Storage device

Abstract

The utility model belongs to wafer production auxiliary equipment, and relates to a storage device. The storage device comprises a bottom plate, the bottom plate is provided with mounting grooves, the multiple mounting grooves are formed in the bottom plate at intervals, first sealing rings are arranged in the mounting grooves, and the outer side walls of the first sealing rings are attached to the inner side walls of the mounting grooves; the air guide grooves are formed in the bottom surfaces of the mounting grooves, and the multiple mounting grooves are communicated through the air guide grooves; the first air guide pipe extends into the bottom plate along the outside of the bottom plate, and the first air guide pipe is communicated with the air guide groove. The wafer fixing device is good in wafer fixing effect, high in wafer mounting and fixing efficiency, free of pollution and capable of being repeatedly used.

Description

Technical Field

[0001] The utility model belongs to wafer production auxiliary equipment and relates to a storage device. Background Art

[0002] During the production process, the chip needs to be transferred through a storage device. During the transfer process, the chip needs to be fixed to prevent damage to the chip caused by bumps during the transfer.

[0003] Existing storage devices usually use glue to fix the chip, which has the following disadvantages:

[0004] 1. Since the adhesive strength of the glue is determined by the glue type and cannot be controlled, there is a risk of debonding and chip fixation failure.

[0005] Second, after gluing, the chip needs to be cleaned and glued, which increases the cleaning process, reduces production efficiency, increases production costs, and pollutes the environment.

[0006] 3. After the glue on the storage device solidifies, it needs to be removed before reuse, which is difficult to remove, causing the transfer tooling to become disposable, resulting in a waste of resources. Utility Model Content

[0007] The technical problem to be solved by the present invention is to provide a storage device which fixes the chip by negative pressure, and can be reused on the one hand, and has good fixing effect and high fixing efficiency on the other hand, and does not generate pollution.

[0008] The technical solution proposed by the utility model is:

[0009] A storage device includes a bottom plate, wherein the bottom plate is provided with:

[0010] Mounting grooves, wherein a plurality of mounting grooves are arranged at intervals on the bottom plate, a first sealing ring is provided in the mounting groove, and an outer wall of the first sealing ring is in contact with an inner wall of the mounting groove;

[0011] An air guide groove is provided on the bottom surface of the mounting groove, and connects the multiple mounting grooves;

[0012] The first air guide pipe extends from the outside of the bottom plate into the bottom plate, and the first air guide pipe is communicated with the air guide groove.

[0013] Optionally, also include:

[0014] A sealing switch is provided on the first air duct.

[0015] Optionally, the sealing switch is a shut-off valve or a one-way valve.

[0016] Optionally, when the sealing switch is a one-way valve, a second air guide pipe is further provided on the bottom plate, and the second air guide pipe is connected to the air guide groove; one end of the second air guide pipe extending out of the bottom plate is connected to a plug.

[0017] Optionally, a sealing gasket is integrally formed at one end of the first sealing ring, and the sealing gasket extends inward along the inner wall of the first sealing ring, and the sealing gasket is a hollow structure.

[0018] Optionally, a guide surface is provided on the end surface of the first sealing ring, the guide surface is located at the end away from the air guide groove, and the distance from the guide surface to the bottom surface of the installation groove decreases inward from the outer wall of the first sealing ring.

[0019] Optionally, also include:

[0020] The cover plate is arranged on the base plate and is movably connected to the base plate.

[0021] Optionally, one end of the cover plate is hinged to the bottom plate.

[0022] Optionally, also include:

[0023] A second sealing ring, a plurality of mounting grooves are located in the second sealing ring, and the second sealing ring is arranged between the cover plate and the bottom plate.

[0024] Optionally, a groove is provided on the bottom plate and / or the cover plate, and the second sealing ring is installed in the groove.

[0025] Optionally, a plurality of mounting grooves spaced apart along the length direction of the base plate form a group, and a plurality of groups of mounting grooves are spaced apart along the width direction of the base plate.

[0026] Optionally, the air guide groove includes:

[0027] a first trough body, which is arranged along the length direction of the bottom plate and connects a group of mounting slots in sequence;

[0028] The second trough body is arranged along the width direction of the bottom plate, and the second trough body connects multiple installation grooves arranged in sequence in the width direction.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] The present invention provides a first sealing ring within the mounting groove, thereby sealing the gap between the outer wall of the wafer and the inner wall of the mounting groove. Furthermore, a first air duct connected to a negative pressure device can be used to discharge gas from the air duct, thereby securing the wafer within the mounting groove. The present invention effectively secures the wafer, efficiently secures the wafer, does not generate pollution, and allows for reuse. The present invention enables the storage of multiple wafers, providing a strong storage capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention.

[0032] Figure 1 It is a structural diagram of the utility model;

[0033] Figure 2 This is a top view of the bottom plate of the utility model;

[0034] Figure 3 This is a bottom view of the cover plate of the utility model;

[0035] Figure 4 This is a top view of the first sealing ring of the utility model;

[0036] Figure 5 This is a cross-sectional view of the first sealing ring of the utility model;

[0037] Figure 6 This is a schematic diagram of the structure of the plug of the utility model using an insert rod and a limit ring;

[0038] Figure 7 This is a schematic diagram of the structure of the plug of the utility model using a threaded rod and a retaining ring.

[0039] In the figure: 1. Base plate; 2. Mounting groove; 3. Air guide groove; 4. First air guide tube; 5. One-way valve; 6. Second air guide tube; 7. Plug; 8. First sealing ring; 9. Sealing gasket; 10. Guide surface; 11. Cover plate; 12. Second sealing ring; 13. Groove; 14. First trough body; 15. Second trough body; 16. Insert rod; 17. Limiting ring; 18. Slot; 19. Threaded rod; 20. Retaining ring; 21. Shut-off valve. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0042] Example 1

[0043] Please refer to Figure 1-7 , a storage device, comprising a bottom plate 1, the bottom plate 1 is provided with:

[0044] Mounting grooves 2, multiple mounting grooves 2 are spaced apart on the bottom plate 1, a first sealing ring 8 is provided in the mounting groove 2, and the outer wall of the first sealing ring 8 is in contact with the inner wall of the mounting groove 2;

[0045] The air guide groove 3 is provided on the bottom surface of the mounting groove 2, and the air guide groove 3 connects the multiple mounting grooves 2;

[0046] The first air guide pipe 4 extends from the outside of the bottom plate 1 into the bottom plate 1 , and the first air guide pipe 4 is communicated with the air guide groove 3 .

[0047] It should be noted that the present invention performs wafer removal and placement operations within a glove box. The glove box is filled with a protective gas to prevent contamination of the chips by impurities in the air. Nitrogen is preferred as the protective gas. Operating within a glove box isolates the chips from dust, water, and oxygen in the air.

[0048] As a further solution, a sealing switch is further provided, which is provided on the first air guide tube 4. The sealing switch is used to restrict the outside air from entering the air guide groove 4 along the first air guide tube 4.

[0049] Specifically, when placing a chip, a vacuum pen is used to grab a chip and place it into the mounting slot 2. The gap between the chip's outer wall and the mounting slot 2 is sealed by the first sealing ring 8. After all mounting slots 2 are loaded with chips, the first air duct 4 is connected to the negative pressure device. The air between the chip and the bottom of the mounting slot 2, the air in the air duct 3, and the air in the first air duct 4 are extracted, thereby generating negative pressure, fixing the chip in the mounting slot 2. When the vacuum level reaches the set range, the first air duct 4 is sealed by the sealing switch.

[0050] When taking out the chips, the vacuum is broken and the protective gas enters the first air guide pipe 4, the air guide groove 3, and the gap between the chip and the bottom of the mounting groove 2 in sequence, so that the air pressure in the glove box is consistent with the air pressure in the air guide groove 3. Then, a vacuum suction pen is used to take out the chips in multiple mounting grooves 2 in sequence.

[0051] As a further solution, a plurality of mounting grooves 2 spaced apart along the length direction of the base plate 1 form a group, and a plurality of groups of mounting grooves 2 are spaced apart along the width direction of the base plate 1 .

[0052] As a further solution, the air guide groove 3 includes:

[0053] A first slot body 14 is provided along the length direction of the bottom plate 1 and connects a group of mounting slots 2 in sequence;

[0054] The second slot body 15 is arranged along the width direction of the base plate 1 , and the second slot body 15 connects a plurality of mounting slots 2 arranged sequentially in the width direction.

[0055] Example 2

[0056] The sealed switch of the present invention is described in detail.

[0057] The first solution for sealed switch: reference Figure 2 The sealing switch is a shutoff valve 21. Shutoff valve 21 can be any of a gate valve, globe valve, ball valve, and butterfly valve. When vacuuming, shutoff valve 21 can be opened, allowing the negative pressure device to extract the gas between the chip and the bottom of mounting groove 2, the gas guide groove 3, and the first gas guide tube 4, thereby creating negative pressure and securing the chip in mounting groove 2. Using a shutoff valve also allows vacuum to be broken simply by opening the shutoff valve.

[0058] The second sealed switch solution uses a rubber tube with a corresponding strapping tape or clamp (not shown). The rubber tube is fixedly connected to the end of the first air duct 4 that extends out of the base plate 1. During vacuuming, the rubber tube is connected to the vacuum equipment via the rubber tube. After vacuuming is complete, the rubber tube is bent and sealed with a strapping tape or clamp to seal the first air duct 4. When the vacuum needs to be broken, the rubber tube is opened.

[0059] The third solution for sealed switches: Reference Figure 1 The sealing switch is a one-way valve 5. When the one-way valve 5 is used, it can be connected to the negative pressure device to extract the gas, and the one-way valve 5 can prevent the gas from entering the first air duct 4 from the outside, thereby realizing the function of the sealing switch.

[0060] As a further solution, a second air duct 6 is further provided on the bottom plate 1 , and the second air duct 6 is connected to the air duct groove 3 ; one end of the second air duct 6 extending out of the bottom plate 1 is connected to a plug 7 .

[0061] When adopting the one-way valve 5, it is inconvenient to break the vacuum. For this reason, a second air guide pipe 6 is provided, and when breaking the vacuum is needed, the vacuum can be broken by removing the plug 7.

[0062] It should be noted that when the one-way valve 5 is used, when the valve core of the one-way valve 5 is made of magnetic material, the valve core can also be adsorbed by a strong magnet, and then the valve core is driven to move by moving the strong magnet to achieve vacuum breaking.

[0063] As a further solution, refer to Figure 6 The plug 7 includes an insert rod 16 and a retaining ring 17. The retaining ring 17 is integrally formed at one end of the insert rod 16. Multiple rubber rings are provided on the outer wall of the insert rod 16. After the insert rod 16 is inserted into the second air duct 6, the multiple rubber rings seal the gap between the outer wall of the insert rod 16 and the inner wall of the second air duct 6. The retaining ring 17 is used to limit the full insertion of the insert rod 16 into the second air duct 6. The retaining ring 17 also assists in inserting and removing the plug 7. Furthermore, to fix the position of the rubber ring, a retaining groove 18 can be provided on the outer wall of the insert rod 16.

[0064] Another solution for plug 7 is to refer to Figure 7 , a threaded rod 19 and a retaining ring 20 are used. The retaining ring 20 is integrally formed at one end of the threaded rod 19. A rubber pad is sleeved on the outer wall of the threaded rod 19. The threaded rod 19 is connected to the second air duct 6 through a thread. When the threaded rod 19 is rotated, the retaining ring 20 presses the rubber pad tightly on the end face of the second air duct 6, thereby sealing the second air duct 6.

[0065] Example 3

[0066] refer to Figure 4 、 Figure 5 , the structure of the first sealing ring 8 is described in detail.

[0067] The shape of the first sealing ring 8 is set according to the shape of the chip and the mounting groove 2. When the chip and the mounting groove 2 are circular, the first sealing ring 8 is circular. When the chip and the mounting groove 2 are rectangular, the first sealing ring 8 is rectangular.

[0068] As a further solution, a sealing gasket 9 is integrally formed at one end of the first sealing ring 8. This gasket 9 extends inward along the inner wall of the first sealing ring 8 and is hollow. The upper end of the gasket 9 mates with the chip, while the lower end mates with the mounting groove 2. With the gasket 9 in place, the chip is secured in the mounting groove 2 without contact with the bottom surface, preventing scratches or other issues that could affect chip quality.

[0069] As a further solution, a guide surface 10 is provided on the end surface of the first sealing ring 8. The guide surface 10 is located at the end away from the air guide groove 3. The distance between the guide surface 10 and the bottom surface of the mounting groove 2 decreases from the outer wall of the first sealing ring 8 inward. The purpose of providing the guide surface 10 is to guide the chip when inserted into the first sealing ring 8.

[0070] Example 4

[0071] Further improvements are made to the above embodiment.

[0072] refer to Figure 1 A cover plate 11 is also provided, which is provided on the base plate 1 and is movably connected to the base plate 1. The purpose of providing the cover plate 11 is to close the mounting slot 2 on the base plate 1 to prevent dust and other impurities from entering the mounting slot 2 and contaminating the chip during turnover.

[0073] As a further solution, one end of the cover plate 11 is hinged to the base plate 1. The other end of the cover plate 11 is fixedly connected to the base plate 1 via a lock or a snap. It should be noted that the cover plate 11 can also cover the base plate 1. The cover plate 11 can also open and close the base plate 1 by sliding.

[0074] As a further solution, a second sealing ring 12 is provided, and the plurality of mounting grooves 2 are located in the second sealing ring 12. The second sealing ring 12 is provided between the cover plate 11 and the bottom plate 1. The purpose of providing the second sealing ring 12 is to seal the gap between the bottom plate 1 and the cover plate 11 to prevent impurities from entering.

[0075] As a further solution, a groove 13 is provided on the bottom plate 1 or the cover plate 11, and the second sealing ring 12 is installed in the groove 13. The purpose of providing the groove 13 is to further fix the second sealing ring 12. Obviously, the groove 13 is provided on the end surfaces of the bottom plate 1 and the cover plate 11 that are close to each other.

[0076] It should be noted that the grooves 13 may also be provided on both the bottom plate 1 and the cover plate 11 .

[0077] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A storage device, characterized in that: The bottom plate comprises: Installation grooves, wherein a plurality of installation grooves are arranged at intervals on the bottom plate, a first sealing ring is arranged in the installation groove, and an outer side wall of the first sealing ring is in contact with an inner side wall of the installation groove; An air guide groove is arranged on the bottom surface of the mounting groove, and the air guide groove connects the multiple mounting grooves; The first air guide pipe extends from the outside of the bottom plate into the bottom plate, and the first air guide pipe is communicated with the air guide groove.

2. The storage device according to claim 1, characterized in that Also includes: A sealing switch is arranged on the first air duct.

3. The storage device according to claim 2, characterized in that: The sealing switch is a shut-off valve or a one-way valve.

4. The storage device according to claim 3, characterized in that: When the sealing switch is a one-way valve, a second air guide pipe is further arranged on the bottom plate, and the second air guide pipe is connected with the air guide groove; one end of the second air guide pipe extending out of the bottom plate is connected with a plug.

5. The storage device according to claim 1, characterized in that: A sealing gasket is integrally formed at one end of the first sealing ring. The sealing gasket extends inwardly along the inner wall of the first sealing ring, and the sealing gasket is a hollow structure.

6. The storage device according to claim 1, characterized in that: A guide surface is provided at one end of the first sealing ring, and the guide surface is located at the end away from the air guide groove. The distance from the guide surface to the bottom surface of the installation groove decreases from the outer wall of the first sealing ring to the inside.

7. The storage device according to claim 1, characterized in that: Also includes: The cover plate is arranged on the bottom plate and is movably connected with the bottom plate.

8. The storage device according to claim 7, characterized in that: Also includes: A second sealing ring, a plurality of mounting grooves are located in the second sealing ring, and the second sealing ring is arranged between the cover plate and the bottom plate.

9. The storage device according to claim 1, characterized in that: A plurality of mounting grooves spaced apart along the length direction of the bottom plate form a group, and a plurality of groups of mounting grooves spaced apart along the width direction of the bottom plate are arranged.

10. The storage device according to claim 9, characterized in that: The air guide groove comprises: A first slot body, which is arranged along the length direction of the bottom plate and connects a group of installation slots in sequence; The second slot body is arranged along the width direction of the bottom plate, and the second slot body connects a plurality of mounting slots arranged sequentially in the width direction.

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