Novel radio frequency board

Abstract

A novel radio frequency board comprises a radio frequency module, a power management module and a control module which are arranged on a PCB, and the radio frequency module comprises an MMIC reflection type single-pole double-throw switch chip U26, an MMIC reflection type single-pole double-throw switch chip U24, a numerical control attenuator chip U9, a radio frequency switch chip U23, a radio frequency switch chip U21 and a radio frequency mixer chip U22. The chip U26 and the chip U24 form a two-path selection first switch circuit, the input end of the first switch circuit inputs radio frequency, the output end of the first switch circuit is connected with a numerical control attenuator chip U9 for carrying out amplitude limiting processing on signals higher than a threshold value, the numerical control attenuator chip U9 is connected with a second switch circuit formed by a radio frequency switch chip U23 and a radio frequency switch chip U21, and the radio frequency switch chip U23 and the radio frequency switch chip U21 are connected with the first switch circuit. A second switch circuit formed by the radio frequency switch chip U23 and the radio frequency switch chip U21 is provided with four signal channels with different frequency bands, and the output end of the second switch circuit is connected with the input end of the radio frequency mixer chip U22.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency, in particular to a novel radio frequency board. Background Art

[0002] The RF circuits integrated in some current RF boards cover a narrow frequency band and cannot be used in higher frequency bands. If you want to expand the frequency band, you need to combine the soft substrate process with the printed circuit board. This not only increases the volume, but also increases the weight accordingly, which is not conducive to the production of some portable devices or the needs of some equipment such as drones. Therefore, there is an urgent need for an RF board that can integrate a wider frequency band and is small in size and light in weight to solve these problems. Utility Model Content

[0003] The purpose of the utility model is to provide a new type of radio frequency board, a single-board design, on which some packaged device circuits are integrated, which can be used in some low-frequency band occasions. At the same time, some bare chips are integrated on this board and applied to high-frequency band occasions. The combination of the two will widen the frequency band, and both are integrated on a single board, which greatly reduces the volume and weight, and can greatly meet the needs of some portable devices and some lightweight equipment.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] A novel radio frequency board comprises a radio frequency module, a power management module and a control module arranged on a PCB board, wherein the control module is connected to the radio frequency module, the power management module supplies power to the radio frequency module and the control module, and the radio frequency module comprises an MMIC reflective single-pole double-throw switch chip U26, an MMIC reflective single-pole double-throw switch chip U24, a digitally controlled attenuator chip U9, a radio frequency switch chip U23, a radio frequency switch chip U21 and a radio frequency mixer chip U22;

[0006] The transmitting single-pole double-throw switch chip U26 and the MMIC reflective single-pole double-throw switch chip U24 constitute a first switch circuit with two-way selection. The input end of the first switch circuit inputs radio frequency. The output end of the first switch circuit is connected to a digitally controlled attenuator chip U9 that performs amplitude limiting processing on signals above a threshold. The digitally controlled attenuator chip U9 is connected to a second switch circuit formed by a radio frequency switch chip U23 and a radio frequency switch chip U21. The second switch circuit formed by the radio frequency switch chip U23 and the radio frequency switch chip U21 has four signal channels of different frequency bands. The output end of the second switch circuit is connected to the input end of the radio frequency mixer chip U22.

[0007] As a preferred embodiment, the RF signal input terminal is connected to the input terminal of the filter F5, the output terminal of the filter F5 is connected to the 7th pin of the chip U26, the 5th pin, the 6th pin and the 8th pin of the chip U26 are connected and grounded; the 9th pin, the 10th pin and the 12th pin of the chip U26 are connected to each other and grounded; the 1st pin, the 3rd pin and the 4th pin of the chip U26 are connected to each other and grounded; the 13th pin of the chip U26 is grounded; the 14th pin of the chip U26 is connected to the 18th pin of the chip U5, the 15th pin of the chip U26 is connected to the 17th pin of the chip U5; the 16th pin of the chip U26 is connected to the power management module; the chip U Pin 2 of U26 is connected to pin 11 of chip U24; pin 11 of chip U26 is connected to pin 1 of monolithic amplifier U29, the model of monolithic amplifier U29 is IGB-005B-S89, pins 2 and 4 of monolithic amplifier U29 are grounded, pin 3 of monolithic amplifier U29 is connected to one end of inductor L3 and one end of capacitor C19, the other end of inductor L3 is connected to one end of capacitor C18 and one end of resistor R3, the other end of capacitor C18 is grounded, and the other end of resistor R3 is connected to the power management module; the other end of capacitor C19 is connected to pin 2 of chip U24;

[0008] Pin 13 of chip U24 is grounded, and pins 1, 3, and 4 of chip U24 are connected to each other and then to ground; pins 5, 6, and 8 of chip U24 are connected to each other and then to ground; pins 9, 10, and 12 of chip U24 are connected and then to ground; pin 19 of chip U24 is connected to the power management module, pin 15 of chip U24 is connected to pin 19 of chip U5, and pin 14 of chip U24 is connected to pin 20 of chip U5;

[0009] Pin 7 of chip U24 is connected to pin 3 of digital control attenuator chip U9, pin 1 of digital control attenuator chip U9 is connected to pin 2 and grounded, pin 4 of digital control attenuator chip U9 is connected to pin 5 and grounded, pin 6 of digital control attenuator chip U9 is connected to pin 7, pin 8, pin 9, pin 10 and grounded, pin 11 of digital control attenuator chip U9 is connected to pin 12, pin 14 and grounded; pin 15 of digital control attenuator chip U9 is connected to power management module; pin 16, pin 17, pin 18 and pin 19 of digital control attenuator chip U9 are connected to pin 28, pin 27, pin 26 and pin 25 of chip U5 respectively; pin 20 of digital control attenuator chip U9 is grounded;

[0010] Pin 13 of the digital control attenuator chip U9 is connected to pin 15 of the RF switch chip U23, and pins 13, 14, and 16 of the RF switch chip U23 are connected and then grounded; pins 10 and 11 of the RF switch chip U23 are connected and then grounded, and pins 2 and 3 of the RF switch chip U23 are grounded and then grounded; pin 5 of the RF switch chip U23 is grounded, pin 6 of the RF switch chip U23 is connected to the power management module, and pins 7 and 8 of the RF switch chip U23 are connected to pins 29 and 30 of the chip U5 respectively;

[0011] Pin 1 of the RF switch chip U23 is connected to the input end of the low-pass filter F8, the input end of the low-pass filter F8 is connected to pin 1 of the attenuator chip U28, pins 3 and 4 of the attenuator chip U28 are grounded, pin 2 of the attenuator U28 is connected to the input end of the low-pass filter F9, and the output end of the low-pass filter F9 is connected to pin 12 of the RF switch chip U21;

[0012] Pin 4 of the RF switch chip U23 is connected to pin 9 of the RF switch chip U21; pin 9 of the RF switch chip U23 is connected to pin 4 of the RF switch chip U21 through a low-pass filter F3; pin 12 of the RF switch chip U23 is connected to the input end of the low-pass filter F1, the output end of the low-pass filter F1 is connected to pin 2 of the attenuator chip U2, pins 3 and 4 of the attenuator chip U2 are grounded, pin 1 of the attenuator chip U2 is connected to the input end of the low-pass filter F2, and the output end of the low-pass filter F2 is connected to pin 1 of the RF switch chip U21;

[0013] Pin 5 of the RF switch chip U21 is grounded, pin 2 and pin 3 of the RF switch chip U21 are connected and then grounded, pin 10 and pin 11 of the RF switch chip U21 are connected and then grounded, and pin 13, pin 14, and pin 16 of the RF switch chip U21 are connected and then grounded; pin 6 of the RF switch chip U21 is connected to the power management module, and pin 7 and pin 8 of the RF switch chip U21 are connected to pin 32 and pin 31 of the chip U5 respectively;

[0014] Pin 15 of the RF switch chip U21 is connected to pin 1 of the monolithic amplifier U25, pins 2 and 4 of the monolithic amplifier U25 are grounded, and pin 3 of the monolithic amplifier U25 is connected to one end of the inductor L1 and one end of the capacitor C7; the other end of the inductor L1 is connected to one end of the capacitor C6 and one end of the resistor R1; the other end of the capacitor C6 is grounded; the other end of the resistor R1 is connected to the power management module; the other end of the capacitor C7 is connected to the input end of the low-pass filter F4, and the output end of the low-pass filter F4 is connected to pin 5 of the RF mixer chip U22;

[0015] Pin 4 and pin 6 of the RF mixer chip U22 are connected to ground; Pin 7 and pin 9 of the RF mixer chip U22 are connected to ground; Pin 1 and pin 3 of the RF mixer chip U22 are connected to ground; Pin 10, Pin 11, and Pin 12 of the RF mixer chip U22 are connected to each other; Pin 2 of the RF mixer chip U22 is connected to the external port LO1, and the frequency is provided from the outside; Pin 8 of the RF mixer chip U22 is connected to the input end of the low-pass filter F6, and the output end of the low-pass filter F6 is connected to Pin 1 of the gain amplifier chip U27, Pin 3 and Pin 4 of the gain amplifier chip U27 are grounded, Pin 3 of the gain amplifier chip U27 is connected to one end of the inductor L2 and one end of the capacitor C17, the other end of the inductor L2 is connected to one end of the capacitor C15 and one end of the resistor R2, the other end of the capacitor C15 is grounded, and the other end of the resistor R2 is connected to the power management module; the other end of the capacitor C17 is connected to the input end of the low-pass filter F7, and the output end of the low-pass filter F7 outputs a signal.

[0016] As a preferred technical solution, the models of chip U26 and chip U24 are ISW-0045DT, the model of chip U9 is IDA-0006-1D, the model of chip U23 and chip U21 are HMC7992LP3DE, and the model of chip U22 is MM1-0626S; the model of attenuator chip U28 is FAC1202.

[0017] As a preferred technical solution, the chips 26, 24, 9, 22 and 27 are bonded to the PCB board using bare chip gold wires.

[0018] As a preferred technical solution, the control module includes an FPGA programmable gate array chip U5 and its basic circuits. The model of the chip U5 is 10M16SAE144I7G.

[0019] As a preferred technical solution, the power management module includes a DC-DC buck chip U3, a buck chip U4, a buck chip U8, and a buck chip U6.

[0020] As a preferred technical solution, pin 1 of the step-down chip U3 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to one end of the capacitor C8, the other end of the capacitor C8 is connected to one end of the resistor R9, and the other end of the resistor R9 is connected to pin 7 of the chip U3; one end of the resistor R9 is also connected to pin 3 of the chip U3, the cathode of the diode D1, and one end of the inductor L25, and the anode of the diode D1 is grounded;

[0021] Pin 2 of chip U3 is connected to one end of capacitor C11, one end of capacitor C10, one end of capacitor C13, and one end of inductor B7. The other end of inductor B7 is connected to one end of capacitor C12 and connected to 28V voltage. The other end of capacitor C12, the other end of C11, the other end of capacitor C10, and the other end of capacitor C13 are grounded.

[0022] Pin 4 of chip U3 is grounded, pin 5 of chip U3 is connected to one end of resistor R10 and one end of resistor R16, the other end of resistor R10 is grounded, the other end of resistor R16 is connected to the other end of inductor L25, one end of capacitor C14, one end of capacitor C22, one end of capacitor C86, one end of capacitor C23, one end of inductor B2, the other end of inductor B2 is connected to one end of capacitor C26 and outputs voltage to port VEE; the other end of capacitor C26, the other end of capacitor C23, the other end of capacitor C86, the other end of capacitor C22, and the other end of capacitor C14 are grounded;

[0023] Pin 6 of chip U3 is connected to one end of capacitor C52 and one end of capacitor C27, the other end of capacitor C52 is connected to ground through resistor R19, and the other end of capacitor C27 is grounded;

[0024] Pin 1 of the step-down chip U4 is connected to one end of the resistor R22, the other end of the resistor R22 is connected to one end of the capacitor C59, the other end of the capacitor C59 is connected to one end of the resistor R23, and the other end of the resistor R23 is connected to pin 7 of the chip U4; one end of the resistor R23 is also connected to pin 3 of the chip U3, the cathode of the diode D2, and one end of the inductor L27, and the anode of the diode D2 is grounded;

[0025] Pin 2 of chip U4 is connected to one end of capacitor C88, one end of capacitor C87, one end of capacitor C92, and one end of inductor B8. The other end of inductor B8 is connected to one end of capacitor C90 and connected to 28V voltage. The other end of capacitor C90, the other end of C92, the other end of capacitor C87, and the other end of capacitor C88 are grounded.

[0026] Pin 4 of chip U4 is grounded, pin 5 of chip U4 is connected to one end of resistor R26 and one end of resistor R28, the other end of resistor R26 is grounded, the other end of resistor R28 is connected to the other end of inductor L27, one end of capacitor C94, one end of capacitor C104, one end of capacitor C120, one end of capacitor C96, one end of inductor B4, the other end of inductor B4 is connected to one end of capacitor C100 and outputs voltage to port VEE1; the other end of capacitor C100, the other end of capacitor C96, the other end of capacitor C120, the other end of capacitor C104, and the other end of capacitor C94 are grounded;

[0027] Pin 6 of chip U4 is connected to one end of capacitor C101 and one end of capacitor C102, the other end of capacitor C102 is connected to ground through resistor R29, and the other end of capacitor C101 is grounded;

[0028] Pin 1 of the step-down chip U8 is connected to one end of the capacitor C123, one end of the capacitor C138 and connected to the voltage 5.3V input port; the other end of the capacitor C123 and the other end of the capacitor C138 are grounded; Pin 3 of the chip U8 is connected to one end of the resistor R14, and the other end of the resistor R14 is connected to Pin 33 of the chip U5; Pin 2 of the chip U8 is grounded, and Pin 5 of the chip U8 is connected to one end of the capacitor C139 and one end of the capacitor C124 and the output voltage is connected to the RF-5V port; the other end of the capacitor C139 and the other end of the capacitor C124 are connected to each other and grounded;

[0029] Pin 1 of the step-down chip U6 is connected to one end of the capacitor C134, one end of the capacitor C136, one end of the capacitor C121, and one end of the inductor B6. The other end of the inductor B6 is connected to one end of the capacitor C133 and outputs a voltage to the port VEE2. The other end of the capacitor C134, the other end of the capacitor C136, the other end of the capacitor C121C, and the other end of the capacitor C133 are grounded.

[0030] Pin 2 of chip U6 is connected to one end of resistor R24, one end of capacitor C291, one end of capacitor C321, one end of capacitor C320, and one end of inductor B9; the other end of inductor B9 is connected to one end of capacitor C294 and inputs a voltage of 5V; the other end of capacitor C294, the other end of capacitor C320, the other end of capacitor C321, and the other end of capacitor C291 are grounded; the other end of inductor R24 ​​is connected to pin 5 of chip U6; pin 4 of chip U6 is grounded; pin 3 of chip U6 is connected to pin 6 of chip U6 via capacitor C135;

[0031] As a preferred technical solution, the models of the buck chip U3 and the buck chip U4 are both SGM6232YPS8G / TR; the model of the buck chip U8 is SGM2211-5.0XN5G / TR; and the model of the buck chip U6 is SGM3204YN6G / TR.

[0032] Compared with the prior art, the utility model has the following beneficial effects:

[0033] Chip 26, chip 24, chip 9, chip 22, and chip 27 are directly bonded to the PCB board with gold wires using bare chips, and then the entire PCB board is packaged together with a packaging structure. Through the gold wire bonding process, the above-mentioned bare chips can be directly bonded to the PCB board, thereby reducing the weight of the entire PCB board. The incoming signals of different frequency bands can be selected through the first switching circuit formed by chip 26 and chip 24, and correspond to the subsequent processing circuit, so that signals with a wider frequency band can be accessed. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is the U5A part of the programmable gate array chip in the control module of the utility model;

[0035] Figure 2 It is the U5B part of the programmable gate array chip in the control module of the utility model;

[0036] Figure 3 It is the U5C part of the programmable gate array chip in the control module of the utility model;

[0037] Figure 4 It is the U5D part of the programmable gate array chip in the control module of the utility model;

[0038] Figure 5 It is the programmable gate array chip flash memory chip U1 and its basic circuit in the control module of the utility model;

[0039] Figure 6 This is a circuit schematic diagram of the buck chip U3 in the power management module of the utility model;

[0040] Figure 7 This is a circuit schematic diagram of the buck chip U4 in the power management module of the utility model;

[0041] Figure 8 This is a circuit schematic diagram of the buck chip U8 in the power management module of the utility model;

[0042] Fig. 9 This is a circuit schematic diagram of the buck chip U10 in the power management module of the utility model;

[0043] Fig.10 This is a circuit schematic diagram of the first part of the radio frequency module of the utility model;

[0044] Fig.11 This is a circuit schematic diagram of the second part of the radio frequency module of the utility model;

[0045] Fig.12 This is the circuit schematic diagram of the third part of the radio frequency module of the utility model. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] On the contrary, the present application covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present application as defined by the claims. Further, in order to make the public have a better understanding of the present application, some specific details are described in detail in the detailed description of the present application below. Those skilled in the art can fully understand the present application without the description of these details.

[0048] Example

[0049] A novel radio frequency board comprises a radio frequency module, a power management module and a control module which are arranged on a PCB board.

[0050] The power management module provides power to the control module and the radio frequency module, and the radio frequency module is used to process radio frequency signals.

[0051] The control module includes an FPGA programmable gate array chip U5, and the model of the chip U5 is 10M16SAE144I7G. Figure 1-4 As shown, it is divided into three figures to show the chip U5 and its basic circuit. Figure 1 The U5A part of the chip is shown. Figure 2 The U5B part of the chip is shown. Figure 3 The U5C part of the chip is shown. Figure 4 The chip U5D portion is shown. The chip U5 is connected to the flash memory chip U1, such as Figure 5 Shown is the flash memory chip U1 and its basic circuit.

[0052] Among them, the power management module includes DC-DC buck chip U3, buck chip U4, buck chip U8, and buck chip U6. The models of buck chip U3 and buck chip U4 are both SGM6232YPS8G / TR; the model of buck chip U8 is SGM2211-5.0XN5G / TR; the model of buck chip U6 is SGM3204YN6G / TR.

[0053] like Figure 6 As shown, pin 1 of the step-down chip U3 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to one end of the capacitor C8, the other end of the capacitor C8 is connected to one end of the resistor R9, and the other end of the resistor R9 is connected to pin 7 of the chip U3; one end of the resistor R9 is also connected to pin 3 of the chip U3, the cathode of the diode D1, and one end of the inductor L25, and the anode of the diode D1 is grounded.

[0054] Pin 2 of chip U3 is connected to one end of capacitor C11, one end of capacitor C10, one end of capacitor C13, and one end of inductor B7. The other end of inductor B7 is connected to one end of capacitor C12 and connected to 28V voltage. The other end of capacitor C12, the other end of C11, the other end of capacitor C10, and the other end of capacitor C13 are grounded.

[0055] Pin 4 of chip U3 is grounded, pin 5 of chip U3 is connected to one end of resistor R10 and one end of resistor R16, the other end of resistor R10 is grounded, the other end of resistor R16 is connected to the other end of inductor L25, one end of capacitor C14, one end of capacitor C22, one end of capacitor C86, one end of capacitor C23, and one end of inductor B2, the other end of inductor B2 is connected to one end of capacitor C26 and outputs voltage to port VEE; the other end of capacitor C26, the other end of capacitor C23, the other end of capacitor C86, the other end of capacitor C22, and the other end of capacitor C14 are grounded.

[0056] Pin 6 of the chip U3 is connected to one end of the capacitor C52 and one end of the capacitor C27. The other end of the capacitor C52 is connected to the ground through the resistor R19, and the other end of the capacitor C27 is grounded.

[0057] like Figure 7 As shown, pin 1 of the step-down chip U4 is connected to one end of the resistor R22, the other end of the resistor R22 is connected to one end of the capacitor C59, the other end of the capacitor C59 is connected to one end of the resistor R23, and the other end of the resistor R23 is connected to pin 7 of the chip U4; one end of the resistor R23 is also connected to pin 3 of the chip U3, the cathode of the diode D2, and one end of the inductor L27, and the anode of the diode D2 is grounded.

[0058] Pin 2 of chip U4 is connected to one end of capacitor C88, one end of capacitor C87, one end of capacitor C92, and one end of inductor B8. The other end of inductor B8 is connected to one end of capacitor C90 and connected to 28V voltage. The other end of capacitor C90, the other end of C92, the other end of capacitor C87, and the other end of capacitor C88 are grounded.

[0059] Pin 4 of chip U4 is grounded, pin 5 of chip U4 is connected to one end of resistor R26 and one end of resistor R28, the other end of resistor R26 is grounded, the other end of resistor R28 is connected to the other end of inductor L27, one end of capacitor C94, one end of capacitor C104, one end of capacitor C120, one end of capacitor C96, one end of inductor B4, the other end of inductor B4 is connected to one end of capacitor C100 and output voltage connection port VEE1; the other end of capacitor C100, the other end of capacitor C96, the other end of capacitor C120, the other end of capacitor C104, and the other end of capacitor C94 are grounded.

[0060] Pin 6 of the chip U4 is connected to one end of the capacitor C101 and one end of the capacitor C102. The other end of the capacitor C102 is connected to the ground through the resistor R29. The other end of the capacitor C101 is grounded.

[0061] like Figure 8 As shown, pin 1 of the step-down chip U8 is connected to one end of capacitor C123, one end of capacitor C138 and connected to the voltage 5.3V input port; the other end of capacitor C123 and the other end of capacitor C138 are grounded; pin 3 of chip U8 is connected to one end of resistor R14, and the other end of resistor R14 is connected to pin 33 of chip U5; pin 2 of chip U8 is grounded, pin 5 of chip U8 is connected to one end of capacitor C139, one end of capacitor C124 and the output voltage is connected to the RF-5V port; the other end of capacitor C139 and the other end of capacitor C124 are connected to each other and grounded.

[0062] Pin 1 of the step-down chip U6 is connected to one end of capacitor C134, one end of capacitor C136, one end of capacitor C121, and one end of inductor B6. The other end of inductor B6 is connected to one end of capacitor C133 and outputs voltage to port VEE2. The other end of capacitor C134, the other end of capacitor C136, the other end of capacitor C121C, and the other end of capacitor C133 are grounded.

[0063] like Fig. 9 As shown, pin 2 of chip U6 is connected to one end of resistor R24, one end of capacitor C291, one end of capacitor C321, one end of capacitor C320, and one end of inductor B9; the other end of inductor B9 is connected to one end of capacitor C294 and input voltage 5V; the other end of capacitor C294, the other end of capacitor C320, the other end of capacitor C321, and the other end of capacitor C291 are grounded; the other end of inductor R24 ​​is connected to pin 5 of chip U6; pin 4 of chip U6 is grounded; pin 3 of chip U6 is connected to pin 6 of chip U6 through capacitor C135.

[0064] The RF module includes an MMIC reflective single-pole double-throw switch chip U26, an MMIC reflective single-pole double-throw switch chip U24, a digitally controlled attenuator chip U9, an RF switch chip U23, an RF switch chip U21, and an RF mixer chip U22.

[0065] The model of chip U26 and chip U24 is ISW-0045DT, the model of chip U9 is IDA-0006-1D, the model of chip U23 and chip U21 is HMC7992LP3DE, and the model of chip U22 is MM1-0626S.

[0066] like Fig.10As shown, the RF signal input end is connected to the input end of the filter F5, the output end of the filter F5 is connected to the 7th pin of the chip U26, the 5th pin, the 6th pin, and the 8th pin of the chip U26 are connected and grounded; the 9th pin, the 10th pin, and the 12th pin of the chip U26 are connected to each other and grounded; the 1st pin, the 3rd pin, and the 4th pin of the chip U26 are connected to each other and grounded; the 13th pin of the chip U26 is grounded; the 14th pin of the chip U26 is connected to the 18th pin of the chip U5, the 15th pin of the chip U26 is connected to the 17th pin of the chip U5; the 16th pin of the chip U26 is connected to the port VEE; the 2 Pin 11 of chip U26 is connected to pin 11 of chip U24; pin 11 of chip U26 is connected to pin 1 of monolithic amplifier U29, the model of monolithic amplifier U29 is IGB-005B-S89, pins 2 and 4 of monolithic amplifier U29 are grounded, pin 3 of monolithic amplifier U29 is connected to one end of inductor L3 and one end of capacitor C19, the other end of inductor L3 is connected to one end of capacitor C18 and one end of resistor R3, the other end of capacitor C18 is grounded, and the other end of resistor R3 is connected to port RF-5V; the other end of capacitor C19 is connected to pin 2 of chip U24;

[0067] Pin 13 of chip U24 is grounded, pin 1, pin 3, and pin 4 of chip U24 are connected to each other and then to ground; pin 5, pin 6, and pin 8 of chip U24 are connected to each other and then to ground; pin 9, pin 10, and pin 12 of chip U24 are connected and then to ground; pin 19 of chip U24 is connected to port VEE, pin 15 of chip U24 is connected to pin 19 of chip U5, and pin 14 of chip U24 is connected to pin 20 of chip U5;

[0068] Pin 7 of chip U24 is connected to pin 3 of digital control attenuator chip U9, pin 1 of digital control attenuator chip U9 is connected to pin 2 and grounded, pin 4 of digital control attenuator chip U9 is connected to pin 5 and grounded, pin 6 of digital control attenuator chip U9 is connected to pin 7, pin 8, pin 9, pin 10 and grounded, pin 11 of digital control attenuator chip U9 is connected to pin 12, pin 14 and grounded; pin 15 of digital control attenuator chip U9 is connected to port VEE2; pin 16, pin 17, pin 18 and pin 19 of digital control attenuator chip U9 are connected to pin 28, pin 27, pin 26 and pin 25 of chip U5 respectively; pin 20 of digital control attenuator chip U9 is grounded;

[0069] like Fig.11 As shown, pin 13 of the digital control attenuator chip U9 is connected to pin 15 of the RF switch chip U23, and pins 13, 14, and 16 of the RF switch chip U23 are connected and then grounded; pins 10 and 11 of the RF switch chip U23 are connected and then grounded, and pins 2 and 3 of the RF switch chip U23 are grounded and then grounded; pin 5 of the RF switch chip U23 is grounded, pin 6 of the RF switch chip U23 is connected to port VEE1, and pins 7 and 8 of the RF switch chip U23 are respectively connected to pins 29 and 30 of the chip U5;

[0070] Pin 1 of the RF switch chip U23 is connected to the input of the low-pass filter F8, the input of the low-pass filter F8 is connected to pin 1 of the attenuator chip U28 (model FAC1202), pins 3 and 4 of the attenuator chip U28 are grounded, pin 2 of the attenuator U28 is connected to the input of the low-pass filter F9, and the output of the low-pass filter F9 is connected to pin 12 of the RF switch chip U21;

[0071] Pin 4 of the RF switch chip U23 is connected to pin 9 of the RF switch chip U21; pin 9 of the RF switch chip U23 is connected to pin 4 of the RF switch chip U21 through a low-pass filter F3; pin 12 of the RF switch chip U23 is connected to the input end of the low-pass filter F1, the output end of the low-pass filter F1 is connected to pin 2 of the attenuator chip U2, pins 3 and 4 of the attenuator chip U2 are grounded, pin 1 of the attenuator chip U2 is connected to the input end of the low-pass filter F2, and the output end of the low-pass filter F2 is connected to pin 1 of the RF switch chip U21;

[0072] Pin 5 of the RF switch chip U21 is grounded, pin 2 and pin 3 of the RF switch chip U21 are connected and then grounded, pin 10 and pin 11 of the RF switch chip U21 are connected and then grounded, pin 13, pin 14, and pin 16 of the RF switch chip U21 are connected and then grounded; pin 6 of the RF switch chip U21 is connected to port VEE1, and pin 7 and pin 8 of the RF switch chip U21 are connected to pin 32 and pin 31 of chip U5 respectively;

[0073] like Fig.12 As shown, pin 15 of the RF switch chip U21 is connected to pin 1 of the monolithic amplifier U25, pins 2 and 4 of the monolithic amplifier U25 are grounded, and pin 3 of the monolithic amplifier U25 is connected to one end of the inductor L1 and one end of the capacitor C7; the other end of the inductor L1 is connected to one end of the capacitor C6 and one end of the resistor R1; the other end of the capacitor C6 is grounded; the other end of the resistor R1 is connected to the port RF-5V; the other end of the capacitor C7 is connected to the input end of the low-pass filter F4, and the output end of the low-pass filter F4 is connected to pin 5 of the RF mixer chip U22;

[0074] Pin 4 and pin 6 of the RF mixer chip U22 are connected to ground; Pin 7 and pin 9 of the RF mixer chip U22 are connected to ground; Pin 1 and pin 3 of the RF mixer chip U22 are connected to ground; Pin 10, Pin 11, and Pin 12 of the RF mixer chip U22 are connected to each other; Pin 2 of the RF mixer chip U22 is connected to the external port LO1, and the frequency is provided from the outside; Pin 8 of the RF mixer chip U22 is connected to the input end of the low-pass filter F6, and the output end of the low-pass filter F6 is connected to the gain amplifier Pin 1 of chip U27 (model IGB-010C1), pins 3 and 4 of gain amplifier chip U27 are grounded, pin 3 of gain amplifier chip U27 is connected to one end of inductor L2 and one end of capacitor C17, the other end of inductor L2 is connected to one end of capacitor C15 and one end of resistor R2, the other end of capacitor C15 is grounded, and the other end of resistor R2 is connected to port RF-5V; the other end of capacitor C17 is connected to the input end of low-pass filter F7, and the output end of low-pass filter F7 outputs the signal.

[0075] In this application, the RF signal is input, filtered and then enters the first switch circuit composed of MMIC reflective single-pole double-throw switch chip U26 and chip U24, which plays a role in line selection. If the input RF signal is large, it will go through the path of the non-GaAs monolithic amplifier U29. If the input RF signal is small, it will go through the path of the non-GaAs monolithic amplifier U29 for signal amplification.

[0076] After the RF signal comes out of the first switching circuit mentioned above, it enters the attenuator U9. If it exceeds the threshold, the signal amplitude is reduced. If it does not exceed the threshold, it passes directly. The signal passing through the attenuator U9 enters the second switching circuit composed of the RF switch U23 and the RF switch U21 again. Four signal channels are formed between the RF switch U23 and the RF switch U21. The wide frequency band is subdivided into four small frequency bands. A wide frequency band is received, divided into four sections, and filtered. The signal output by the second switching circuit enters the mixer after amplification and filtering again. It is mixed with the signal input from the port LO1 to realize spectrum shifting and output a signal of another frequency band.

[0077] Among them, chip 26, chip 24, chip 9, chip 22, and chip 27 are directly bonded to the PCB board with gold wires using bare chips, and then the entire PCB board is packaged together with a packaging structure. Through the gold wire bonding process, the above-mentioned bare chips can be directly bonded to the PCB board, thereby reducing the weight of the entire PCB board. The incoming signals of different frequency bands can be selected through the first switching circuit formed by chip 26 and chip 24. The RF switch chip U23 and the RF switch chip U21 constitute four signal channels of different frequency bands, thereby being able to access signals in a wider frequency band.

[0078] It is worth noting that, based on the above structural design, in order to solve the same technical problem, even if some insubstantial improvements are made on the present invention, they also fall within the protection scope of the present invention.

Claims

1. A novel radio frequency board, comprising a radio frequency module, a power management module and a control module arranged on a PCB board, wherein the control module is connected to the radio frequency module, and the power management module supplies power to the radio frequency module and the control module, wherein the radio frequency module comprises an MMIC reflective single-pole double-throw switch chip U26, an MMIC reflective single-pole double-throw switch chip U24, a digitally controlled attenuator chip U9, a radio frequency switch chip U23, a radio frequency switch chip U21 and a radio frequency mixer chip U22; The transmitting single-pole double-throw switch chip U26 and the MMIC reflective single-pole double-throw switch chip U24 constitute a first switch circuit with two-way selection. The input end of the first switch circuit inputs radio frequency. The output end of the first switch circuit is connected to a digitally controlled attenuator chip U9 that performs amplitude limiting processing on signals above a threshold. The digitally controlled attenuator chip U9 is connected to a second switch circuit formed by a radio frequency switch chip U23 and a radio frequency switch chip U21. The second switch circuit formed by the radio frequency switch chip U23 and the radio frequency switch chip U21 has four signal channels of different frequency bands. The output end of the second switch circuit is connected to the input end of the radio frequency mixer chip U22. The MMIC reflective single-pole double-throw switch chip U26, the MMIC reflective single-pole double-throw switch chip U24, the digitally controlled attenuator chip U9, and the RF mixer chip U22 are bare chip gold-wire bonded to the PCB board.

2. A novel radio frequency board according to claim 1, characterized in that: The RF signal input terminal is connected to the input terminal of the filter F5, the output terminal of the filter F5 is connected to the 7th pin of the chip U26, and the 5th pin, the 6th pin, and the 8th pin of the chip U26 are connected and grounded; Pins 9, 10, and 12 of chip U26 are connected to each other and grounded; Pins 1, 3, and 4 of chip U26 are connected to each other and grounded; Pin 13 of chip U26 is grounded; Pin 14 of chip U26 is connected to pin 18 of chip U5, and pin 15 of chip U26 is connected to pin 17 of chip U5; Pin 16 of chip U26 is connected to the power management module; Pin 2 of chip U26 is connected to pin 11 of chip U24; Pin 11 of chip U26 is connected to pin 1 of monolithic amplifier U29, the model of monolithic amplifier U29 is IGB-005B-S89, pins 2 and 4 of monolithic amplifier U29 are grounded, pin 3 of monolithic amplifier U29 is connected to one end of inductor L3 and one end of capacitor C19, the other end of inductor L3 is connected to one end of capacitor C18 and one end of resistor R3, the other end of capacitor C18 is grounded, and the other end of resistor R3 is connected to the power management module; The other end of capacitor C19 is connected to pin 2 of chip U24; Pin 13 of chip U24 is grounded, and pins 1, 3, and 4 of chip U24 are connected to each other and then grounded; Pins 5, 6, and 8 of chip U24 are connected to each other and then grounded; Pins 9, 10, and 12 of chip U24 are connected to ground; Pin 19 of chip U24 is connected to the power management module, pin 15 of chip U24 is connected to pin 19 of chip U5, and pin 14 of chip U24 is connected to pin 20 of chip U5; Pin 7 of chip U24 is connected to pin 3 of digital control attenuator chip U9, pin 1 of digital control attenuator chip U9 is connected to pin 2 and grounded, pin 4 of digital control attenuator chip U9 is connected to pin 5 and grounded, pin 6 of digital control attenuator chip U9 is connected to pin 7, pin 8, pin 9, pin 10 and grounded, pin 11 of digital control attenuator chip U9 is connected to pin 12, pin 14 and grounded; Pin 15 of the digital controlled attenuator chip U9 is connected to the power management module; Pins 16, 17, 18 and 19 of the digital attenuator chip U9 are connected to pins 28, 27, 26 and 25 of the chip U5 respectively; Pin 20 of the digital attenuator chip U9 is grounded; Pin 13 of the digital control attenuator chip U9 is connected to pin 15 of the RF switch chip U23, and pins 13, 14, and 16 of the RF switch chip U23 are connected and then grounded; Pin 10 and pin 11 of the RF switch chip U23 are connected to ground, and pin 2 and pin 3 of the RF switch chip U23 are connected to ground and then grounded; pin 5 of the RF switch chip U23 is grounded, pin 6 of the RF switch chip U23 is connected to the power management module, and pin 7 and pin 8 of the RF switch chip U23 are connected to pin 29 and pin 30 of the chip U5 respectively; Pin 1 of the RF switch chip U23 is connected to the input end of the low-pass filter F8, the input end of the low-pass filter F8 is connected to pin 1 of the attenuator chip U28, pins 3 and 4 of the attenuator chip U28 are grounded, pin 2 of the attenuator U28 is connected to the input end of the low-pass filter F9, and the output end of the low-pass filter F9 is connected to pin 12 of the RF switch chip U21; Pin 4 of the RF switch chip U23 is connected to pin 9 of the RF switch chip U21; pin 9 of the RF switch chip U23 is connected to pin 4 of the RF switch chip U21 through a low-pass filter F3; pin 12 of the RF switch chip U23 is connected to the input end of the low-pass filter F1, the output end of the low-pass filter F1 is connected to pin 2 of the attenuator chip U2, pins 3 and 4 of the attenuator chip U2 are grounded, pin 1 of the attenuator chip U2 is connected to the input end of the low-pass filter F2, and the output end of the low-pass filter F2 is connected to pin 1 of the RF switch chip U21; Pin 5 of the RF switch chip U21 is grounded, pin 2 and pin 3 of the RF switch chip U21 are connected and then grounded, pin 10 and pin 11 of the RF switch chip U21 are connected and then grounded, and pin 13, pin 14, and pin 16 of the RF switch chip U21 are connected and then grounded; pin 6 of the RF switch chip U21 is connected to the power management module, and pin 7 and pin 8 of the RF switch chip U21 are connected to pin 32 and pin 31 of the chip U5 respectively; Pin 15 of the RF switch chip U21 is connected to pin 1 of the monolithic amplifier U25, pins 2 and 4 of the monolithic amplifier U25 are grounded, and pin 3 of the monolithic amplifier U25 is connected to one end of the inductor L1 and one end of the capacitor C7; the other end of the inductor L1 is connected to one end of the capacitor C6 and one end of the resistor R1; the other end of the capacitor C6 is grounded; the other end of the resistor R1 is connected to the power management module; the other end of the capacitor C7 is connected to the input end of the low-pass filter F4, and the output end of the low-pass filter F4 is connected to pin 5 of the RF mixer chip U22; Pin 4 and pin 6 of the RF mixer chip U22 are connected to ground; Pin 7 and pin 9 of the RF mixer chip U22 are connected to ground; Pin 1 and pin 3 of the RF mixer chip U22 are connected to ground; Pin 10, Pin 11, and Pin 12 of the RF mixer chip U22 are connected to each other; Pin 2 of the RF mixer chip U22 is connected to the external port LO1, and the frequency is provided from the outside; Pin 8 of the RF mixer chip U22 is connected to the input end of the low-pass filter F6, and the output end of the low-pass filter F6 is connected to Pin 1 of the gain amplifier chip U27, Pin 3 and Pin 4 of the gain amplifier chip U27 are grounded, Pin 3 of the gain amplifier chip U27 is connected to one end of the inductor L2 and one end of the capacitor C17, the other end of the inductor L2 is connected to one end of the capacitor C15 and one end of the resistor R2, the other end of the capacitor C15 is grounded, and the other end of the resistor R2 is connected to the power management module; the other end of the capacitor C17 is connected to the input end of the low-pass filter F7, and the output end of the low-pass filter F7 outputs a signal.

3. A novel radio frequency board according to claim 1, characterized in that: The model of chip U26 and chip U24 is ISW-0045DT, the model of chip U9 is IDA-0006-1D, the model of chip U23 and chip U21 is HMC7992LP3DE, the model of chip U22 is MM1-0626S; the model of attenuator chip U28 is FAC1202.

4. A novel radio frequency board according to claim 1, characterized in that: The control module includes an FPGA programmable gate array chip U5 and its basic circuits. The model of the chip U5 is 10M16SAE144I7G.

5. A novel radio frequency board according to claim 1, characterized in that: The power management module includes a DC-DC buck chip U3, a buck chip U4, a buck chip U8, and a buck chip U6; Pin 1 of the step-down chip U3 is connected to one end of the resistor R6, the other end of the resistor R6 is connected to one end of the capacitor C8, the other end of the capacitor C8 is connected to one end of the resistor R9, and the other end of the resistor R9 is connected to pin 7 of the chip U3; one end of the resistor R9 is also connected to pin 3 of the chip U3, the cathode of the diode D1, and one end of the inductor L25, and the anode of the diode D1 is grounded; Pin 2 of chip U3 is connected to one end of capacitor C11, one end of capacitor C10, one end of capacitor C13, and one end of inductor B7. The other end of inductor B7 is connected to one end of capacitor C12 and connected to 28V voltage. The other end of capacitor C12, the other end of C11, the other end of capacitor C10, and the other end of capacitor C13 are grounded. Pin 4 of chip U3 is grounded, pin 5 of chip U3 is connected to one end of resistor R10 and one end of resistor R16, the other end of resistor R10 is grounded, the other end of resistor R16 is connected to the other end of inductor L25, one end of capacitor C14, one end of capacitor C22, one end of capacitor C86, one end of capacitor C23, one end of inductor B2, the other end of inductor B2 is connected to one end of capacitor C26 and outputs voltage to port VEE; the other end of capacitor C26, the other end of capacitor C23, the other end of capacitor C86, the other end of capacitor C22, and the other end of capacitor C14 are grounded; Pin 6 of chip U3 is connected to one end of capacitor C52 and one end of capacitor C27, the other end of capacitor C52 is connected to ground through resistor R19, and the other end of capacitor C27 is grounded; Pin 1 of the step-down chip U4 is connected to one end of the resistor R22, the other end of the resistor R22 is connected to one end of the capacitor C59, the other end of the capacitor C59 is connected to one end of the resistor R23, and the other end of the resistor R23 is connected to pin 7 of the chip U4; one end of the resistor R23 is also connected to pin 3 of the chip U3, the cathode of the diode D2, and one end of the inductor L27, and the anode of the diode D2 is grounded; Pin 2 of chip U4 is connected to one end of capacitor C88, one end of capacitor C87, one end of capacitor C92, and one end of inductor B8. The other end of inductor B8 is connected to one end of capacitor C90 and connected to 28V voltage. The other end of capacitor C90, the other end of C92, the other end of capacitor C87, and the other end of capacitor C88 are grounded. Pin 4 of chip U4 is grounded, pin 5 of chip U4 is connected to one end of resistor R26 and one end of resistor R28, the other end of resistor R26 is grounded, the other end of resistor R28 is connected to the other end of inductor L27, one end of capacitor C94, one end of capacitor C104, one end of capacitor C120, one end of capacitor C96, one end of inductor B4, the other end of inductor B4 is connected to one end of capacitor C100 and outputs voltage to port VEE1; the other end of capacitor C100, the other end of capacitor C96, the other end of capacitor C120, the other end of capacitor C104, and the other end of capacitor C94 are grounded; Pin 6 of chip U4 is connected to one end of capacitor C101 and one end of capacitor C102, the other end of capacitor C102 is connected to ground through resistor R29, and the other end of capacitor C101 is grounded; Pin 1 of the step-down chip U8 is connected to one end of the capacitor C123, one end of the capacitor C138 and connected to the voltage 5.3V input port; the other end of the capacitor C123 and the other end of the capacitor C138 are grounded; Pin 3 of the chip U8 is connected to one end of the resistor R14, and the other end of the resistor R14 is connected to Pin 33 of the chip U5; Pin 2 of the chip U8 is grounded, and Pin 5 of the chip U8 is connected to one end of the capacitor C139 and one end of the capacitor C124 and the output voltage is connected to the RF-5V port; the other end of the capacitor C139 and the other end of the capacitor C124 are connected to each other and grounded; Pin 1 of the step-down chip U6 is connected to one end of the capacitor C134, one end of the capacitor C136, one end of the capacitor C121, and one end of the inductor B6. The other end of the inductor B6 is connected to one end of the capacitor C133 and outputs a voltage to the port VEE2. The other end of the capacitor C134, the other end of the capacitor C136, the other end of the capacitor C121C, and the other end of the capacitor C133 are grounded. Pin 2 of chip U6 is connected to one end of resistor R24, one end of capacitor C291, one end of capacitor C321, one end of capacitor C320, and one end of inductor B9; the other end of inductor B9 is connected to one end of capacitor C294 and input voltage 5V; the other end of capacitor C294, the other end of capacitor C320, the other end of capacitor C321, and the other end of capacitor C291 are grounded; the other end of inductor R24 ​​is connected to pin 5 of chip U6; pin 4 of chip U6 is grounded; pin 3 of chip U6 is connected to pin 6 of chip U6 through capacitor C135.

6. A novel radio frequency board according to claim 5, characterized in that: The models of the buck chip U3 and the buck chip U4 are both SGM6232YPS8G / TR; the model of the buck chip U8 is SGM2211-5.0XN5G / TR; the model of the buck chip U6 is SGM3204YN6G / TR.

Images