterized in that: Thermally conductive silicone sheets (4) are arranged on both sides of the outside of the transistor body (3), and the thermally conductive silicone sheets (4) are symmetrically distributed with respect to a vertical center line of the transistor body (3).

5. The field effect transistor with anti-lead deformation according to claim 3, characterized in that: The heat dissipation plate (5) is provided with heat dissipation holes (12) inside, and the heat dissipation holes (12) are provided in a plurality of groups. The heat dissipation holes (12) are arranged at equal intervals inside the heat dissipation plate (5).

6. The field effect transistor with anti-lead deformation according to claim 1, characterized in that: A dustproof net (10) is provided at one end of the heat dissipation plate (5), mounting holes (11) are provided at four corners inside the heat dissipation plate (5) and the dustproof net (10), and mounting bolts (9) are provided inside the mounting holes (11).

7. The field effect transistor with anti-lead deformation according to claim 6, characterized in that: The mounting bolts (9) are symmetrically distributed about the vertical center line of the heat dissipation plate (5), and the dustproof net (10) is arranged at the front end of the heat dissipation hole (12).

8. The field effect transistor for preventing lead deformation according to claim 6, characterized in that: The mounting bolts (9) and the mounting holes (11) cooperate with each other, and the dust screen (10) is mounted on the front end of the heat sink (5) via the mounting bolts (9) and the mounting holes (11).

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