FPC capable of avoiding steel sheet reinforcement grounding failure

Abstract

The utility model discloses a flexible printed circuit (FPC) capable of avoiding grounding failure of a steel sheet reinforcement, which comprises a connector, an FPC, a non-conductive adhesive layer and the steel sheet reinforcement, the steel sheet reinforcement is adhered to the FPC through the non-conductive adhesive layer, the connector is arranged on one surface of the FPC far away from the steel sheet reinforcement, and the connector is arranged on the other surface of the FPC far away from the steel sheet reinforcement. At least one geometrical grounding window for exposing a grounding copper surface is arranged at the edge of the FPC close to the steel sheet reinforcement, a conductive layer is arranged on the FPC close to the steel sheet reinforcement, the conductive layer corresponds to the grounding window in position, and the steel sheet reinforcement and the FPC are in grounding connection through the conductive layer and the grounding window. The edge, close to the steel sheet reinforcement, of the FPC is provided with the grounding window, a grounding copper surface is exposed, the steel sheet reinforcement and the FPC are grounded by arranging the conductive layer, and the design effectively avoids functional failure caused by electrostatic damage to the connector due to grounding failure of the steel sheet reinforcement; the conductivity of the conductive silver paste or tin is superior to that of the conductive thermosetting adhesive, so that the rapid conduction of static electricity is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of display, in particular to an FPC which can avoid the failure of steel sheet reinforcement grounding. Background Art

[0002] In order to prevent static electricity from damaging the connector, mobile phone display modules will be grounded by reinforcing the steel sheet on the back of the connector. At present, the grounding treatment of steel sheet reinforcement is through conductive thermosetting adhesive and FPC grounding. However, because the grounding window is generally small (less than 1mm), or because the temperature and pressure of the conductive thermosetting adhesive are not enough during hot pressing, or because of subsequent reliability failure, the thermosetting adhesive is not well bonded to the copper surface of the grounding window, resulting in grounding failure or high resistance, affecting static electricity release. Moreover, the technical threshold and cost of conductive thermosetting adhesive are high, which is not conducive to reducing production costs.

[0003] For example, the Chinese utility model patent (CN116321716A) discloses a bonding process of thermosetting conductive adhesive and reinforcing steel sheets, which involves the technical field of processing of reinforcing steel sheets. The bonding process of thermosetting conductive adhesive and reinforcing steel sheets includes five steps: steel sheet pretreatment, positioning, hot pressing, shaping and trimming, and punching. The bonding process of thermosetting conductive adhesive and reinforcing steel sheets can make the thermosetting conductive adhesive and reinforcing steel sheets fit perfectly. Compared with the traditional bonding process of thermosetting conductive adhesive and reinforcing steel sheets, the bonding process first bonds the thermosetting conductive adhesive with the reinforcing steel sheets, and then cuts the reinforcing steel sheets according to production requirements. This method is not only highly efficient, but also can effectively promote the production and manufacturing speed of reinforcing steel sheets. No bubbles will appear during the bonding process, and there is no need to cut the reinforcing steel sheets and thermosetting conductive adhesive separately. In addition, it has low requirements on the working experience of the operator, is easy to use, and is easy to promote and use.

[0004] However, when the inventor of the present invention implemented this device, he found the following defects: the thermosetting adhesive did not adhere well to the copper surface of the grounding window, resulting in grounding failure or high resistance, which affected the static discharge. Moreover, the technical threshold of conductive thermosetting adhesive is high, and the cost is high, which is not conducive to reducing production costs. Utility Model Content

[0005] Based on this, it is necessary to provide an FPC that avoids the failure of steel sheet reinforcement grounding in response to the above technical problems. A grounding window is provided on the FPC near the edge of the steel sheet reinforcement to expose the grounding copper surface. By providing a conductive layer, the steel sheet reinforcement and the FPC are grounded. This design effectively avoids the failure of the steel sheet reinforcement grounding and causes electrostatic damage to the connector, resulting in functional failure. Moreover, it is obvious that the conductive performance of conductive silver paste or tin is better than that of conductive thermosetting adhesive, which is more conducive to the rapid conduction of static electricity.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] An FPC that avoids failure of steel sheet reinforcement grounding.

[0008] The FPC for preventing the failure of steel sheet reinforcement grounding specifically includes, from bottom to top,

[0009] A connector, an FPC, a non-conductive adhesive layer and a steel sheet reinforcement, wherein the steel sheet reinforcement and the FPC are bonded to each other through the non-conductive adhesive layer, the connector is arranged on a side of the FPC away from the steel sheet reinforcement, the FPC is provided with at least one grounding window of a geometric shape for exposing a grounding copper surface at an edge close to the steel sheet reinforcement, a conductive layer is provided on the FPC close to the steel sheet reinforcement, the conductive layer corresponds to the position of the grounding window, and the steel sheet reinforcement and the FPC are grounded and connected to the grounding window through the conductive layer.

[0010] As a preferred implementation of the FPC for avoiding steel sheet reinforcement grounding failure provided by the utility model, the shape of the conductive layer is set to be a triangular prism shape, and the height of the conductive layer is lower than the height of the steel sheet reinforcement.

[0011] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, the conductive layer is a conductive silver paste or a tin layer.

[0012] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, there are two grounding windows and two conductive layers, both of which are arranged on the left and right sides of the upper surface of the FPC.

[0013] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, the cross-sectional shape of the grounding window is any one of a circle, a rectangle, an ellipse and a triangle.

[0014] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, the non-conductive adhesive layer is any one of non-conductive thermosetting adhesive, epoxy thermal conductive adhesive, silicone thermal conductive adhesive, organic silica gel and polyurethane adhesive.

[0015] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, the adhesion of the conductive layer is greater than 5B.

[0016] As a preferred implementation of the FPC for avoiding the failure of steel sheet reinforcement grounding provided by the utility model, the manufacturing material of the steel sheet reinforcement is a polyimide reinforcement plate, a glass fiber reinforcement plate, or a SUS304 stainless steel reinforcement plate.

[0017] As a preferred implementation of the FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model, the distance between the two conductive layers is 7 mm-10 mm.

[0018] As a preferred implementation of the FPC for avoiding steel sheet reinforcement grounding failure provided by the utility model, the thickness of the steel sheet reinforcement is 0.1 mm to 0.2 mm.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The utility model provides an FPC that avoids the failure of steel sheet reinforcement grounding. A grounding window is provided on the FPC near the edge of the steel sheet reinforcement to expose the grounding copper surface. The steel sheet reinforcement and the FPC are grounded by providing a conductive layer. The utility model effectively avoids the failure of the steel sheet reinforcement grounding to cause static electricity damage to the connector and cause functional failure. Moreover, it is obvious that the conductive performance of the conductive silver paste or tin is better than that of the conductive thermosetting adhesive, which is more conducive to the rapid drainage of static electricity. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of an FPC for avoiding failure of steel sheet reinforcement grounding provided by the utility model;

[0023] Figure 2 for Figure 1 Side view of

[0024] Figure 3 for Figure 2 A partial enlarged view of point A. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0026] As in the background art, the thermosetting adhesive does not adhere well to the copper surface of the grounding window, resulting in grounding failure or large resistance, affecting static discharge. Moreover, the conductive thermosetting adhesive has high technical barriers and high costs, which is not conducive to reducing production costs.

[0027] In order to solve this technical problem, the utility model provides an FPC which avoids the failure of steel sheet reinforcement grounding.

[0028] Specifically, please refer to Figure 1-3 , the FPC to avoid the failure of steel sheet reinforcement grounding includes the following from bottom to top:

[0029] Connector 1, FPC2, non-conductive adhesive layer 3 and steel sheet reinforcement 4, the steel sheet reinforcement 4 and FPC2 are bonded by the non-conductive adhesive layer 3, the connector 1 is arranged on the side of the FPC2 away from the steel sheet reinforcement 4, and at least one grounding window 5 of a geometric shape for exposing the grounding copper surface is arranged at the edge of the FPC2 close to the steel sheet reinforcement 4, and a conductive layer 6 is arranged on the FPC2 close to the steel sheet reinforcement 4, and the conductive layer 6 corresponds to the position of the grounding window 5, and the steel sheet reinforcement 4 and the FPC2 are grounded and connected to the grounding window 5 through the conductive layer 6.

[0030] The utility model provides an FPC that avoids the failure of grounding of the steel sheet reinforcement. A grounding window 5 is provided on the FPC2 near the edge of the steel sheet reinforcement 4 to expose the grounding copper surface. The steel sheet reinforcement 4 and the FPC2 are grounded by providing a conductive layer 6. The design effectively avoids the failure of grounding of the steel sheet reinforcement 4 to cause static electricity to damage the connector 1 and cause functional failure. Moreover, it is obvious that the conductive performance of the conductive silver paste or tin is better than that of the conductive thermosetting adhesive, which is more conducive to the rapid conduction of static electricity.

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings. Example 1

[0034] Please refer to Figure 1-3 , an FPC to avoid failure of steel sheet reinforcement grounding, which includes from bottom to top

[0035] Connector 1, FPC2, non-conductive adhesive layer 3 and steel sheet reinforcement 4, the steel sheet reinforcement 4 and FPC2 are bonded by the non-conductive adhesive layer 3, the connector 1 is arranged on the side of the FPC2 away from the steel sheet reinforcement 4, and at least one grounding window 5 of a geometric shape for exposing the grounding copper surface is arranged at the edge of the FPC2 close to the steel sheet reinforcement 4, and a conductive layer 6 is arranged on the FPC2 close to the steel sheet reinforcement 4, and the conductive layer 6 corresponds to the position of the grounding window 5, and the steel sheet reinforcement 4 and the FPC2 are grounded and connected to the grounding window 5 through the conductive layer 6.

[0036] Through the above structural design, the non-conductive adhesive layer 3 is any one of non-conductive thermosetting adhesive, epoxy thermal conductive adhesive, silicone thermal conductive adhesive, organic silica gel and polyurethane adhesive. In the present embodiment, the non-conductive adhesive layer 3 is non-conductive thermosetting adhesive; the conductive layer 6 is a conductive silver paste or a tin layer. In the present embodiment, the conductive layer 6 is a conductive silver paste; the number of grounding windows 5 can be more or less. In order to obtain a better grounding effect, the conductive silver paste or tin can also be dotted into a line. In the present embodiment, the number of grounding windows 5 is two, and the conductive layer 6 is in the shape of a triangular prism. The height of the conductive layer 6 should not exceed the steel sheet reinforcement 4, mainly to avoid structural interference; a grounding window 5 is provided on the FPC2 near the edge of the steel sheet reinforcement 4, leaking the grounding copper surface, and by providing the conductive layer 6, the steel sheet reinforcement 4 and the FPC2 are grounded. The design effectively avoids the failure of the grounding of the steel sheet reinforcement 4 and causes electrostatic damage to the connector 1, causing functional failure, and, obviously, the conductive performance of the conductive silver paste or tin is better than that of the conductive thermosetting adhesive, which is more conducive to the rapid conduction of static electricity.

[0037] Specifically, the shape of the conductive layer 6 is set to be a triangular prism shape, and the height of the conductive layer 6 is lower than the height of the steel sheet reinforcement 4 .

[0038] Through the above structural design, the height of the conductive layer 6 is lower than the height of the steel sheet reinforcement 4, mainly to avoid structural interference.

[0039] Specifically, the conductive layer 6 is a conductive silver paste or a tin layer.

[0040] Through the above structural design, in this embodiment, the conductive layer 6 is a conductive silver paste, and can also be a tin layer under different requirements.

[0041] Specifically, there are two grounding windows 5 and two conductive layers 6 , both of which are arranged on the left and right sides of the upper surface of the FPC 2 .

[0042] Through the above structural design, the conductive layer 6 is triangular, one side of which is in contact with the steel sheet reinforcement 4, and the bottom side is in contact with the grounding copper surface leaking through the grounding window 5, mainly to ground the steel sheet reinforcement 4 and the FPC2. This design effectively avoids electrostatic damage to the connector 1 caused by grounding failure of the steel sheet reinforcement 4 and causes functional failure.

[0043] Specifically, the cross-sectional shape of the grounding window 5 is any one of a circle, a rectangle, an ellipse and a triangle.

[0044] Through the above structural design, in this embodiment, the cross-sectional shape of the grounding window 5 is circular. In different embodiments, it can also be a different shape, any one of a rectangle, an ellipse and a triangle. Example 2

[0045] The FPC for avoiding the failure of steel sheet reinforcement grounding provided in Example 1 is further optimized, specifically, as follows: Figure 1-3 As shown, the non-conductive adhesive layer 3 is any one of non-conductive thermosetting adhesive, epoxy thermal conductive adhesive, silicone thermal conductive adhesive, organic silica gel and polyurethane adhesive.

[0046] Through the above structural design, in this embodiment, the non-conductive adhesive layer 3 is a non-conductive thermosetting adhesive. In different requirements, the non-conductive adhesive layer 3 can also be any one of epoxy thermal conductive adhesive, silicone thermal conductive adhesive, organic silicone and polyurethane adhesive. Example 3

[0047] The FPC for avoiding the failure of steel sheet reinforcement grounding provided in Example 1 or 2 is further optimized, such as Figure 1-3 As shown, the adhesion of the conductive layer 6 is greater than 5B.

[0048] Through the above structural design, the adhesion of the conductive layer 6 is greater than 5B and there is no risk of falling off.

[0049] Specifically, the steel sheet reinforcement 4 is made of a polyimide reinforcement plate, a glass fiber reinforcement plate, or a SUS304 stainless steel reinforcement plate.

[0050] Through the above structural design, in this embodiment, the steel sheet reinforcement 4 is made of a polyimide reinforcement plate. In different requirements, the steel sheet reinforcement 4 can be made of different materials.

[0051] Specifically, the distance between the two conductive layers 6 is 7 mm-10 mm.

[0052] Through the above structural design, in this embodiment, the distance between the conductive layers 6 is 7 mm.

[0053] Specifically, the thickness of the steel sheet reinforcement 4 is 0.1 mm to 0.2 mm.

[0054] Through the above structural design, in this embodiment, the thickness of the sheet reinforcement is 0.1 mm.

[0055] The FPC provided by the utility model can avoid the failure of steel sheet reinforcement grounding and has the following beneficial effects:

[0056] A grounding window 5 is provided on the FPC2 near the edge of the steel sheet reinforcement 4 to expose the grounding copper surface. The steel sheet reinforcement 4 and the FPC2 are grounded by providing a conductive layer 6. This design effectively avoids the failure of the grounding of the steel sheet reinforcement 4 to cause electrostatic damage to the connector 1 and cause functional failure. Moreover, it is obvious that the conductive performance of the conductive silver paste or tin is better than that of the conductive thermosetting adhesive, which is more conducive to the rapid conduction of static electricity.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. An FPC for avoiding failure of steel sheet reinforcement grounding, characterized in that: The invention comprises, from bottom to top, a connector (1), an FPC (2), a non-conductive adhesive layer (3) and a steel sheet reinforcement (4), wherein the steel sheet reinforcement (4) and the FPC (2) are bonded together via the non-conductive adhesive layer (3), the connector (1) is arranged on a side of the FPC (2) away from the steel sheet reinforcement (4), the FPC (2) is provided with at least one grounding window (5) of a geometric shape for exposing a grounding copper surface at an edge close to the steel sheet reinforcement (4), a conductive layer (6) is provided on the FPC (2) in close contact with the steel sheet reinforcement (4), the conductive layer (6) corresponds to the position of the grounding window (5), and the steel sheet reinforcement (4) and the FPC (2) are grounded and connected to the grounding window (5) via the conductive layer (6).

2. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 1, characterized in that: The shape of the conductive layer (6) is set to be a triangular prism shape, and the height of the conductive layer (6) is lower than the height of the steel sheet reinforcement (4).

3. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 2, characterized in that: The conductive layer (6) is a conductive silver paste or a tin layer.

4. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 3 is characterized in that: There are two grounding windows (5) and two conductive layers (6), both of which are arranged on the left and right sides of the upper surface of the FPC (2).

5. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 4, characterized in that: The cross-sectional shape of the grounding window (5) is any one of a circular shape, a rectangular shape, an elliptical shape and a triangular shape.

6. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 1, characterized in that: The non-conductive adhesive layer (3) is any one of non-conductive thermosetting adhesive, epoxy thermal conductive adhesive, silicone thermal conductive adhesive, organic silica gel and polyurethane adhesive.

7. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 1, characterized in that: The adhesion of the conductive layer (6) is greater than 5B.

8. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 1, characterized in that: The steel sheet reinforcement (4) is made of a polyimide reinforcement plate, a glass fiber reinforcement plate, or a SUS304 stainless steel reinforcement plate.

9. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 4, characterized in that: The distance between the two conductive layers (6) is 7 mm to 10 mm.

10. The FPC for avoiding steel sheet reinforcement grounding failure according to claim 1, characterized in that: The thickness of the steel sheet reinforcement (4) is 0.1 mm to 0.2 mm.

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