Stamping die with buffering function

Abstract

The utility model provides a stamping die with a buffering function, which relates to the technical field of stamping dies, and comprises a buffering mechanism, an adjusting mechanism is arranged in the buffering mechanism, the buffering mechanism comprises a lower die, a side plate is arranged at the top of the lower die, an elastic sheet is arranged in the side plate, and the elastic sheet is connected with the lower die. A connecting rod is arranged at one end of the elastic piece, and a buffer plate is arranged on the outer side of the connecting rod. When the lifting rod retracts, the locking plate is in contact with the buffer plate and applies external force to the buffer plate, at the moment, the connecting rod moves downwards in the linear groove and extrudes the elastic pieces in the side plates, the side plates are arranged on the two sides of the buffer plate, and when the buffer plate is pressed, the elastic pieces can be clamped in the buffer plate. The upper die and the lower die are buffered up and down in a specified space, mechanical vibration is reduced, and direct impact force of the upper die to the lower die can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of stamping dies, in particular to a stamping die with a buffer function. Background Art

[0002] A stamping die is a tool used to apply pressure to a metal sheet to cause it to plastically deform or separate. It usually consists of an upper die and a lower die, and pressure is applied by a press or punch to stamp the metal sheet into the desired shape.

[0003] In the existing technology, when the die is stamping the sheet, under the application of external force, the upper die may have too much pressure, causing the stamping to move down faster, and due to the fast speed, the lower die cannot absorb the pressure in time, resulting in damage or increased wear of the die. This may shorten the service life of the die, increase the frequency of die replacement and production costs, and cause uneven stamping. Since the lower die is in contact with the workpiece for a short time, the impact effect cannot be fully completed, resulting in poor surface quality in the stamping area. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings in the prior art and provide a stamping die with a buffer function.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a stamping die with a buffering function, comprising: a buffering mechanism, an adjusting mechanism is arranged inside the buffering mechanism, the buffering mechanism comprises a lower die, a side plate is arranged on the top of the lower die, a spring is arranged inside the side plate, a connecting rod is arranged at one end of the spring, a buffer plate is arranged on the outside of the connecting rod, an arc plate is arranged on the top of the buffer plate, a locking plate is arranged on the outside of the arc plate, an upper die is arranged on the top of the locking plate, and a lifting rod is arranged between the upper die and the lower die.

[0006] As a preferred embodiment, the adjustment mechanism includes a screw rod, the bottom end of which is movably connected to the top of the base plate, the bottom of the base plate is fixedly connected to the top of the anti-slip pad, the top of the base plate is fixedly connected to the bottom end of the limiting rod, the top end of the limiting rod is connected through the interior of the lower mold, and the interior of the lower mold is threadedly connected to the outer side of the screw rod.

[0007] As a preferred embodiment, the top of the lower mold is fixedly connected to one side of the side plate, and the inner wall of the side plate is fixedly connected to one end of the spring sheet.

[0008] As a preferred embodiment, the other end of the spring sheet is fixedly connected to one end of the connecting rod, and the outer side of the middle end of the connecting rod is slidably connected to the inner surface of the linear groove provided on the inner wall of the buffer plate.

[0009] As a preferred implementation, the top of the buffer plate contacts the bottom of the lock plate, and a slot is provided at the bottom of the lock plate.

[0010] As a preferred implementation, the inner surface of the slot is vertically clamped with the outer side of the arc plate, and the bottom of the arc plate is fixedly connected with the top of the buffer plate.

[0011] As a preferred embodiment, one end of the side surface of the lower mold is fixedly connected to the bottom end of the lifting rod, and the top end of the lifting rod is fixedly connected to one end of the side surface of the upper mold.

[0012] As a preferred embodiment, the bottom of the upper mold and the top of the lower mold correspond vertically to each other.

[0013] Compared with the prior art, the advantages and positive effects of the utility model are:

[0014] 1. As the lifting rod is retracted, its lock plate will contact the buffer plate and exert external force on the buffer plate. At this time, the connecting rod will move downward in the linear groove and squeeze the spring in the side plate. The side plates are designed on both sides of the buffer plate. When the buffer plate is under pressure, it can be buffered up and down in the specified space, reducing mechanical vibration and reducing the direct impact force of the upper mold on the lower mold.

[0015] 2. By rotating the screw rod, the bottom of the lower mold is moved away from the platform. When it is away from the platform, the bottom plate will serve as a support point, thereby increasing the operating space. This makes it easier for the operator to perform more operations on the mold, such as replacing workpieces, cleaning the mold, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model is a schematic structural diagram of a stamping die with a buffer function.

[0017] Figure 2 A schematic diagram of the side structural view of a stamping die assembly with a buffering function provided by the utility model.

[0018] Figure 3 This is a schematic diagram of the structure of some components of a stamping die with a buffer function provided by the utility model.

[0019] Figure 4 A schematic diagram of the component matching structure of a stamping die with a buffer function provided by the utility model.

[0020] Legend:

[0021] 1. Buffer mechanism; 11. Lower mold; 12. Upper mold; 13. Side plate; 14. Shrapnel; 15. Connecting rod; 16. Buffer plate; 17. Arc plate; 18. Lock plate; 19. Slot; 110. Lifting rod; 111. Linear slot;

[0022] 2. Adjustment mechanism; 21. Screw rod; 22. Bottom plate; 23. Anti-slip pad; 24. Limit rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1

[0025] like Figure 1 - Figure 4 As shown, the utility model provides a technical solution: a stamping die with a buffering function, comprising: a buffering mechanism 1, an adjusting mechanism 2 is arranged inside the buffering mechanism 1, the buffering mechanism 1 comprises a lower die 11, a side plate 13 is arranged on the top of the lower die 11, a spring sheet 14 is arranged inside the side plate 13, a connecting rod 15 is arranged at one end of the spring sheet 14, a buffer plate 16 is arranged on the outside of the connecting rod 15, an arc plate 17 is arranged on the top of the buffer plate 16, a locking plate 18 is arranged on the outside of the arc plate 17, an upper die 12 is arranged on the top of the locking plate 18, a lifting rod 110 is arranged between the upper die 12 and the lower die 11, the top of the lower die 11 is fixedly connected to one side of the side plate 13, and the side plate 14 is arranged on one end of the connecting rod 15. The inner wall of the plate 13 is fixedly connected to one end of the spring sheet 14, the other end of the spring sheet 14 is fixedly connected to one end of the connecting rod 15, the outer side of the middle end of the connecting rod 15 is slidably connected to the inner surface of the linear groove 111 provided on the inner wall of the buffer plate 16, the top of the buffer plate 16 is in contact with the bottom end of the locking plate 18, and the bottom of the locking plate 18 is provided with a slot 19, the inner surface of the slot 19 is vertically engaged with the outer side of the arc plate 17, the bottom of the arc plate 17 is fixedly connected to the top of the buffer plate 16, one end of the side surface of the lower mold 11 is fixedly connected to the bottom end of the lifting rod 110, the top of the lifting rod 110 is fixedly connected to one end of the side surface of the upper mold 12, and the bottom of the upper mold 12 and the top of the lower mold 11 correspond to each other vertically.

[0026] In this embodiment, when the device is in use, as the lifting rod 110 between the upper mold 12 and the lower mold 11 is started, the device punches the object between the two. During the punching process, in order to reduce the excessive pressure of the upper mold 12 on the lower mold 11 during the punching process, as the lifting rod 110 is retracted, the upper mold 12 will be close to the lower mold 11. During this process, its locking plate 18 will contact the buffer plate 16 and apply external force to the buffer plate 16. At this time, the connecting rod 15 will move downward in the linear groove 111 and squeeze the spring sheet 14 in the side plate 13. The side plate 13 is designed on both sides of the buffer plate 16. When the buffer plate 16 is under pressure, it can be buffered up and down in the specified space to reduce mechanical vibration, reduce the direct impact force of the upper mold 12 on the lower mold 11, reduce the friction and wear of the mold during operation, ensure the accuracy and stability of the mold, and improve the processing accuracy and quality of the product.

[0027] Secondly, when the locking plate 18 is vertically matched with the buffer plate 16, since a slot 19 is provided at the bottom of the locking plate 18, when the locking plate 18 is in the process of matching, the slot 19 will correspond to the arc plate 17 on the buffer plate 16 and complete the snap connection, which can increase the connection strength between them. This can ensure that during the operation, the locking plate 18 and the buffer plate 16 will not loosen or separate, and the snap connection design can ensure the alignment accuracy and consistency between the locking plate 18 and the buffer plate 16, which helps to maintain the accuracy of the mold and avoid offset or misalignment during the operation.

[0028] Example 2

[0029] like Figure 1 - Figure 2 As shown, the adjustment mechanism 2 includes a screw rod 21, the bottom end of the screw rod 21 is movably connected to the top of the base plate 22, the bottom of the base plate 22 is fixedly connected to the top of the anti-slip pad 23, the top of the base plate 22 is fixedly connected to the bottom end of the limiting rod 24, the top end of the limiting rod 24 is connected through the interior of the lower mold 11, and the interior of the lower mold 11 is threadedly connected to the outer side of the screw rod 21.

[0030] In this embodiment, the screw rod 21 is rotated so that the bottom of the lower mold 11 is away from the platform. When it is away from the platform, the bottom plate 22 will serve as a support point, thereby increasing the operating space. This makes it convenient for the operator to perform more operations on the mold, such as replacing workpieces, cleaning the mold, etc., and an anti-skid pad 23 is designed on the bottom plate 22. The anti-skid pad 23 of the bottom plate 22 can prevent the mold from accidentally sliding or falling during operation, thereby increasing the safety of operation, and the anti-skid pad 23 of the bottom plate 22 can reduce the vibration and noise of the mold during operation, which can improve the working environment. The limit rod 24 will ensure that the bottom plate 22 is not affected by the rotation of the screw rod 21 and does not shake significantly, so as to achieve accurate positioning of the bottom plate 22 and ensure the required clearance and pressure during the processing.

[0031] Working principle:

[0032] like Figure 1 - Figure 4 As shown, when the new type is used, according to the needs of the user, when the lifting rod 110 is retracted, the upper mold 12 will be close to the lower mold 11. During this process, its lock plate 18 will contact the buffer plate 16 and apply external force to the buffer plate 16. At this time, the connecting rod 15 will move downward in the linear groove 111 and squeeze the spring 14 in the side plate 13. The side plates 13 are designed on both sides of the buffer plate 16. When the buffer plate 16 is under pressure, it can be buffered up and down in the specified space to reduce mechanical vibration and reduce the direct impact force of the upper mold 12 on the lower mold 11. Secondly, when the lock plate 18 is vertically matched with the buffer plate 16, since the bottom of the lock plate 18 is provided with a card slot 19, when the lock plate 18 is in the process of matching, the card slot 19 will correspond to the arc plate 17 on the buffer plate 16 and complete the card connection, which can increase the connection strength between them.

[0033] By rotating the screw rod 21, the bottom of the lower mold 11 is moved away from the platform. When it is away from the rear bottom plate 22, it will serve as a support point, thereby increasing the operating space. This makes it easier for the operator to perform more operations on the mold, such as replacing workpieces, cleaning the mold, etc.

[0034] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A stamping die with a buffer function, characterized in that: include: A buffer mechanism (1), wherein an adjustment mechanism (2) is arranged inside the buffer mechanism (1), and the buffer mechanism (1) comprises a lower mold (11), a side plate (13) is arranged on the top of the lower mold (11), a spring sheet (14) is arranged inside the side plate (13), a connecting rod (15) is arranged at one end of the spring sheet (14), a buffer plate (16) is arranged on the outside of the connecting rod (15), an arc plate (17) is arranged on the top of the buffer plate (16), a locking plate (18) is arranged on the outside of the arc plate (17), an upper mold (12) is arranged on the top of the locking plate (18), and a lifting rod (110) is arranged between the upper mold (12) and the lower mold (11).

2. A stamping die with a buffering function according to claim 1, characterized in that: The adjusting mechanism (2) comprises a screw rod (21), the bottom end of the screw rod (21) is movably connected to the top of the bottom plate (22), the bottom of the bottom plate (22) is fixedly connected to the top of the anti-slip pad (23), the top of the bottom plate (22) is fixedly connected to the bottom end of a limiting rod (24), the top end of the limiting rod (24) is connected through the inside of the lower mold (11), and the inside of the lower mold (11) is threadedly connected to the outer side of the screw rod (21).

3. The stamping die with a buffer function according to claim 1, characterized in that: The top of the lower mold (11) is fixedly connected to one side of the side plate (13), and the inner wall of the side plate (13) is fixedly connected to one end of the spring sheet (14).

4. The stamping die with a buffer function according to claim 1, characterized in that: The other end of the spring sheet (14) is fixedly connected to one end of the connecting rod (15), and the outer side of the middle end of the connecting rod (15) is slidably connected to the inner surface of the linear groove (111) provided on the inner wall of the buffer plate (16).

5. The stamping die with a buffer function according to claim 1, characterized in that: The top of the buffer plate (16) contacts the bottom of the lock plate (18), and a card slot (19) is provided at the bottom of the lock plate (18).

6. The stamping die with buffer function according to claim 5, characterized in that: The inner surface of the clamping groove (19) is vertically clamped with the outer side of the arc plate (17), and the bottom of the arc plate (17) is fixedly connected with the top of the buffer plate (16).

7. The stamping die with a buffering function according to claim 1, characterized in that: One end of the side surface of the lower mold (11) is fixedly connected to the bottom end of the lifting rod (110), and the top end of the lifting rod (110) is fixedly connected to one end of the side surface of the upper mold (12).

8. The stamping die with a buffer function according to claim 1, characterized in that: The bottom of the upper mold (12) and the top of the lower mold (11) correspond vertically to each other.

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