Electronic device

Abstract

The utility model provides electronic equipment which comprises a shell, a screen, a first loudspeaker module and a flexible circuit board module covering the back face of the screen and electrically connected with the screen. The flexible circuit board module is provided with an avoiding hole, the avoiding hole extends from the surface of one side, away from the screen, of the flexible circuit board module to the surface of the other side opposite to the surface of the side in the first direction, and the avoiding hole at least covers the first loudspeaker area. Therefore, according to the electronic equipment provided by the invention, the space occupied by the loudspeaker and the circuit board in the thickness direction of the electronic equipment can be reduced, and the electronic equipment is light and thin.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] The electronic device has a housing and a screen, and the screen is mounted in the housing and surrounds the housing to form a receiving cavity. In some products, the screen driver chip is arranged on the short side of the screen, and the circuit board on the back of the screen is also installed in a position close to the screen driver chip. The screen driver chip and the electronic components on the circuit board are electrically connected to control the screen of the electronic device.

[0003] Electronic devices usually also include multiple speakers, which are also installed in the accommodating cavity. In the thickness direction of the electronic device, the static size of the speaker itself occupies a certain space, and the speaker needs to maintain a certain distance from the housing, circuit board and other structures of the electronic device to reserve vibration space for the speaker diaphragm and prevent the speaker from colliding with the circuit board and causing damage to the screen. Therefore, the installation space required for the speaker in the thickness direction of the electronic device is relatively large.

[0004] Multiple speakers are usually dispersedly arranged at the short sides of the electronic device to output sound evenly to the outside world. For example, in a tablet computer, two speakers are generally arranged near the two short sides of the tablet computer to output sound to the user in an all-round manner. In this case, the speakers and circuit boards are inevitably overlapped in the thickness direction of the electronic device. The space occupied by the speakers in the thickness direction of the electronic device is relatively large. The stacking of the circuit board and the speakers will cause the two to occupy a larger space in the thickness direction of the electronic device, further increasing the thickness of the electronic device, which is contrary to consumers' pursuit of thinner and lighter electronic devices.

[0005] It can be seen that in the prior art, the loudspeaker and the circuit board occupy a lot of space in the thickness direction of the electronic device, which makes it difficult to make the electronic device thinner and lighter. Utility Model Content

[0006] An embodiment of the present application provides an electronic device, which solves the problem in the prior art that a speaker and a circuit board occupy a large amount of space in the thickness direction of the electronic device, making it difficult to make the electronic device thinner and lighter.

[0007] An embodiment of the present application provides an electronic device, including a shell, a screen and a first speaker module. The screen is installed on the shell and forms a accommodating cavity around the shell. The first speaker module is located in the accommodating cavity and includes a first structural shell and a first speaker installed in the first structural shell. The first structural shell is installed on the shell, wherein, on a plane perpendicular to the first direction, the area where the first speaker in the first speaker module is located is the first speaker area.

[0008] The electronic device also includes a flexible circuit board module covering the back of the screen and electrically connected to the screen. The flexible circuit board module is provided with an avoidance hole. The avoidance hole extends along a first direction from a side surface of the flexible circuit board module away from the screen toward another side surface opposite to the one side surface. The avoidance hole at least covers the first speaker area of ​​the first speaker module.

[0009] The electronic device provided in the embodiment of the present application includes a flexible circuit board module and a first speaker module arranged in a receiving cavity, the flexible circuit board module is covered on the back of the screen, the first structural shell in the first speaker module is installed on the housing of the electronic device, and the first speaker is installed on the first structural shell. A avoidance hole is provided on the flexible circuit board module, and the avoidance hole extends from a side surface of the flexible circuit board module away from the screen along a first direction toward the other side surface, that is, from a side surface facing the first speaker module toward the other side surface, wherein the first direction is the thickness direction of the electronic device. Moreover, on a plane perpendicular to the first direction, the avoidance hole at least covers the first speaker area. It can be understood that the first speaker and the avoidance hole are arranged correspondingly in the thickness direction of the electronic device, so that the space in the avoidance hole can be used as a part of the installation space of the first speaker, thereby reducing the total size occupied by the first speaker in the first direction, and further reducing the thickness of the electronic device.

[0010] Therefore, the electronic device provided in the present application can reduce the space occupied by the speaker and the circuit board in the thickness direction of the electronic device, thereby achieving lightweight and thin electronic equipment.

[0011] In some embodiments, the avoidance hole penetrates the flexible circuit board module. The avoidance hole penetrates the flexible circuit board module, so that the flexible circuit board module can avoid the first speaker to the greatest extent, and the thickness of the electronic device can be reduced as much as possible.

[0012] In some embodiments, the screen includes a functional layer, the functional layer includes a first glass substrate, the electronic device includes at least one screen driver chip, the at least one screen driver chip is arranged on the side edge portion of the first glass substrate of the screen and is electrically connected to the flexible circuit board module, and in the circumferential direction of the electronic device, the avoidance hole and the at least one screen driver chip are staggered.

[0013] The flexible circuit board module is provided with some connecting wires to realize the electrical connection between the screen driver chip and the electronic components arranged on the flexible circuit board module. The avoidance hole and the screen driver chip are staggered in the circumferential direction of the electronic device, and the connecting wires on the flexible circuit board module can bypass the avoidance hole along the outer circumference of the avoidance hole, thereby ensuring that the electrical connection between the screen driver chip and the electronic components on the flexible circuit board module is more reliable.

[0014] In some embodiments, the at least one screen driver chip is two screen driver chips, the two screen driver chips are arranged relatively spaced apart along the width direction of the electronic device, and the avoidance hole is arranged between the two screen driver chips in the width direction of the electronic device.

[0015] In some embodiments, the first speaker includes a fixed bracket, a vibrator, and a voice coil, the fixed bracket is mounted on the first structural shell, the outer peripheral edge of the vibrator is connected to the fixed bracket, the voice coil is mounted on the first side of the vibrator, in the first direction, the second side of the vibrator is arranged toward the screen, and the area of ​​the first structural shell arranged toward the second side of the vibrator is arranged as a hollow structure. The first side of the vibrator is arranged opposite to the second side.

[0016] It can be understood that in the first direction, not only does the vibration member of the first speaker need enough space to allow the vibration member to generate vibration and allow air to flow through, but the first speaker as a whole needs to be kept at a certain safety distance from the screen to prevent collision and protect the screen. With the above solution, the vibration member is arranged between the voice coil and the screen, that is, the vibration member faces the screen, and the voice coil is located on the side of the vibration member away from the screen. Then, the safety distance that needs to be maintained between the first speaker and the screen is contained in the vibration space of the vibration member, and only the vibration space of the vibration member needs to be ensured, which reduces the space occupied by the first speaker module in the first direction, allowing the electronic device to be further thinned.

[0017] In some embodiments, a portion of the first structural shell surrounding the periphery of the vibration element passes through the avoidance hole of the flexible circuit board module and contacts the back of the screen, and a front sound cavity is formed around the second side of the vibration element, the back of the screen and the first structural shell, and the first structural shell has a sound guide channel, through which the front sound cavity is connected to the outside of the first structural shell.

[0018] By adopting the above solution, the distance between the first structural shell and the screen is minimized, which saves the installation space of the first speaker module in the first direction to the maximum extent. In addition, the front sound cavity formed by the vibrator and the screen is connected to the outside of the first structural shell through the sound guide channel, ensuring that the vibrator can vibrate and produce sound and the sound can be transmitted.

[0019] In some embodiments, the electronic device further comprises a second speaker module disposed in the accommodating cavity, the second speaker module comprising a second structural shell and a second speaker mounted on the second structural shell, and the second structural shell is mounted on the housing. On a plane perpendicular to the first direction, the projections of the second speaker module and the flexible circuit board module do not overlap.

[0020] By adopting the above solution, a second speaker module is arranged in the accommodating cavity to make the sound effect of the electronic device better. The second speaker module is staggered with the flexible circuit board module, that is, the second speaker module and the flexible circuit board module do not overlap in the first direction, so the thickness of the electronic device will not be increased.

[0021] In some embodiments, the first speaker module and the second speaker module are spaced apart in the length direction of the electronic device, and the audio range of the first speaker and the audio range of the second speaker are the same.

[0022] With the above solution, the audio range of the first speaker and the second speaker is the same, and the second speaker module and the first speaker module are spaced apart in the length direction of the electronic device, so that the electronic device outputs sound more evenly, improving the user experience.

[0023] In some embodiments, the electronic device further comprises at least one third speaker module disposed in the accommodating cavity, each of the at least one third speaker module comprises a third structural shell and a third speaker mounted on the third structural shell, and the third structural shell is mounted on the housing. The audio range of the third speaker is greater than the audio range of the first speaker.

[0024] In some embodiments, the at least one third speaker module is two third speaker modules, and the two third speaker modules are arranged relatively spaced apart along the length direction of the electronic device. In the width direction of the electronic device, the two third speaker modules are arranged on one side of the avoidance hole.

[0025] With the above solution, the audio range of the third speaker is greater than that of the first speaker and the second speaker, so that the audio range of the electronic device is wider and the treble effect is better. The two third speaker modules are arranged at intervals, and the first speaker module and the second speaker module are arranged at intervals, so that the sound can be transmitted from multiple angles, the sound quality is clear, and the sound effect is better.

[0026] In some embodiments, the flexible circuit board module includes a shielding layer, a flexible circuit board and a heat dissipation layer stacked in sequence, wherein the flexible circuit board is electrically connected to the screen driving chip. The shielding layer plays a role in shielding interference, and the heat dissipation layer plays a role in heat dissipation, which is conducive to improving the performance of the flexible circuit board module.

[0027] In some embodiments, the electronic device is a tablet computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The figure is a schematic diagram of the disassembled structure of the first electronic device;

[0029] Figure 2 is a schematic diagram of the disassembled structure of the second electronic device;

[0030] Figure 3 A schematic diagram of the installation structure of a speaker module in a second electronic device;

[0031] Figure 4 It is a schematic diagram of the three-dimensional structure of an electronic device according to an embodiment of the present application;

[0032] Figure 5 This is a schematic diagram of the disassembled structure of the electronic device according to the embodiment of the present application;

[0033] Figure 6 This is a schematic diagram of the structure of a screen in an electronic device according to an embodiment of the present application;

[0034] Figure 7 This is a schematic diagram of the exploded structure of a flexible circuit board module in an electronic device according to an embodiment of the present application;

[0035] Figure 8a This is a schematic diagram of a first installation structure of a first speaker module in an electronic device according to an embodiment of the present application;

[0036] Figure 8b This is a schematic diagram of a second installation structure of the first speaker module in the electronic device according to an embodiment of the present application.

[0037] Description of reference numerals:

[0038] The first option:

[0039] 100', electronic device; 101', housing; 102', screen; 103', receiving chamber;

[0040] 201', screen driver chip; 202', PCB board; 203', flexible circuit board module;

[0041] 30', speaker module;

[0042] X', length direction of the electronic device.

[0043] Second option:

[0044] 100”, electronic device; 101”, housing; 102”, screen; 103”, receiving chamber;

[0045] 20”, flexible circuit board module;

[0046] 30”, speaker module; 301”, structural shell; 302”, speaker; 3021”, vibrating element; 3022”, voice coil; 3023”, magnetic circuit system;

[0047] X', length direction of the electronic device; H', thickness direction of the electronic device.

[0048] This application:

[0049] 10. first speaker module; 11. first speaker; 111. fixing bracket;

[0050] 112, vibrating member; 1121, first side; 1122, second side;

[0051] 113, voice coil; 114, magnetic circuit system; 1141, magnet; 1142, magnetic bowl; 1143, magnetic plate;

[0052] 12. first structural shell; 121. sound guide channel; 13. front sound cavity;

[0053] 20. Second speaker module; 21. Second speaker; 22. Second structural shell;

[0054] 30. a third speaker module; 31. a third speaker; 32. a third structural shell;

[0055] 40. flexible circuit board module; 401. shielding layer; 402. flexible circuit board; 403. heat dissipation layer;

[0056] 41. Avoidance hole;

[0057] 50. electronic device; 510. housing;

[0058] 520, screen; 5201, display surface; 5202, back surface;

[0059] 521, first glass substrate; 5211, side edge portion; 522, liquid crystal layer; 523, second glass substrate;

[0060] 530, accommodating chamber;

[0061] 60. Screen driver chip;

[0062] F1, first direction; X, length direction of the electronic device; Y, width direction of the electronic device. DETAILED DESCRIPTION

[0063] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0064] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0065] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0066] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0067] In the description of the present application, it should be understood that "electrical connection" in the present application can be understood as physical contact and electrical conduction between components; it can also be understood as a form in which different components in a circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals.

[0068] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0069] The electronic device has a housing and a screen. The screen is mounted in the housing and surrounds the housing to form a receiving cavity. The receiving cavity contains electronic components. The circuit board and the speaker are both arranged below the screen and are stacked in the thickness direction of the electronic device. The two occupy a large space in the thickness direction of the electronic device, resulting in a thicker thickness of the electronic device. Two typical structures are used as examples to illustrate this problem.

[0070] See also Figure 1-Figure 3 , Figure 1 The figure is a schematic diagram of the disassembled structure of the first electronic device; Figure 2 is a schematic diagram of the disassembled structure of the second electronic device; Figure 3 The figure is a schematic diagram of the installation structure of the speaker module in the second electronic device.

[0071] To facilitate the description of the internal structure and layout of electronic equipment, Figure 1 , Figure 2 , and the following Figure 5 The electronic device is split into two parts along the fastening point between the screen and the shell. The upper part is the screen and components such as a circuit board installed on the back of the screen, and the lower part is the shell and components such as a speaker module installed in the shell. The upper and lower structures in the figure can be fastened together around the axis between the two to form an electronic device.

[0072] like Figure 1As shown in the figure, the electronic device 100' is a tablet computer using a vertical screen solution (the vertical screen solution is a screen display method mainly in the longitudinal direction. In this mode, text, images and page elements are arranged vertically, that is, arranged along the length direction X' of the electronic device. The user needs to slide up and down to view the complete content). The electronic device 100' has a housing 101' and a screen 102'. The screen 102' is installed on the housing 101' and surrounds the housing 101' to form a receiving cavity 103'. The screen driver chip 201' is arranged on the side edge of a short side (the right short side in the figure) of the screen 102'. A PCB board 202' (Printed Circuit Board) is arranged in the receiving cavity 103' near the short side. The PCB board 202' is provided with electronic components related to the screen 102'. The screen driver chip 201' and the electronic components on the PCB board 202' are electrically connected through a flexible circuit board module 203', and the flexible circuit board module 203' is covered on the back of the screen 102'. In the length direction X' of the electronic device, the flexible circuit board module 203' extends from the screen driver chip 201' toward the PCB board 202' to achieve electrical connection between the electronic components on the PCB board 202' and the screen driver chip 201'. The thickness of the PCB board 202' is relatively large, with a total thickness of about 0.9 mm, and the thickness of the flexible circuit board module 203' is slightly thinner, with a total thickness of about 0.35 mm.

[0073] The electronic device 100' also includes a speaker module 30'. Two speaker modules 30' are respectively arranged at the positions near the two short sides of the electronic device 100' in the container 103' to uniformly output sound to the outside. The speaker module 30' has a certain thickness. In order to avoid the thickness of the electronic device 100' being too thick, the speaker module 30' and the PCB board 202' are staggered in the length direction X' of the electronic device. The speaker module 30' on the right side of the figure is arranged between the PCB board 202' and the right edge of the electronic device 100', so that the speaker module 30' and the PCB board 202' can be misaligned to avoid the two stacking in the thickness direction of the electronic device. The size of the PCB board 202' in the length direction X' of the electronic device is about 14mm. In order to stagger the speaker module 30' on the right side with the PCB board 202', it is necessary to reduce the size of the speaker module 30' to avoid the PCB board 202', which sacrifices a part of the volume of the internal sound cavity of the speaker module 30'. The volume of the sound cavity of a single speaker module 30' is reduced by more than 0.5cc. In addition, the speaker module 30' on the right side and the flexible circuit board module 203' are still stacked in the thickness direction of the electronic device, which also has a certain impact on the thickness of the electronic device 100'.

[0074] Based on this, some manufacturers have made improvements. Figure 2-Figure 3As shown, unlike the above-mentioned electronic device 100', the electronic device 100" adopts a circuit board integration solution, removes the PCB board, and integrates all the electronic components on the PCB board into the flexible circuit board module to form an integrated flexible circuit board module 20". This structure does not require reducing the size of the speaker module 30" to avoid the PCB board, thereby ensuring the volume of the sound cavity of the speaker module 30". However, the speaker module 30" and the flexible circuit board module 20" are still overlapped in the thickness direction H" of the electronic device, and the thickness of the electronic device 100" is still relatively thick.

[0075] like Figure 3 As shown, the speaker module 30" includes a structural shell 301" and a speaker 302" installed on the structural shell 301", and the speaker 302" is fixedly connected to the shell 101" of the electronic device 100" through the structural shell 301". The speaker 302" includes a vibrator 3021", a voice coil 3022" and a magnetic circuit system 3023". After the voice coil 3022" is energized, the magnetic field generated interacts with the magnetic circuit system 3023", so that the voice coil 3022" vibrates in the thickness direction H" of the electronic device and drives the vibrator 3021" to vibrate up and down. Among them, the vibrator 3021" is arranged on the side of the voice coil 3022" away from the screen 102", which can also be understood as that the vibrator 3021" is arranged toward the shell 101".

[0076] Since the screen 102" is relatively fragile, the speaker 302" needs to maintain a safe distance of 0.3mm from the flexible circuit board module 20" to prevent the speaker 302" from colliding with the flexible circuit board module 20" and causing damage to the screen 102". In addition, the vibrator 3021" also needs to maintain a distance of 0.9mm from the housing 101" (including the maximum amplitude of 0.5mm and the airflow space of 0.4mm) to vibrate. Figure 3 As shown, if d represents the static size of the speaker 302" in the thickness direction H" of the electronic device (i.e., the size of the vibrator 3021" when not vibrating), the total thickness of the speaker 302" and the flexible circuit board module 20" is d+0.3mm+0.9mm+0.35mm=(1.55+d)mm, which has high requirements on the height of the accommodating cavity 103", which is not conducive to the thinning of the electronic device 100".

[0077] Therefore, in the prior art, the speaker module and the circuit board occupy a large amount of space in the thickness direction of the electronic device, which makes it difficult to make the electronic device thinner and lighter.

[0078] In order to solve the above technical problems, an embodiment of the present application provides an electronic device, which reduces the thickness of the electronic device by avoiding the circuit board and the speaker module. The electronic device provided in the embodiment of the present application can be, but is not limited to, a tablet computer, and can also be an e-reader, a mobile phone, a laptop computer, a smart watch, smart glasses, a vehicle-mounted device, etc. The structure of the electronic device of the present application is described below by taking the electronic device being a tablet computer as an example.

[0079] See also Figure 4-Figure 7 , Figure 4 It is a schematic diagram of the three-dimensional structure of an electronic device according to an embodiment of the present application; Figure 5 This is a schematic diagram of the disassembled structure of the electronic device according to the embodiment of the present application; Figure 6 This is a schematic diagram of the structure of a screen in an electronic device according to an embodiment of the present application; Figure 7 This is a schematic diagram of the exploded structure of a flexible circuit board module in an electronic device according to an embodiment of the present application.

[0080] like Figure 4-Figure 5 As shown, the electronic device 50 includes a housing 510 and a screen 520, wherein the screen 520 is mounted on the housing 510 and surrounds the housing 510 to form a receiving cavity 530. The housing 510 is used to carry the screen 520 and protect the components disposed in the receiving cavity 530. The components disposed in the receiving cavity 530 include, but are not limited to, circuit boards, batteries, memory, central processing units, camera modules, speaker modules, communication modules, etc., and this application does not limit this.

[0081] The screen 520 is used for image presentation and human-computer interaction. The screen 520 may be, but is not limited to, a thin film transistor liquid crystal display (TFT-LCD), a twisted nematic liquid crystal display (TN-LCD), an in-plane switching liquid crystal display (IPS-LCD), a micro organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (OLED) screen, etc., and the present application does not limit this. In one embodiment, the screen 520 is an LCD display screen. The side surface of the screen 520 facing the user (i.e., the surface away from the side of the housing 510 along the first direction F1) is its display surface 5201, and the display surface 5201 is used to display information and provide an interactive interface for the user. It is understandable that the first direction F1 is the thickness direction of the electronic device 50.

[0082] It should be noted that the present application does not limit the display mode of the screen 520 of the electronic device 50, and a vertical screen solution or a horizontal screen solution can be adopted. In one embodiment, the display mode of the electronic device 50 is a vertical screen mode. In this mode, the text, image and page elements displayed on the display surface 5201 are arranged vertically, that is, arranged along the length direction X of the electronic device, and the user needs to slide up and down to view the complete content.

[0083] like Figure 6 As shown, in one embodiment, the screen 520 includes two glass substrates spaced apart along the first direction F1, namely a first glass substrate 521 and a second glass substrate 523, wherein the first glass substrate 521 is arranged on the side away from the accommodating cavity 530. A liquid crystal layer 522 is arranged between the two glass substrates, wherein the liquid crystal layer 522 can realize image display and provide a picture for the user. In some embodiments, other components are also arranged between the two glass substrates to jointly constitute the functional layer of the screen 520. The components between the two glass substrates may include a backlight source (not shown in the figure) to provide backlight and a filter (not shown in the figure) to filter and enhance the light emitted by the backlight source to display different colors, and may also include other components, which are not limited in this application. It can be understood by those skilled in the art that, in addition to the functional layer, the screen 520 may also include and other laminated layers. In an example scenario, the screen 520 may further include a glass cover plate, which can provide positive protection for the functional layer of the screen 520. The glass cover plate and the first glass substrate 521 may be provided as a separate structure, or the two may be integrated on the same structural layer, which is not limited in the present application. Figure 5-Figure 6 As shown, in one embodiment, the electronic device 50 includes a screen driver chip 60. The screen driver chip 60 controls the display of the screen 520, processes and stores image information, etc. The number of screen driver chips 60 is not limited, and can be 1, 2, 4, etc., and this application does not limit this. Figure 5 As shown, in one embodiment, two screen driving chips 60 are disposed in the electronic device 50. The two screen driving chips 60 are disposed on the same short side of the screen 520 and are relatively spaced apart along the width direction Y of the electronic device.

[0084] In one embodiment, the electronic device 50 adopts a COG (Chip On Glass) solution, that is, the screen driving chip 60 is disposed on the side edge portion 5211 of the first glass substrate 521 of the screen 520. Figure 6As shown, in one embodiment, the first glass substrate 521 has a side edge portion 5211, and the side edge portion 5211 can be understood as the portion of the first glass substrate 521 extending outward beyond the liquid crystal layer 522 along the circumference of the screen 520. The screen driver chip 60 is mounted on the side edge portion 5211 of the first glass substrate 521, which can be understood as the screen driver chip 60 is arranged on the outside of the liquid crystal layer 522. Except for the first glass substrate 521, the screen driver chip 60 is not stacked with other structures in the screen 520, so the thickness of the screen 520 will not be increased, so that the thickness of the electronic device 50 can be reduced as much as possible.

[0085] See also Figure 8a-8b , Figure 8a This is a schematic diagram of a first installation structure of a first speaker module in an electronic device according to an embodiment of the present application; Figure 8b This is a schematic diagram of a second installation structure of the first speaker module in the electronic device according to an embodiment of the present application.

[0086] like Figure 5 , Figure 7-Figure 8a As shown, the electronic device 50 also includes a flexible circuit board module 40 that is covered on the back side 5202 of the screen 520 and electrically connected to the screen driver chip 60. The back side 5202 of the screen 520 can be understood as a side surface of the screen 520 that is arranged opposite to its display surface 5201, and can also be understood as a side surface of the screen 520 that faces the housing 510 along the first direction F1. It can be understood by those skilled in the art that the flexible circuit board module 40 is provided with an electronic unit related to the control of the screen 520, and the flexible circuit board module 40 is arranged on the back side 5202 of the screen 520. At the same time, the screen driver chip 60 adopts the COG solution, so that the signal transmission path between the screen driver chip 60 and the flexible circuit board module 40 is short, which reduces the energy loss during signal transmission, thereby achieving lower power consumption.

[0087] It should be noted that the specific structure of the flexible circuit board module 40 is not limited. Figure 7As shown, in one embodiment, the flexible circuit board module 40 includes a shielding layer 401, a flexible circuit board 402 and a heat dissipation layer 403 stacked in sequence along the first direction F1, wherein the flexible circuit board 402 is electrically connected to the screen driver chip 60. The flexible circuit board 402 is provided with electronic components related to the screen 520, including but not limited to capacitors, resistors, crystal oscillators, connectors, etc. It can be understood that these electronic components need to be electrically connected to the screen driver chip 60 to achieve control of the screen 520. The shielding layer 401 is arranged on the side surface of the flexible circuit board 402 facing the housing 510, which can play a role in shielding interference signals. Its material is not limited and can be an insulating material such as Mylar. The heat dissipation layer 403 is arranged on the side surface of the flexible circuit board 402 facing the screen 520 and is attached to the back side 5202 of the screen 520, which can play a role in heat dissipation. Its material is not limited and can be a metal material with good thermal conductivity such as graphite or aluminum, copper, etc., which is not limited in this application. The two sides of the flexible circuit board 402 are respectively covered with a shielding layer 401 and a heat dissipation layer 403, which is beneficial to improve the performance of the flexible circuit board module 40. In other alternative embodiments, the flexible circuit board module 40 may also include more stacked layers to achieve more functions, or fewer stacked layers to reduce the thickness, which is not limited in the present application.

[0088] like Figure 5 , Figure 8a-8b As shown, the electronic device 50 includes a first speaker module 10, and the first speaker module 10 is located in the accommodating cavity 530. The first speaker module 10 includes a first structural shell 12, and a first speaker 11 installed in the first structural shell 12. Among them, on a plane perpendicular to the first direction F1, the area where the first speaker 11 in the first speaker module 10 is located is the first speaker area. The first speaker area can also be understood as the area where the projection of the first speaker 11 on the plane perpendicular to the first direction F1 is located.

[0089] The first structural shell 12 is fixedly connected to the housing 510 of the electronic device 50, so as to fix the first speaker 11 to the housing 510 of the electronic device 50 through the first structural shell 12. The first structural shell 12 and the housing 510 can be an integral structure or a split structure, which is not limited in the present application. In one embodiment, the first structural shell 12 and the housing 510 are an integral structure. In other alternative embodiments, the first structural shell 12 and the housing 510 can also be a split structure, and then the first structural shell 12 and the housing 510 are fixedly connected by bonding, welding, riveting, etc.

[0090] like Figure 5 , Figure 7-8bAs shown, the flexible circuit board module 40 is provided with an avoidance hole 41, which extends along a first direction F1 from a side surface of the flexible circuit board module 40 away from the screen 520 toward another side surface opposite to the side surface, that is, the avoidance hole 41 extends from the shielding layer 401 toward the heat dissipation layer 403. The avoidance hole 41 at least covers the first speaker area of ​​the first speaker module 10.

[0091] The electronic device 50 provided in the embodiment of the present application includes a flexible circuit board module 40 and a first speaker module 10 disposed in a receiving cavity 530. The number of the first speaker modules 10 is not limited, and may be 1, 2, etc., and the present application does not limit this. In one embodiment, the number of the first speaker module 10 is 1. The flexible circuit board module 40 is covered on the back 5202 of the screen 520, the first structural shell 12 in the first speaker module 10 is installed on the housing 510 of the electronic device 50, and the first speaker 11 is installed on the first structural shell 12. The flexible circuit board module 40 is provided with an avoidance hole 41, and the avoidance hole 41 extends from a side surface of the flexible circuit board module 40 away from the screen 520 toward the other side surface along the first direction F1, that is, from a side surface facing the first speaker module 10 toward the other side surface, wherein the first direction F1 is the thickness direction of the electronic device 50. Moreover, on a plane perpendicular to the first direction F1, the avoidance hole 41 at least covers the area of ​​the first speaker 11. It can be understood that the first speaker 11 and the avoidance hole 41 are arranged correspondingly in the thickness direction of the electronic device 50, so that the space within the avoidance hole 41 can be used as a part of the installation space of the first speaker 11 (the installation space can be understood as the sum of the size of the first speaker 11 itself and the safety distance between the first speaker 11 and other structures), thereby reducing the total size occupied by the first speaker 11 in the first direction F1 and further reducing the thickness of the electronic device 50.

[0092] Therefore, the electronic device 50 provided in the present application can reduce the space occupied by the speaker and the circuit board in the thickness direction of the electronic device 50 , thereby achieving a lighter and thinner electronic device 50 .

[0093] like Figure 8a As shown, in one embodiment, the avoidance hole 41 penetrates the flexible circuit board module 40. It can be understood that the avoidance hole 41 sequentially penetrates the shielding layer 401, the flexible circuit board 402 and the heat dissipation layer 403 along the first direction F1. The avoidance hole 41 penetrates the flexible circuit board module 40, so that the flexible circuit board module 40 can avoid the first speaker 11 to the greatest extent and reduce the thickness of the electronic device 50 as much as possible. In other alternative embodiments, the avoidance hole 41 may not penetrate the flexible circuit board module 40, for example, a groove is formed on the side facing the first speaker module 10, and the present application does not limit this.

[0094] like Figure 5As shown, in one embodiment, the avoidance holes 41 and the screen driver chips 60 are staggered in the circumferential direction of the electronic device 50, and the circumferential direction of the electronic device 50 can be understood as a direction perpendicular to the first direction F1. It can be understood by those skilled in the art that some connecting wires are provided on the flexible circuit board module 40 to realize the electrical connection between the screen driver chip 60 and the electronic components provided on the flexible circuit board module 40. The avoidance holes 41 and the screen driver chip 60 are staggered in the circumferential direction of the electronic device, and the connecting wires on the flexible circuit board module 40 can bypass the avoidance holes 41 along the outer periphery of the avoidance holes 41, so as to ensure that the electrical connection between the screen driver chip 60 and the electronic components on the flexible circuit board module 40 is more reliable.

[0095] like Figure 5 As shown, in one embodiment, the avoidance hole 41 is arranged between the two screen driver chips 60 in the width direction Y of the electronic device. In the width direction Y of the electronic device, the distance between the two screen driver chips 60 is larger than the distance between each screen driver chip 60 and the long side of the electronic device 50, and the first speaker 11 is arranged corresponding to the avoidance hole 41. Arranging the avoidance hole 41 between the two screen driver chips 60 is conducive to leaving enough installation space for the first speaker 11. In addition, in the width direction Y of the electronic device, the first speaker module 10 is arranged at the center position rather than the edge, so that the sound effect is more uniform. In other alternative embodiments, in the circumference of the electronic device 50, the avoidance hole 41 and the first speaker 11 corresponding to the avoidance hole 41 can also be arranged at other positions that do not affect the connection wiring on the flexible circuit board module 40, and the present application is not limited to this.

[0096] Those skilled in the art can understand that, as long as the avoidance hole 41 is provided on the flexible circuit board module 40, the first speaker 11 can be avoided to a certain extent, and the total thickness of the first speaker 11 and the flexible circuit board module 40 can be reduced. The present application does not limit the specific structure of the first speaker 11, how to install it in the electronic device 50, and how to cooperate with the first structural shell 12. The following is an example of possible structures with reference to the accompanying drawings.

[0097] like Figure 8a As shown, in one embodiment, the first speaker 11 includes a fixed bracket 111, a vibrating member 112, a voice coil 113 and a magnetic circuit system 114. The voice coil 113 is fixedly connected to the vibrating member 112. A coil is arranged inside the voice coil 113. When current is passed through the voice coil 113, the magnetic field generated by the voice coil 113 interacts with the magnetic field of the magnetic circuit system 114, so that the voice coil 113 can move up and down in the first direction F1, and drive the vibrating member 112 to vibrate back and forth in the first direction F1.

[0098] Those skilled in the art will appreciate that the specific structure of the vibration member 112 is not limited. In one embodiment, the vibration member 112 includes a diaphragm and a dome disposed on the diaphragm. The outer peripheral edge of the diaphragm is connected to the fixed bracket 111 via a folded ear structure, and the diaphragm is fixedly connected to the voice coil 113.

[0099] Those skilled in the art can understand that the structure of the magnetic circuit system 114 is not limited. In one embodiment, the magnetic circuit system 114 may include a central magnet 1141, a magnetic bowl 1142, and a magnetic conductive plate 1143. The magnetic bowl 1142 is arranged around the periphery of the central magnet 1141 and forms an annular gap with the central magnet 1141. The voice coil 113 is arranged between the gap between the central magnet 1141 and the magnetic bowl 1142. The magnetic conductive plate 1143 is arranged on the side of the central magnet 1141 away from the magnetic bowl 1142 and is fixedly connected to the central magnet 1141.

[0100] The vibrating member 112 and the magnetic circuit system 114 are both fixedly connected to the fixed bracket 111, and the fixed bracket 111 is fixedly connected to the first structural shell 12, that is, the first speaker 11 is installed on the first structural shell 12 through the fixed bracket 111, and further, is installed on the housing 510 of the electronic device 50. It should be noted that the fixing method of the fixed bracket 111 and the first structural shell 12 is not limited. In one embodiment, the fixed bracket 111 and the first structural shell 12 are an integrated structure. In an alternative embodiment, the two can also be split structures, and then the two are fixedly connected by bonding, welding, etc., and the present application does not limit this. The position of the connection between the fixed bracket 111 and the first structural shell 12 is not limited. In one embodiment, the fixed bracket 111 is annular and fixedly connected to the inner wall surface of the first structural shell 12.

[0101] like Figure 8a As shown, in one embodiment, in the first direction F1, the voice coil 113 is installed on the first side 1121 of the vibrator 112, and the second side 1122 of the vibrator 112 is arranged toward the screen 520, wherein the first side 1121 and the second side 1122 of the vibrator 112 are arranged opposite to each other. It can be understood that the vibrator 112 is arranged between the voice coil 113 and the screen 520 in the first direction F1, that is, the vibrator 112 is arranged toward the avoidance hole 41. In addition, the area of ​​the first structural shell 12 arranged toward the second side 1122 of the vibrator 112 is arranged as a hollow structure to prevent interference with the vibration of the vibrator 112.

[0102] Those skilled in the art will appreciate that, in the first direction, the vibration member 112 of the first speaker 11 requires sufficient space to allow the vibration member 112 to vibrate and allow air to flow through. In one example, the space required for the vibration member 112 to vibrate in the first direction F1 is 0.9 mm (including an amplitude of 0.5 mm and an airflow gap of 0.4 mm).

[0103] In addition, since the vibrating member 112 is connected to the fixed bracket 111, when the vibrating member 112 vibrates, the fixed bracket 111 will produce slight vibrations. In order to prevent damage to the screen 520, the first speaker 11 as a whole needs to maintain a certain safety distance from the components above it to prevent collision and protect the screen. It can be understood that the component above the first speaker 11 is the flexible circuit board module 40, or, when the avoidance hole 41 digs through the flexible circuit board module 40, the component above the first speaker 11 is the screen 520. The safety distance between the first speaker 11 and the component above it is usually 0.3mm. With the solution that the vibrating member 112 is set toward the avoidance hole 41, the 0.3mm safety distance that needs to be maintained between the first speaker 11 and the screen 520 is contained within the 0.9mm vibration space required by the vibrating member 112. Figure 8a As shown, taking the scenario where the avoidance hole 41 passes through the flexible circuit board module 40 as an example, d represents the static size of the first speaker 11, the distance between the first speaker 11 and the screen 520 is 0.9 mm, and the minimum thickness of the first speaker 11 and the flexible circuit board module 40 is (d+0.9) mm. Figure 3 Compared with the structure in , it is reduced by 0.65 mm, which reduces the space occupied by the first speaker module 10 in the first direction F1, so that the electronic device 50 can be further thinned.

[0104] In one embodiment, the first structural shell 12 is hollowed out along the first direction F1 on one side of the housing 510 of the electronic device 50, and the magnetic bowl 1142 is kept at a distance of 0.05 mm from the housing 520 of the electronic device 50, so that when the first speaker 11 vibrates, the user does not feel the vibration when holding the electronic device 50, thereby improving the user's experience. In other alternative embodiments, the side of the first structural shell 12 facing the housing 510 of the electronic device 50 may not be hollowed out, and this application does not limit this.

[0105] It should be noted that the vibration member 112 of the first speaker 11 may not be arranged toward the avoidance hole 41, and this application does not limit this. Figure 8bAs shown, in an alternative embodiment, in the first direction F1, the vibrator 112 is disposed between the voice coil 113 and the housing 520, that is, the vibrator 112 is disposed toward the housing 510. At this time, a vibration space of 0.9 mm needs to be maintained between the vibrator 112 and the housing 510, and a safety distance of 0.3 mm needs to be maintained between the first speaker 11 and the flexible circuit board module 40 above it. Taking the scenario in which the avoidance hole 41 passes through the flexible circuit board module 40 as an example, the thickness of the flexible circuit board module 40 is 0.35 mm, and a part of the structure of the first speaker module 10 can be disposed in the avoidance hole 41. The first speaker 11 and the screen 520 are spaced at a safety distance of 0.3 mm. Then, the minimum total thickness of the first speaker 11 and the flexible circuit board module 40 is d+0.3+0.9=(1.2+d) mm, compared to Figure 3 Compared with the structure in the figure, it is reduced by 0.35mm.

[0106] like Figure 8a As shown, in one embodiment, the portion of the first structural shell 12 surrounding the outer periphery of the vibrating member 112 passes through the avoidance hole 41 of the flexible circuit board module 40 and contacts the back side 5202 of the screen 520, and the second side 1122 of the vibrating member 112, the back side 5202 of the screen 520 and the first structural shell 12 surround and form a front sound cavity 13, and the first structural shell 12 has a sound guide channel 121, and the front sound cavity 13 is connected to the outside of the first structural shell 12 through the sound guide channel 121. With this structure, the distance between the first structural shell 12 and the screen 520 is the shortest, which saves the installation space of the first speaker module 10 in the first direction F1 to the maximum extent. In addition, the front sound cavity 13 formed by the vibrating member 112 and the screen 520 is connected to the outside of the first structural shell 12 through the sound guide channel 121, ensuring that the vibrating member 112 can vibrate and sound and the sound can be transmitted.

[0107] like Figure 5As shown, in one embodiment, the electronic device 50 also includes a second speaker module 20 disposed in the accommodating cavity 530. The number of the second speaker modules 20 is not limited, and can be 1, 2, etc. In one embodiment, the electronic device 50 includes 1 second speaker module 20. The second speaker module 20 includes a second structural shell 22 and a second speaker 21 installed on the second structural shell 22, and the second structural shell 22 is installed on the housing 510. The second structural shell 22 and the housing 510 can be an integrated structure or a split structure, which is not limited in this application. On a plane perpendicular to the first direction F1, the projections of the second speaker module 20 and the flexible circuit board module 40 do not overlap. The second speaker module 20 is provided so that the volume of the electronic device 50 can be louder and the stereo effect is better. The projections of the second speaker module 20 and the flexible circuit board module 40 do not overlap, which can be understood as the second speaker module 20 and the flexible circuit board module 40 are staggered, that is, the second speaker module 20 and the flexible circuit board module 40 are not stacked in the first direction F1, thereby avoiding the problem of a larger thickness of the electronic device 50 caused by the stacking of the flexible circuit board module 40 and the second speaker module 20.

[0108] In one embodiment, the first speaker module 10 and the second speaker module 20 are spaced apart in the length direction X of the electronic device, and the audio range of the first speaker 11 and the second speaker 21 are the same. It should be noted that the audio range of the first speaker 11 and the second speaker 21 is not limited. In one embodiment, the audio range of the first speaker 11 and the second speaker 21 is less than 3000 Hz. It can be understood that the first speaker 11 and the second speaker 21 within this audio range are both low-frequency speakers, which meet the requirements of the electronic device 50 for low-frequency sound effects. Figure 5 As shown, in one embodiment, the second speaker module 20 is close to the short side of the electronic device 50 where the screen driver chip 60 is not provided, that is, the second speaker module 20 and the first speaker module 10 are arranged at intervals in the length direction of the electronic device 50, so that the electronic device 50 outputs sound more uniformly, improving the user experience. In other alternative embodiments, the first speaker 11 and the second speaker 21 can be speakers with different audio ranges, and the second speaker 21 may not be arranged near the short side, and this application is not limited to this.

[0109] like Figure 5As shown, in one embodiment, the electronic device 50 further includes a third speaker module 30 disposed in the accommodating cavity 530. The number of the third speaker modules 30 is not limited, and may be 1, 2, etc. In one embodiment, two third speaker modules 30 are disposed in the accommodating cavity 530. Each third speaker module 30 includes a third structural shell 32 and a third speaker 31 mounted on the third structural shell, and the third structural shell 32 is mounted on the housing 510. The audio range of the third speaker 31 is not limited. In one embodiment, the audio range of the third speaker 31 is greater than the audio range of the first speaker 11, that is, greater than 3000 Hz. It can be understood that the third speaker 31 is a high-frequency speaker, which can be used as a supplement to the first speaker 11 and the second speaker 21, so that the high-frequency effect of the electronic device 50 is better. In addition, as a high-frequency speaker, the amplitude of the third speaker 31 is small, only 0.1 mm is required, and the space required in the first direction F1 is small, so the thickness of the electronic device 50 will not be increased.

[0110] It should be noted that the positions of the two third speaker modules 30 are not limited. In one embodiment, the two third speaker modules 30 are relatively spaced apart along the length direction X of the electronic device, respectively close to the two short sides of the electronic device 50. In the width direction Y of the electronic device, the two third speaker modules 30 are arranged on one side of the avoidance hole 41, that is, on one side of the first speaker module 10. It can be understood by those skilled in the art that the two third speaker modules 30 are spaced apart, and the first speaker module 10 and the second speaker module 20 are spaced apart, so that the sound can be transmitted at multiple angles, the sound quality is clear, and the sound effect is better.

[0111] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An electronic device, comprising a housing, a screen and a first speaker module, wherein the screen is mounted on the housing and surrounds the housing to form a receiving cavity, the first speaker module is located in the receiving cavity and comprises a first structural shell and a first speaker mounted in the first structural shell, the first structural shell is mounted on the housing, wherein: On a plane perpendicular to the first direction, the area where the first speaker in the first speaker module is located is a first speaker area, which is characterized by: The electronic device also includes a flexible circuit board module covering the back of the screen and electrically connected to the screen, the flexible circuit board module being provided with an avoidance hole, the avoidance hole extending along the first direction from a side surface of the flexible circuit board module away from the screen toward another side surface opposite to the one side surface, the avoidance hole at least covering the first speaker area of ​​the first speaker module.

2. The electronic device according to claim 1, wherein: The avoidance hole passes through the flexible circuit board module.

3. The electronic device according to claim 1, wherein: The screen includes a functional layer, the functional layer includes a first glass substrate, the electronic device includes at least one screen driver chip, the at least one screen driver chip is arranged on the side edge portion of the first glass substrate of the screen and is electrically connected to the flexible circuit board module, and in the circumferential direction of the electronic device, the avoidance hole and the at least one screen driver chip are staggered.

4. The electronic device according to claim 3, characterized in that: The at least one screen driving chip is two screen driving chips, the two screen driving chips are arranged relatively spaced apart along the width direction of the electronic device, and the avoidance hole is arranged between the two screen driving chips in the width direction of the electronic device.

5. The electronic device according to claim 1, wherein: The first speaker includes a fixed bracket, a vibrator and a voice coil, the fixed bracket is installed on the first structural shell, the outer peripheral edge of the vibrator is connected to the fixed bracket, the voice coil is installed on a first side of the vibrator, in the first direction, the second side of the vibrator is arranged toward the screen, and the area of ​​the first structural shell facing the second side of the vibrator is arranged as a hollow structure; wherein the first side of the vibrator is arranged opposite to the second side.

6. The electronic device according to claim 5, characterized in that: The portion of the first structural shell surrounding the outer periphery of the vibration member passes through the avoidance hole of the flexible circuit board module and contacts the back of the screen, and a front sound cavity is formed around the second side of the vibration member, the back of the screen and the first structural shell. The first structural shell has a sound guide channel, through which the front sound cavity is connected to the outside of the first structural shell.

7. The electronic device according to claim 1, wherein: The electronic device further comprises a second speaker module disposed in the accommodating cavity, the second speaker module comprising a second structural shell and a second speaker mounted on the second structural shell, and the second structural shell is mounted on the housing; On a plane perpendicular to the first direction, projections of the second speaker module and the flexible circuit board module do not overlap.

8. The electronic device according to claim 7, characterized in that: The first speaker module and the second speaker module are spaced apart in the length direction of the electronic device; The first speaker and the second speaker have the same audio frequency range.

9. The electronic device according to claim 1, wherein: The electronic device further comprises at least one third speaker module disposed in the accommodating cavity, wherein each of the at least one third speaker module comprises a third structural shell and a third speaker mounted on the third structural shell, and the third structural shell is mounted on the housing; The audio range of the third speaker is greater than the audio range of the first speaker.

10. The electronic device according to claim 9, characterized in that: The at least one third speaker module is two third speaker modules, and the two third speaker modules are arranged relatively spaced apart along the length direction of the electronic device; In the width direction of the electronic device, the two third speaker modules are arranged on one side of the avoidance hole.

11. The electronic device according to claim 1, wherein: The flexible circuit board module includes a shielding layer, a flexible circuit board and a heat dissipation layer which are sequentially stacked in the first direction, wherein the flexible circuit board is electrically connected to the screen driving chip.

12. The electronic device according to any one of claims 1 to 11, characterized in that: The electronic device is a tablet computer.

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