Separating device of photocuring model

Abstract

The utility model relates to a separation device of a photocuring model. The separation device of the photocuring model comprises a separation tank and a temperature adjusting mechanism, the separation tank is used for accommodating a photocuring model; and the temperature adjusting mechanism is connected with the separation tank and is used for cooling the photocuring model. According to the scheme provided by the invention, the photo-curing model can be separated conveniently and quickly without being influenced by the flatness of the photo-curing model.

Description

Technical Field

[0001] The present application relates to the field of 3D printing technology, and in particular to a device for separating photocured models. Background Art

[0002] In the field of 3D (three dimensional) printing, rapid prototyping technology can be divided into many categories according to the materials used, prototyping methods, etc., among which the most common is photo-curing rapid prototyping. The principle of photo-curing is to use the characteristics of photosensitive resin (UV) in a fluid state to undergo polymerization reaction under light, and irradiate the light source according to the cross-sectional shape of the object to be formed, so that the fluid resin is cured and formed.

[0003] In a light-curing 3D printer based on LCD technology, the shape of the illuminated area is controlled by LCD. By controlling the pattern displayed on LCD through the internal circuit system, the shape of each layer of the molded body during the 3D printing process can be controlled. The surface light source required for light curing is arranged below the LCD, the resin pool is arranged above the LCD, and the Z-axis transmission structure and the molding platform are added to realize light-curing 3D printing based on LCD technology. During printing, the molding platform is lowered to the bottom of the resin pool, and its bottom surface is almost in contact with the polymer film at the bottom of the resin pool. Then, the LCD controls the transmission of a part of the light, which irradiates the resin between the bottom surface of the molding platform and the resin pool film. After solidification, it has adhesion to the bottom surface of the molding platform and the resin pool film. If the adhesion between the bottom surface of the platform is greater than the adhesion between the film, when the molding platform is lifted upward, the solidified resin will separate from the film, thus forming the first layer of the printed body. Next, the molding platform is lowered to a position one layer higher than the previous one, and then the LCD transmits the light required for the second layer of printing, and the resin between the first layer of the printed body and the film is solidified to form the second layer of the printed body. This process is repeated many times until the printing process is completed.

[0004] The first layer of printed body at the beginning of printing must be guaranteed to be bonded to the bearing surface and maintain a certain bonding strength to receive the second layer of printed body. For the printing success rate, the greater the bonding strength, the better; but for removing the printed body from the bearing surface after printing, the smaller the bonding strength, the better, so there is a contradiction here. The existing scheme generally balances the above two application requirements by accurately controlling the surface roughness of the bearing surface; in addition, there are also methods of punching holes on the bearing surface, and using a cylinder to push the printed body out of the hole after printing, thereby separating the printed body from the bearing surface; or grooving on the bearing surface, and using a comb-like tool to shovel the printed body off. Among them, the purpose of the first scheme is to achieve a balance in bonding strength, but this balance is difficult to master in actual use. There is a contradiction in the printer printing large and small parts, and this scheme does not fundamentally solve the problem. The second scheme cannot print models that require a flat surface due to the presence of holes on the bearing surface. The third scheme is similar to the second one, and it is also impossible to print models that require a flat surface. Utility Model Content

[0005] In order to solve or partially solve the problems existing in the related art, the present application provides a device for separating a photocurable model, which can separate the photocurable model conveniently and quickly without being affected by the flatness of the photocurable model.

[0006] In a first aspect, the present application provides a separation device for a photocurable model, which comprises a separation pool and a temperature control mechanism; the separation pool is used to accommodate the photocurable model; the temperature control mechanism is connected to the separation pool, and the temperature control mechanism is used to cool the photocurable model.

[0007] Furthermore, the separation device of the molding platform model also includes an ultrasonic generator, which is installed in the separation tank. The separation tank is used to contain a cleaning liquid, and the ultrasonic generator sends ultrasonic waves to the photocurable model through the cleaning liquid.

[0008] Furthermore, there are a plurality of ultrasonic generators, and the plurality of ultrasonic generators are installed on the outer side of the separation tank, and the plurality of ultrasonic generators form a circle around the separation tank.

[0009] Furthermore, the ultrasonic generator is located at the bottom of the separation tank.

[0010] Furthermore, the temperature adjustment mechanism includes a semiconductor refrigeration sheet, a cooling surface of the semiconductor refrigeration sheet is connected to the separation pool, and the semiconductor refrigeration sheet is heat-conducted with the separation pool.

[0011] Furthermore, the temperature control mechanism includes a heat absorption block, a heat dissipation pipe and a heat dissipation block, the heat absorption block is connected to the semiconductor refrigeration plate, the heat absorption block and the semiconductor refrigeration plate are heat-conducted, and the heat dissipation pipe is respectively connected to the heat absorption block and the heat dissipation block.

[0012] Furthermore, the cooling surface of the semiconductor refrigeration sheet is attached to the bottom surface of the separation tank, and the cooling surface of the semiconductor refrigeration sheet covers at least one third of the bottom surface of the separation tank.

[0013] Furthermore, the separation tank is made of metal.

[0014] Furthermore, a temperature sensor is provided in the separation pool, and the temperature sensor is used to detect the temperature of the separation pool.

[0015] Furthermore, the temperature control mechanism includes an evaporator, a compressor, a condenser, a throttle valve, and a heat absorber. The evaporator, the compressor, the condenser, and the throttle valve are connected in sequence through pipelines. The evaporator is connected to the throttle valve through a pipeline, the heat absorber is connected to the separation tank, the heat absorber and the separation tank are heat-conducted, and the evaporator is connected to the heat absorber through a pipeline.

[0016] The technical solution provided by the present application may include the following beneficial effects: by placing the printed molding platform together with the photocurable model into a separation tank, the molding platform and the photocurable model are placed in a low-temperature environment, and the temperature difference is used to cause different deformation amounts of the molding platform and the photocurable model at the bonding point, thereby increasing the peeling force between the photocurable model and the bottom surface of the molding platform, and promoting the separation of the photocurable model from the bottom surface of the molding platform. There is no need to punch holes in the photocurable model or the molding platform, and no damage is caused to the photocurable model. The photocurable model with flatness requirements can be peeled off, the operation is convenient, the success rate of peeling off the photocurable model is higher, and the peeling efficiency is also higher.

[0017] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0019] Figure 1 is a schematic structural diagram of a light-curing model separation device shown in an embodiment of the present application;

[0020] Figure 2 is a schematic structural diagram of another perspective of the light-curing model separation device shown in an embodiment of the present application;

[0021] Figure 3 It is a schematic diagram of the structure of the separation tank shown in the embodiment of the present application.

[0022] Reference numerals: separation tank 1; temperature regulating mechanism 2; semiconductor cooling sheet 21; heat absorbing block 22; heat dissipation pipe 23; heat dissipation block 24; ultrasonic generator 3; forming platform 4. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0024] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0025] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] In view of the above problems, an embodiment of the present application provides a device for separating a photocured model, which is not affected by the flatness of the photocured model and can separate the photocured model conveniently and quickly.

[0028] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0029] Figure 1 It is a schematic diagram of the structure of the separation device of the light-curing model shown in the embodiment of the present application.

[0030] See also Figure 1 The separation device of the photocurable model includes a separation tank 1 and a temperature control mechanism 2. The volume of the separation tank 1 is larger than the size of the photocurable model, and the separation tank 1 can accommodate the photocurable model. The opening of the separation tank 1 is larger than the bottom end of the molding platform 4, and the bottom end of the molding platform 4 and the photocurable model can be extended into the separation tank 1 together, wherein the molding platform 4 is a molding device that can be extended into the resin pool to make the resin photocured on the surface of the molding platform 4.

[0031] Figure 2 It is a structural schematic diagram of another perspective of the separation device of the light-curing model shown in the embodiment of the present application.

[0032] See also Figure 1 and Figure 2 , the temperature regulating mechanism 2 is connected to the separation pool 1, and the temperature regulating mechanism 2 is used to cool the photocuring model. The temperature regulating mechanism 2 can directly cool the separation pool 1, and the temperature regulating mechanism 2 can indirectly cool the photocuring model through the separation pool 1. In some embodiments, the shape of the forming platform 4 matches the shape of the separation pool 1, and the bottom end of the forming platform 4 can directly contact the separation pool 1. The bottom end of the forming platform 4 is directly heat-conducted with the separation pool 1, and the heat of the photocuring model is transferred to the separation pool 1 through the forming platform 4, thereby achieving the effect of cooling the forming platform 4 and the photocuring model at the same time. In some embodiments, the separation pool 1 is filled with a heat-conducting liquid, and the photocuring model and the forming platform 4 are soaked in the heat-conducting liquid. The heat of the photocuring model and the forming platform 4 is transferred to the heat-conducting liquid, and the heat is then transferred from the heat-conducting liquid to the separation pool 1, and then transferred to the temperature regulating mechanism 2, thereby achieving the effect of cooling the photocuring model and the forming platform 4 at the same time.

[0033] Since the thermal expansion coefficients of different materials are different, in the same temperature change range, different materials of the same length will have different thermal expansion or cold contraction. If the two are glued together, a lateral shear force will be generated on the bonding surface due to the inconsistent deformation, which is also called peeling force.

[0034] The present application places the printed forming platform 4 together with the light-curing model into the separation tank 1, so that the forming platform 4 and the light-curing model are in a low-temperature environment, and utilizes the temperature difference to cause different deformation amounts of the forming platform 4 and the light-curing model at the bonding point, thereby improving the peeling force between the light-curing model and the bottom surface of the forming platform 4, and promoting the separation of the light-curing model from the bottom surface of the forming platform 4. There is no need to punch holes in the light-curing model or the forming platform 4, and no damage is caused to the light-curing model. The light-curing model with flatness requirements can be peeled off, the operation is convenient, the success rate of peeling off the light-curing model is higher, and the peeling efficiency is also higher.

[0035] According to experimental measurements, the best result is obtained when the photocuring model is printed at room temperature of 20 to 30°C, cooled to -10 to 0°C, and peeled off from the forming platform 4. If the cooling temperature is too high, the deformation of the photocuring model relative to the bottom plate of the forming platform 4 is too small to generate sufficient peeling force; if the cooling temperature is too low, the forming accuracy of the photocuring model will be adversely affected after cooling and then returning to room temperature, and the scanning accuracy will drop by 2 to 5%, which does not meet the product accuracy requirements.

[0036] Figure 3 It is a schematic diagram of the structure of the separation tank shown in the embodiment of the present application.

[0037] See also Figure 1-3 In some embodiments, the separation device of the model of the molding platform 4 further includes an ultrasonic generator 3, which is installed in the separation tank 1; the separation tank 1 is used to contain a cleaning liquid, which is a heat-conducting liquid. In addition to transmitting ultrasonic waves, the cleaning liquid can also cooperate with the temperature control mechanism 2 for heat conduction; the ultrasonic generator 3 sends ultrasonic waves to the photocurable model through the cleaning liquid, so that the photocurable model generates relative vibration relative to the molding platform 4 on the bottom surface of the molding platform 4, thereby promoting the separation of the photocurable model from the bottom surface of the molding platform 4; in addition, the ultrasonic energy can further intensify the damage to the bonding between the photocurable model and the molding platform 4, and as the ultrasonic vibration continues, the photocurable model will be separated from the molding platform 4; after the photocurable model is photocured, some liquid photosensitive resin will remain on the surface of the photocurable model, and after the photocurable model is soaked in the separation tank 1, a part of the residual liquid photosensitive resin will dissolve into the cleaning liquid, and the other part of the residual liquid photosensitive resin will be separated from the photocurable model under the action of ultrasonic vibration, thereby achieving the cleaning of the photocurable model.

[0038] See also Figure 1 and Figure 2, there are multiple ultrasonic generators 3, and the multiple ultrasonic generators 3 are installed on the outer side of the separation tank 1, and the multiple ultrasonic generators 3 are surrounded in a circle around the separation tank 1. In this embodiment, the ultrasonic generator 3 is an ultrasonic vibrator, and there are four ultrasonic generators 3. The four ultrasonic generators 3 are distributed in a rectangular shape to ensure that the photocuring model and the molding platform 4 can evenly receive ultrasonic waves. In other embodiments, there can be five, six, seven, and so on ultrasonic generators 3. The ultrasonic generator 3 is located at the bottom of the separation tank 1. When the photocuring model and the molding platform 4 extend into the separation tank 1, the bonding surface of the photocuring model and the molding platform 4 is generally at the bottom of the separation tank 1. When the ultrasonic generator 3 is at the bottom of the separation tank 1, it can more directly and efficiently transmit ultrasonic waves to the bonding surface of the photocuring model and the molding platform 4, thereby better separating the photocuring model and the molding platform 4.

[0039] See also Figure 1 and Figure 2 In some embodiments, the temperature control mechanism 2 includes a semiconductor refrigeration sheet 21, a cooling surface of the semiconductor refrigeration sheet 21 is connected to the separation tank 1, the semiconductor refrigeration sheet 21 and the separation tank 1 are heat-conducted, and the heating surface of the semiconductor refrigeration sheet 21 faces away from the separation tank 1. When the semiconductor refrigeration sheet 21 is working, the cooling surface of the semiconductor refrigeration sheet 21 can continuously cool down the separation tank 1, so that the photocuring model in the separation tank 1 and the bottom of the molding platform 4 are at a suitable temperature. Specifically, the temperature control mechanism 2 may further include a heat absorbing block 22, a heat dissipation pipe 23 and a heat dissipation block 24. The heat absorbing block 22 is connected to the heating surface of the semiconductor refrigeration plate 21. The heat absorbing block 22 and the semiconductor refrigeration plate 21 are thermally conductive, and the heat generated by the semiconductor refrigeration plate 21 can be transferred to the heat absorbing block 22. The heat dissipation pipe 23 is respectively connected to the heat absorbing block 22 and the heat dissipation block 24. The heat of the heat absorbing block 22 can be transferred to the heat dissipation block 24 through the heat dissipation pipe 23, and the heat dissipation block 24 then discharges the heat, thereby achieving a heat dissipation effect on the semiconductor refrigeration plate 21. The heat dissipation block 24 is a metal block. The heat dissipation block 24 can be equipped with a fan to accelerate the air flow to discharge the heat. Fins can also be set on the heat dissipation block 24 to increase the surface area of ​​the heat dissipation block 24 in contact with the air, thereby enhancing the effect of the heat dissipation block 24 dissipating the heat.

[0040] See also Figure 1-3 In some embodiments, the cooling surface of the semiconductor refrigeration sheet 21 is attached to the bottom surface of the separation tank 1. The semiconductor refrigeration sheet 21 can be fixed to the bottom surface of the separation tank 1 by bolts. The cooling surface of the semiconductor refrigeration sheet 21 covers at least one-third of the bottom surface of the separation tank 1, ensuring that the cooling effect of the bottom surface of the separation tank 1 is sufficiently uniform, thereby ensuring that the cleaning liquid in the separation tank 1 can also be cooled more evenly.

[0041] In some embodiments, the temperature control mechanism 2 includes an evaporator, a compressor, a condenser, a throttle valve, and a heat-absorbing element. The evaporator, the compressor, the condenser, and the throttle valve are connected in sequence through a pipeline. The evaporator is connected to the throttle valve through a pipeline, the heat-absorbing element is connected to the separation tank 1, the heat-absorbing element and the separation tank 1 are heat-conducted, and the evaporator is connected to the heat-absorbing element through a pipeline. The compressor compresses the gaseous refrigerant into a high-temperature and high-pressure gaseous state, and the high-temperature and high-pressure gaseous refrigerant is transported to the condenser for cooling. After cooling, it becomes a medium-temperature and high-pressure liquid refrigerant. The medium-temperature and high-pressure liquid refrigerant is depressurized through the throttle valve to become a low-temperature and low-pressure gas-liquid mixture, absorbs heat through the evaporator, and then becomes a gaseous refrigerant and re-enters the compressor for compression; there is a coolant in the pipeline connecting the evaporator and the heat-absorbing element, and the coolant brings the heat of the heat-absorbing element to the evaporator, and then the refrigerant in the evaporator absorbs the heat of the coolant, thereby cooling the heat-absorbing element, and the heat-absorbing element cools the separation tank 1.

[0042] See also Figure 1 and Figure 2 , the separation tank 1 is made of metal, preferably, the separation tank 1 is made of stainless steel, which ensures the strength of the separation tank 1 while also ensuring that the separation tank 1 has good thermal conductivity. A temperature sensor is provided in the separation tank 1, and the temperature sensor is used to detect the temperature of the separation tank 1. Since the separation effect of the photocuring model and the molding platform 4 is best when they are at -10 to 0°C, the temperature of the cleaning liquid in the separation tank 1 can be detected by the temperature sensor; when the temperature of the cleaning liquid reaches -10 to 0°C, the temperature control mechanism 2 can be controlled by an external controller to reduce the working efficiency or stop working; when the clear liquid is higher than 0°C, the external controller controls the temperature control mechanism 2 to work normally to ensure that the accuracy of the separated photocuring model meets the requirements.

[0043] During the working process of one of the embodiments, the power is turned on first, and the semiconductor cooling plate 21 starts to work and cools the separation tank 1 until the cleaning liquid in the separation tank 1 is cooled to the target temperature. Preferably, the target temperature is -10°C to 0°C, and the cleaning liquid is kept in the target temperature range. After the printing is completed, the molding platform 4 with the photocurable model is immersed in the cleaning tank, and the photocurable model and the platform are rapidly cooled by the cleaning liquid. At this time, since the thermal expansion coefficient of the photocurable model is much larger than that of the metal molding platform 4, the shrinkage of the photocurable model will also be greater. At this time, shear stress will be generated at the edge of the photocurable model, inducing edge cracking, thereby destroying the bonding between the surface of the photocurable model and the bottom of the molding platform 4. Then the ultrasonic generator 3 is controlled to start working, and the ultrasonic energy is transmitted to the photocurable model and the molding platform 4 through the cleaning liquid, further aggravating the damage to the bonding point. As the ultrasonic vibration continues, the photocurable model will be separated from the molding platform 4. During this process, the photocuring model is also cleaned. A part of the liquid photosensitive resin attached to the surface of the photocuring model is directly dissolved into the cleaning liquid, and the other part is separated from the photocuring model under the action of ultrasonic vibration, and the separated photocuring model can be taken out.

[0044] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0045] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A device for separating a light-cured model, characterized in that: include: A separation tank, the separation tank is used to accommodate the light-cured model; A temperature control mechanism is connected to the separation pool and is used to cool the photocuring model; the temperature control mechanism includes a semiconductor refrigeration sheet, a cooling surface of the semiconductor refrigeration sheet is connected to the separation pool, and the semiconductor refrigeration sheet is heat-conducted with the separation pool.

2. The light-cured model separation device according to claim 1, characterized in that: It also includes an ultrasonic generator, which is installed in the separation tank. The separation tank is used to contain the cleaning liquid. The ultrasonic generator sends ultrasonic waves to the light-cured model through the cleaning liquid.

3. The light-cured model separation device according to claim 2, characterized in that: There are multiple ultrasonic generators, which are installed on the outer side of the separation tank and surround the separation tank in a circle.

4. The light-cured model separation device according to claim 2, characterized in that: The ultrasonic generator is located at the bottom of the separation tank.

5. The light-cured model separation device according to claim 1, characterized in that: The temperature control mechanism includes a heat absorbing block, a heat dissipation pipe and a heat dissipation block. The heat absorbing block is connected to the semiconductor refrigeration sheet. The heat absorbing block and the semiconductor refrigeration sheet are heat-conducted. The heat dissipation pipe is respectively connected to the heat absorbing block and the heat dissipation block.

6. The light-cured model separation device according to claim 1, characterized in that: The cooling surface of the semiconductor refrigeration sheet is attached to the bottom surface of the separation tank, and the cooling surface of the semiconductor refrigeration sheet covers at least one third of the bottom surface of the separation tank.

7. The device for separating a light-cured model according to claim 1, characterized in that: The separation tank is made of metal.

8. The light-cured model separation device according to claim 1, characterized in that: A temperature sensor is provided in the separation tank, and the temperature sensor is used to detect the temperature of the separation tank.

9. The light-cured model separation device according to claim 1, characterized in that: The temperature control mechanism includes an evaporator, a compressor, a condenser, a throttle valve, and a heat absorber. The evaporator, the compressor, the condenser, and the throttle valve are connected in sequence through pipelines. The evaporator is connected to the throttle valve through a pipeline. The heat absorber is connected to the separation tank. The heat absorber and the separation tank are heat-conducted. The evaporator is connected to the heat absorber through a pipeline.

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