Module RTP bonding pad structure

Abstract

The utility model discloses a module RTP bonding pad structure, which comprises a first connecting part, a second connecting part, a third connecting part and a fourth connecting part, a bonding pad area is arranged on the second connecting part, and the second connecting part can be bent in the bonding pad area; the welding pin foot part is arranged in the bonding pad area; wherein a plurality of guide loops are arranged in the welding pin foot part, when a certain guide loop is in open circuit, each guide loop can electrically connect the first connecting part with the second connecting part, open circuit compensation operation can be achieved through the plurality of guide loops in the welding pin foot part, and specifically, once the second connecting part is bent in the bonding pad area, the second connecting part can be electrically connected with the second connecting part through the guide loops. At the moment, a plurality of guide loops are bent, however, due to the fact that one guide loop can correspond to one circuit (the circuit at the position refers to a unit connected with the pin), when a certain guide loop is disconnected, each guide loop can electrically connect the first connecting part with the second connecting part.

Description

Technical Field

[0001] The utility model relates to the field of display modules, and in particular to a module RTP pad structure. Background Art

[0002] FPC stands for "Flexible Printed Circuit". It is a technology that makes lightweight, thin, soft and bendable electronic products by printing circuits on flexible substrates. FPC is widely used in modern electronic devices such as smartphones, tablets, laptops and other portable or compact electronic devices. Modular FPC refers to FPC components that contain specific functions and can be integrated into larger electronic systems as independent modules. For example, the FPC in the display module.

[0003] In the prior art, such as the patent document with application number CN201920849666.2, it discloses a tear-resistant FPC display module, which enhances the hardness of the FPC and improves the mechanical strength of the connection end by setting a number of reinforcement areas, avoids the damage of the FPC connection line by external force, facilitates the overall assembly of the product, and extends the service life of the FPC; by reserving RTP pads, users can directly weld and connect to realize the transmission function when needed; an IC component area is also provided to ensure the integrity of the FPC connection and improve the stability and high reliability of the product during use.

[0004] Although the technical solution disclosed in the above patent document can solve the problem of external force damaging the FPC connection line, there are still limitations in the stress problem during the bending process of the FPC. Because the connection of the FPC is achieved by welding the pin feet, but the FPC will generate stress when it is bent, resulting in elastic deformation of the metal circuit on the pin feet (such as Figure 1 , which shows the soldering pins in the prior art). Once the stress is large or the metal line is thin, cracking is likely to occur, causing abnormal function of RTP. Utility Model Content

[0005] Based on this, it is necessary to provide a module RTP pad structure to address the above technical issues.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A module RTP pad structure, comprising:

[0008] A first connecting portion connected to the display module;

[0009] The second connecting portion has a pad area thereon, and the second connecting portion can be bent at the pad area;

[0010] Solder the pin feet and set them in the pad area;

[0011] There are multiple guide loops in the welding pin foot. When a certain guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2.

[0012] Furthermore, the welding pin foot includes a plurality of single feet arranged in the pad area, and the plurality of single feet are grouped in pairs to form a main loop section, and each of the two ends of the main loop section is provided with a secondary loop section, and the main loop section and the secondary loop section are connected to form a guide loop.

[0013] Furthermore, the single pin has a repair soldering area, and the repair soldering area is located at a bending position in the pad area.

[0014] Furthermore, the width of the repair welding area is at least equal to that of a single foot.

[0015] Furthermore, the repair welding area is in a quadrilateral or I-shape.

[0016] Furthermore, a spacing strip having a length at least equal to the length of the repair welding area is provided between adjacent single legs.

[0017] Furthermore, the thickness of the spacer strip is not less than the thickness of a single foot.

[0018] Furthermore, the single leg has a reinforcement area, the reinforcement area is located at the bending position in the pad area, and a reinforcement sheet is provided on the surface of the reinforcement area, and the reinforcement sheet matches and fits with the surface of the single leg after being bent.

[0019] Furthermore, both ends of the reinforcing sheet are provided with spot welding rods fixed to the surface of the single leg.

[0020] Furthermore, the spot welding rod has a spot welding area.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] The utility model can realize the circuit break compensation operation by welding multiple guide loops in the pin foot. Specifically, once the connection part 2 is bent in the pad area, multiple guide loops are also bent. However, since one guide loop can correspond to one circuit (the circuit here refers to the unit connected to the pin foot), when a certain guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 to avoid the problem that the stress is too large or the metal line is too thin, thereby cracking and causing the RTP function to be abnormal. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the prior art when the connection part 1 is connected to the connection part 2;

[0024] Figure 2 This is a schematic diagram of the structure when the connection part 1 and the connection part 2 provided by the utility model are connected;

[0025] Figure 3 This is a schematic diagram of the structure of the welding pin foot provided by the utility model;

[0026] Figure 4 A schematic diagram of the structure of a single foot provided by the utility model;

[0027] Figure 5 A schematic diagram of the structure of the loop sub-section provided by the utility model;

[0028] Figure 6 This is a structural schematic diagram of a connecting portion 1 in the third embodiment of the present utility model;

[0029] Figure 7 This is a schematic diagram of the reinforcing sheet structure provided by the utility model.

[0030] The markings in the figure are as follows:

[0031] 1. Connection part 1; 2. Connection part 2; 3. Solder pad area; 4. Soldering pin foot; 5. Single foot; 6. Spacer; 7. Spot welding rod; 8. Spot welding area; 9. Repair welding area; 10. Reinforcement sheet. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0033] RTP pads are often referred to as "Rapid Thermal Process" pads used in the electronics assembly industry. These pads are designed to heat up and cool down quickly during the soldering process to create high-quality solder joints. RTP pads are often used on high-density or high-performance circuit boards, such as military and avionics equipment, or other high-precision products that require very reliable soldering. RTP pads are designed to improve heat transfer characteristics and enhance soldering efficiency and quality. These pads may have specific shapes, sizes, and material combinations to optimize the soldering process and improve the performance and reliability of the final product.

[0034] In display modules, "TFT" refers to "Thin-Film Transistor" technology, which is a type of liquid crystal display (LCD) technology. TFT LCD is one of the most common display technologies currently, and is widely used in screens for TVs, computer monitors, mobile phones, tablets, and various other electronic devices. TFT technology involves the use of thin-film transistors on a glass substrate to control the arrangement of liquid crystals, with each transistor directly driving a pixel. Because each pixel is controlled by a tiny transistor, TFT LCD can provide faster response times, higher resolutions, and better image quality, especially in terms of color and contrast, which is a clear advantage over older passive matrix LCD technologies (such as STN). A "display module" is a component that integrates a display screen and related circuits and components, and can be directly installed into an electronic device. A TFT display module is an integral component that includes a TFT LCD screen and may also include a backlight unit, driver circuit board, and interface circuits. This makes it easier for device manufacturers to integrate high-quality displays into their products.

[0035] As described in the background art, the FPC is connected by welding the pins, but the FPC will generate stress when it is bent, causing the metal circuit on the pin to deform elastically (such as Figure 1 , which shows the soldering pins in the prior art). Once the stress is large or the metal line is thin, cracking is likely to occur, causing abnormal functions of the RTP.

[0036] In order to solve this technical problem, the utility model provides a module RTP pad.

[0037] Specifically, please refer to Figure 1-7 , module RTP pad structure, including:

[0038] A connecting part 1, connected to the display module;

[0039] The second connecting portion 2 is provided with a pad area 3, and the second connecting portion 2 can be bent at the pad area 3;

[0040] The pin foot 4 is welded and arranged in the pad area 3;

[0041] The welding pin foot 4 has a plurality of guide loops therein. When a certain guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2 .

[0042] The utility model can realize the circuit break compensation operation by welding multiple guide loops in the pin foot 4. Specifically, once the connection part 2 is bent in the pad area 3, multiple guide loops are also bent. However, since one guide loop can correspond to one circuit (the circuit here refers to the unit connected to the pin foot), when a certain guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2 to avoid the problem that the stress is too large or the metal line is too thin, thereby cracking and causing the RTP function to be abnormal.

[0043] In the prior art (such as Figure 1 ), the RTP welding position may be slightly broken when the module FPC is bent and used, causing abnormal RTP function. In the utility model, by increasing the pins at the welding position to form a ring-shaped routing, when the main pin is slightly broken, the spare pin plays a role in protecting the line and ensuring normal TP communication. In addition, this line optimization will not increase the pins at the interface end, and the customer host does not need to be modified.

[0044] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0045] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0046] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0047] Please refer to Figure 2-3 , module RTP pad structure, including:

[0048] A connecting part 1, connected to the display module;

[0049] The second connecting portion 2 is provided with a pad area 3, and the second connecting portion 2 can be bent at the pad area 3;

[0050] The pin foot 4 is welded and arranged in the pad area 3;

[0051] Among them, the welding pin foot 4 has multiple guide loops. When a guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2. The welding pin foot 4 includes multiple single pins 5 arranged in the pad area 3. The multiple single pins 5 form a main loop section in the form of two groups. Both ends of each main loop section are provided with loop sub-sections. When the main loop section and the loop sub-section are connected, a guide loop is formed.

[0052] Specifically, the main section of the guiding loop is connected to the auxiliary section of the loop, that is, every two single pins 5 are divided into a group, and two auxiliary sections of the loop are used at the same time to connect the ends of the two single pins 5, thereby forming a loop, that is, a guiding loop. On this guiding loop, no matter which single pin 5 has a micro-break, the purpose of data transmission can still be continued.

[0053] For further optimization of the module RTP pad structure provided in Example 1, please refer to Figure 4-5 , module RTP pad structure, including:

[0054] A connecting part 1, connected to the display module;

[0055] The second connecting portion 2 is provided with a pad area 3, and the second connecting portion 2 can be bent at the pad area 3;

[0056] The pin foot 4 is welded and arranged in the pad area 3;

[0057] Among them, the welding pin foot 4 has multiple guide loops. When a guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2. The welding pin foot 4 includes multiple single feet 5 arranged in the pad area 3. The multiple single feet 5 form a main loop section in the form of a group of two. A loop sub-section is arranged at both ends of each main loop section. When the main loop section and the loop sub-section are connected, a guide loop is formed. The single foot 5 has a repair welding area 9, and the repair welding area 9 is located at the bending part in the pad area 3.

[0058] In some specific embodiments, the width of the repair welding area 9 is at least equal to that of the single foot 5. This is set so that when repair welding is performed in the repair welding area 9, the range of the repair welding will be equal to that of the single foot 5, thereby avoiding the phenomenon that the repair welding position melts and breaks due to a small contact area in the repair welding area and excessively high temperature.

[0059] In some specific implementations, the repair welding area 9 is quadrilateral or I-shaped. The quadrilateral is the entire repair welding area 9 being repaired, and the I-shaped is a metal wire (not limited to one but may be multiple) in the repair welding area 9, which makes the welding strength higher.

[0060] In some specific embodiments, a spacing bar 6 having a length at least equal to that of the repair welding area 9 is provided between adjacent single pins 5. This is provided to prevent adjacent repair welding areas from being connected and causing a circuit breaker.

[0061] In some specific implementations, the thickness of the spacer bar 6 is not less than the thickness of the single leg 5, and this configuration is intended to further limit the scope of the repair welding.

[0062] Since the guide loop also needs to be bent, when both single pins 5 are slightly broken, it is easy to cause the RTP function to be abnormal, so a second embodiment is provided, and the working principle of the second embodiment is as follows:

[0063] The pad area 3 is bent directly. Since the soldering repair area 9 is located at the bending position in the pad area 3, electrical connection can be achieved by only soldering in the soldering repair area 9 (that is, there is a vacancy or partial connection before the soldering repair area 9).

[0064] For further optimization of the module RTP pad structure provided in Example 1 or 2, please refer to Figure 6-7 The module RTP pad structure includes: a connecting portion 1, which is connected to the display module; a connecting portion 2, on which a pad area 3 is provided, and the connecting portion 2 can be bent in the pad area 3; a welding pin foot 4, which is arranged in the pad area 3;

[0065] Among them, the welding pin foot 4 has multiple guide loops. When a guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2. The welding pin foot 4 includes multiple single feet 5 arranged in the pad area 3. The multiple single feet 5 form a main loop section in the form of a group of two. Both ends of each main loop section are provided with a loop sub-section. After the main loop section and the loop sub-section are connected, a guide loop is formed. The single foot 5 has a reinforcement area, and the reinforcement area is located at the bending part in the pad area 3. The reinforcement sheet 10 is provided on the surface of the reinforcement area, and the reinforcement sheet 10 matches and fits with the surface of the single foot 5 after the bending.

[0066] In some specific embodiments, both ends of the reinforcing sheet 10 are provided with spot welding rods 7 fixed to the surface of the single leg 5. The spot welding rods 7 are directly covered at the bend, so as to perform a secondary connection at the bend.

[0067] In some specific embodiments, the spot welding rod 7 has a spot welding area 8 , and the spot welding area 8 exists to prevent the spot welding range from exceeding the spot welding area 8 .

[0068] There is a certain difficulty in setting the repair welding area 9. In order to reduce the difficulty of setting, a third embodiment is provided. The working principle of the third embodiment is as follows:

[0069] The reinforcement area is bent directly, and the reinforcement area is located at the bending point in the pad area 3. The reinforcement sheet 10 matches and fits the surface of the single leg 5 after being bent, and then the spot welding rod 7 is fixed to the surface of the single leg 5 in the spot welding area 8 to achieve electrical connection.

[0070] The use process of the module RTP pad structure provided by the utility model is as follows: the utility model can realize the circuit break compensation operation by welding multiple guide loops in the pin foot 4. Specifically, once the connection part 2 is bent in the pad area 3, multiple guide loops also have multiple bends. However, since one guide loop can correspond to one circuit (the circuit here refers to the unit connected to the pin foot), when a guide loop is broken, each guide loop can electrically connect the connection part 1 with the connection part 2 2 to avoid the problem of abnormal function of RTP caused by cracking due to high stress or thin metal lines.

[0071] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A module RTP pad structure, characterized in that: include: A connecting portion 1 (1), connected to the display module; A second connecting portion (2) having a pad area (3) disposed thereon, wherein the second connecting portion (2) is capable of being bent at the pad area (3); A soldering pin foot (4) is arranged in the soldering pad area (3); The welding pin foot (4) has a plurality of guide loops therein, and when a certain guide loop is broken, each guide loop can electrically connect the connection part 1 (1) with the connection part 2 (2).

2. The module RTP pad structure according to claim 1, characterized in that: The soldering pin foot (4) comprises a plurality of single feet (5) arranged in the soldering pad area (3), wherein the plurality of single feet (5) are grouped in pairs to form a main loop section, and each of the two ends of the main loop section is provided with a secondary loop section, and the main loop section and the secondary loop section are connected to form a guide loop.

3. The module RTP pad structure according to claim 2, characterized in that: The single foot (5) has a repair soldering area (9), and the repair soldering area (9) is located at a bend in the pad area (3).

4. The module RTP pad structure according to claim 3, characterized in that: The width of the repair welding area (9) is at least equal to that of the single foot (5).

5. The module RTP pad structure according to claim 3 or 4, characterized in that: The repair welding area is quadrilateral or I-shaped.

6. The module RTP pad structure according to claim 5, characterized in that: A spacing strip (6) having a length at least equal to the length of the repair welding area (9) is provided between adjacent single legs (5).

7. The module RTP pad structure according to claim 6, characterized in that: The thickness of the spacer strip (6) is not less than the thickness of the single foot (5).

8. The module RTP pad structure according to claim 2, characterized in that: The single leg (5) has a reinforcement area, the reinforcement area is located at a bend in the pad area (3), a reinforcement sheet (10) is provided on the surface of the reinforcement area, and the reinforcement sheet (10) matches and fits with the surface of the single leg (5) after the bend.

9. The module RTP pad structure according to claim 8, characterized in that: Spot welding rods (7) fixedly connected to the surface of the single leg (5) are provided at both ends of the reinforcing sheet (10).

10. The module RTP pad structure according to claim 9, characterized in that: The spot welding rod (7) is provided with a spot welding area (8).

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