Heat dissipation device for terminal

Abstract

The utility model provides a heat dissipation device for a terminal, relates to the technical field of heat dissipation, and aims to solve the problem that an existing heat dissipation device is large in energy loss or not in place in cooling. The heat dissipation device for the terminal comprises a condensation plate which is installed on a partition plate of a protection cabinet, the terminal is placed on the condensation plate, and a condensation pipeline is arranged in the condensation plate; a cooling medium is stored in the condensation box; the delivery pump is mounted in the condensation tank, and a liquid supply pipeline is arranged at the liquid outlet end of the delivery pump; the multi-way pipeline is communicated with the liquid supply pipeline; one end of the conveying pipeline is communicated with the multi-way pipeline, and the other end is communicated with the condensing pipeline; each conveying pipeline is provided with the corresponding automatic control valve; the reflux pipeline is used for communicating the condensing pipeline with the condensing box; the refrigeration assembly is mounted in the condensation box; the temperature sensors are mounted on each layer of partition plate; the controller is used for adjusting the heat dissipation power. The structure that the condensation plates are arranged in a layered mode is adopted, and the heat exchange effect of the heat dissipation device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device for a terminal. Background Art

[0002] The data terminal is generally placed in a separate protective cabinet or rack. Since the data terminal needs to receive data for a long time and perform complex processing, a large amount of heat will be generated during the use of the data terminal. An external heat sink is required to cool it to avoid terminal overheating and terminal failure or fire.

[0003] When cooling the terminal, most of the existing heat dissipation devices are fans. After the terminal has been used for a period of time, the heat causes the fan to run at full load. After running at full load for a certain period of time, the fan will also generate heat. At the same time, the fan may also short-circuit due to overheating, causing the fan to stop running or, in serious cases, a fire. In the process of use, we found that the heat generated by each terminal on each floor is different due to the operating frequency. Using whole-machine cooling will cause large energy loss or some terminals will still have insufficient cooling. Utility Model Content

[0004] The utility model provides a terminal heat sink to solve the problems of large energy loss or insufficient cooling in existing heat sinks. The structure of layered condensation plates is adopted to improve the heat exchange effect of the heat sink.

[0005] The technical solution adopted by the utility model is:

[0006] A heat dissipation device for a terminal, comprising:

[0007] A condensation plate is installed on a partition of a protection cabinet or a placement rack, and the terminal is placed on the condensation plate, and a condensation pipeline is provided in the condensation plate;

[0008] A condensation tank, wherein a cooling medium for heat exchange is stored in the condensation tank;

[0009] A delivery pump is installed in the condensate tank, and a liquid supply pipeline is provided at the liquid outlet end of the delivery pump;

[0010] A multi-channel pipeline, the liquid inlet end of which is connected to the liquid supply pipeline;

[0011] A delivery pipeline, the number of which matches the liquid outlet end of the multi-way pipeline, one end of the delivery pipeline is connected to the multi-way pipeline, and the other end is connected to the condensation pipeline;

[0012] An automatic control valve, each of the delivery pipelines is equipped with the automatic control valve;

[0013] A reflux pipe, one end of which is connected to the condensation pipeline, and the other end of which is connected to the condensation tank;

[0014] a refrigeration assembly installed in the condensation tank; and

[0015] A temperature sensor is installed on each layer of the partition of the corresponding protection cabinet or the placement rack;

[0016] A controller, wherein a signal input end of the controller is connected to a signal output end of the temperature sensor; a first signal output end of the controller is connected to a signal input end of the delivery pump, a second signal output end of the controller is connected to a signal input end of the automatic control valve, and a third signal output end of the controller is connected to a signal input end of the refrigeration component.

[0017] Optionally, the condensation plate can be used as a partition of a protective cabinet or a storage rack.

[0018] Optionally, when the condensation plate is used as a partition, the condensation plate is detachably connected to the protection cabinet and the placement rack.

[0019] Optionally, the heat dissipation device further comprises:

[0020] Auxiliary heat dissipation device is installed between two partitions.

[0021] Optionally, the auxiliary heat dissipation device includes:

[0022] A mounting frame, installed between two partitions;

[0023] The fan is installed in the mounting frame, and its air inlet is arranged toward the side where the terminal is placed.

[0024] Optionally, the heat dissipation device further comprises:

[0025] The liquid level sensor is installed on the outer side wall of the condensation tank.

[0026] Optionally, the refrigeration component comprises:

[0027] A plurality of semiconductor heat sinks, the heat absorbing end of which is arranged inside the box body of the condensing box, and the heat exchanging end of which is arranged outside the box body of the condensing box;

[0028] A protective shell is mounted on the outer wall of the condensation box, so that an installation area for a semiconductor heat sink is formed between the outer wall of the condensation box and the protective shell, and a plurality of air outlets are provided on the protective shell;

[0029] The auxiliary heat dissipation fan is installed on the protective shell and is used to lead out the hot air in the installation area.

[0030] Optionally, the cooling medium is cooling oil or water.

[0031] Optionally, the condensation plate is made of copper.

[0032] Optionally, the condensation pipeline includes:

[0033] The straight tubes are arranged side by side along the width direction of the condensation plate, and the head and tail ends of two adjacent straight tubes are connected through a bend pipe.

[0034] Compared with the prior art, the beneficial effects of the utility model are:

[0035] 1. The purpose of setting condensation plates on the partitions where the terminals are placed on each floor is to improve the heat dissipation efficiency. At the same time, the heat exchange efficiency is controlled by the automatic control valves set on the transmission pipeline.

[0036] 2. The purpose of setting temperature sensors on each layer is to adjust the heat exchange efficiency of the controller according to the temperature of each layer and avoid excessively high temperature on a certain layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation device for the terminal.

[0039] Figure 2 The present invention is a schematic diagram of the structure of a terminal heat dissipation device having an auxiliary heat dissipation device.

[0040] Figure 3 A schematic diagram of the structure of a condensation plate of a terminal heat sink used as a partition.

[0041] Figure 4 This is a schematic diagram of the structure of a condensation plate of a terminal heat sink.

[0042] Reference numerals:

[0043] 1. Condensation plate; 12. Condensation pipeline; 2. Placement rack; 21. Partition; 3. Condensation box; 31. Cooling medium; 4. Delivery pump; 41. Liquid supply pipeline; 5. Multi-way pipeline; 6. Delivery pipeline; 7. Automatic control valve; 8. Return pipeline; 9. Refrigeration component; 91. Semiconductor heat sink; 92. Protective shell; 93. Auxiliary cooling fan; 10. Temperature sensor; 110. Controller; 120. Auxiliary heat dissipation device; 121. Mounting rack; 122. Fan; 130. Liquid level sensor. DETAILED DESCRIPTION

[0044] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the products of the present invention are conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0049] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0050] like Figure 1 and Figure 2 As shown, an embodiment of the utility model provides a terminal heat dissipation device, including: a condensation plate 1, a condensation box 3, a delivery pump 4, a multi-way pipe 5, a delivery pipe 6, an automatic control valve 7, a return pipe 8, a refrigeration component 9, a temperature sensor 10 and a controller 110.

[0051] The condensation plate 1 is installed on the partition 21 of the protection cabinet or the placement rack 2, and the terminal is placed on the condensation plate 1. The condensation plate 1 is provided with a condensation pipeline 12. The cooling medium 31 for heat exchange is stored in the condensation box 3. The delivery pump 4 is installed in the condensation box 3, and the liquid outlet end of the delivery pump 4 is provided with a liquid supply pipeline 41. The liquid inlet end of the multi-way pipeline 5 is connected with the liquid supply pipeline 41. The number of delivery pipelines 6 matches the liquid outlet end of the multi-way pipeline 5, one end of the delivery pipeline 6 is connected with the multi-way pipeline 5, and the other end is connected with the condensation pipeline 12. The automatic control valve 7 is installed on each of the delivery pipelines 6. One end of the reflux pipeline 8 is connected with the condensation pipeline 12, and the other end is connected with the condensation box 3. The refrigeration component 9 is installed in the condensation box 3. The temperature sensor 10 is installed on each layer of the partition 21 of the protection cabinet or the placement rack 2. The signal input end of the controller 110 is connected to the signal output end of the temperature sensor 10; the first signal output end of the controller 110 is connected to the signal input end of the delivery pump 4, the second signal output end of the controller 110 is connected to the signal input end of the automatic control valve 7, and the third signal output end of the controller 110 is connected to the signal input end of the refrigeration component 9.

[0052] When in use, the temperature of each layer is detected by the temperature sensor 10, and the temperature information is fed back to the controller 110. When the temperature information fed back by the temperature sensor 10 to the controller 110 is higher than the preset minimum threshold, the controller 110 controls the delivery pump 4 to work, and the controller 110 controls the opening of the automatic control valve 7 according to the temperature value, and provides the cooling medium 31 to the corresponding number of layers of condensation plates 1. The cooling medium 31 enters the condensation box 3 for cooling after heat exchange, and performs the next cycle after cooling.

[0053] During use, the data frequencies received and processed by the terminals on each layer are inconsistent, resulting in different heating values ​​on each layer. Therefore, a condensation plate 1 is provided on each layer of the partition 21 to facilitate separate heat exchange for the terminals on each layer and reduce the frequency of terminal failures due to overheating during use.

[0054] In another embodiment, if Figure 3As shown, in order to increase the distance between the two condensation plates 1 , the condensation plates 1 can be used as partitions 21 of the protection cabinet or the placement rack 2 .

[0055] In another embodiment, if Figure 3 As shown, when the condensing plate 1 is used as a partition 21, the condensing plate 1 is detachably connected to the protection cabinet and the placement rack 2. In order to facilitate the replacement of the condensing plate 1 after a failure, the connection mode of the condensing plate 1 to the protection cabinet or the placement rack 2 is set to a detachable connection. The detachable connection in this embodiment is a bolt connection or a clamping connection.

[0056] In another embodiment, if Figure 2 As shown, in order to improve the heat dissipation efficiency of the device, the heat dissipation device further includes: an auxiliary heat dissipation device 120, and the auxiliary heat dissipation device 120 is installed between the two partitions 21.

[0057] More specifically, the auxiliary heat dissipation device 120 includes: a mounting frame 121 and a fan 122; the mounting frame 121 is installed between two partitions 21. The fan 122 is installed in the mounting frame 121, and its air inlet is arranged toward the side where the terminal is placed.

[0058] By arranging a mounting frame 121 between two partitions 21 and arranging a fan 122 in the mounting frame 121, the hot air emitted between the partitions 21 can be taken away by the fan 122, thereby further improving the efficiency of heat exchange.

[0059] In another embodiment, if Figure 1 As shown, in order to prevent the liquid level of the cooling medium 31 in the condensation tank 3 from being lower than a preset minimum value, which affects the normal use of the heat dissipation device, a liquid level sensor 130 is provided on the outer wall of the condensation tank 3. The liquid level sensor 130 is a non-contact liquid level sensor 130.

[0060] In another embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the refrigeration assembly 9 includes: a plurality of semiconductor heat sinks 91, a protective shell 92 and an auxiliary heat dissipation fan 93. The heat absorption end of the semiconductor heat sink 91 is arranged in the box body of the condensation box 3, and the heat exchange end is arranged outside the box body of the condensation box 3. The protective shell 92 is installed on the outer wall of the condensation box 3, so that the installation area of ​​the semiconductor heat sink 91 is formed between the outer wall of the condensation box 3 and the protective shell 92, and the protective shell 92 is provided with a plurality of air outlets. The auxiliary heat dissipation fan 93 is installed on the protective shell 92, and is used to lead out the hot air in the installation area.

[0061] When in use, the heat absorbing end of the semiconductor heat sink 91 absorbs the temperature in the cooling medium 31, and then dissipates the heat through the heat exchange section arranged outside the condensation box 3. In order to prevent users from accidentally touching it, a protective shell 92 is arranged outside the semiconductor heat sink 91. In order to quickly dissipate the heat between the protective shell 92 and the condensation box 3, an auxiliary heat dissipation fan 93 is arranged on the protective shell 92. The auxiliary heat dissipation fan 93 accelerates the air flow in the installation area between the protective shell 92 and the condensation box 3, thereby improving the heat dissipation efficiency.

[0062] In another embodiment, in order to save costs, the cooling medium 31 in this embodiment is cooling oil or water.

[0063] In another embodiment, in order to improve the heat transfer efficiency, the condensation plate 1 is made of copper.

[0064] In another embodiment, if Figure 4 As shown, in order to increase the residence time of the cooling medium 31 in the condensation plate 1 so that most of the heat transferred to the condensation plate 1 is taken away by the circulating cooling medium 31, the condensation pipeline 12 includes: straight tubes arranged side by side along the width direction of the condensation plate 1, and the head and tail ends of two adjacent straight tubes are connected by a bend pipe.

[0065] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A heat dissipation device for a terminal, characterized in that: include: A condensation plate is installed on a partition of a protection cabinet or a placement rack, and the terminal is placed on the condensation plate, and a condensation pipeline is provided in the condensation plate; A condensation tank, wherein a cooling medium for heat exchange is stored in the condensation tank; A delivery pump is installed in the condensate tank, and a liquid supply pipeline is provided at the liquid outlet end of the delivery pump; A multi-channel pipeline, the liquid inlet end of which is connected to the liquid supply pipeline; A delivery pipeline, the number of which matches the liquid outlet end of the multi-way pipeline, one end of the delivery pipeline is connected to the multi-way pipeline, and the other end is connected to the condensation pipeline; An automatic control valve, each of the delivery pipelines is equipped with the automatic control valve; A reflux pipe, one end of which is connected to the condensation pipeline, and the other end of which is connected to the condensation tank; a refrigeration assembly installed in the condensation tank; and A temperature sensor is installed on each layer of the partition of the corresponding protection cabinet or the placement rack; A controller, wherein a signal input end of the controller is connected to a signal output end of the temperature sensor; a first signal output end of the controller is connected to a signal input end of the delivery pump, a second signal output end of the controller is connected to a signal input end of the automatic control valve, and a third signal output end of the controller is connected to a signal input end of the refrigeration component.

2. The heat dissipation device for a terminal according to claim 1, characterized in that: The condensation plate can be used as a partition of a protection cabinet or a placement rack.

3. The heat dissipation device for a terminal according to claim 2, characterized in that: When the condensation plate is used as a partition, the condensation plate is detachably connected to the protection cabinet and the placement rack.

4. The heat dissipation device for a terminal according to claim 1, characterized in that: The heat dissipation device further comprises: Auxiliary heat dissipation device is installed between two partitions.

5. The heat dissipation device for a terminal according to claim 4, characterized in that: The auxiliary heat dissipation device comprises: A mounting frame, installed between two partitions; The fan is installed in the mounting frame, and its air inlet is arranged toward the side where the terminal is placed.

6. The heat dissipation device for a terminal according to claim 1, characterized in that: The heat dissipation device further comprises: The liquid level sensor is installed on the outer side wall of the condensation tank.

7. The heat dissipation device for a terminal according to claim 1, characterized in that: The refrigeration assembly comprises: A plurality of semiconductor heat sinks, the heat absorbing end of which is arranged inside the box body of the condensing box, and the heat exchanging end of which is arranged outside the box body of the condensing box; A protective shell is mounted on the outer wall of the condensation box, so that an installation area for a semiconductor heat sink is formed between the outer wall of the condensation box and the protective shell, and a plurality of air outlets are provided on the protective shell; The auxiliary heat dissipation fan is installed on the protective shell and is used to lead out the hot air in the installation area.

8. The heat dissipation device for a terminal according to claim 1, characterized in that: The cooling medium is cooling oil or water.

9. The heat dissipation device for a terminal according to claim 1, characterized in that: The condensation plate is made of copper.

10. The heat dissipation device for a terminal according to claim 1, characterized in that: The condensation pipeline comprises: The straight tubes are arranged side by side along the width direction of the condensation plate, and the head and tail ends of two adjacent straight tubes are connected through a bend pipe.

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