LED packaging sheet for backlight

Abstract

The utility model provides an LED packaging sheet for backlight, which is characterized in that a bearing sheet (2) is made of a transparent insulating sheet and is provided with a plurality of wafer embedding openings (21), and LED wafers (1) are arranged in the wafer embedding openings (21); the driving electrode disc (22) on the bearing sheet (2) and the wafer electrode disc (13) on the LED wafer (1) can be directly connected through the solder (5), no gold wire packaging is needed, the driving electrode disc (22) and the wafer electrode disc (13) can be arranged on the side wall, and the conductive connection reliability of the two electrode discs is improved.

Description

[0001] This utility model is a divisional application with application number 2020203886072, application date March 7, 2020, and invention name “An LED packaging sheet and LED chip for display and backlight”. Technical Field

[0002] The utility model belongs to the technical field of LED packaging, in particular to an LED device used for LCD backlight. Background Art

[0003] Whether it is an LED display or an LED backlight, the smaller the spacing between LED lamp beads, the better. The problem caused by small spacing (mini, miro) is that the size of the LED chip is small, the spacing between the two electrodes on the chip is small, the spacing between the chips is small, and the number is large. It is difficult to ensure the reliable electrical connection between the two electrodes on the thousands of LED chips and the driving circuit, and the yield rate of mass production of products is low, etc., which leads to high product costs. The existing gold wire packaging process cannot solve this problem. Summary of the invention

[0004] The purpose of the utility model is to solve the above-mentioned problems and to propose a technical solution with simple structure, no gold wire packaging and low cost.

[0005] The technical solution of the utility model: The LED packaging sheet of the utility model is used for a backlight source in a display or a display device, and includes an LED chip and a carrier sheet. The carrier sheet is provided with a plurality of chip indentations, and a plurality of LED chips are arranged in the chip indentations. A driving electrode disk is arranged on the carrier sheet, and the driving electrode disk on the carrier sheet is close to the chip electrode disk on the LED chip. The electrical conduction connection between the two electrode disks is directly connected by soldering. The carrier sheet is made of a transparent insulating sheet, and the LED chip is arranged in a structure with a working layer facing backward.

[0006] In the present invention, the direction in which the LED emits light is defined as the front. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The following will clearly and completely describe the implementation of the present invention in conjunction with the drawings in the embodiments of the present invention. The described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0008] Figure 1 , 2 They are characteristic cross-sectional schematic diagrams of two types of LED packaging sheets of the present invention.

[0009] Figure 3 , 4 They are characteristic cross-sectional schematic diagrams of two types of LED packaging sheets of the present invention.

[0010] Figure 5 The utility model is a schematic diagram of the planar features of the wafer inlay and the wafer.

[0011] Figure 6 yes Figure 5 Schematic diagram of the AA characteristic section.

[0012] In the figure: 1. chip, 11. substrate, 12. working layer, 13. chip electrode disk, 14. process pad, 15. notch, 2. carrier plate, 21. chip inlay, 22. drive electrode disk, 23. process pad, 24. notch, 3. rear substrate, 31. electrode disk, 4. front light-transmitting layer, 5. solder. DETAILED DESCRIPTION

[0013] Figure 1 In the LED package sheet of the utility model shown in the figure, the carrier sheet 2 is provided with a plurality of wafer indentations 21, the LED wafer 1 is arranged in the wafer indentations 21, the driving electrode disk 22 on the carrier sheet 2 is close to the wafer electrode disk 13 on the LED wafer 1, and the electrical connection between the two electrode disks is directly welded and connected by solder 5, generally using tin solder. The figure also shows a front light-transmitting layer 4 and a rear substrate 3.

[0014] The LED single-layer sheet described in the present invention is provided with a number of LED chips which should be no less than two. For display or LCD backlight, the number of LED chips provided on the LED single-layer sheet may be hundreds, thousands, or even tens of thousands, which is not too many.

[0015] Figure 2 In the LED package of the present invention shown, the driving electrode disk 22 on the carrier plate 2 is arranged on the side wall of the chip indentation 21, and the driving electrode disk 22 and the chip electrode disk 13 are directly welded and connected by solder 5.

[0016] Figure 3 In the LED package of the utility model shown in the figure, the chip electrode disk 13 on the LED chip 1 is arranged on the side wall of the LED chip 1, and the driving electrode disk 22 is arranged on the side wall of the chip indentation 21, and the driving electrode disk 22 and the chip electrode disk 13 are directly connected by soldering through the solder 5; the figure also shows that the substrate 11 of the LED chip 1 is in front and the working layer 12 is facing backward.

[0017] Figure 4 In the LED package of the present invention shown, an electrode disk 31 is provided on the rear substrate 3, and the driving electrode disk 22 on the carrier plate 2 is directly connected to the chip electrode disk 13 on the chip 1 by solder 5, and the solder 5 is directly conductively connected to the electrode disk 31 on the rear substrate 3.

[0018] Display and LCD backlight require the configuration of LED chip drive control circuit and transistor (TFT). In the utility model, the LED chip 1 drive control circuit and transistor can be arranged on the carrier 2. Figure 4 As shown, the driving control circuit and transistors of the LED chip 1 are generally arranged on the rear substrate 3 .

[0019] Figure 5 The chip inlet 21 and LED chip 1 of the utility model shown in the figure, the LED chip 1 is a quadrilateral, the corners of the LED chip 1 are cut into circular notches, the two chip electrode pads 13 of the chip 1 are respectively arranged in the side walls of the circular notches at two opposite corners, and the side walls of the circular notches (15) at the other two opposite corners are provided with process pads 14; the two opposite corners of the chip inlet 21 are provided with circular notches 24, and the driving electrode disk 22 on the side wall of the chip inlet 21 is arranged in the circular notches 24; the other two corners of the chip inlet 21 are also cut into circular notches, and the side walls of the circular notches are provided with process pads 23, as shown in FIG. Figure 6 shown.

[0020] The chip inlet 21 is provided with a notch-shaped (circular notch-shaped in the figure) driving electrode disk 22, which corresponds to the chip electrode disk 13 and should be provided on the side wall of the chip inlet 21. When solder (tin solder) is used for welding, the solder 5 is filled in the cavity formed by the circular notch of the LED chip 1 and the circular notch of the chip inlet 21.

[0021] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An LED packaging sheet for backlight, comprising an LED chip (1) and a carrier sheet (2), wherein the LED chip (1) comprises a substrate (11) and a working layer (12), the carrier sheet (2) is provided with a plurality of chip indentations (21), a plurality of LED chips (1) are arranged in the chip indentations (21), a driving electrode disk (22) is arranged on the carrier sheet (2), the driving electrode disk (22) on the carrier sheet (2) is close to the chip electrode disk (13) on the LED chip (1), the driving electrode disk (22) and the chip electrode disk (13) are electrically connected by direct soldering with solder, and characterized in that: The carrier sheet (2) is made of a transparent insulating sheet material.

2. The LED packaging sheet for backlight according to claim 1, characterized in that: The LED chip (1) is arranged in a structure with the working layer (12) facing backwards.

3. The LED packaging sheet for backlight according to claim 1, characterized in that: A driving electrode disk (22) corresponding to the wafer electrode disk (13) on the wafer (1) is arranged on the side wall of the wafer embedding opening (21).

4. The LED packaging sheet for backlight according to claim 1, 2, or 3, characterized in that: A rear substrate (3) is provided, an electrode disk (31) is provided on the rear substrate (3), a driving electrode disk (22) on a carrier sheet (2) and a chip electrode disk (13) on a chip (1) are directly connected by welding using solder (5), and the solder (5) is directly and electrically connected to the electrode disk (31) on the rear substrate (3).

5. The LED packaging sheet for backlight according to claim 1, or 2, or 3, characterized in that: The driving control circuit and transistor of the LED chip (1) are arranged on the carrier sheet (2).

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