Radiator assembly of electronic component

Abstract

The utility model discloses a radiator assembly of an electronic component, and relates to the technical field of electronic components. The device comprises a mounting plate, a plurality of positioning columns are arranged at the top of the mounting plate in parallel, an electronic component body is mounted at the top of each positioning column, and fastening bolts are fixedly connected between the electronic component body and the positioning columns; vertical plates are symmetrically inserted into the top of the mounting plate, fans are mounted on the two opposite side faces of the two vertical plates, and locking assemblies used for fixing the vertical plates are slidably inserted into the two opposite side faces of the mounting plate. The locking assembly comprises inserting rods symmetrically inserted into the two opposite side faces of the mounting plate in a sliding mode, and the ends, close to the vertical plate, of the inserting rods abut against the vertical plate in a contact mode. The vertical plate and the fan can be conveniently and quickly assembled and disassembled through the movement of the insertion rod and the matched use of the inclined notch in the vertical plate and the lock hole, so that the convenience of assembly and disassembly is improved, and the efficiency of assembly and disassembly is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic components, and particularly relates to a radiator assembly of electronic components. Background Art

[0002] Electronic components are components of electronic elements and small machines and instruments. They are often composed of several parts and can be used interchangeably in similar products. They often refer to certain parts of industries such as electrical appliances, radios, and instruments. They are a general term for electronic devices such as capacitors, transistors, hairsprings, and springs.

[0003] At present, in order to make electronic components work better, a radiator is provided to accelerate the heat dissipation of the electronic components, thereby ensuring the normal operation of the electronic components. However, the installation and disassembly of the existing radiator assembly is generally completed by fixing with multiple sets of bolts, which is not only cumbersome to operate, but also affects the efficiency of installation and disassembly.

[0004] To this end, we provide a heat sink assembly for electronic components to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a heat sink assembly for electronic components, which can quickly and conveniently complete the installation and disassembly of the vertical plate and the fan through the movement of the insertion rod and the coordinated use of the oblique notches and lock holes on the vertical plate, thereby improving the convenience of installation and disassembly, effectively improving the efficiency of installation and disassembly, and solving the problem that the installation and disassembly of the existing radiator assembly are generally completed by fixing with multiple sets of bolts, which is not only cumbersome to operate, but also affects the efficiency of installation and disassembly.

[0006] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0007] The utility model is a heat sink assembly for electronic components, comprising a mounting plate; a plurality of positioning posts are arranged in parallel on the top of the mounting plate, an electronic component body is commonly mounted on the top of each of the positioning posts, a fastening bolt is fixedly connected between the electronic component body and the positioning post; vertical plates are symmetrically inserted into the top of the mounting plate, fans are installed on the two opposite side surfaces of the two vertical plates, and locking components for fixing the vertical plates are slidably inserted on the two opposite side surfaces of the mounting plate; the locking component comprises an insertion rod symmetrically and slidably inserted on the two opposite side surfaces of the mounting plate, one end of the insertion rod close to the vertical plate is in contact with the vertical plate, the other end of the insertion rod is fixedly connected to a baffle, and a spring sleeved on the peripheral side surface of the insertion rod is fixedly connected between the baffle and the mounting plate.

[0008] The utility model is further configured that the top of the mounting plate is symmetrically provided with positioning grooves matching the two vertical plates, and the two fans are respectively an induced draft fan and a suction fan.

[0009] The utility model is further configured that a side surface of the vertical plate is provided with an oblique slot, and an inner side surface of the oblique slot is provided with a lock hole matching the insertion rod.

[0010] The utility model is further configured such that a buffer assembly is provided at the bottom of the mounting plate, and the buffer assembly includes a base arranged below the mounting plate, and two groups of support rods are inserted in parallel and slidingly on the top of the base, and the top of each support rod is fixedly connected to a connecting plate, and a plug plate is slidably inserted on a side of each connecting plate close to the mounting plate, and each plug plate is slidably inserted on the mounting plate, and two springs slidably sleeved on the side surfaces of the support rods are fixedly connected between the connecting plate and the base.

[0011] The utility model is further configured that the tops of two adjacent connecting plates are fixedly connected with push-pull plates, and a transverse plate is fixedly connected between the two adjacent push-pull plates.

[0012] The utility model is further configured that a slide groove matching the push-pull plate is provided on the top of the connecting plate, and plug interfaces matching each plug board are provided on two opposite side surfaces of the mounting plate.

[0013] The utility model is further configured such that a sleeve is symmetrically fixedly connected to the top of the base, a damping rod is slidably inserted inside the sleeve, the top of the damping rod is fixedly connected to the bottom of the mounting plate, and the interior of the sleeve is filled with damping fluid.

[0014] The utility model has the following beneficial effects:

[0015] The utility model uses the process of pressing the vertical plate into the positioning groove, the oblique groove on the vertical plate squeezes and contacts the insertion rod, so that the insertion rod moves along the oblique groove, and with the use of spring 1, the insertion rod moves into the locking hole on the oblique groove, thereby quickly completing the installation of the fan and the vertical plate, pulling the baffle outward, driving the insertion rod to move away from the vertical plate, so that the insertion rod is separated from the contact with the vertical plate, thereby quickly completing the disassembly of the fan and the vertical plate, and at the same time, the two fans are respectively an induced draft fan and an suction fan, so that the airflow continuously passes over the electronic component body, thereby taking away the heat slot of the electronic component body, and then completing the heat dissipation of the electronic component body, ensuring the normal operation of the electronic component body.

[0016] The vibration energy generated by the electronic component body of the utility model when working is transmitted to the second spring through the support rod. At the same time, with the use of the damping rod and the damping fluid, the damping rod, the damping fluid and the buffer assembly constitute the necessary conditions for buffering and shock absorption, thereby achieving the shock absorption effect on the electronic component body, and then ensuring the stability of the electronic component body when working.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 The present invention is a schematic diagram of the three-dimensional structure of a heat sink assembly of an electronic component.

[0020] Figure 2 The present invention is a schematic diagram of a partial three-dimensional structure of a heat sink assembly of an electronic component.

[0021] Figure 3 The present invention is a schematic diagram of the three-dimensional structure of the connection between the positioning column, the fastening bolt and the mounting plate in a heat sink assembly of an electronic component.

[0022] Figure 4 The present invention is a three-dimensional structural schematic diagram of the connection between a neutral plate, a fan and an oblique notch of a radiator assembly of an electronic component.

[0023] Figure 5 The present invention is a schematic diagram of the three-dimensional structure of a locking assembly in a heat sink assembly of an electronic component.

[0024] Figure 6 The present invention is a schematic diagram of the three-dimensional structure of a buffer assembly in a heat sink assembly of an electronic component.

[0025] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0026] 1-mounting plate, 2-positioning column, 3-fastening bolt, 4-positioning groove, 5-electronic component body, 6-vertical plate, 7-fan, 8-oblique notch, 9-locking hole, 10-insertion rod, 11-baffle, 12-spring 1, 13-sleeve, 14-support rod, 15-spring 2, 16-connecting plate, 17-insertion plate, 18-push-pull plate, 19-slide groove, 20-horizontal plate, 21-locking assembly, 22-buffer assembly, 23-base. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] For specific embodiment 1, please refer to Figure 1-6 The utility model is a heat sink assembly for electronic components, including a mounting plate 1; a plurality of positioning columns 2 are arranged in parallel on the top of the mounting plate 1, and an electronic component body 5 is installed on the top of each positioning column 2, and a fastening bolt 3 is fixedly connected between the electronic component body 5 and the positioning column 2; a vertical plate 6 is symmetrically inserted on the top of the mounting plate 1, and fans 7 are installed on the opposite sides of the two vertical plates 6, and locking components 21 for fixing the vertical plates 6 are slidably inserted on the opposite sides of the mounting plate 1; the locking component 21 includes an insertion rod 10 symmetrically and slidably inserted on the opposite sides of the mounting plate 1, and one end of the insertion rod 10 close to the vertical plate 6 is in contact with the vertical plate 6, and the other end of the insertion rod 10 is fixedly connected with a baffle 11, and a spring 12 arranged on the side surface of the insertion rod 10 is fixedly connected between the baffle 11 and the mounting plate 1, and an oblique notch 8 is opened on one side of the vertical plate 6, and a lock hole 9 matching the insertion rod 10 is opened on an inner side of the oblique notch 8.

[0029] The operation process of this embodiment is as follows: the electronic component body 5 is placed on the positioning column 2 accordingly, and then the installation of the electronic component body 5 is completed by tightening the bolts 3, and then the two vertical plates 6 with the fan 7 are inserted into the positioning groove 4 on the mounting plate 1. During the process of pressing the vertical plate 6 into the positioning groove 4, the oblique notch 8 on the vertical plate 6 squeezes and contacts the insertion rod 10, so that the insertion rod 10 moves along the oblique notch 8, and with the use of the spring 12, the insertion rod 10 moves into the lock hole 9 on the oblique notch 8, thereby quickly completing the installation of the fan 7 and the vertical plate 6, pulling the baffle 11 outward, driving the insertion rod 10 to move away from the vertical plate 6, so that the insertion rod 10 is out of contact with the vertical plate 6, thereby quickly completing the disassembly of the fan 7 and the vertical plate 6, and at the same time, the two fans 7 are respectively an induced draft fan and an suction fan, so that the airflow continuously passes over the electronic component body 5, thereby taking away the heat slot of the electronic component body 5, and then completing the heat dissipation of the electronic component body 5, ensuring the normal operation of the electronic component body 5.

[0030] For specific embodiment 2, please refer to Figure 1-6On the basis of the specific embodiment 1, a buffer assembly 22 is provided at the bottom of the mounting plate 1, and the buffer assembly 22 includes a base 23 provided below the mounting plate 1, and two groups of support rods 14 are inserted in parallel and slidingly at the top of the base 23, and the top of each support rod 14 is fixedly connected to a connecting plate 16, and a plugging plate 17 is inserted in a sliding manner on a side of each connecting plate 16 close to the mounting plate 1, and each plugging plate 17 is inserted in a sliding manner on the mounting plate 1, and a sliding sleeve on the side of the support rod 14 is fixedly connected between the connecting plate 16 and the base 23. Spring 2 15, the tops of two adjacent connecting plates 16 are fixedly connected with push-pull plates 18, a cross plate 20 is fixedly connected between the two adjacent push-pull plates 18, a slide groove 19 matching the push-pull plates 18 is provided on the top of the connecting plate 16, and plug interfaces matching each plug plate 17 are provided on the opposite sides of the mounting plate 1, the top of the base 23 is symmetrically fixedly connected with a sleeve 13, a damping rod is slidably inserted inside the sleeve 13, the top of the damping rod is fixedly connected to the bottom of the mounting plate 1, and the interior of the sleeve 13 is filled with damping fluid.

[0031] The operation process of this embodiment is as follows: the vibration energy generated by the electronic component body 5 when it is working is transmitted to the spring 2 15 through the support rod 14. At the same time, with the use of the damping rod and the damping fluid, the damping rod, the damping fluid and the buffer assembly 22 constitute the necessary conditions for buffering and shock absorption, thereby achieving the shock absorption effect on the electronic component body 5, and then ensuring the stability of the electronic component body 5 when it is working.

[0032] For specific embodiment 3, please refer to Figure 1-6 On the basis of the specific embodiment 1 and the specific embodiment 2, the top of the mounting plate 1 is symmetrically provided with positioning grooves 4 matching the two vertical plates 6, and the two fans 7 are respectively an induced draft fan and a suction fan.

[0033] The operation process of this embodiment is as follows: two fans 7 are used to speed up the flow of air around the electronic component body 5, thereby speeding up the heat dissipation effect.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A heat sink assembly for electronic components, comprising a mounting plate (1); characterized in that: A plurality of positioning columns (2) are arranged in parallel on the top of the mounting plate (1); an electronic component body (5) is mounted on the top of each positioning column (2); and a fastening bolt (3) is fixedly connected between the electronic component body (5) and the positioning column (2); A vertical plate (6) is symmetrically inserted on the top of the mounting plate (1), two opposite side surfaces of the two vertical plates (6) are both mounted with fans (7), and two opposite side surfaces of the mounting plate (1) are both slidably inserted with locking components (21) for fixing the vertical plates (6); The locking assembly (21) comprises an insertion rod (10) symmetrically and slidably inserted on two opposite side surfaces of the mounting plate (1), one end of the insertion rod (10) close to the vertical plate (6) is in contact with the vertical plate (6), the other end of the insertion rod (10) is fixedly connected to a baffle (11), and a spring (12) sleeved on the side surface of the insertion rod (10) is fixedly connected between the baffle (11) and the mounting plate (1).

2. The heat sink assembly for electronic components according to claim 1, characterized in that: The top of the mounting plate (1) is symmetrically provided with positioning grooves (4) matching the two vertical plates (6), and the two fans (7) are respectively an induced draft fan and a suction fan.

3. The heat sink assembly of an electronic component according to claim 2, characterized in that: An oblique notch (8) is provided on one side of the vertical plate (6), and a locking hole (9) matching the insertion rod (10) is provided on an inner side of the oblique notch (8).

4. The heat sink assembly for electronic components according to claim 3, characterized in that: A buffer assembly (22) is provided at the bottom of the mounting plate (1), and the buffer assembly (22) comprises a base (23) provided below the mounting plate (1), and two groups of support rods (14) are slidably inserted in parallel at the top of the base (23), and a connecting plate (16) is fixedly connected to the top of each support rod (14), and a plug plate (17) is slidably inserted on a side of each connecting plate (16) close to the mounting plate (1), and each plug plate (17) is slidably inserted on the mounting plate (1), and a spring (15) slidably sleeved on the side surface of the support rod (14) is fixedly connected between the connecting plate (16) and the base (23).

5. The heat sink assembly for electronic components according to claim 4, characterized in that: The tops of two adjacent connecting plates (16) are fixedly connected to push-pull plates (18), and a transverse plate (20) is fixedly connected between the two adjacent push-pull plates (18).

6. The heat sink assembly for electronic components according to claim 5, characterized in that: The top of the connecting plate (16) is provided with a slide groove (19) matching the push-pull plate (18), and the two opposite side surfaces of the mounting plate (1) are provided with plug interfaces matching each plug plate (17).

7. The heat sink assembly for electronic components according to claim 6, characterized in that: The top of the base (23) is symmetrically fixedly connected with a sleeve (13), a damping rod is slidably inserted inside the sleeve (13), the top of the damping rod is fixedly connected to the bottom of the mounting plate (1), and the interior of the sleeve (13) is filled with damping fluid.

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