Efficient heat dissipation MOS tube

Abstract

The utility model discloses a high-efficiency heat radiation MOS tube, which comprises a heat radiator, a ceramic chip, a single tube positioning piece, an MOS tube, an elastic rubber pad and a dust cover, the ceramic chip is installed on the surface of the radiator through the positioning pin, the single-tube positioning piece is installed on the ceramic chip through the radiator positioning pin, a plurality of MOS tube limiting grooves are evenly distributed in the single-tube positioning piece, and the MOS tubes are installed in the MOS tube limiting grooves and tightly attached to the ceramic chip; a plurality of rubber pad limiting grooves are formed in the inner wall of the dustproof cover and correspond to the MOS tubes one to one, the elastic rubber pads are attached to the rubber pad limiting grooves, the dustproof cover and the radiator are locked, and the MOS tubes are covered and pressed by the elastic rubber pads. According to the utility model, the contact surfaces of the MOS tube and the ceramic chip can be completely attached, the heat dissipation performance is improved, a plurality of single tubes can be covered by one dust cover, the size of the radiator is reduced, a tool clamp is not needed, dust prevention is realized, and the stability performance is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of frequency converters, and in particular relates to a high-efficiency heat dissipation MOS tube. Background Art

[0002] The inverter MOS tube will generate a lot of heat when working. If this heat cannot be dissipated, the semiconductor material in the MOS tube will decompose due to the high temperature, causing the MOS to be damaged and fail.

[0003] At present, in order to cool down the inverter MOS tube, the industrial industry generally needs to add an aluminum substrate or an insulating thermal conductive silicone sheet directly below the MOS tube for heat conduction and heat dissipation, and a large heat sink is required for heat dissipation. When using an aluminum substrate for heat dissipation, the flatness of the aluminum substrate surface is difficult to ensure, and there will be a gap between the MOS tube and the aluminum substrate surface, thereby reducing the heat dissipation efficiency. When using an insulating thermal conductive silicone sheet for heat dissipation, the thermal conductive silicone sheet is prone to aging and its thermal conductivity is unstable. It may crack over time, causing heat dissipation and safety issues.

[0004] Currently, the shrapnel and plastic cover for pressing MOS tubes on the market can only press up to 3 MOS tubes. The more MOS tubes there are, the more shrapnel and plastic covers are needed, which leads to a larger arrangement spacing of the MOS tubes, a larger size of the heat sink, and an increase in cost.

[0005] Therefore, under the premise of ensuring performance, how to make the inverter's heat dissipation performance as good as possible, the volume as small as possible, and the power density as high as possible is a difficult problem that the industry needs to overcome. Summary of the invention

[0006] The purpose of the utility model is to provide a high-efficiency heat dissipation MOS tube to solve the problems raised in the above background technology.

[0007] To achieve the above object, the utility model provides the following technical solutions: an efficient heat dissipation MOS tube, comprising a heat sink, a ceramic sheet, a single tube positioning piece, a MOS tube, an elastic rubber pad and a dust cover;

[0008] The ceramic sheet is mounted on the surface of the radiator through positioning pins, the single-tube positioning piece is mounted on the ceramic sheet through positioning pins of the radiator, a plurality of MOS tube limiting grooves are evenly distributed on the single-tube positioning piece, and the plurality of MOS tubes are mounted in the MOS tube limiting grooves and close to the ceramic sheet;

[0009] A plurality of rubber pad limiting grooves are opened on the inner wall of the dust cover, and the plurality of rubber pad limiting grooves correspond to the MOS tubes one by one. The elastic rubber pad is attached to the rubber pad limiting grooves, the dust cover is locked with the radiator, and the elastic rubber pad covers and presses the MOS tubes.

[0010] Preferably, the dust cover and the heat sink are locked by screws.

[0011] Preferably, the single-tube positioning member comprises a positioning member body, a single-tube limiting groove and a pin limiting rib, a plurality of single-tube limiting grooves are opened on the positioning member body, and a pin limiting rib is provided on one side of each single-tube limiting groove.

[0012] Preferably, a dust cover sheet metal is installed in the dust cover.

[0013] Preferably, the ceramic sheet is an alumina ceramic sheet.

[0014] Technical effects and advantages of the utility model:

[0015] 1. This structure can ensure that the contact surface of the MOS tube and the ceramic sheet are fully fitted, thereby improving the heat dissipation performance. One dust cover can cover multiple single tubes, reducing the volume of the radiator, eliminating the need for tooling and fixtures, achieving dust prevention, and improving stability.

[0016] 2. The dust cover is inlaid with sheet metal inside, which improves the strength of the dust cover and enables it to press the seven MOS tubes for a long time.

[0017] 3. The dust cover presses the MOS tube through the elastic rubber pad, so that each MOS tube is subjected to uniform pressure, avoiding the situation where the contact surface between the MOS tube and the ceramic sheet is not tight.

[0018] 4. The single-tube positioning piece is provided with a limit groove and pin spacing ribs, making the installation of the MOS tube simple and convenient, while avoiding the problem of pin deviation during installation.

[0019] 5. The radiator is equipped with positioning pins, and the ceramic plate and the single-tube positioning piece are provided with positioning holes. No positioning tooling is required during installation, which is convenient for operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the structure of the dust cover;

[0022] Figure 3 It is a structural schematic diagram of a single-tube positioning member.

[0023] In the figure: 1 screw, 2 dust cover, 3 elastic rubber pad, 4 MOS tube, 5 single tube positioning piece, 6 ceramic sheet, 7 positioning pin, 8 heat sink, 50 positioning piece body, 51 single tube limiting groove, 52 pin limiting rib, 53 MOS tube limiting groove, 21 rubber pad limiting groove, 22 dust cover sheet metal. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 1-Figure 3 A specific implementation of a high-efficiency heat dissipation MOS tube of the utility model is shown: comprising a heat sink 8, a ceramic sheet 6, a single tube positioning member 5, a MOS tube 4, an elastic rubber pad 3 and a dust cover 2;

[0026] The ceramic sheet 6 is mounted on the surface of the radiator 8 through the positioning pins 7, the single-tube positioning member 5 is mounted on the ceramic sheet 6 through the radiator positioning pins, a plurality of MOS tube limiting grooves 53 are evenly distributed on the single-tube positioning member 5, and the plurality of MOS tubes 4 are mounted in the MOS tube limiting grooves 53 and close to the ceramic sheet 6;

[0027] A plurality of rubber pad limiting grooves 21 are provided on the inner wall of the dust cover 2, and the plurality of rubber pad limiting grooves 21 correspond to the MOS tubes 4 one by one. The elastic rubber pad 3 is attached to the rubber pad limiting groove 21, and the dust cover 2 is locked with the heat sink 8. The elastic rubber pad 3 covers and presses the MOS tube 4. The elastic rubber pad 3 has good elasticity. The elastic rubber pad 3 is pressed down by the dust cover 2 to generate elastic deformation. At the same time, the elastic rubber pad 3 generates elastic deformation force acting on the MOS tube 4, so that the lower surface of the MOS tube 4 is always in close contact with the ceramic sheet 6.

[0028] The dust cover 2 and the heat sink 8 are locked by screws 1, and positioning holes are provided on the ceramic sheet 6 and the single-tube positioning piece 5 for easy installation.

[0029] Among them, the single-tube positioning member 5 includes a positioning member body 50, a single-tube limiting groove 51 and a pin limiting rib 52. A plurality of single-tube limiting grooves 51 are opened on the positioning member body 50, and a pin limiting rib 52 is provided on one side of each single-tube limiting groove 51, which solves the problem of deviation during installation and welding of the MOS tube, increases the creepage distance, and improves safety.

[0030] A dust cover sheet metal 22 is installed in the dust cover 2, and convex reinforcement ribs are added to the sheet metal, which greatly improves the strength of the dust cover, so that it can press the seven MOS tubes for a long time.

[0031] Among them, the ceramic sheet is an alumina ceramic sheet, which has insulation function and good thermal conductivity, solves the safety and heat dissipation problems, and the overall heat sink effect is better than the aluminum substrate method, thereby improving the power density.

[0032] The utility model can ensure that the contact surfaces of the MOS tube and the ceramic sheet are completely fitted, and the heat dissipation performance is good. One dust cover can press multiple single tubes, reducing the volume of the radiator, and no tooling fixture is required, so as to achieve dust prevention and improve stability performance.

[0033] The applicant further declares that the present invention illustrates the implementation method and device structure of the present invention through the above embodiments, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above methods and structures to be implemented. Those skilled in the art should understand that any improvement to the present invention, equivalent replacement of the implementation method selected by the present invention, addition of steps, selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.

[0034] The present invention is not limited to the above-mentioned embodiments, and all methods that use structures and methods similar to the present invention to achieve the purpose of the present invention are within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation MOS tube, characterized in that: It comprises a heat sink (8), a ceramic sheet (6), a single tube positioning piece (5), a MOS tube (4), an elastic rubber pad (3) and a dust cover (2); The ceramic sheet (6) is mounted on the surface of the heat sink (8) via positioning pins (7); the single-tube positioning piece (5) is mounted on the ceramic sheet (6) via positioning pins of the heat sink; a plurality of MOS tube limiting grooves (53) are evenly distributed on the single-tube positioning piece (5); and the plurality of MOS tubes (4) are mounted in the MOS tube limiting grooves (53) and are closely attached to the ceramic sheet (6); A plurality of rubber pad limiting grooves (21) are formed on the inner wall of the dust cover (2), the plurality of rubber pad limiting grooves (21) correspond to the MOS tubes (4) one by one, the elastic rubber pads (3) are attached to the rubber pad limiting grooves (21), the dust cover (2) is locked with the heat sink (8), and the elastic rubber pads (3) cover and press the MOS tubes (4) tightly.

2. The high-efficiency heat dissipation MOS tube according to claim 1, characterized in that: The dust cover (2) and the heat sink (8) are locked together by means of screws (1).

3. The high-efficiency heat dissipation MOS tube according to claim 1, characterized in that: The single-tube positioning member (5) comprises a positioning member body (50), a single-tube limiting groove (51) and a pin limiting rib (52). A plurality of single-tube limiting grooves (51) are provided on the positioning member body (50), and a pin limiting rib (52) is provided on one side of each single-tube limiting groove (51).

4. The high-efficiency heat dissipation MOS tube according to claim 1, characterized in that: A dust cover sheet metal (22) is installed in the dust cover (2).

5. The high-efficiency heat dissipation MOS tube according to claim 1, characterized in that: The ceramic sheet (6) is an alumina ceramic sheet.

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