Radiator and domain controller

Abstract

The utility model discloses a radiator and a domain controller, and the radiator comprises a bottom plate which comprises a first surface and a second surface which are arranged oppositely; the first fin group is convexly arranged from the first surface to the direction far away from the second surface; the second fin group is convexly arranged from the first surface to the direction far away from the second surface; the protruding height, relative to the first surface, of the second fin set is different from the protruding height, relative to the first surface, of the first fin set. At least part of the fins in the second fin set and at least part of the fins in the first fin set are arranged in a penetrating mode. According to the embodiment of the invention, heat dissipation can be timely and effectively carried out on the heating element, a good heat dissipation effect is achieved, and therefore the passive heat dissipation requirement is well met.

Description

Technical Field

[0001] The present disclosure relates to thermal management technology, and in particular to a heat sink and a domain controller. Background Art

[0002] In some scenarios, passive heat dissipation is required. Passive heat dissipation is generally achieved through a radiator, such as a finned radiator. However, in the related art, the heat dissipation effect of the radiator is not good, and it is difficult to meet the passive heat dissipation requirements. Utility Model Content

[0003] In order to improve the heat dissipation performance of the radiator and better meet the passive heat dissipation requirements, the present disclosure is proposed. An embodiment of the present disclosure provides a radiator and a domain controller.

[0004] According to one aspect of an embodiment of the present disclosure, there is provided a heat sink, comprising:

[0005] A bottom plate, the bottom plate comprising a first surface and a second surface disposed opposite to each other;

[0006] A first fin group, the first fin group is protruding from the first surface toward a direction away from the second surface;

[0007] A second fin group, wherein the second fin group is protruded from the first surface toward a direction away from the second surface;

[0008] The protruding height of the second fin group relative to the first surface is different from the protruding height of the first fin group relative to the first surface; at least part of the fins in the second fin group and at least part of the fins in the first fin group penetrate each other.

[0009] According to another aspect of an embodiment of the present disclosure, a domain controller is provided, including:

[0010] Circuit boards;

[0011] The above-mentioned radiator is used to dissipate heat for the heating element arranged on the circuit board.

[0012] Based on the heat sink and domain controller provided by the above embodiment of the present disclosure, the heat sink can be used to dissipate heat for the heating element. Specifically, the heat generated by the heating element can be conducted to the bottom plate. Two types of fin groups can be arranged on the bottom plate, one of which is the first fin group and the other is the second fin group. Taking the case where the height of the protrusion corresponding to the second fin group is greater than the height of the protrusion corresponding to the first fin group as an example, the second fin group can be regarded as the main fin group, which plays a major role in heat dissipation for the heat conducted from the bottom plate. Since at least part of the fins in the second fin group and at least part of the fins in the first fin group are mutually interpenetrated, the first fin group can be regarded as an auxiliary fin group, and at least part of the fins in the first fin group can be used to equalize the temperature of each fin mutually interpenetrated with the fin. In this way, the temperature of each fin in the second fin group can be kept consistent as much as possible, and some fins in the second fin group can be avoided from being difficult to exchange heat due to the temperature being too low and too close to the ambient temperature, so that each fin in the second fin group can be efficiently cooled. Therefore, by adopting the embodiment of the present disclosure, the first fin group and the second fin group work in coordination, so as to dissipate heat for the heat generating element in a timely and effective manner, achieve a good heat dissipation effect, and thus better meet the passive heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic structural diagram of a heat sink provided by some exemplary embodiments of the present disclosure at a certain viewing angle.

[0014] Figure 2 It is a schematic structural diagram of a heat sink provided by some exemplary embodiments of the present disclosure at another viewing angle.

[0015] Figure 3 It is a schematic structural diagram of a heat sink provided by some exemplary embodiments of the present disclosure at another viewing angle.

[0016] Figure 4 is a schematic structural diagram of a heat sink provided by some exemplary embodiments of the present disclosure at another viewing angle.

[0017] Figure 5 is a schematic structural diagram of a heat sink provided by some exemplary embodiments of the present disclosure at another viewing angle.

[0018] Figure 6 It is a schematic diagram of the structure of a domain controller provided by some exemplary embodiments of the present disclosure.

[0019] Figure 7 It is a schematic diagram of the assembly of the heat dissipation boss and the heat generating element in some exemplary embodiments of the present disclosure.

[0020] Figure 8 It is a schematic diagram of the structure of the heat generating element in some exemplary embodiments of the present disclosure.

[0021] Fig. 9 It is a schematic diagram of the arrangement of the pressure relief grooves in some exemplary embodiments of the present disclosure. DETAILED DESCRIPTION

[0022] Below, the exemplary embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure, and it should be understood that the present disclosure is not limited to the exemplary embodiments described here.

[0023] In the description of the present disclosure, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present disclosure.

[0024] In the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0025] Exemplary Systems

[0026] An embodiment of the present disclosure provides a heat sink.

[0027] Optionally, the heat sink can be applied to a domain controller in a vehicle. It is understandable that the domain controller is a core component for implementing assisted driving and unmanned driving technology in a vehicle. The domain controller is a highly integrated complex circuit system, such as a circuit system integrating a power module, a control module, a sensor module, an electronic control unit, etc.

[0028] Of course, the radiator can also be applied to other devices or systems that require passive heat dissipation, and the present disclosure does not limit this. For ease of understanding, the following description is based on the case where the radiator is applied to a domain controller as an example.

[0029] like Figures 1 to 5 As shown, the heat sink may include:

[0030] The bottom plate 10 may include a first surface S1 and a second surface S2 disposed opposite to each other;

[0031] A first fin set 20, the first fin set 20 may be protruded from the first surface S1 in a direction away from the second surface S2;

[0032] The second fin set 30 may be protruded from the first surface S1 toward a direction away from the second surface S2;

[0033] The protruding height of the second fin set 30 relative to the first surface S1 may be different from the protruding height of the first fin set 20 relative to the first surface S1; at least part of the fins 301 in the second fin set 30 and at least part of the fins 201 in the first fin set 20 may penetrate each other.

[0034] Optionally, Figures 1 to 3 as well as Figures 5 and 6 In the embodiment, the upper surface of the bottom plate 10 may be the first surface S1, and the lower surface of the bottom plate 10 may be the second surface S2. The first surface S1 and the second surface S2 may be parallel to each other.

[0035] Optionally, the first fin group 20 may include a plurality of fins 201, for example, N fins 201. Each fin 201 in the first fin group 20 may be protruded from the first surface S1 in a direction away from the second surface S2. Each fin 201 in the first fin group 20 may be perpendicular to the first surface S1. The protruding heights of each fin 201 in the first fin group 20 relative to the first surface S1 may be the same, so that the protruding height of any fin 201 in the first fin group 20 relative to the first surface S1 can be used as the protruding height of the first fin group 20 relative to the first surface S1. In an example, the protruding height of the first fin group 20 relative to the first surface S1 can be expressed as Figure 5 h1 in the content.

[0036] Optionally, the second fin group 30 may include a plurality of fins 301, for example, M fins 301. Each fin 301 in the second fin group 30 may be protruded from the first surface S1 in a direction away from the second surface S2. Each fin 301 in the second fin group 30 may be perpendicular to the first surface S1. The protruding heights of each fin 301 in the second fin group 30 relative to the first surface S1 may be the same, so that the protruding height of any fin 301 in the second fin group 30 relative to the first surface S1 can be used as the protruding height of the second fin group 30 relative to the first surface S1. In an example, the protruding height of the second fin group 30 relative to the first surface S1 can be expressed as Figure 5 h2 in .

[0037] It should be noted that the protruding height of the second fin set 30 relative to the first surface S1 may be different from the protruding height of the first fin set 20 relative to the first surface S1. Then, there may be the following two situations:

[0038] Case 1: The protruding height of the second fin set 30 relative to the first surface S1 is greater than the protruding height of the first fin set 20 relative to the first surface S1, that is, h2 is greater than h1 (corresponding to Figure 5 );

[0039] Case 2: The protruding height of the second fin set 30 relative to the first surface S1 is smaller than the protruding height of the first fin set 20 relative to the first surface S1 , that is, h2 is smaller than h1 .

[0040] For the above-mentioned situation 1, the first fin group 20 can be called a low fin group, and the second fin group 30 can be called a tall fin group. For the above-mentioned situation 2, the second fin group 30 can be called a low fin group, and the first fin group 20 can be called a tall fin group. For ease of understanding, the following mainly introduces the above-mentioned situation 1.

[0041] It should be noted that at least some of the fins 301 in the second fin set 30 and at least some of the fins 201 in the first fin set 20 can be mutually interpenetrated. For example, for any fin 301 in the second fin set 30, the fin 301 can be mutually interpenetrated with at least some of the fins 201 in the first fin set 20. The mutual interpenetration of the fin 301 and a certain fin 201 in the first fin set 20 can be understood as: the fin 301 passes through the fin 201, and the fin 201 also passes through the fin 301.

[0042] Generally speaking, domain controllers include components that generate heat during operation and require passive heat dissipation, such as Figures 6 to 8 The heating element 40 is shown in FIG. 4. Optionally, the heating element 40 may be a chip.

[0043] In the embodiment of the present disclosure, the heat sink can be used to dissipate heat for the heating element 40. Specifically, the heat generated by the heating element 40 can be conducted to the base plate 10. Two types of fin groups can be provided on the base plate 10, one of which is the first fin group 20, and the other is the second fin group 30. Taking the case where the protruding height corresponding to the second fin group 30 is greater than the protruding height corresponding to the first fin group 20 as an example, the second fin group 30 can be regarded as the main fin group, which plays a major role in heat dissipation for the heat conducted from the base plate 10. Since at least part of the fins 301 in the second fin group 30 and at least part of the fins 201 in the first fin group 20 are mutually interpenetrated, the first fin group 20 can be regarded as an auxiliary fin group, and each fin 301 mutually interpenetrated with the fin 201 can be evenly heated through at least part of the fins 201 in the first fin group 20. In this way, the temperature of each fin 301 in the second fin group 30 can be made close to the same, and it is avoided that some fins 301 in the second fin group 30 are difficult to exchange heat due to being too low in temperature and too close to the ambient temperature, so that each fin 301 in the second fin group 30 can dissipate heat efficiently. Therefore, by adopting the embodiment of the present disclosure, through the coordinated work of the first fin group 20 and the second fin group 30, the heat of the heating element 40 can be dissipated in a timely and effective manner, and a good heat dissipation effect can be achieved, thereby better meeting the passive heat dissipation requirements.

[0044] In some optional examples, the protruding height of the second fin set 30 relative to the first surface S1 may be greater than the protruding height of the first fin set 20 relative to the first surface S1;

[0045] The first fin group 20 may include a plurality of first auxiliary fins, and the plurality of first auxiliary fins may be parallel to each other; and / or the first fin group 20 may include a plurality of second auxiliary fins, and the plurality of second auxiliary fins may be distributed in a radial shape.

[0046] Optionally, each fin 201 in the first fin group 20 can be used as a first auxiliary fin, so that the first fin group 20 can include N first auxiliary fins. Alternatively, each fin 201 in some of the fins 201 in the first fin group 20 can be used as a first auxiliary fin, and each fin 201 in another part of the fins 201 can be used as a second auxiliary fin, so that the first fin group 20 can include N1 first auxiliary fins and N2 second auxiliary fins, N1+N2=N. Alternatively, each fin 201 in the first fin group 20 can be used as a second auxiliary fin, so that the first fin group 20 can include N second auxiliary fins. For ease of understanding, the following description is based on the case where the first fin group 20 includes N1 first auxiliary fins and N2 second auxiliary fins.

[0047] In some optional embodiments of the present disclosure, the plurality of second auxiliary fins may be arranged relative to Figure 4 Of course, the plurality of second auxiliary fins may also be distributed radially relative to the midpoint of the dotted line 50 or other positions.

[0048] In some optional embodiments of the present disclosure, one side of the structure composed of multiple second auxiliary fins may be distributed with some first auxiliary fins in the first fin group 20, and the other side may be distributed with another part of the first auxiliary fins in the first fin group 20, and any first auxiliary fin in the first fin group 20 may extend to the edge of the structure (for the sake of convenience, this structure will be referred to as the target structure later).

[0049] like Figure 4 As shown, N1 first auxiliary fins can be divided into two parts, namely the first sub-fin group and the second sub-fin group. The first sub-fin group can be located on the left side of the target structure, and the first sub-fin group can include n1 first auxiliary fins, and the n1 first auxiliary fins can be parallel to each other. The second sub-fin group can be located on the right side of the target structure, and the second sub-fin group can include n2 first auxiliary fins, and the n2 first auxiliary fins can be parallel to each other, n1+n2=N1. The n1 first auxiliary fins in the first sub-fin group can be arranged at equal intervals, and the n2 first auxiliary fins in the second sub-fin group can also be arranged at equal intervals. The specific spacing can be set according to actual needs, and the present disclosure does not limit this. The right end of each first auxiliary fin in the first sub-fin group can extend to the edge of the target structure. The left end of each first auxiliary fin in the second sub-fin group can extend to the edge of the target structure.

[0050] It should be noted that the number of the heating element 40 in the domain controller can be multiple. Figure 6 A heating element 40 may be provided on each of the left and right sides of the heating element 40 shown in the figure, that is, there may be a total of three heating elements 40 that need to be passively cooled. In the actual operation of the radiator, the target structure can be used for Figure 6 The first sub-fin group and the second sub-fin group can be used for the heat dissipation of the heating element 40 shown in the figure, and the heat dissipation of the other two heating elements 40 can be achieved through the heat sink. In this way, the passive heat dissipation of multiple heating elements 40 can be achieved simultaneously through the heat sink. In addition, since the target structure is a radial structure, the target structure is conducive to achieving uniform temperature along each radiation direction, so that each fin 301 in the second fin group 30 can dissipate heat more efficiently. Therefore, the target structure can be suitable for the heat dissipation of the heating element 40 with large power consumption and / or large thermal resistance.

[0051] It can be understood that if the heat generating element 40 is a chip, the thermal resistance of the heat generating element 40 may refer to the heat transfer resistance from the chip junction to the top surface of the chip, and the unit may be °C / W.

[0052] In the embodiment of the present disclosure, since the first fin group 20 includes a plurality of first auxiliary fins parallel to each other and / or a plurality of second auxiliary fins distributed radially, the overall structure of the first fin group 20 is relatively regular, easy to manufacture, and beneficial to heat dissipation of the heating element 40 with large power consumption and / or large thermal resistance through the radial structure.

[0053] In some optional examples, the second fin group 30 may include a plurality of main fins, and the plurality of main fins may be parallel to each other; the angle between the first auxiliary fins and the main fins interpenetrating each other may be greater than or equal to 30 degrees and less than or equal to 90 degrees.

[0054] Optionally, each fin 301 included in the second fin group 30 can be used as a main fin, so that the second fin group 30 can include M main fins, and the M main fins can be parallel to each other. The M main fins in the second fin group 30 can be arranged at equal intervals, and the specific interval can be set according to actual needs, which is not limited in the present disclosure.

[0055] Optionally, the angle between the mutually interpenetrating first auxiliary fin and the main fin may be within the range of [30 degrees, 90 degrees]. Thus, the angle between the mutually interpenetrating first auxiliary fin and the main fin may be 30 degrees, 45 degrees, 60 degrees, 85 degrees, 90 degrees, etc., which are not listed here one by one.

[0056] In the embodiment of the present disclosure, since the second fin group 30 includes a plurality of main fins parallel to each other, the structure of the second fin group 30 is relatively regular and easy to manufacture. In addition, by limiting the angle between the first auxiliary fins and the main fins interlaced with each other to the range of [30 degrees, 90 degrees], it is helpful to ensure the rationality of the angle and avoid the unreasonable angle affecting the temperature uniformity effect.

[0057] In some optional examples, such as Figure 6 , Figure 7 As shown, the heat sink may also include:

[0058] The heat dissipation boss 60 may be protruded from the second surface S2 in a direction away from the first surface S1 , and the heat dissipation boss 60 may be provided with a receiving groove 601 .

[0059] Optionally, the heat dissipation boss 60 may be perpendicular to the second surface S2. The receiving groove 601 may be disposed at the lower end of the heat dissipation boss 60. The receiving groove 601 may be used to receive at least part of the components of the heat generating element 40.

[0060] In the embodiment of the present disclosure, at least part of the components of the heating element 40 can be accommodated by the accommodating groove 601, and there can be a gap between the accommodating groove 601 and the heating element 40, and the gap is used to fill the heat-conducting medium, including but not limited to silica gel, thermal grease, thermal gel, etc. In this way, the heat at the heating element 40 can be transferred to the bottom plate 10 after passing through the thermal conductive medium and the heat dissipation boss 60, and dissipated through the first fin group 20 and the second fin group 30, so as to achieve a good heat dissipation effect, thereby better meeting the passive heat dissipation requirements.

[0061] In some optional examples, the protruding height of the first fin group 20 relative to the first surface S1 is a first height, the protruding height of the second fin group 30 relative to the first surface S1 is a second height, and the ratio of the first height to the second height is less than or equal to 0.5.

[0062] Optionally, h1 in the above text can be used as the first height, h2 in the above text can be used as the second height, and the ratio of h1 to h2 can be less than or equal to 0.5. For example, the ratio of h1 to h2 can be 0.5, 0.4, 0.3, 0.2, 0.15, 0.1, etc., which are not listed here one by one.

[0063] In the embodiment of the present disclosure, by making the ratio of the first height to the second height less than or equal to 0.5, the protruding heights corresponding to the first fin group 20 and the second fin group 30 can be significantly different. In this way, it is helpful to avoid the protruding heights corresponding to the first fin group 20 and the second fin group 30 being close to each other and to reduce the gap between adjacent fins 301 in the second fin group 30 in disguised form, thereby helping to ensure the heat dissipation performance of the radiator.

[0064] In some embodiments, the ratio of h1 to h2 may preferably be less than or equal to 0.2.

[0065] The embodiment of the present disclosure also provides a domain controller. Figure 6 As shown, a domain controller may include:

[0066] Circuit board 70;

[0067] The heat sink in any of the above embodiments is used to dissipate heat for the heating element 40 disposed on the circuit board 70 .

[0068] Optionally, the circuit board 70 may be a printed circuit board assembly (PCBA).

[0069] Optionally, the heating element 40 and the circuit board 70 may be welded, and solder balls may exist between the heating element 40 and the circuit board 70 .

[0070] In the embodiment of the present disclosure, the first fin group 20 and the second fin group 30 in the radiator can timely and effectively dissipate heat for the heat generating element 40 in the domain controller, achieving a good heat dissipation effect, thereby better meeting the passive heat dissipation requirements. This is conducive to ensuring the working performance of the domain controller, thereby ensuring the safety of the vehicle.

[0071] In some optional examples, such as Figure 7 , Figure 8 As shown, the heating element 40 may include:

[0072] The body 401 may include a third surface S3 and a fourth surface S4 disposed opposite to each other, and the fourth surface S4 may face Figure 6 The circuit board 70;

[0073] The raised portion 403 may be raised from the third surface S3 in a direction away from the fourth surface S4. The raised portion 403 may include a fifth surface S5, a sixth surface S6, and a seventh surface S7. The sixth surface S6 and the seventh surface S7 may be disposed on both sides of the fifth surface S5. The sixth surface S6 and the fifth surface S5 may be disposed at an angle. The seventh surface S7 and the fifth surface S5 may be disposed at an angle. The sixth surface S6 and the seventh surface S7 may extend to the third surface S3 respectively.

[0074] The heat sink may include the heat dissipation boss 60 described above, the shape of the receiving groove 601 provided on the heat dissipation boss 60 may be adapted to the shape of the protrusion 403, the receiving groove 601 may accommodate the protrusion 403, and a gap for filling a heat-conducting medium may be provided between the protrusion 403 and the receiving groove 601;

[0075] At least a portion of the heat dissipation boss 60 that is opposite to the target area may be provided with Figure 7 , Fig. 9 As shown in the decompression groove 603 , the gap may be in communication with the decompression groove 603 ; the target area refers to an area of ​​the third surface S3 excluding respective projection areas of the fifth surface S5 , the sixth surface S6 , and the seventh surface S7 .

[0076] Optionally, the body 401 may be a component of the heating element 40 for realizing a set function (eg, a calculation function). Figure 8 The upper surface of the middle body 401 can be used as the third surface S3. Figure 8 The lower surface of the middle body 401 may serve as the fourth surface S4. The third surface S3 and the fourth surface S4 may be parallel to each other.

[0077] Optionally, the raised portion 403 may be a portion for cooperating with the heat dissipation boss 60. The raised portion 403 and the body 401 may be integrally formed. The raised portion 403 may include a fifth surface S5, a sixth surface S6, and a seventh surface S7, and the sixth surface S6 and the seventh surface S7 may be symmetrically distributed on both sides of the fifth surface S5. The sixth surface S6 may be at an obtuse angle to the fifth surface S5. The seventh surface S7 may also be at an obtuse angle to the fifth surface S5. The lower left end of the sixth surface S6 may extend to the third surface S3. The lower right end of the seventh surface S7 may extend to the third surface S3.

[0078] Alternatively, if Figure 7 As shown, for the receiving groove 601 disposed on the heat dissipation boss 60 , the groove diameter may gradually increase in a direction away from the groove bottom, so that the shape of the receiving groove 601 is adapted to the shape of the protrusion 403 .

[0079] Optionally, the fifth surface S5, the sixth surface S6 and the seventh surface S7 can be projected onto the third surface S3 in a projection direction from top to bottom. In this way, a first projection area corresponding to the fifth surface S5, a second projection area corresponding to the sixth surface S6, and a third projection area corresponding to the seventh surface S7 in the third surface S3 can be determined. The union of other areas of the third surface S3 except the first projection area, the second projection area and the third projection area can be used as the target area. At least a portion of the area of ​​the heat dissipation boss 60 opposite to the target area can be provided with a decompression groove 603. In one example, as Fig. 9 As shown, there may be multiple decompression grooves 603 , and the multiple decompression grooves 603 may be evenly distributed relative to the heat dissipation boss 60 .

[0080] In the embodiment of the present disclosure, the protrusion 403 can be placed in the receiving groove 601, and the gap between the protrusion 403 and the receiving groove 601 is filled with heat-conducting medium such as thermal grease, thermal gel, etc., so as to efficiently transfer the heat at the heating element 40 to the bottom plate 10 through the heat-conducting medium and the heat dissipation boss 60, so as to dissipate heat through the first fin group 20 and the second fin group 30. It should be noted that when the amount of heat-conducting medium in the gap between the protrusion 403 and the receiving groove 601 is too much, the soldering tin ball between the heating element 40 and the circuit board 70 is subjected to a large force, which is easy to crush the soldering tin ball, resulting in failure of the heating element 40. In the embodiment of the present disclosure, through the setting of the pressure relief groove 603, if the amount of heat-conducting medium is too much, part of the heat-conducting medium can be discharged through the pressure relief groove 603, so as to reduce the force, thereby avoiding the soldering tin ball from being crushed, and then ensuring the normal operation of the heating element 40 while ensuring heat transfer. The embodiment of the present disclosure is particularly suitable for the case where the viscosity of the heat-conducting medium is large.

[0081] In some optional examples, the heat sink may include a heat dissipation boss 60, and a receiving groove 601 arranged on the heat dissipation boss 60 may accommodate the heat generating element 40; the gap between the bottom of the receiving groove 601 and the heat generating element 40, and the gap between the groove wall of the receiving groove 601 and the heat generating element 40 may be filled with a heat conducting medium.

[0082] Optionally, the heating element 40 may include six surfaces, namely, top, bottom, front, back, left, and right. The lower surface may be welded to the circuit board 70 by soldering tin balls. During actual installation, the receiving groove 601 may accommodate the heating element 40, and the gaps between the remaining five surfaces of the heating element 40 except the lower surface and the receiving groove 601 may be filled with thermal conductive media such as thermal grease and thermal conductive gel. In this way, the remaining five surfaces are connected to the heat dissipation boss 60 through the thermal conductive media, and the heating element 40 is cooled by immersion, which is conducive to expanding the heat dissipation area and improving the heat dissipation performance.

[0083] In some optional examples, the first fin group 20 in the heat sink may include multiple second auxiliary fins, the heat sink may include a heat dissipation boss 60, the heat generating component 40 may meet preset power consumption conditions and / or preset thermal resistance conditions, and the accommodating groove 601 arranged on the heat dissipation boss 60 may accommodate the heat generating component 40; the setting area of ​​the heat dissipation boss 60 on the second surface S2 of the base plate 10 in the heat sink corresponds to the setting area of ​​the structure composed of multiple second auxiliary fins (i.e., the target structure) on the first surface S1 of the base plate 10.

[0084] Optionally, if the power of the heating element 40 is greater than a preset power, or the power of the heating element 40 is more than 20 times the power of other components in the domain controller that require passive heat dissipation, it can be determined that the heating element 40 meets the preset power consumption condition.

[0085] Optionally, if the thermal resistance of the heating element 40 is greater than a preset thermal resistance, or the thermal resistance of the heating element 40 is more than 10 times the thermal resistance of other components in the domain controller that require passive heat dissipation, it can be determined that the heating element 40 meets the preset thermal resistance condition.

[0086] It should be noted that if the heating element 40 meets the preset power consumption condition and / or the preset thermal resistance condition, it means that the power of the heating element 40 is relatively large and / or the thermal resistance is relatively large, and the heat dissipation of the heating element 40 is relatively difficult. Therefore, there is a significant passive heat dissipation demand for the heating element 40. In view of this, the setting area of ​​the heat dissipation boss 60 on the second surface S2 can be made to correspond to the setting area of ​​the target structure on the first surface S1 of the base plate 10. In this way, the heat at the heating element 40 can be conducted to the base plate 10 after passing through the heat-conducting medium and the heat dissipation boss 60, and the heat is dissipated through the target structure and the second fin group 30. As described above, the target structure can achieve a very good temperature equalization effect, thereby being able to very effectively achieve the heat dissipation of the heating element 40 with relatively large power and / or relatively large thermal resistance.

[0087] In summary, by adopting the embodiments of the present disclosure, a good heat dissipation effect can be achieved, thereby better meeting the passive heat dissipation requirements.

[0088] It should be noted that the various optional embodiments and optional implementation methods disclosed above can be flexibly selected and combined as needed to achieve corresponding functions and effects, and the present disclosure does not list them one by one.

[0089] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0090] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other.

[0091] Those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present disclosure claims and their equivalents, the present disclosure is also intended to include these modifications and variations.

Claims

1. A radiator, characterized in that: include: A bottom plate (10), the bottom plate (10) comprising a first surface (S1) and a second surface (S2) disposed opposite to each other; A first fin group (20), the first fin group (20) being protruded from the first surface (S1) in a direction away from the second surface (S2); A second fin group (30), the second fin group (30) is protruding from the first surface (S1) in a direction away from the second surface (S2); The protruding height of the second fin group (30) relative to the first surface (S1) is different from the protruding height of the first fin group (20) relative to the first surface (S1); at least part of the fins (301) in the second fin group (30) and at least part of the fins (201) in the first fin group (20) are interpenetrating.

2. The heat sink according to claim 1, characterized in that: The protruding height of the second fin group (30) relative to the first surface (S1) is greater than the protruding height of the first fin group (20) relative to the first surface (S1); The first fin group (20) comprises a plurality of first auxiliary fins, and the plurality of first auxiliary fins are parallel to each other; and / or, The first fin group (20) comprises a plurality of second auxiliary fins, and the plurality of second auxiliary fins are distributed in a radial manner.

3. The heat sink according to claim 2, characterized in that: A part of the first auxiliary fins in the first fin group (20) is distributed on one side of the structure composed of a plurality of the second auxiliary fins, and another part of the first auxiliary fins in the first fin group (20) is distributed on the other side, and any of the first auxiliary fins in the first fin group (20) extends to the edge of the structure.

4. The heat sink according to claim 2, characterized in that: The second fin group (30) comprises a plurality of main fins, and the plurality of main fins are parallel to each other; the angle between the first auxiliary fins and the main fins interpenetrating each other is greater than or equal to 30 degrees and less than or equal to 90 degrees.

5. The radiator according to any one of claims 1 to 4, characterized in that: Also includes: A heat dissipation boss (60), the heat dissipation boss (60) is protruding from the second surface (S2) in a direction away from the first surface (S1), and the heat dissipation boss (60) is provided with a receiving groove (601).

6. The radiator according to any one of claims 1 to 4, characterized in that: The protruding height of the first fin group (20) relative to the first surface (S1) is a first height, the protruding height of the second fin group (30) relative to the first surface (S1) is a second height, and the ratio of the first height to the second height is less than or equal to 0.

5.

7. A domain controller, characterized in that: include: Circuit board (70); The heat sink according to any one of claims 1 to 6, wherein the heat sink is used to dissipate heat for a heating element (40) disposed on the circuit board (70).

8. The domain controller according to claim 7, characterized in that: The heating element (40) comprises: A body (401), the body (401) comprising a third surface (S3) and a fourth surface (S4) disposed opposite to each other, the fourth surface (S4) facing the circuit board (70); a raised portion (403), the raised portion (403) being raised from the third surface (S3) in a direction away from the fourth surface (S4), the raised portion (403) comprising a fifth surface (S5), a sixth surface (S6) and a seventh surface (S7), the sixth surface (S6) and the seventh surface (S7) being arranged on both sides of the fifth surface (S5), the sixth surface (S6) and the fifth surface (S5) being arranged at an angle, the seventh surface (S7) and the fifth surface (S5) being arranged at an angle, and the sixth surface (S6) and the seventh surface (S7) respectively extending to the third surface (S3); The heat sink comprises a heat dissipation boss (60); the shape of a receiving groove (601) arranged on the heat dissipation boss (60) matches the shape of the protrusion (403); the receiving groove (601) receives the protrusion (403); and a gap for filling a heat-conducting medium is provided between the protrusion (403) and the receiving groove (601); A pressure relief groove (603) is provided in at least a portion of the heat dissipation boss (60) opposite to the target area, and the gap is connected to the pressure relief groove (603); the target area represents the area of ​​the third surface (S3) excluding the respective projection areas of the fifth surface (S5), the sixth surface (S6) and the seventh surface (S7).

9. The domain controller according to claim 7, characterized in that: The heat sink comprises a heat dissipation boss (60); a receiving groove (601) arranged on the heat dissipation boss (60) receives the heat generating element (40); a gap between the bottom of the receiving groove (601) and the heat generating element (40), and a gap between the groove wall of the receiving groove (601) and the heat generating element (40) are both filled with a heat conducting medium.

10. The domain controller according to claim 7, characterized in that: The first fin group (20) in the heat sink includes a plurality of second auxiliary fins, the heat sink includes a heat dissipation boss (60), the heat generating element (40) meets a preset power consumption condition and / or a preset thermal resistance condition, and a receiving groove (601) arranged on the heat dissipation boss (60) receives the heat generating element (40); the setting area of ​​the heat dissipation boss (60) on the second surface (S2) of the base plate (10) in the heat sink corresponds to the setting area of ​​the structure composed of the plurality of second auxiliary fins on the first surface (S1) of the base plate (10).

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