Wafer detection device
By setting up a liftable feed rod on the wafer detection table, the problem of limit bar hindering wafer replacement is solved, and automatic rise after wafer detection is realized and automatic retraction before replacement is improved, which improves the operation convenience of workers .
Patent Information
- Application Number
- CN202420172534.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-24
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-01-24
AI Technical Summary
The limit bars of existing wafer detection stations will hinder workers from manually picking up wafers, resulting in inconvenient wafer replacement.
A wafer detection device is designed, including a plurality of feed rods being provided on the detection table and a driving member is equipped to drive the lifting and lowering of the feed rod to avoid obstacles to the limit bar.
After wafer detection is completed, the feed rod will automatically rise, allowing workers to easily pick up the wafer and automatically retract before placing the new wafer, improving the convenience of wafer replacement.
Smart Images
Figure CN222440571U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor processing equipment, and in particular to a wafer detection device. Background Art
[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It is made by dissolving high-purity polycrystalline silicon and then adding silicon crystal seeds. It is then slowly pulled out to form a cylindrical single crystal silicon, which is then formed after processes such as grinding, polishing and slicing.
[0003] A wafer inspection platform is disclosed in the related art, including a placement platform for placing a wafer to be inspected, and a limiting bar for limiting the position of the wafer is arranged on the placement platform.
[0004] In the above solution, although the limit bar can limit the wafer, it may hinder the workers from manually picking up the wafer, so it is inconvenient for the workers to replace the wafer. Utility Model Content
[0005] In order to facilitate workers to pick up wafers, the present application provides a wafer detection device.
[0006] The present application provides a wafer inspection device that adopts the following technical solution:
[0007] A wafer inspection device comprises an inspection platform for placing wafers, a plurality of ejector rods are vertically slidably penetrated on the inspection platform relative to the placement position of the wafer, and a driving member for driving the ejector rods to rise and fall is arranged inside the inspection platform.
[0008] By adopting the above technical solution, after the wafer inspection is completed, the driving member drives the ejector rod to rise, so that the worker can take the wafer without being hindered by the limit bar. Before placing a new wafer, the driving member drives the ejector rod to retract downward into the inspection table.
[0009] Optionally, an air cavity is opened in the detection platform, the bottom end of the ejecting rod extends into the air cavity, the driving member includes a piston cylinder arranged below the air cavity and electrically connected to the control system, the piston rod of the piston cylinder extends into the air cavity and is connected to a push plate, the push plate is tightly attached to the air cavity and each vertical side wall, and a plurality of through holes are opened in the detection platform for connecting the bottom of the air cavity with the outside world.
[0010] By adopting the above technical solution, the piston rod of the piston cylinder extends to push the push plate upward, the gas in the air cavity above the push plate is pressurized and pushes the ejection rod upward, thereby realizing the ejection of the wafer.
[0011] Optionally, a limiting plate for supporting the top wall of the air cavity is provided at the bottom of the ejecting rod.
[0012] By adopting the above technical solution, the limiting plate limits the highest position of the ejecting rod for ejecting materials.
[0013] Optionally, an installation cavity is provided in the detection platform, a plurality of vertical guide rods are arranged at the bottom of the installation cavity, a mounting hole is vertically provided in the ejecting rod and the ejecting rod is slidably sleeved on the guide rod through the mounting hole, a compression spring is supported between the bottom end of the ejecting rod and the inner bottom wall of the installation cavity, a fixing ring is arranged at the bottom of the installation cavity, a motor electrically connected to the control system is arranged in the detection platform, the output shaft of the motor extends into the installation cavity and is connected to a rotating disk, the rotating disk is located in the fixing ring, the output shaft of the motor, the rotating disk and the fixing ring are coaxially arranged, and the inner side wall of the fixing ring is A plurality of notches are evenly opened in the direction of rotation, and a sliding groove is circumferentially opened on the inner wall of the fixed ring relative to the position between two adjacent notches. One end of the sliding groove is closed, and the other end is connected to the notch in the circumferential rotation direction of the rotating disk. A sliding ball protruding from the sliding groove slides in the notch, one sliding ball corresponds to one ejecting rod and a pulling wire is tied between the sliding ball and the corresponding ejecting rod. A reversing ring for the pulling wire to pass through is also arranged on the bottom wall of the mounting cavity. There is a gap between the rotating disk and the fixed ring, and a plurality of shifting tips are evenly arranged circumferentially on the circumferential outer wall of the rotating disk, and the shifting tips are tightly attached to the inner wall of the fixed ring.
[0014] By adopting the above technical solution, the control system starts the motor, the output shaft of the motor drives the rotating disk to rotate, the rotating disk drives the pick tip to rotate, and the pick tip drives the sliding ball to slide toward the open end of the slide slot, thereby pulling the wire downward to pull the ejector rod back into the inspection table. When the pick tip moves the sliding ball into the notch, the pulling action of the pick tip on the sliding ball is released, and the compression spring pushes the ejector rod upward, thereby realizing the ejection of the wafer by the ejector rod, and at the same time, the wire pulls the sliding ball back to the closed end of the slide slot.
[0015] Optionally, the cross-section of the slide groove is C-shaped, and the slide ball is in close contact with the side wall of the slide groove.
[0016] By adopting the above technical solution, the C-shaped slide groove can limit the slide ball.
[0017] Optionally, a suction slot for connecting the outside with the mounting hole is provided at the top of the ejector rod.
[0018] By adopting the above technical solution, when the compression spring pushes the ejection rod upward, negative pressure is formed in the mounting hole, and the outside air is sucked into the mounting hole through the suction groove. As a result, the mounting hole can generate a certain suction force on the wafer, reducing the possibility of the wafer detaching from the ejection rod, thereby improving the stability of the ejection.
[0019] Optionally, elastic cotton is arranged at the top end of the ejector rod.
[0020] By adopting the above technical solution, the elastic cotton protects the ejector rod, thereby reducing the possibility of damage to the wafer when the ejector rod lifts the wafer.
[0021] Optionally, the sliding bead is coated with polytetrafluoroethylene.
[0022] By adopting the above technical solution, the friction coefficient of polytetrafluoroethylene is small, thereby improving the smoothness of the sliding ball in the sliding groove.
[0023] In summary, the present application includes at least one of the following beneficial technical effects:
[0024] 1. After the wafer inspection is completed, the drive unit drives the ejector rod to rise, so that the worker can take the wafer without being hindered by the limit bar. Before placing a new wafer, the drive unit drives the ejector rod to retract downward into the inspection table;
[0025] 2. The control system starts the motor, the output shaft of the motor drives the rotating disk to rotate, the rotating disk drives the pick tip to rotate, the pick tip drives the sliding ball to slide toward the open end of the slide slot, and the pull wire pulls the ejector rod downward to retract into the test table. When the pick tip moves the sliding ball into the gap, the action of the pick tip on the sliding ball is released, and the compression spring pushes the ejector rod upward, thereby realizing the ejection of the wafer by the ejector rod, and at the same time, the pull wire pulls the sliding ball back to the closed end of the slide slot. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a structural diagram of Example 1 of the present application.
[0027] Figure 2 It is a cross-sectional view showing the positional relationship between the piston cylinder, the push plate and the through hole in Example 1 of the present application.
[0028] Figure 3 It is a cross-sectional view of the positional relationship among the motor, rotating disk, and fixed ring in Example 2 of the present application.
[0029] Figure 4 It is a cross-sectional view of the positional relationship between the sliding ball, the pull wire and the pick tip in Example 2 of the present application.
[0030] Explanation of the reference numerals in the accompanying drawings: 1. Testing table; 101. Air cavity; 102. Through hole; 103. Mounting cavity; 2. Ejecting rod; 3. Piston cylinder; 4. Push plate; 5. Limiting plate; 6. Guide rod; 7. Compression spring; 8. Fixed ring; 81. Slide groove; 9. Motor; 10. Rotating disk; 11. Notch; 12. Sliding ball; 13. Pull wire; 14. Reversing ring; 15. Pick tip; 16. Elastic cotton. DETAILED DESCRIPTION
[0031] The following is combined with Figure 1-4 This application is described in further detail.
[0032] An embodiment of the present application discloses a wafer inspection device.
[0033] Example 1
[0034] Reference Figure 1 The wafer inspection device includes an inspection table 1 for placing wafers to be inspected, and a plurality of ejector rods 2 are vertically slidably penetrated on the inspection table 1 relative to the placement position of the wafers. A driving member for driving the ejector rods 2 to rise and fall is also provided in the inspection table 1.
[0035] Reference Figure 1 and Figure 2 An air cavity 101 is provided in the testing platform 1 below the ejecting rod 2, and the bottom end of the ejecting rod 2 extends into the air cavity 101. The driving member includes a piston cylinder 3 arranged below the air cavity 101 and electrically connected to the control system. The piston rod of the piston cylinder 3 extends into the air cavity 101 and is threadedly connected with a horizontal push plate 4. The push plate 4 is tightly attached to the vertical side wall of the air cavity 101. A through hole 102 for communicating with the outside is also provided at a position of the testing platform 1 relative to the bottom of the air cavity 101.
[0036] Reference Figure 1 and Figure 2 After the wafer inspection is completed, the control system starts the piston cylinder 3, and the piston rod of the piston cylinder 3 extends upward, thereby pushing the push plate 4 to move upward in the air cavity 101. Since the air cavity 101 is relatively closed relative to the position above the push plate 4, the air above the push plate 4 is constantly pressurized.
[0037] Thus, the ejector rod 2 extends upward under the action of the air pressure in the air cavity 101, thereby pushing the wafer off the upper surface of the test table 1, thereby facilitating workers to manually pick up the wafer. Before placing the next wafer to be tested, the piston rod retracts downward, and the ejector rod 2 is also retracted into the test table 1 in advance.
[0038] Reference Figure 1 and Figure 2 The bottom of the ejector rod 2 is threadedly connected with a limiting plate 5 for supporting the top wall of the air cavity 101. The limiting plate 5 limits the highest ejection position of the ejector rod 2, thereby reducing the possibility of the ejector rod 2 being completely ejected.
[0039] The implementation principle of Example 1 is as follows: the control system starts the piston cylinder 3, and the piston rod of the piston cylinder 3 extends upward, thereby pushing the push plate 4 to move upward in the air cavity 101. Since the air cavity 101 is relatively closed relative to the position above the push plate 4, the air above the push plate 4 is constantly pressurized. The ejector rod 2 extends upward under the action of the air pressure in the air cavity 101, thereby pushing the wafer away from the upper surface of the test table 1, thereby facilitating workers to manually pick up the wafer. Before placing the next wafer to be tested, the piston rod is retracted downward, and the ejector rod 2 is also retracted into the test table 1 in advance.
[0040] Example 2
[0041] Reference Figure 3 and Figure 4 The difference between this embodiment and embodiment 1 is that: an installation cavity 103 is opened in the detection table 1, and a plurality of vertical guide rods 6 are threadedly connected to the bottom of the installation cavity 103, and an installation hole (not shown in the figure) is opened between the top and bottom ends of the ejecting rod 2, one ejecting rod 2 corresponds to one guide rod 6 and the ejecting rod 2 is slidably mounted on the corresponding guide rod 6 through the installation hole, and a compression spring 7 is supported between the bottom end of the ejecting rod 2 and the inner bottom wall of the installation cavity 103.
[0042] Reference Figure 3 and Figure 4 A fixing ring 8 is bolted to the bottom of the installation cavity 103, and a motor 9 electrically connected to the control system is arranged in the detection table 1. The output shaft of the motor 9 extends into the installation cavity 103 and a rotating disk 10 is fixedly provided in the fixed sleeve. The rotating disk 10 is located in the fixing ring 8, and the output shaft of the motor 9, the rotating disk 10 and the fixing ring 8 are coaxially arranged.
[0043] Reference Figure 3 and Figure 4 A plurality of notches 11 are uniformly provided on the inner side wall of the fixed ring 8 in the circumferential direction, and a slide groove 81 is provided at a position between two adjacent notches 11 on the inner side wall of the fixed ring 8. One end of the slide groove 81 is closed, and the other end is connected to the notch 11 in the rotation direction of the rotating disk 10.
[0044] The cross-section of the slide groove 81 is C-shaped, and a sliding ball 12 protruding from the slide groove 81 slides inside the slide groove 81. The sliding ball 12 is tightly attached to the side wall of the slide groove 81. One sliding ball 12 corresponds to one ejecting rod 2 and a pull wire 13 is tied between the sliding ball 12 and the corresponding ejecting rod 2. A plurality of reversing rings 14 are also threadedly connected to the bottom of the mounting cavity 103, and the pull wire 13 passes through the reversing ring 14.
[0045] Reference Figure 3 and Figure 4 There is a gap between the rotating disk 10 and the fixed ring 8 , and a plurality of pick tips 15 are uniformly and integrally formed on the circumferential outer wall of the rotating disk 10 , and the pick tips 15 are in close contact with the inner wall of the fixed ring 8 .
[0046] Reference Figure 3 and Figure 4 The worker starts the motor 9 through the control system, and the output shaft of the motor 9 drives the rotating disk 10 to rotate, so that the pick tip 15 rotates synchronously, and the pick tip 15 contacts the part of the sliding ball 12 protruding outside the slide groove 81 and pushes it to slide in the slide groove 81. The sliding ball 12 pulls the ejecting rod 2 downward through the pull wire 13 until the sliding ball 12 moves to the connection between the slide groove 81 and the notch 11, and the motor 9 stops working.
[0047] Reference Figure 3 and Figure 4 When the wafer inspection is completed, the control system starts the motor 9 again, and the pick tip 15 drives the sliding ball 12 to move into the notch 11. When the pick tip 15 completely moves over the notch 11, the sliding ball 12 is pulled back into the chute 81. In this process, the ejector rod 2 first moves downward a small amount, and then, under the action of the compression spring 7, it quickly extends upward, and the sliding ball 12 is pulled back to the closed end of the chute 81, thereby realizing the ejector rod 2 to eject the wafer.
[0048] Reference Figure 3 and Figure 4 The sliding ball 12 is coated with polytetrafluoroethylene, and the friction coefficient of polytetrafluoroethylene is relatively small, which is beneficial to improving the smoothness of the sliding ball 12 pushing the sliding ball 12 to slide in the sliding groove 81 by the shifting tip 15.
[0049] Reference Figure 3 and Figure 4 The top of the ejector rod 2 is bonded with elastic cotton 16, which converts the rigid impact of the ejector rod 2 on the wafer into a flexible impact, thereby reducing the possibility of damage to the bottom surface of the wafer.
[0050] Reference Figure 3 and Figure 4 A suction slot (not shown in the figure) is provided at the top of the ejector rod 2 for connecting the outside world with the mounting hole. When the compression spring 7 pushes the ejector rod 2 upward, negative pressure is formed in the mounting hole, and the outside air is sucked into the mounting hole through the suction slot. The mounting hole can generate a certain suction force on the wafer, reducing the possibility of the wafer detaching from the ejector rod 2, thereby improving the stability of the ejector.
[0051] The implementation principle of Example 2 is as follows: the worker starts the motor 9 through the control system, and the output shaft of the motor 9 drives the rotating disk 10 to rotate, so that the pick tip 15 rotates accordingly, and the pick tip 15 contacts the part of the sliding ball 12 protruding outside the chute 81 and pushes it to slide in the chute 81. The sliding ball 12 pulls the ejector rod 2 downward through the pull wire 13 until the sliding ball 12 moves to the intersection of the chute 81 and the notch 11, and the motor 9 stops working. When the wafer inspection is completed, the control system starts the motor 9 again, and the pick tip 15 drives the sliding ball 12 to move into the notch 11. When the pick tip 15 completely moves over the notch 11, the sliding ball 12 is pulled back into the chute 81. In this process, the ejector rod 2 first moves downward a small amount, and then, under the action of the compression spring 7, it quickly extends upward, and the sliding ball 12 is pulled back to the closed end of the chute 81, thereby realizing the ejection effect of the ejector rod 2 on the wafer.
[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A wafer inspection device, characterized in that: The invention comprises a testing platform (1) for placing wafers, a plurality of ejector rods (2) are vertically slidably penetrated on the testing platform (1) relative to the placement position of the wafers, and a driving member for driving the ejector rods (2) to rise and fall is arranged inside the testing platform (1).
2. The wafer inspection device according to claim 1, characterized in that: The testing platform (1) has an air cavity (101) formed therein, the bottom end of the ejecting rod (2) extends into the air cavity (101), the driving member comprises a piston cylinder (3) arranged below the air cavity (101) and electrically connected to a control system, the piston rod of the piston cylinder (3) extends into the air cavity (101) and is connected to a push plate (4), the push plate (4) is in close contact with the air cavity (101) and each vertical side wall, and a plurality of through holes (102) for connecting the bottom of the air cavity (101) with the outside are also formed therein.
3. The wafer inspection device according to claim 2, characterized in that: The bottom of the ejector rod (2) is provided with a limiting plate (5) for supporting the top wall of the air cavity (101).
4. The wafer inspection device according to claim 1, characterized in that: The detection platform (1) is provided with an installation cavity (103), the bottom of which is provided with a plurality of vertical guide rods (6), the ejector rod (2) is provided with an installation hole vertically and is slidably sleeved on the guide rod (6) through the installation hole, a compression spring (7) is supported between the bottom end of the ejector rod (2) and the inner bottom wall of the installation cavity (103), a fixing ring (8) is arranged at the bottom of the installation cavity (103), a motor (9) electrically connected to a control system is arranged in the detection platform (1), the output shaft of the motor (9) extends into the installation cavity (103) and is connected to a rotating disk (10), the rotating disk (10) is located in the fixing ring (8), the output shaft of the motor (9), the rotating disk (10) and the fixing ring (8) are coaxially arranged, and a plurality of notches are evenly arranged on the inner side wall of the fixing ring (8) in a circumferential direction. The fixing ring (8) has a slot (81) formed on the inner wall thereof at a position between two adjacent slots (11). One end of the slot (81) is closed, and the other end is connected to the slot (11) in the circumferential direction of rotation of the rotating disk (10). A sliding ball (12) protruding from the slot (81) slides in the slot (11). One sliding ball (12) corresponds to one ejecting rod (2), and a pull wire (13) is connected between the sliding ball (12) and the corresponding ejecting rod (2). A reversing ring (14) for the pull wire (13) to pass through is also arranged on the bottom wall of the mounting cavity (103). There is a gap between the rotating disk (10) and the fixing ring (8). A plurality of shifting tips (15) are evenly arranged on the circumferential outer wall of the rotating disk (10), and the shifting tips (15) are in close contact with the inner wall of the fixing ring (8).
5. The wafer inspection device according to claim 4, characterized in that: The cross section of the slide groove (81) is C-shaped, and the slide ball (12) is in close contact with the side wall of the slide groove (81).
6. The wafer inspection device according to claim 4, characterized in that: The top end of the ejector rod (2) is provided with an air suction slot for connecting the outside with the mounting hole.
7. The wafer inspection device according to claim 6, characterized in that: The top end of the ejector rod (2) is provided with elastic cotton (16).
8. The wafer inspection device according to claim 4, characterized in that: The sliding bead (12) is coated with polytetrafluoroethylene.