PCB laminating machine

Abstract

The utility model discloses a PCB (Printed Circuit Board) laminating machine. Comprising a rack, a PCB conveying device arranged on the rack, and the following mechanisms which are arranged on the rack and sequentially surround the PCB conveying device: a feeding device for feeding a to-be-processed PCB, a burning device for burning the to-be-processed PCB, and a dispensing device for dispensing a component mounting position on the PCB, the attaching device is used for grabbing and attaching the components to the component mounting positions on the PCBs; and the discharging device is used for discharging the processed PCBs. According to the utility model, the to-be-processed PCBs are loaded on the PCB conveying device through the loading device, so that the PCBs can be sequentially conveyed to the burning device for burning, conveyed to the dispensing device for dispensing and conveyed to the laminating device for laminating with components; and finally, the discharging device is used for discharging the processed PCBs, so that full automation of PCB processing is realized, and the processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing equipment, in particular to a PCB laminating machine. Background Art

[0002] With the rapid development of science and technology today, PCB boards have become indispensable components of various equipment. In the production process of PCB boards, the PCB boards need to be burned, and then the corresponding components are attached to the corresponding positions to realize the preset functions of the PCB boards. However, most of the current production and processing of PCB boards are done manually, that is, the PCB boards are taken to the burning station manually for burning, and then the corresponding positions on the PCB boards are manually glued, and finally the components are manually attached to the corresponding positions. The entire process is basically done manually, which is extremely inefficient and prone to defective products, affecting the quality of the PCB boards. Utility Model Content

[0003] The utility model provides a PCB bonding machine to solve the technical problems raised in the background technology.

[0004] The utility model provides a PCB bonding machine, comprising a frame, a PCB board conveying device installed on the frame, and the following mechanisms installed on the frame and arranged around the PCB board conveying device in sequence: a loading device for loading a PCB board to be processed, a burning device for burning the PCB board to be processed, a glue dispensing device for dispensing glue on component mounting positions on the PCB board, a bonding device for grabbing and bonding components to the component mounting positions on the PCB board, and a unloading device for unloading a PCB board that has been processed.

[0005] Furthermore, the conveying device includes a conveying mechanism installed on the frame, the conveying mechanism includes a conveying frame and a conveyor belt installed on the conveying frame, a limiting mechanism is provided on the conveying frame at a position corresponding to the burning device, and / or a limiting mechanism is provided on the conveying frame at a position corresponding to the dispensing device, and / or a limiting mechanism is provided on the conveying frame at a position corresponding to the bonding device, and the limiting mechanism is used to limit the movement of the PCB board to facilitate the corresponding device to perform processing operations.

[0006] Furthermore, the conveyor belt is provided with a plurality of placement plates for placing PCB boards; the limiting mechanism comprises a mounting plate mounted on the conveying frame, a limiting power member mounted on the mounting plate and a limiting plate connected to the output end of the limiting power member; a positioning hole is provided on the placement plate, and a positioning member matching the positioning hole is provided on the limiting plate; the limiting mechanism also comprises a blocking assembly; the blocking assembly comprises a blocking power member mounted on the mounting plate, a blocking frame mounted on the blocking power member and a blocking member connected to the output end of the blocking power member and axially connected to the blocking frame, and a blocking wheel is axially connected to the blocking member.

[0007] Furthermore, the conveying mechanism has two, the two conveying mechanisms are arranged in parallel, the two conveying mechanisms are respectively a first conveying mechanism and a second conveying mechanism, the first end of the first conveying mechanism or the first end of the second conveying mechanism has a first inter-belt transfer mechanism for pushing the placement plate on the first conveying mechanism to the second conveying mechanism, the second end of the first conveying mechanism or the second end of the second conveying mechanism has a second inter-belt transfer mechanism for pushing the placement plate on the second conveying mechanism to the first conveying mechanism; the first inter-belt transfer mechanism and the second inter-belt transfer mechanism both include a transfer guide rail installed on the conveying frame, a transfer base slidably installed on the transfer guide rail, a transfer power member for driving the transfer base to move in a directional manner on the transfer guide rail, and a pushing plate connected to the transfer base for pushing the placement plate to move.

[0008] Furthermore, the burning device comprises a burning rack mounted on the frame, a burning guide rail mounted on the burning rack, a burning base slidably mounted on the burning guide rail, and a burning plate detachably mounted on the burning base.

[0009] Furthermore, the dispensing device includes a dispensing frame installed on the frame, a dispensing lateral drive group installed on the dispensing frame, a dispensing vertical drive group installed on the dispensing lateral drive group, a dispensing longitudinal drive group installed on the dispensing vertical drive group, and a dispensing head installed on the dispensing longitudinal drive group.

[0010] Furthermore, the dispensing transverse drive group includes a dispensing transverse guide rail installed on the dispensing frame, a dispensing transverse base slidably installed on the dispensing transverse guide rail, and a dispensing transverse power member for driving the dispensing transverse base to move in a directional manner on the dispensing transverse guide rail.

[0011] Furthermore, the dispensing vertical drive group includes a dispensing vertical guide rail installed on the dispensing horizontal base, a dispensing vertical base slidably installed on the dispensing vertical guide rail, and a dispensing conveying power member for driving the dispensing vertical base to move in a directional manner on the dispensing vertical guide rail.

[0012] Furthermore, the dispensing longitudinal drive group includes a dispensing longitudinal guide rail installed on the dispensing vertical base, a dispensing longitudinal base slidably installed on the dispensing longitudinal guide rail, and a dispensing longitudinal power member for driving the dispensing longitudinal base to move directional on the dispensing longitudinal guide rail; the dispensing head is installed on the dispensing longitudinal base.

[0013] Furthermore, the bonding device includes a component vibration loading bin installed on the frame, a vibration plate located at the outlet of the component vibration loading bin, a detection mechanism for detecting the speed of light toward the vibration plate, and a bonding mechanism for sucking components from the vibration plate to bond them to the PCB board; the detection mechanism includes a detection frame installed on the frame and a detection CCD installed on the detection frame.

[0014] Furthermore, the bonding mechanism includes a bonding frame installed on the frame, a robotic arm installed on the bonding frame, and a bonding assembly installed on the robotic arm; the bonding assembly includes a bonding plate installed on the robotic arm, a bonding motor installed on the bonding plate, and a component adsorption piece connected to the output end of the bonding motor.

[0015] Furthermore, the loading device and the unloading device are respectively installed at both ends of the conveying device in the length direction, and the loading device and the unloading device both include a material bin for placing PCB boards and a plate suction mechanism for sucking PCB boards; the material bin is provided with a plurality of card slots for clamping PCB boards; the plate suction mechanism includes a plate suction frame installed on the frame, a plate suction transverse drive group installed on the plate suction frame, a plate suction longitudinal drive group installed on the plate suction transverse drive group, a steering drive group installed on the plate suction longitudinal drive group, and a suction plate installed on the steering drive group.

[0016] Furthermore, the suction plate transverse driving group includes a suction plate transverse guide rail installed on the suction plate frame, a suction plate transverse base slidably installed on the suction plate transverse guide rail, and a suction plate transverse power member for driving the suction plate transverse base to move directional on the suction plate transverse guide rail.

[0017] Furthermore, the steering drive group includes a steering power component mounted on the longitudinal base of the suction plate and a steering plate connected to the output end of the steering power component; the suction disk is mounted on the steering plate.

[0018] Furthermore, the loading device and the unloading device also include a material rack, a feeding belt installed on the material rack, and an adsorption limit assembly installed on the material rack at a position corresponding to the suction plate mechanism; a locking hole is provided on the material bin; the adsorption limit assembly includes an adsorption limit power component installed on the material rack and a locking component connected to the output end of the adsorption limit power component.

[0019] The beneficial effect of the utility model is as follows: the utility model loads the PCB board to be processed onto the PCB board conveying device through the loading device, so that the PCB board can be sequentially conveyed to the burning device for burning, conveyed to the glue dispensing device for glue dispensing and conveyed to the bonding device for bonding with components, and finally the unloading device unloads the processed PCB board, thereby realizing full automation of PCB board processing and improving processing efficiency. Specifically, the conveying frame of the conveying mechanism is provided with the limiting mechanism at the position corresponding to the burning device, the glue dispensing device and the bonding device, so that the PCB board can be limited at the position when it reaches the corresponding working position under the conveyance of the conveyor belt, thereby facilitating the processing of the corresponding device and improving the processing yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of the PCB bonding machine of the utility model.

[0021] Figure 2 The utility model is a three-dimensional diagram of the PCB bonding machine without the loading device and the unloading device.

[0022] Figure 3 It is a three-dimensional diagram of the PCB board conveying device of the PCB bonding machine of the utility model.

[0023] Figure 4 It is a stereoscopic diagram of the loading device or unloading device of the utility model.

[0024] Figure 5 The utility model is a three-dimensional diagram of a loading device or a unloading device without a suction plate mechanism.

[0025] Figure 6 It is a three-dimensional diagram of the suction plate mechanism of the utility model.

[0026] Figure 7 It is a three-dimensional diagram of the silo of the utility model.

[0027] Figure 8 It is a three-dimensional diagram of the laminating device of the utility model.

[0028] Fig. 9 It is a three-dimensional diagram of the laminating mechanism of the utility model.

[0029] Fig.10 It is a stereoscopic diagram of the glue dispensing device of the utility model.

[0030] Fig.11 It is a three-dimensional diagram of the limiting mechanism of the utility model.

[0031] Fig.12 It is a stereoscopic diagram of the first inter-belt transfer mechanism or the second inter-belt transfer mechanism of the utility model.

[0032] Fig.13 It is a three-dimensional diagram of the placement plate of the utility model.

[0033] Fig.14 It is a three-dimensional diagram of the burning device of the present utility model. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0035] The following is a specific implementation method combined with the attached Figure 1-14 The utility model is described in further detail.

[0036] The utility model provides a PCB bonding machine, comprising a frame 1, a PCB board conveying device 2 installed on the frame 1, and the following mechanisms installed on the frame 1 and arranged around the PCB board conveying device 2 in sequence: a loading device 3 for loading a PCB board to be processed, a burning device for burning the PCB board to be processed, a glue dispensing device 5 for dispensing glue on component mounting positions on the PCB board, a bonding device 6 for grabbing and bonding components to component mounting positions on the PCB board, and a unloading device 7 for unloading a PCB board that has been processed.

[0037] In this embodiment, the PCB board to be processed is loaded onto the PCB board conveying device 2 through the loading device 3, so that the PCB board can be sequentially conveyed to the burning device for burning, conveyed to the dispensing device 5 for dispensing, and conveyed to the bonding device 6 for bonding with components, and finally the unloading device 7 realizes the unloading of the processed PCB board, thereby realizing full automation of PCB board processing and improving processing efficiency.

[0038] In a specific embodiment, Figure 3As shown, the conveying device includes a conveying mechanism installed on the frame 1, and the conveying mechanism includes a conveying frame 22 and a conveyor belt 212 installed on the conveying frame 22. A limiting mechanism 23 is provided on the conveying frame 22 at a position corresponding to the burning device, and / or a limiting mechanism 23 is provided on the conveying frame 22 at a position corresponding to the dispensing device 5, and / or a limiting mechanism 23 is provided on the conveying frame 22 at a position corresponding to the bonding device 6. The limiting mechanism 23 is used to limit the movement of the PCB board to facilitate the corresponding device to perform processing operations. Preferably, the conveying frame 22 is provided with the limiting mechanism 23 at positions corresponding to the dispensing device 5, the burning device and the bonding device 6, so that the PCB board can be limited at the position when it reaches the corresponding working position under the transportation of the conveyor belt 212, thereby facilitating the corresponding device to perform processing and improving the processing yield.

[0039] In a specific embodiment, the conveyor belt 212 is provided with a plurality of placement plates 8 for placing PCB boards; the limiting mechanism 23 includes a mounting plate 231 mounted on the conveyor frame 22, a limiting power member 232 mounted on the mounting plate 231, and a limiting plate 233 connected to the output end of the limiting power member 232; the placement plate 8 is provided with a positioning hole 81, and the limiting plate 233 is provided with a positioning member 234 that cooperates with the positioning hole 81; taking the limiting mechanism 23 corresponding to the burning device as an example, when the placement plate on which the PCB board to be processed is placed When 8 is transported to the position of the burning device by the conveyor belt 212, the limiting power member 232 drives the positioning plate to drive the positioning member 234 to be inserted into the positioning hole 81 on the placement plate 8, thereby limiting the movement of the placement plate 8, so that the burning device can perform the burning operation on the PCB board. Specifically, there are multiple positioning holes 81 on the placement plate 8, and they are arranged around the placement plate 8. Correspondingly, there are also multiple positioning members 234, and they are arranged around the limiting plate 233, so as to limit the movement of the placement plate 8.

[0040] In a specific embodiment, Fig.13 As shown, the placement plate 8 is provided with a plurality of raised columns 82, and the PCB board has a plurality of column holes that cooperate with the raised columns 82, so that the PCB board can be restricted on the placement plate 8 to achieve smooth transportation of the PCB board.

[0041] In a specific embodiment, Fig.11As shown, the limiting mechanism 23 also includes a blocking component; the blocking component includes a blocking power member 235 installed on the mounting plate 231, a blocking frame 236 installed on the blocking power member 235, and a blocking member 237 connected to the output end of the blocking power member 235 and axially connected to the blocking frame 236, and a blocking wheel 238 is axially connected to the blocking member 237. In this embodiment, in the initial state, the end of the blocking member 237 away from the output end of the blocking power member 235 is lower than the conveying surface of the conveyor belt 212, that is, lower than the height of the placement plate 8 placed on the conveyor belt 212. Similarly, taking the limiting mechanism 23 corresponding to the burning device as an example, when the placement plate 8 on which the PCB board to be processed is placed is transported by the conveyor belt 212 to the burning device, the placement plate 8 is lower than the conveying surface of the conveyor belt 212. position, the blocking power member 235 drives the blocking member 237 to rotate relative to the blocking frame 236, so that the end of the blocking member 237 away from the output end of the blocking power member 235 protrudes from the conveying surface of the conveyor belt 212. At this time, the placement plate 8 contacts the blocking member 237 and is blocked by the blocking member 237, so that the inertia from the conveyor belt 212 can be removed, and then the placement plate 8 stays under the burning station of the burning device, which facilitates the insertion of the positioning member 234 into the positioning hole 81. The blocking member 237 is axially connected with a blocking wheel 238, so that when the placement plate 8 contacts the blocking wheel 238, part of the inertia can be eliminated to prevent the blocking member 237 from rigidly contacting the placement plate 8 and causing poor positioning.

[0042] In an optional embodiment, the blocking member 237 may not be provided with the blocking wheel 238, but an elastic member may be provided on the blocking member 237, and the elastic member may be elastic silicone or rubber.

[0043] In a specific embodiment, the conveying mechanism has two, and the two conveying mechanisms are arranged in parallel. The two conveying mechanisms are respectively a first conveying mechanism 21 and a second conveying mechanism 22. The first end of the first conveying mechanism 21 or the first end of the second conveying mechanism 22 has a first belt-to-belt transfer mechanism 24 for pushing the placement plate 8 on the first conveying mechanism 21 to the second conveying mechanism 22. The second end of the first conveying mechanism 21 or the second end of the second conveying mechanism 22 has a second belt-to-belt transfer mechanism 25 for pushing the placement plate 8 on the second conveying mechanism 22 to the first conveying mechanism 21. In this embodiment, the conveying directions of the first conveying mechanism 21 and the second conveying mechanism 22 are opposite. By setting the first conveying mechanism 21 and the second conveying mechanism 22, the cyclic conveying of the placement plate 8 can be realized, such as the burning device, the dispensing device 5 and the bonding device 6 are arranged away from the first conveying mechanism 21 On one side of the second conveying mechanism 22, the first conveying mechanism 21 can be used to convey the placement plate 8 with PCB boards on the conveying belt 212, and the second conveying mechanism 22 is used to convey the placement plate 8 with holes received from the end of the first conveying mechanism 21, so that the empty placement plate 8 is conveyed to the starting position of the first conveying mechanism 21 through the second conveying mechanism 22, and the first belt-to-belt transfer mechanism 24 on the first end of the conveying mechanism is used to push the placement plate 8 at the end (the end of the conveying direction) of the second conveying mechanism 22 to the starting end (the starting end of the conveying direction) of the first conveying mechanism 21, and the second belt-to-belt transfer mechanism 25 on the second end of the conveying mechanism is used to push the placement plate 8 on the end of the second conveying mechanism 22 after the PCB board has been unloaded by the unloading device 7 to the starting end of the second conveying mechanism 22, and so on and so forth, to realize the cyclic conveying of the placement plate 8, thereby improving the processing efficiency.

[0044] In a specific embodiment, Fig.12As shown, the first inter-belt transfer mechanism 24 and the second inter-belt transfer mechanism 25 both include a transfer guide rail 241 installed on the conveying frame 22, a transfer base 242 slidably installed on the transfer guide rail 241, a transfer power member 243 for driving the transfer base 242 to move in a directional manner on the transfer guide rail 241, and a push plate 244 connected to the transfer base 242 for pushing the placement plate 8 to move. In the present embodiment, taking the example of pushing the empty placement plate 8 at the end position on the second conveying mechanism 22 to the starting position of the first conveying mechanism 21, the transfer power member 243 drives the transfer base 242 to drive the push plate 244 to move, so that the push plate 244 moves toward the first conveying mechanism 21 on the side of the second conveying mechanism 22 away from the first conveying mechanism 21, so that the push plate 244 contacts the empty placement plate 8 on the second conveying mechanism 22 and pushes the empty placement plate 8 onto the first conveying mechanism 21.

[0045] In a specific embodiment, Fig.14 As shown, the burning device includes a burning rack 41 installed on the frame 1, a burning guide rail 42 installed on the burning rack 41, a burning base 43 slidably installed on the burning guide rail 42, and a burning board 44 detachably installed on the burning base 43, and also includes a burning power member 45 for driving the burning base 43 to move directional on the burning guide rail 42. In this embodiment, the burning board 44 is detachable from the burning base 43, so that different burning boards 44 can be replaced according to different customizations. When the PCB board is limited at the lower end of the burning board 44 by the limiting mechanism 23, the burning power 45 drives the burning base 43 to drive the burning board 44 to move on the burning guide rail 42 toward the PCB board, so that the burning board 44 contacts the PCB board to achieve burning. The burning board 44 is a prior art and will not be described in detail.

[0046] In a specific embodiment, Fig.10As shown, the dispensing device 5 includes a dispensing frame 51 installed on the frame 1, a dispensing horizontal drive group installed on the dispensing frame 51, a dispensing vertical drive group installed on the dispensing horizontal drive group, a dispensing longitudinal drive group installed on the dispensing vertical drive group, and a dispensing head 55 installed on the dispensing longitudinal drive group. In this embodiment, the PCB board located on the placement plate 8 is transported to the position of the dispensing device 5 after being burned by the burning device, and is limited by the limiting mechanism 23 at the dispensing device 5. After that, the dispensing horizontal drive group, the dispensing vertical drive group and the dispensing longitudinal drive group drive the dispensing head 55 to move in space, so that the dispensing head 55 can dispense glue at the position corresponding to the PCB board row. The dispensing head 55 is a prior art and will not be described in detail.

[0047] In a specific embodiment, the glue dispensing transverse drive group includes a glue dispensing transverse guide rail 521 installed on the glue dispensing frame 51, a glue dispensing transverse base 522 slidably installed on the glue dispensing transverse guide rail 521, and a glue dispensing transverse power member for driving the glue dispensing transverse base 522 to move in a directional manner on the glue dispensing transverse guide rail 521. In this embodiment, the glue dispensing transverse base 522 is driven to move in a directional manner on the glue dispensing transverse guide rail 521 by the glue dispensing transverse power member, thereby driving the glue dispensing head 55 to move in the transverse direction.

[0048] In a specific embodiment, the glue dispensing vertical drive group includes a glue dispensing vertical guide rail 531 installed on the glue dispensing horizontal base 522, a glue dispensing vertical base 532 slidably installed on the glue dispensing vertical guide rail 531, and a glue dispensing conveying power member for driving the glue dispensing vertical base 532 to move in a directional manner on the glue dispensing vertical guide rail 531. In this embodiment, the glue dispensing vertical power member 533 drives the glue dispensing vertical base 532 to move in a directional manner on the glue dispensing vertical guide rail 531, thereby driving the glue dispensing head 55 to move in the vertical direction.

[0049] In a specific embodiment, the dispensing longitudinal drive group includes a dispensing longitudinal guide rail 541 installed on the dispensing vertical base 532, a dispensing longitudinal base 542 slidably installed on the dispensing longitudinal guide rail 541, and a dispensing longitudinal power member for driving the dispensing longitudinal base 542 to move directionally on the dispensing longitudinal guide rail 541; the dispensing head 55 is installed on the dispensing longitudinal base 542. In this embodiment, the dispensing longitudinal power member drives the dispensing longitudinal base 542 to move directionally on the dispensing longitudinal guide rail 541, thereby driving the dispensing head 55 to move in the longitudinal direction, and then the dispensing head 55 is driven to move in space by the dispensing transverse drive group, the dispensing vertical drive group and the dispensing longitudinal drive group, so that the dispensing head 55 can dispense glue at the position corresponding to the PCB board row.

[0050] In a specific embodiment, Figure 8 , 9 As shown, the bonding device 6 includes a component vibration loading bin 61 installed on the frame 1, a vibration disk 62 located at the outlet of the component vibration loading bin 31, a detection mechanism for detecting the light speed toward the vibration disk 62, and a bonding mechanism for sucking components from the vibration disk 62 to bond them to the PCB board; the detection mechanism includes a detection frame 631 installed on the frame 1 and a detection CCD 632 installed on the detection frame 631. In this embodiment, the component vibration loading bin 61 is used to load components that need to be bonded to the PCB board onto the vibration disk 62, and the vibration disk 62 drives the components located thereon to vibrate so that the components turn over. When the detection CCD 632 detects that the components are in the correct direction, the bonding mechanism sucks the components in the correct direction and sucks and bonds the components to the PCB board.

[0051] In a specific embodiment, the bonding mechanism includes a bonding frame 641 installed on the frame 1, a robotic arm 642 installed on the bonding frame 641, and a bonding component installed on the robotic arm 642; the bonding component includes a bonding plate 643 installed on the robotic arm 642, a bonding motor 644 installed on the bonding plate 643, and a component adsorbent 645 connected to the output end of the bonding motor 644. In this embodiment, the robotic arm 642 drives the bonding component to move to the vibration plate 62, so that the bonding motor 644 drives the component adsorbent 645 to press down and contact with the component, and adsorb the component, and then the robotic arm 642 continues to move to the upper end of the PCB board bonding position, and the bonding motor 644 drives the component adsorbent 645 to drive the component to be bonded to the PCB board. The robotic arm 642 is a prior art and is not described in detail. The component adsorbent 645 is connected to a vacuum pump to achieve vacuum adsorption of components.

[0052] In a specific embodiment, the loading device 3 and the unloading device 7 are respectively installed at the two ends of the conveying device in the length direction, and the loading device 3 and the unloading device 7 both include a material bin 31 for placing PCB boards and a suction plate mechanism for sucking PCB boards; the material bin 31 is provided with a plurality of card slots 311 for clamping PCB boards; the suction plate mechanism includes a suction plate frame installed on the frame 1, a suction plate transverse driving group 322 installed on the suction plate frame, a suction plate longitudinal driving group 323 installed on the suction plate transverse driving group 322, a steering driving group 324 installed on the suction plate longitudinal driving group 323 and an adsorption disk 321 installed on the steering driving group 324. In this embodiment, a plurality of PCB boards are inserted in the card slots 311 of the material bin 31, and the loading device 3 loads the PCBs. Taking the material as an example, the suction plate 321 is driven to reach the material bin 31 under the cooperation of the suction plate transverse driving group 322, the suction plate longitudinal driving group 323 and the suction plate steering driving group 324, so that the suction plate 321 and the PCB board on the material bin 31 closest to the suction plate 321 are adsorbed, and then the suction plate longitudinal driving group 323 drives the suction plate 321 to drive the PCB board to leave the material bin 31, and under the drive of the suction plate steering driving group 324, the PCB board is rotated 90 degrees, so that the PCB board is parallel to the placement plate 8, and then the suction plate transverse driving group 322 drives the PCB board to the upper end of the placement plate 8, and the suction plate longitudinal driving group 323 drives the PCB board to be placed on the placement plate 8, thereby realizing the loading of the PCB board, and the suction plate 321 is connected to the vacuum pump, so as to realize the vacuum adsorption of the PCB board.

[0053] In a specific embodiment, the suction plate transverse driving group 322 includes a suction plate transverse guide rail 3221 installed on the suction plate frame, a suction plate transverse base 3222 slidably installed on the suction plate transverse guide rail 3221, and a suction plate transverse power member for driving the suction plate transverse base 3222 to move in a directional manner on the suction plate transverse guide rail 3221. In this embodiment, the suction plate transverse power member drives the suction plate transverse base 3222 to move in a directional manner on the suction plate transverse guide rail 3221, so that the PCB board can move from the position of the silo 31 to the position of the placement plate 8 on the conveyor belt 212.

[0054] In a specific embodiment, the suction plate longitudinal drive group 323 includes a suction plate longitudinal guide rail 3231 installed on the suction plate transverse base 3222, a suction plate longitudinal base 3232 slidably installed on the suction plate longitudinal guide rail 3231, and a suction plate longitudinal power member for driving the suction plate longitudinal base 3232 to move directionally on the suction plate longitudinal guide rail 3231. In this embodiment, the suction plate longitudinal power member drives the suction plate longitudinal base 3232 to move directionally on the suction plate longitudinal guide rail 3231, so that the PCB board can leave the card slot 311 of the silo 31 and be moved by the suction plate transverse drive group 322 to the position of the placement plate 8 on the conveyor belt 212.

[0055] In a specific embodiment, the steering drive group 324 includes a steering power member 3241 installed on the longitudinal base 3232 of the suction plate and a steering plate 3242 connected to the output end of the steering power member 3241; the adsorption disk 321 is installed on the steering plate 3242. In this embodiment, the adsorption disk 321 has multiple adsorption disks 321. By setting multiple adsorption disks 321, the PCB board can be stably adsorbed. The steering power member 3241 is used to drive the steering plate 3242 to rotate in two directions parallel to the horizontal plane and perpendicular to the horizontal plane, so that when the steering plate 3242 is perpendicular to the horizontal plane, the PCB board on the silo 31 can be adsorbed or the PCB board can be inserted into the card slot 311. When the steering plate 3242 is parallel to the horizontal plane, the PCB board on the placement plate 8 can be adsorbed or the PCB board can be placed on the placement plate 8. The steering power member 3241 is a prior art and will not be described in detail.

[0056] In a specific embodiment, Figure 6-7 As shown, the loading device 3 and the unloading device 7 both include a material rack 33, a feeding belt 34 installed on the material rack 33, and an adsorption limit assembly installed on the material rack 33 at a position corresponding to the suction plate mechanism; a locking hole 312 is provided on the material bin 31; the adsorption limit assembly includes an adsorption limit power piece 35232 installed on the material rack 33 and a locking piece 36 connected to the output end of the adsorption limit power piece 35232. In this embodiment, the material bin 31 can be transported by the feeding belt 34, and when loading or unloading is required, the material bin 31 at the suction plate mechanism needs to be kept in a stable state. Therefore, an adsorption limit assembly is provided at a corresponding position on the feeding belt 34. Specifically, the adsorption limit power piece 35232 drives the locking piece 36 to be inserted into the locking hole 312 of the material bin 31, thereby preventing the material bin 31 from moving, thereby facilitating the suction plate assembly to load or unload the PCB board.

[0057] In an optional embodiment, the power member described in the present invention can be a cylinder, a motor or a combination of the two. The conveyor belt 212 and the feed belt 34 are both existing technologies and will not be described in detail.

Claims

1. A PCB laminating machine, characterized in that: The machine comprises a frame, a PCB board conveying device installed on the frame, and the following mechanisms installed on the frame and arranged in sequence around the PCB board conveying device: A loading device, used for loading PCB boards to be processed; Burning device, used for burning the PCB board to be processed; Glue dispensing device, used for dispensing glue on the component installation positions on the PCB board; A laminating device is used to grab and laminat components onto component mounting positions on a PCB; Unloading device, used for unloading the processed PCB board; The conveying device includes a conveying mechanism installed on the frame, and the conveying mechanism includes a conveying frame and a conveying belt installed on the conveying frame. A limiting mechanism is provided on the conveying frame at a position corresponding to the burning device, and / or a limiting mechanism is provided on the conveying frame at a position corresponding to the dispensing device, and / or a limiting mechanism is provided on the conveying frame at a position corresponding to the bonding device. The limiting mechanism is used to limit the movement of the PCB board to facilitate the corresponding device to perform processing operations.

2. The PCB bonding machine according to claim 1, characterized in that: The conveyor belt is provided with a plurality of placement plates for placing PCB boards; the limiting mechanism comprises a mounting plate mounted on the conveying frame, a limiting power member mounted on the mounting plate and a limiting plate connected to the output end of the limiting power member; a positioning hole is provided on the placement plate, and a positioning member matching the positioning hole is provided on the limiting plate; the limiting mechanism also comprises a blocking assembly; the blocking assembly comprises a blocking power member mounted on the mounting plate, a blocking frame mounted on the blocking power member and a blocking member connected to the output end of the blocking power member and axially connected to the blocking frame, and a blocking wheel is axially connected to the blocking member.

3. The PCB bonding machine according to claim 2, characterized in that: The conveying mechanisms include two, which are arranged in parallel, and are respectively a first conveying mechanism and a second conveying mechanism. The first end of the first conveying mechanism or the first end of the second conveying mechanism has a first inter-belt transfer mechanism for pushing the placement plate on the first conveying mechanism to the second conveying mechanism, and the second end of the first conveying mechanism or the second end of the second conveying mechanism has a second inter-belt transfer mechanism for pushing the placement plate on the second conveying mechanism to the first conveying mechanism. The first inter-belt transfer mechanism and the second inter-belt transfer mechanism both include a transfer guide rail installed on the conveying frame, a transfer base slidably installed on the transfer guide rail, a transfer power member for driving the transfer base to move in a directional manner on the transfer guide rail, and a pushing plate connected to the transfer base for pushing the placement plate to move.

4. The PCB bonding machine according to any one of claims 1 to 3, characterized in that: The burning device comprises a burning rack mounted on the frame, a burning guide rail mounted on the burning rack, a burning base slidably mounted on the burning guide rail, and a burning plate detachably mounted on the burning base.

5. The PCB bonding machine according to any one of claims 1 to 3, characterized in that: The dispensing device includes a dispensing frame installed on the frame, a dispensing horizontal drive group installed on the dispensing frame, a dispensing vertical drive group installed on the dispensing horizontal drive group, a dispensing longitudinal drive group installed on the dispensing vertical drive group, and a dispensing head installed on the dispensing longitudinal drive group.

6. The PCB bonding machine according to claim 5, characterized in that: The dispensing transverse drive group includes a dispensing transverse guide rail mounted on the dispensing frame, a dispensing transverse base slidably mounted on the dispensing transverse guide rail, and a dispensing transverse power member for driving the dispensing transverse base to move directional on the dispensing transverse guide rail; The glue dispensing vertical drive group includes a glue dispensing vertical guide rail mounted on the glue dispensing horizontal base, a glue dispensing vertical base slidably mounted on the glue dispensing vertical guide rail, and a glue dispensing conveying power member for driving the glue dispensing vertical base to move directional on the glue dispensing vertical guide rail; The dispensing longitudinal drive group includes a dispensing longitudinal guide rail installed on the dispensing vertical base, a dispensing longitudinal base slidably installed on the dispensing longitudinal guide rail, and a dispensing longitudinal power member for driving the dispensing longitudinal base to move directional on the dispensing longitudinal guide rail; the dispensing head is installed on the dispensing longitudinal base.

7. The PCB bonding machine according to any one of claims 1 to 3, characterized in that: The bonding device includes a component vibration loading bin installed on the frame, a vibration plate located at the outlet of the component vibration loading bin, a detection mechanism for detecting the speed of light toward the vibration plate, and a bonding mechanism for sucking components from the vibration plate to bond them to the PCB board; the detection mechanism includes a detection frame installed on the frame and a detection CCD installed on the detection frame.

8. The PCB bonding machine according to claim 7, characterized in that: The bonding mechanism includes a bonding frame installed on the frame, a robotic arm installed on the bonding frame, and a bonding assembly installed on the robotic arm; the bonding assembly includes a bonding plate installed on the robotic arm, a bonding motor installed on the bonding plate, and a component adsorption piece connected to the output end of the bonding motor.

9. The PCB bonding machine according to any one of claims 1 to 3, characterized in that: The loading device and the unloading device are respectively installed at the two ends of the conveying device in the length direction, and both the loading device and the unloading device include a material bin for placing PCB boards and a plate suction mechanism for sucking PCB boards; the material bin is provided with a plurality of card slots for clamping PCB boards; the plate suction mechanism includes a plate suction frame installed on the frame, a plate suction transverse driving group installed on the plate suction frame, a plate suction longitudinal driving group installed on the plate suction transverse driving group, a steering driving group installed on the plate suction longitudinal driving group, and a suction plate installed on the steering driving group; The suction plate transverse driving group includes a suction plate transverse guide rail mounted on the suction plate frame, a suction plate transverse base slidably mounted on the suction plate transverse guide rail, and a suction plate transverse power member for driving the suction plate transverse base to move directional on the suction plate transverse guide rail; The steering drive group comprises a steering power component mounted on the longitudinal base of the suction plate longitudinal drive group and a steering plate connected to the output end of the steering power component; the suction disc is mounted on the steering plate.

10. The PCB bonding machine according to claim 9, characterized in that: The loading device and the unloading device also include a material rack, a feeding belt installed on the material rack, and an adsorption limit assembly installed on the material rack at a position corresponding to the suction plate mechanism; a locking hole is provided on the material bin; the adsorption limit assembly includes an adsorption limit power component installed on the material rack and a locking component connected to the output end of the adsorption limit power component.

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