Matrix type LED light-emitting module and light-emitting equipment

Abstract

The utility model relates to the technical field of display, in particular to a matrix type light-emitting diode (LED) light-emitting module and light-emitting equipment, which comprise a printed circuit board (PCB), light-emitting groups and a membrane, the light-emitting groups are distributed on the PCB in a matrix mode, each light-emitting group is composed of an LED chip, adhesive glue and a silica gel carrier, the LED chips are fixedly arranged on the PCB, the adhesive glue covers the LED chips, and the membrane is arranged on the PCB. The section of the bonding glue is in a semi-oval shape, the silica gel carrier covers the bonding glue, the section of the upper end of the silica gel carrier is in an arc shape, the diaphragm covers the upper end of the PCB, and a gap is formed between the diaphragm and the light-emitting set. The device is simple in structure and high in production efficiency; and through the bonding glue and the silica gel carrier, light emitted by the LED chips can be effectively diffused, the light-emitting angle of the light-emitting module is increased, and the light-emitting effect of the light-emitting module is guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of display technology, and in particular to a matrix LED light-emitting module and a light-emitting device. Background Art

[0002] With the development of technology, LED devices are increasingly used in TV backlight and lighting. In the field of light-emitting modules, the main product form is the light bar type backlight source, which consists of four main components: several strip PCBs + packaged LEDs + lenses + diaphragms; in the field of panel lighting, it is usually a combination of PCB boards + packaged LEDs + lenses + diaphragms.

[0003] The existing light-emitting modules have a complex structure, many production steps, low production efficiency, and a limited light-emitting angle, resulting in poor light-emitting effects. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a matrix LED light-emitting module.

[0005] The utility model provides the following technical solution: a matrix LED light-emitting module, including a PCB board, a light-emitting group and a diaphragm, wherein the light-emitting group is distributed on the PCB board in a matrix manner, the light-emitting group is composed of an LED chip, an adhesive and a silicone carrier, the LED chip is fixed on the PCB board, the adhesive covers the LED chip, the cross-section of the adhesive is semi-elliptical, the silicone carrier covers the adhesive, the upper end cross-section of the silicone carrier is arc-shaped, the diaphragm covers the upper end of the PCB board, and has a gap with the light-emitting group.

[0006] The matrix LED light-emitting module of one embodiment of the utility model has a simple structure. The LED chip does not need to be packaged and can be directly sealed by adhesive glue and a silicone carrier. During production, it is only necessary to prepare the light-emitting groups in advance and then fix each light-emitting group on a PCB board. The process is simple and the production efficiency is high. Moreover, the light emitted by the LED chip can be effectively dispersed through the adhesive glue and the silicone carrier, thereby improving the light-emitting angle of the light-emitting module and ensuring the light-emitting effect of the light-emitting module.

[0007] Furthermore, a DBR optical film layer is provided on the upper end of the LED chip.

[0008] Furthermore, the silicone carrier includes a positioning portion and a diverging portion, the positioning portion is disc-shaped and fixedly connected to the PCB board, the diverging portion is located at the upper end of the positioning portion, and the cross-section of the diverging portion is arc-shaped.

[0009] Furthermore, a groove with a V-shaped cross section is provided in the middle of the upper end of the divergent portion, the inner wall of the groove is a smooth arc, and the vertical center line of the groove is colinear with the vertical center line of the adhesive.

[0010] Furthermore, the ratio of the distance between adjacent light-emitting groups to the distance between the membrane and the PCB board is between 0.5 and 4.5.

[0011] Furthermore, the diameter of the lower end of the silica gel carrier is between 2.2 mm and 2.8 mm, and the height of the silica gel carrier is between 1.1 mm and 1.5 mm.

[0012] Furthermore, the groove depth of the pressed groove is between 0.08 mm and 0.12 mm, and the height of the adhesive is between 0.9 mm and 1.1 mm.

[0013] The utility model also provides a light-emitting device, which includes the matrix LED light-emitting module as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 This is a schematic diagram of the internal structure of the matrix LED light-emitting module of the present utility model;

[0016] Figure 2 It is a structural schematic diagram of the light-emitting group in the matrix LED light-emitting module of the utility model;

[0017] Figure 3 It is a schematic diagram of the top structure of the matrix LED light-emitting module of the present invention.

[0018] Description of reference numerals:

[0019] 10. PCB board; 20. Light-emitting group; 21. LED chip; 22. DBR optical film layer; 23. Adhesive; 24. Silicone carrier; 241. Positioning part; 242. Diverging part; 243. Pressing groove; 30. Diaphragm. DETAILED DESCRIPTION

[0020] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0021] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0023] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0024] Reference Figures 1 to 3 In one embodiment of the utility model, a matrix LED light-emitting module includes a PCB board 10, a light-emitting group 20 and a diaphragm 30. The light-emitting group 20 is distributed on the PCB board 10 in a matrix manner. The light-emitting group 20 is composed of an LED chip 21, an adhesive 23 and a silicone carrier 24. The LED chip 21 is fixed on the PCB board 10, and the adhesive 23 covers the LED chip 21. The cross-section of the adhesive 23 is semi-elliptical. The silicone carrier 24 covers the adhesive 23. The upper end cross-section of the silicone carrier 24 is arc-shaped. The diaphragm 30 covers the upper end of the PCB board 10 and has a gap with the light-emitting group 20.

[0025] The matrix LED light-emitting module of one embodiment of the utility model has a simple structure. The LED chip 21 does not need to be packaged and can be directly sealed by the adhesive 23 and the silicone carrier 24. During production, it is only necessary to prepare the light-emitting groups 20 in advance and then fix each light-emitting group 20 on the PCB board 10. The process is simple and the production efficiency is high. Moreover, the light emitted by the LED chip 21 can be effectively dispersed through the adhesive 23 and the silicone carrier 24, thereby improving the light-emitting angle of the light-emitting module and ensuring the light-emitting effect of the light-emitting module.

[0026] A DBR optical film layer 22 is provided on the upper end of the LED chip 21; by providing the DBR optical film layer 22, the reflection effect of the light emitted by the LED chip 21 can be improved, and the light efficiency can be improved; in this embodiment, the structure and principle of the PCB board 10, the film 30 and the DBR optical film layer 22 are well known to those skilled in the art, so they are not described in detail here.

[0027] The silicone carrier 24 includes a positioning portion 241 and a diverging portion 242. The positioning portion 241 is disc-shaped and fixedly connected to the PCB board 10. The diverging portion 242 is located at the upper end of the positioning portion 241, and the cross-section of the diverging portion 242 is arc-shaped. The positioning portion 241 plays a role in stable connection with the PCB board 10, and the arc-shaped structure of the diverging portion 242 mainly plays a role in optical refraction and reflection, thereby improving the light-emitting angle of each light-emitting group 20, that is, the light-emitting effect of the entire light-emitting module is better. In this embodiment, the positioning portion 241 and the diverging portion 242 are an integrated structure.

[0028] A V-shaped groove 243 is provided in the middle of the upper end of the divergent portion 242, the inner wall of the groove 243 is a smooth arc, and the vertical center line of the groove 243 is colinear with the vertical center line of the adhesive 23; the divergent portion 242 is provided with the groove 243, and then cooperates with the semi-ellipsoidal adhesive to fully reflect or refract the light emitted by the LED chip 21, thereby increasing the light-emitting angle of the light-emitting module, and the material difference between the adhesive 23 and the silicone carrier 24 also leads to different refractive indices of the two, which can further increase the light-emitting angle of the light-emitting module; in this embodiment, the LED chip 21 and the adhesive 23 are located at the lower end center of the silicone carrier 24. In specific implementation, the LED chip 21 is embedded in the silicone carrier 24 through the adhesive 23, and then cured by baking to obtain a light-emitting group 20, and then the light-emitting group 20 is fixed to the PCB board 10, and finally the diaphragm 30 is installed.

[0029] The ratio of the spacing between adjacent light-emitting groups 20 to the spacing between the diaphragm 30 and the PCB board 10 is between 0.5 and 4.5; this distance ratio meets the requirements of the luminous visual effects of backlight and lighting application scenarios; in this embodiment, the ratio of the spacing between adjacent light-emitting groups 20 to the spacing between the diaphragm 30 and the PCB board 10 is 0.8.

[0030] The diameter of the lower end of the silicone carrier 24 is between 2.2mm and 2.8mm, and the height of the silicone carrier 24 is between 1.1mm and 1.5mm; the depth of the groove 243 is between 0.08mm and 0.12mm, and the height of the adhesive 23 is between 0.9mm and 1.1mm; the size of the silicone carrier 24 and the size of the adhesive 23 can both affect the reflection angle of the light emitted by the LED chip 21, and the appropriate size can ensure that the light-emitting angle of the light-emitting group 20 is optimal; in this embodiment, the diameter of the lower end of the silicone carrier 24 is 2.5mm, the height of the positioning portion 241 is 0.5mm, the height of the silicone carrier 24 is 1.3mm, the depth of the groove 243 is 0.1mm, the height of the adhesive 23 is 1mm, and the short axis diameter of the adhesive 23 is 0.8mm.

[0031] The utility model also provides a light-emitting device, which includes the above matrix LED light-emitting module.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A matrix LED light-emitting module, characterized in that: It includes a PCB board, a light-emitting group and a diaphragm, wherein the light-emitting group is distributed on the PCB board in a matrix manner, and the light-emitting group is composed of an LED chip, an adhesive and a silicone carrier. The LED chip is fixed on the PCB board, the adhesive covers the LED chip, and the cross-section of the adhesive is semi-elliptical. The silicone carrier covers the adhesive, and the upper end cross-section of the silicone carrier is arc-shaped. The diaphragm covers the upper end of the PCB board and has a gap with the light-emitting group.

2. The matrix LED light-emitting module according to claim 1, characterized in that: A DBR optical film layer is arranged on the upper end of the LED chip.

3. The matrix LED light-emitting module according to claim 1, characterized in that: The silica gel carrier comprises a positioning portion and a diverging portion. The positioning portion is disc-shaped and fixedly connected to the PCB board. The diverging portion is located at the upper end of the positioning portion, and the cross section of the diverging portion is arc-shaped.

4. The matrix LED light-emitting module according to claim 3, characterized in that: A V-shaped groove is provided in the middle of the upper end of the divergent portion. The inner wall of the groove is a smooth arc, and the vertical center line of the groove is collinear with the vertical center line of the adhesive.

5. The matrix LED light-emitting module according to claim 1, characterized in that: The ratio of the distance between adjacent light-emitting groups to the distance between the membrane and the PCB board is between 0.5 and 4.

5.

6. The matrix LED light-emitting module according to claim 1, characterized in that: The diameter of the lower end of the silica gel carrier is between 2.2 mm and 2.8 mm, and the height of the silica gel carrier is between 1.1 mm and 1.5 mm.

7. The matrix LED light-emitting module according to claim 4, characterized in that: The groove depth of the pressed groove is between 0.08 mm and 0.12 mm, and the height of the adhesive is between 0.9 mm and 1.1 mm.

8. A light emitting device, characterized in that: The light-emitting device comprises the matrix LED light-emitting module according to any one of claims 1 to 7.

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