Novel high-performance honeycomb radiator

Abstract

The utility model discloses a novel high performance honeycomb radiator, relates to electronic device technical field, including VC vapor chamber and honeycomb fin, the VC vapor chamber is used for conducting the heat generated by electronic device, the honeycomb fin is fixed on the upper condensation surface of VC vapor chamber, on the honeycomb fin is equidistantly equipped with a plurality of honeycomb pore canals, and the honeycomb pore canals are fixed on the upper condensation surface of VC vapor chamber. Cold air is blown into the multiple sets of honeycomb-shaped hole channels to rapidly take away heat, the honeycomb fins are formed by connecting multiple sets of fin sets end to end, each set of fin set is composed of a semi-hexagonal left fin and a semi-hexagonal right fin which are symmetrically connected, and heat generated by the electronic device is guided to the honeycomb fins through the VC temperature equalizing plate; and then the heat is taken away through cold air blowing through the honeycomb fins, the heat dissipation effect is achieved, the heat dissipation area of the structures of the semi-hexagonal left fins and the semi-hexagonal right fins is utilized to the maximum degree, tiny dust is not prone to gathering, and the good dustproof effect can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a novel high-performance honeycomb radiator. Background Art

[0002] In recent years, as the heat density of electronic devices has gradually increased, the demand for heat dissipation has increased, and the requirements for the heat dissipation environment of the power supply configured on ICT equipment such as communications or servers have been improved, and the requirements for the heat dissipation function of the radiator have also become higher and higher; due to the inherent limitations of the product structure;

[0003] Traditional electronic radiators are mainly fin-shaped radiators with low heat dissipation efficiency and high noise. Therefore, we have proposed a new type of high-performance honeycomb radiator. By utilizing bionics and imitating the honeycomb cross-sectional structure, it is suitable for use in the heat dissipation structure of the power supply heat dissipation environment configured on ICT equipment such as communications or servers. It can greatly increase the heat exchange area, reduce noise, improve and stabilize product performance, and extend product service life. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a novel high-performance honeycomb radiator, which solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a new high-performance honeycomb radiator, including:

[0006] VC temperature averaging plate, the VC temperature averaging plate is used to conduct the heat generated by the electronic device;

[0007] Honeycomb fins are fixed on the upper condensing surface of the VC temperature equalizing plate. A plurality of groups of honeycomb holes are arranged at equal intervals on the honeycomb fins, and the cold wind blows through the plurality of honeycomb holes to quickly take away the heat. The honeycomb fins are composed of a plurality of fin groups connected end to end, and each group of the fin groups is composed of a symmetrically connected semi-hexagonal left fin and a semi-hexagonal right fin.

[0008] Furthermore, the honeycomb radiator further comprises:

[0009] The reinforcing bracket is fixed to the lower part of the VC temperature equalizing plate and has a matching size.

[0010] Furthermore, the honeycomb radiator further comprises:

[0011] A central groove, wherein the central groove is provided in the middle of the reinforcing bracket, and the lower evaporation surface of the VC temperature homogenizing plate passes through the central groove;

[0012] The edge grooves are arranged at the two end edges of the reinforcing bracket and are distributed in a rectangular shape.

[0013] Furthermore, the honeycomb radiator further comprises:

[0014] The number of the fixed components is four, and the four groups of the fixed components are installed at the two end edges of the VC temperature homogenizing plate and are distributed in a rectangular shape.

[0015] Further, the fixing assembly comprises:

[0016] Screws, the screws are movable at the edge of the VC temperature homogenizing plate and correspond to the position of the edge groove;

[0017] An annular groove, the annular groove is provided on the outer surface of the screw;

[0018] A gasket, which is installed inside the ring groove and is located below the VC temperature plate;

[0019] A spring is secured to the outside of the screw and washer.

[0020] Furthermore, the fixing assembly further comprises:

[0021] The clamping ring is clamped in the inner part of the ring groove and is located below the gasket.

[0022] Compared with the above-mentioned background technology, the new high-performance honeycomb radiator provided in the present application includes a VC temperature equalizing plate and honeycomb fins. The honeycomb fin structure has good specific stiffness and specific strength, and at the same time it has good unidirectional flowability. It adopts a heat dissipation structure with honeycomb upper and lower through holes. By utilizing the fusion of the VC temperature equalizing plate structure and the honeycomb aluminum structure, the heat dissipation area is greatly increased, and the heat generated by the heat source is quickly transferred to the honeycomb copper heat sink. The air flow is enhanced by taking advantage of the structural advantages, and the vertical channels are used to increase the convection intensity and increase the heat exchange area. The hot air can be quickly dissipated through the through holes, and the heat generated by the heat source is quickly dissipated to the surrounding environment through the honeycomb heat sink, so as to improve the heat dissipation efficiency and reduce noise.

[0023] The utility model provides a new high-performance honeycomb radiator. Compared with the prior art, it has the following beneficial effects:

[0024] The new high-performance honeycomb radiator introduces the heat generated by electronic devices into the honeycomb fins through the VC temperature equalizer; then the heat is taken away by blowing cold air through the honeycomb fins to achieve the heat dissipation effect. The structural heat dissipation area of ​​the semi-hexagonal left fin and the semi-hexagonal right fin is maximized, and dust is not easy to gather, which can have a good dust-proof effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a new high-performance honeycomb radiator;

[0026] Figure 2This is a schematic diagram of the bottom structure of a new high-performance honeycomb radiator;

[0027] Figure 3 This is a schematic diagram of the disassembled structure of a new high-performance honeycomb radiator;

[0028] Figure 4 This is a schematic diagram of the split structure of the honeycomb fins in the new high-performance honeycomb radiator;

[0029] Figure 5 This is a schematic diagram of the structure of the reinforcement bracket in the new high-performance honeycomb radiator;

[0030] Figure 6 Schematic diagram of the split structure of the fixed components in the new high-performance honeycomb radiator.

[0031] In the figure: 1. VC temperature equalizing plate; 2. honeycomb fin; 21. fin group; 211. semi-hexagonal left fin; 212. semi-hexagonal right fin; 3. honeycomb channel; 4. reinforcing bracket; 41. center groove; 42. edge groove; 5. fixing assembly; 51. screw; 52. ring groove; 53. washer; 54. spring; 55. retaining ring. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1-6 The utility model provides a new high-performance honeycomb radiator technical solution: the new high-performance honeycomb radiator includes a VC temperature averaging plate 1, a honeycomb fin 2, a plurality of honeycomb channels 3, a reinforcing bracket 4 and a plurality of fixing components 5.

[0034] Specifically, the VC temperature averaging plate 1 is a known technology. When the evaporation surface boss of the VC temperature averaging plate 1 encounters heat, the liquid heat transfer medium inside the copper powder capillary absorbs heat and vaporizes into steam. Under the action of the internal steam pressure difference, the heat is transferred to the condensation surface of the VC temperature averaging plate 1 to conduct the heat generated by the electronic device.

[0035] The honeycomb fins 2 are fixed on the upper condensing surface of the VC temperature equalizing plate 1. A plurality of groups of honeycomb channels 3 are arranged at equal intervals on the honeycomb fins 2. Cold air blows through the plurality of honeycomb channels 3 in a vertical direction, fully passes through the gaps between the honeycombs, and quickly takes away the heat. The hot air can quickly pass through and dissipate, and the heat generated by the heat source is quickly dissipated to the surrounding environment through the honeycomb fins 2. The honeycomb fins 2 are composed of a plurality of fin groups 21 connected end to end, and each fin group 21 is composed of a symmetrically connected semi-hexagonal left fin 211 and a semi-hexagonal right fin 212. The structural heat dissipation area of ​​the semi-hexagonal left fin 211 and the semi-hexagonal right fin 212 is maximized, and dust is not easy to gather, which has a good dustproof effect, and can be arbitrarily cut into irregular shapes.

[0036] The reinforcing bracket 4 is fixed to the lower part of the VC temperature averaging plate 1 and has a matching size. A central groove 41 and an edge groove 42 are provided on the reinforcing bracket 4. The central groove 41 is provided in the middle position of the reinforcing bracket 4. The lower evaporation surface of the VC temperature averaging plate 1 passes through the central groove 41, so that the lower evaporation surface boss of the VC temperature averaging plate 1 is in contact with the heating end surface of the electronic device to facilitate heat conduction. The edge grooves 42 are provided at the two end edges of the reinforcing bracket 4 and are distributed in a rectangular shape.

[0037] There are four groups of fixing components 5 , which are installed at the two end edges of the VC temperature homogenizing plate 1 and are distributed in a rectangular shape. The four groups of fixing components 5 are used to fix the honeycomb radiator on the electronic device.

[0038] The fixing assembly 5 includes a screw 51, an annular groove 52, a washer 53, a spring 54 and a retaining ring 55. The screw 51 moves on the edge of the VC temperature equalizing plate 1 and corresponds to the position of the edge groove 42. The annular groove 52 is opened on the outer surface of the screw 51. The washer 53 is installed inside the annular groove 52 and is located below the VC temperature equalizing plate 1. The spring 54 is fixed to the outside of the screw 51 and the washer 53. The retaining ring 55 is engaged with the inside of the annular groove 52 and is located below the washer 53.

[0039] During the operation of the honeycomb radiator, electronic devices generate heat. The evaporation surface boss of the VC temperature equalizing plate 1 encounters the hot copper powder capillary, and the liquid heat transfer medium inside absorbs heat and vaporizes into steam. Under the action of the internal steam pressure difference, the heat is transferred to the condensation surface of the VC temperature equalizing plate 1, so that the heat is transferred to the honeycomb fins 2. The cold air blows through multiple groups of honeycomb channels 3 in a vertical direction, fully passes through the gaps between the honeycombs, and quickly takes away the heat. The hot air can quickly pass through and dissipate, and the heat generated by the heat source is quickly dissipated to the surrounding environment through the honeycomb fins 2. The steam with high latent heat in the VC temperature equalizing plate 1 will gradually change into liquid after releasing its own latent heat. The liquid medium flows back to the evaporation surface under the capillary force of the sintered copper powder to carry out the next round of heat transfer cycle, thereby completing a heat transfer process.

Claims

1. New high-performance honeycomb radiator, characterized by: include: A VC temperature averaging plate (1), wherein the VC temperature averaging plate (1) is used to conduct heat generated by electronic devices; A honeycomb fin (2), wherein the honeycomb fin (2) is fixed to the upper condensing surface of the VC temperature averaging plate (1), a plurality of groups of honeycomb holes (3) are arranged at equal intervals on the honeycomb fin (2), and cold air blows through the plurality of groups of honeycomb holes (3) to quickly take away heat, and the honeycomb fin (2) is composed of a plurality of groups of fin groups (21) connected end to end, and each group of the fin groups (21) is composed of a symmetrically connected semi-hexagonal left fin (211) and a semi-hexagonal right fin (212).

2. The novel high-performance honeycomb radiator according to claim 1 is characterized in that: Also includes: A reinforcing bracket (4), wherein the reinforcing bracket (4) is fixed to the lower part of the VC temperature averaging plate (1) and has a matching size.

3. The novel high-performance honeycomb radiator according to claim 1 is characterized in that: Also includes: A central groove (41), wherein the central groove (41) is provided at a middle position of the reinforcing bracket (4), and the lower evaporation surface of the VC temperature averaging plate (1) passes through the central groove (41); Edge grooves (42), the edge grooves (42) are provided at the edges of both ends of the reinforcing bracket (4) and are distributed in a rectangular shape.

4. The novel high-performance honeycomb radiator according to claim 1 is characterized in that: Also includes: The fixing components (5) are four in number, and the four groups of the fixing components (5) are installed at the two end edges of the VC temperature homogenizing plate (1) and are distributed in a rectangular shape.

5. The novel high-performance honeycomb radiator according to claim 4 is characterized in that: The fixing assembly (5) comprises: A screw (51), wherein the screw (51) is movable on the edge of the VC temperature homogenizing plate (1) and corresponds to the position of the edge groove (42); an annular groove (52), wherein the annular groove (52) is formed on the outer surface of the screw (51); A gasket (53), the gasket (53) being installed inside the annular groove (52) and located below the VC temperature equalizing plate (1); A spring (54) is fixed outside the screw (51) and the washer (53).

6. The novel high-performance honeycomb radiator according to claim 5 is characterized in that: The fixing assembly (5) further comprises: A clamping ring (55) is clamped inside the annular groove (52) and is located below the gasket (53).

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