Liquid supply device, liquid supply control system and slicing machine

Abstract

The utility model discloses a liquid supply device, a liquid supply control system and a slicer, the liquid supply device comprises a main liquid supply pipe and at least two liquid supply tanks, the liquid supply tanks are used for containing cutting mixed liquid, and each liquid supply tank is connected with the main liquid supply pipe through a liquid supply branch pipe; the at least two liquid supply tanks are used for providing cutting mixed liquid for the spraying device through the liquid supply branch pipes and the main liquid supply pipe in sequence during silicon rod machining. According to the embodiment of the utility model, in the silicon rod cutting process, the new liquid supply tank is switched to provide the cutting mixed liquid for the spraying device, so that the concentration of silicon powder in the cutting mixed liquid when the second half section is cut is reduced, the cutting torque of a diamond wire net is further reduced, the high-position wire breakage rate of the diamond wire net is reduced, and the cutting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon rod slicing, in particular to a liquid supply device, a liquid supply control system and a slicing machine. Background Art

[0002] At present, a slicer is usually used to slice silicon rods. The slicer includes a diamond wire mesh, a mortar tank, a spray device, etc. The mortar tank contains cutting mortar. During the process of the diamond wire mesh cutting the silicon rod, the mortar tank provides the cutting mortar to the spray device, so that the spray device sprays the cutting mortar. The used cutting mortar will be recycled and flow back to the mortar tank.

[0003] However, in the process of cutting silicon rods, more and more silicon powder will be generated. Due to the recycling of the cutting mortar, the concentration of silicon powder in the cutting mortar in the mortar tank gradually accumulates, which will affect the subsequent cutting force of the diamond wire mesh, making the diamond wire mesh easy to break, resulting in low cutting efficiency. Summary of the invention

[0004] The utility model provides a liquid supply device, a liquid supply control system and a slicer, aiming to solve the technical problem of low cutting efficiency caused by gradual accumulation of silicon powder concentration in cutting mortar when cutting silicon rods in the prior art.

[0005] In a first aspect, an embodiment of the utility model provides a liquid supply device, comprising a main liquid supply pipe and at least two liquid supply tanks, wherein the liquid supply tanks are used to hold a cutting mixed liquid, each of the liquid supply tanks is connected to the main liquid supply pipe via a liquid supply branch pipe, and at least two of the liquid supply tanks are used to provide a cutting mixed liquid to a spray device via the liquid supply branch pipe and the main liquid supply pipe in sequence during silicon rod processing.

[0006] Optionally, the cutting mixture includes cutting liquid, and the proportion and / or components of the cutting liquid in the cutting mixture contained in at least two of the liquid supply tanks are inconsistent.

[0007] Optionally, each of the liquid supply branches is provided with a valve.

[0008] Optionally, a main liquid return pipe is further included, and each of the liquid supply tanks is connected to the main liquid return pipe via a liquid return branch pipe.

[0009] Optionally, the cutting mixture further comprises water, and the at least two liquid supply tanks comprise a first liquid supply tank and a second liquid supply tank, wherein the first liquid supply tank and the second liquid supply tank contain a first cutting mixture and a second cutting mixture respectively;

[0010] The ratio of the volume of water to the volume of the cutting liquid in the first cutting mixture is 12-14, and the ratio of the volume of water to the volume of the cutting liquid in the second cutting mixture is 9-11.

[0011] Optionally, the main liquid return pipe is connected to the plurality of liquid return branch pipes via a diverter valve.

[0012] Optionally, each of the liquid supply branches is provided with a liquid supply pump.

[0013] Optionally, each of the liquid return branches is provided with a filter.

[0014] Optionally, a liquid inlet and a liquid discharge port are respectively provided at the top and the bottom of the liquid supply tank, the liquid inlet is connected to a liquid inlet pipe, and the liquid discharge port is connected to a liquid discharge pipe.

[0015] In a second aspect, an embodiment of the utility model provides a slicer, comprising any of the liquid supply devices described above.

[0016] Optionally, a controller is also included, and the liquid supply device includes a main liquid supply pipe and at least two liquid supply tanks, each of the liquid supply tanks is connected to the main liquid supply pipe through a liquid supply branch pipe, each of the liquid supply branch pipes is provided with a valve, and the controller is electrically connected to the valve. The controller is also used to be electrically connected to a displacement sensor in the slicer, and the displacement sensor is used to measure the cutting depth of the silicon rod.

[0017] Optionally, the multiple valves include a first valve and a second valve, and the controller is used to control the first valve to open and the second valve to close when the cutting depth is less than a preset depth. The controller is also used to control the first valve to close and the second valve to open when the cutting depth is greater than or equal to the preset depth, wherein the preset depth is 90mm-120mm.

[0018] In a third aspect, an embodiment of the utility model provides a slicer, comprising any of the liquid supply control systems described above.

[0019] In the embodiment of the utility model, when cutting silicon rods, the first liquid supply tank first provides the spray device with a cutting mixture through the liquid supply branch pipe and the main liquid supply pipe, and the used cutting mixture flows back to the first liquid supply tank, and then the first liquid supply tank is switched to the second liquid supply tank, and the second liquid supply tank provides the spray device with a cutting mixture through the liquid supply branch pipe and the main liquid supply pipe, and the used cutting mixture flows back to the second liquid supply tank, and then the switching continues until the preset number of liquid supply tanks complete the liquid supply in sequence. During the silicon rod cutting process, since a new liquid supply tank is switched to provide the spray device with a cutting mixture, the cutting mixture in the new liquid supply tank has not yet begun to be recycled, thereby reducing the concentration of silicon powder in the cutting mixture during the second half of the cutting, thereby reducing the cutting torque of the diamond wire mesh, so that the cutting force of the diamond wire mesh can be fully released, reducing the high-position wire breakage rate of the diamond wire mesh and the proportion of silicon wafer edge damage after cutting, thereby improving the cutting efficiency and reducing the wire consumption in the overall process.

[0020] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a liquid supply device provided in an embodiment of the utility model;

[0022] Figure 2 A schematic diagram of the structure of another liquid supply device provided in an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of the structure of a liquid supply device connected to a cutting chamber provided in an embodiment of the utility model;

[0024] Figure 4 A schematic structural diagram of the connection between the liquid supply tank, the liquid inlet pipe and the liquid discharge pipe provided in an embodiment of the utility model.

[0025] Reference numerals:

[0026] 1-liquid supply tank, 2-liquid supply branch pipe, 3-main liquid supply pipe, 4-valve, 5-liquid supply pump, 6-main liquid return pipe, 7-liquid return branch pipe, 8-diverter valve, 9-filter, 10-switch valve, 11-liquid inlet pipe, 12-liquid discharge pipe, 13-cutting chamber, 14-spraying device. DETAILED DESCRIPTION

[0027] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0028] At present, a slicer is usually used to slice silicon rods. The slicer includes a diamond wire mesh, a mortar tank, a spray device, etc. The mortar tank contains cutting mortar. In the process of the diamond wire mesh cutting the silicon rod, the mortar tank provides the spray device with cutting mortar so that the spray device sprays out the cutting mortar. The used cutting mortar will be recycled and flow back to the mortar tank. However, in the process of cutting silicon rods, more and more silicon powder will be generated. Due to the recycling of the cutting mortar, the concentration of silicon powder in the cutting mortar in the mortar tank gradually accumulates, which will affect the subsequent cutting force of the diamond wire mesh. With the gradual development of thinning and fine wire, the concentration of silicon powder in the cutting process has an increasingly greater impact on the cutting force of the diamond wire mesh, making the diamond wire mesh easy to break. After breaking, it needs to be rewired, resulting in low cutting efficiency. In order to solve the above technical problems, the utility model provides a liquid supply device, a liquid supply control system and a slicer.

[0029] First, refer to Figure 1 and Figure 2 The embodiment of the utility model discloses a liquid supply device, including a main liquid supply pipe 3 and at least two liquid supply tanks 1, the liquid supply tanks 1 are used to hold a cutting mixed liquid, each liquid supply tank 1 is connected to the main liquid supply pipe 3 through a liquid supply branch pipe 2, and at least two liquid supply tanks 1 are used to provide a cutting mixed liquid to a spray device 14 through the liquid supply branch pipe 2 and the main liquid supply pipe 3 in sequence during silicon rod processing.

[0030] Specifically, the liquid supply device is used to supply liquid to the spray device 14 in the slicer, and the slicer is used to slice silicon rods. Figure 3 The slicer includes a cutting chamber 13, a spray device 14 is arranged in the cutting chamber 13, and a diamond wire net is also arranged in the cutting chamber 13. The cutting mixed liquid sprayed by the spray device 14 is used to remove the heat and silicon powder generated during the silicon rod cutting process. The liquid supply branch pipe 2 extends into the liquid supply tank 1.

[0031] The total number of liquid supply tanks 1 can be set according to actual needs, such as 2-6. During the silicon rod slicing process, liquid supply can be completed in sequence by a preset number of liquid supply tanks 1, and the preset number is greater than or equal to 2 and less than or equal to the total number of liquid supply tanks 1. For example, referring to Figure 1 The liquid supply device may include two liquid supply tanks 1, and the two liquid supply tanks 1 complete the liquid supply in sequence during the silicon rod slicing process; Figure 2The liquid supply device may include four liquid supply tanks 1. During the silicon rod slicing process, two of the liquid supply tanks 1 may complete the liquid supply in sequence, or four of the liquid supply tanks 1 may complete the liquid supply in sequence. It should be noted that only one liquid supply tank 1 is supplying liquid at any time.

[0032] The cutting mixture is specifically a mortar, and the cutting mixture may include cutting fluid, water, and silicon carbide powder. Silicon carbide powder is used as a wire cutting abrasive, and the cutting fluid plays a cooling, dispersing and lubricating role. The cutting fluid may include polyethylene glycol, a surfactant, a chelating agent, a defoaming agent, etc. The cutting mixtures contained in each liquid supply tank 1 may be the same cutting mixture or different cutting mixtures.

[0033] When slicing silicon rods, different liquid supply tanks 1 can be used for liquid supply according to different stages of cutting. For example, when the liquid supply device includes two liquid supply tanks 1, one of the liquid supply tanks 1 can provide the spray device 14 with a cutting mixture through the liquid supply branch pipe 2 and the main liquid supply pipe 3 in the first half of cutting, and then the other liquid supply tank 1 can provide the spray device 14 with a cutting mixture through the liquid supply branch pipe 2 and the main liquid supply pipe 3 in the second half of cutting, thereby significantly reducing the concentration of silicon powder in the cutting mixture in the second half of cutting, that is, reducing the concentration of silicon powder in the cutting mixture when cutting to a difficult position during the cutting process. The first half of cutting and the second half of cutting can be determined according to the cutting depth, such as when the cutting depth is less than the preset depth, it is the first half of cutting, and when the cutting depth is greater than or equal to the preset depth, it is the second half of cutting. The preset depth can be 90mm-120mm.

[0034] In the embodiment of the utility model, when cutting silicon rods, the first liquid supply tank 1 first provides the spray device 14 with a cutting mixture through the liquid supply branch pipe 2 and the main liquid supply pipe 3, and the used cutting mixture flows back to the first liquid supply tank 1, and then the first liquid supply tank 1 is switched to the second liquid supply tank 1, and the second liquid supply tank 1 provides the spray device 14 with a cutting mixture through the liquid supply branch pipe 2 and the main liquid supply pipe 3, and the used cutting mixture flows back to the second liquid supply tank 1, and then the switching continues until the preset number of liquid supply tanks 1 complete the liquid supply in sequence. It should be noted that there is no need to stop the machine during the switching of the liquid supply tanks 1.

[0035] Although the recovered cutting mixture will be filtered through the filter and then flow back to the liquid supply tank 1, the filter cannot filter out the silicon powder due to the small particles of silicon powder. Therefore, the recovered cutting mixture contains a certain amount of silicon powder. As the silicon rods are continuously cut, more and more silicon powder is generated, and the concentration of silicon powder in the cutting mixture in the current liquid supply tank 1 will continue to increase. In the embodiment of the utility model, during the silicon rod cutting process, since the new liquid supply tank 1 is switched to provide the cutting mixture for the spray device 14, the cutting mixture in the new liquid supply tank 1 has not yet begun to be recycled, thereby reducing the concentration of silicon powder in the cutting mixture in the second half of the cutting, thereby reducing the cutting torque of the diamond wire mesh, so that the cutting force of the diamond wire mesh can be fully released, reducing the high-position wire breakage rate of the diamond wire mesh and the proportion of broken edges of the silicon wafers after cutting, thereby improving the cutting efficiency and reducing the wire consumption in the overall process.

[0036] The cutting mixture includes cutting liquid, and the proportion and / or components of the cutting liquid in the cutting mixture contained in at least two liquid supply tanks 1 are inconsistent.

[0037] Specifically, the proportion of cutting liquid in the cutting mixture refers to the proportion of the volume of the cutting liquid to the volume of the entire cutting mixture. The cutting mixture also includes water. When the ratio of the volume of water to the volume of the cutting liquid changes, the proportion of the cutting liquid changes. In order to quickly bring out the silicon powder in the cutting seam during the second half of the cutting, the proportion of the cutting liquid in the cutting mixture contained in the liquid supply tank 1 used in the second half of the cutting can be higher than the proportion of the cutting liquid in the cutting mixture contained in the liquid supply tank 1 used in the first half of the cutting.

[0038] The components of the cutting fluid may be inconsistent, or the components of the cutting fluid may be consistent, but the proportion of at least one component may be inconsistent. The cutting fluid may include polyethylene glycol, dispersants, surfactants, chelating agents, defoaming agents, and the like. In order to quickly bring out the silicon powder in the cutting seam during the second half of the cutting, the dispersibility of the cutting fluid in the cutting mixture contained in the liquid supply tank 1 used in the second half of the cutting may be higher than the dispersibility of the cutting fluid in the cutting mixture contained in the liquid supply tank 1 used in the first half of the cutting. In order to achieve the above-mentioned effect, the proportion of the dispersant in the cutting fluid in the cutting mixture used in the second half of the cutting may be higher than the proportion of the dispersant in the cutting fluid in the cutting mixture used in the first half of the cutting.

[0039] In order to improve the liquid carrying capacity of the diamond wire mesh during the first half of cutting, the wettability of the cutting liquid in the cutting mixture contained in the liquid supply tank 1 used in the first half of cutting can be higher than the wettability of the cutting liquid in the cutting mixture contained in the liquid supply tank 1 used in the second half of cutting. In order to achieve the above effect, the proportion of the surfactant in the cutting liquid in the cutting mixture used in the first half of cutting can be higher than the proportion of the surfactant in the cutting liquid in the cutting mixture used in the second half of cutting.

[0040] In the embodiment of the utility model, by setting the proportion and / or components of the cutting liquid in the cutting mixture contained in at least two liquid supply tanks 1 to be inconsistent, different cutting mixtures can be used in the first half of cutting and the second half of cutting to meet different needs.

[0041] The diamond wire mesh uses a reciprocating cutting method when cutting silicon rods. During the cutting process, the diamond wire is divided into new wire and old wire. The new wire is the diamond wire that has not been used yet. In the first half of the cutting, most of the old wire is cut, and in the second half of the cutting, most of the new wire is cut. Different cutting mixtures are used in the first half of the cutting and the second half of the cutting, that is, different cutting mixtures are used for the old wire and the new wire, so that the cutting force of the diamond wire at different process stages can be fully released.

[0042] Reference Figures 1 to 3 , each liquid supply branch pipe 2 is provided with a valve 4.

[0043] Specifically, the valve 4 can be a regulating valve, which can be a solenoid valve, an electric valve, a pneumatically driven valve, a hydraulically driven valve, etc. The opening of the regulating valve can be adjusted, so that the flow rate of the liquid supply can be adjusted. When the valve 4 on the liquid supply branch pipe 2 is opened, the liquid supply tank 1 connected to the liquid supply branch pipe 2 is connected to the main liquid supply pipe 3 through the liquid supply branch pipe 2. At this time, the liquid is supplied by the liquid supply tank 1. In the embodiment of the utility model, by controlling the opening and closing of different valves 4, different liquid supply tanks 1 can be selected for liquid supply.

[0044] Reference Figures 1 to 3 The liquid supply device provided in the embodiment of the utility model further includes a total liquid return pipe 6, and each liquid supply tank 1 is connected to the total liquid return pipe 6 through a liquid return branch pipe 7. Specifically, the total liquid return pipe 6 is used to connect the cutting chamber 13, and the used cutting mixed liquid will flow back to the current liquid supply tank 1 through the total liquid return pipe 6 and the liquid return branch pipe 7 to realize the recycling of the cutting mixed liquid.

[0045] The cutting mixture also includes water, and at least two liquid supply tanks 1 include a first liquid supply tank and a second liquid supply tank, and the first liquid supply tank and the second liquid supply tank respectively contain a first cutting mixture and a second cutting mixture; the ratio of the volume of water to the volume of the cutting liquid in the first cutting mixture is 12-14, and the ratio of the volume of water to the volume of the cutting liquid in the second cutting mixture is 9-11.

[0046] Specifically, the ratio of the volume of water to the volume of the cutting liquid in the first cutting mixture can be 12, 12.5, 13, 13.3, 13.5, 14, etc., and the ratio of the volume of water to the volume of the cutting liquid in the first cutting mixture is preferably 40:3. The ratio of the volume of water to the volume of the cutting liquid in the second cutting mixture can be 9, 9.5, 9.8, 10, 10.5, 11, etc., and the ratio of the volume of water to the volume of the cutting liquid in the second cutting mixture is preferably 10. The first liquid supply tank is used for liquid supply in the first half of the cutting, and the second liquid supply tank is used for liquid supply in the second half of the cutting. The proportion of water in the second cutting mixture used in the second half of the cutting is low, and the proportion of cutting liquid is high, so that the silicon powder in the cutting seam can be quickly brought out during the second half of the cutting.

[0047] Reference Figure 1 and Figure 3 , the total liquid return pipe 6 is connected to multiple liquid return branches 7 through a diverter valve 8. Specifically, the diverter valve 8 has a diverter valve inlet and multiple diverter valve outlets, the diverter valve inlet is connected to the total liquid return pipe 6, and the multiple diverter valve outlets are respectively connected to multiple liquid return branches 7. When one of the liquid supply tanks 1 supplies liquid, the diverter valve outlet connected to the liquid return branch 7 connected to the liquid supply tank 1 is connected to the diverter valve inlet, and the diverter valve outlets connected to the liquid return branch 7 connected to other liquid supply tanks 1 are not connected to the diverter valve inlet. In the embodiment of the utility model, multiple liquid return branches 7 can be connected through the diverter valve 8, the structure is simple, and it is easy to control.

[0048] In other embodiments, reference Figure 2 , no diverter valve 8 is set, but a switch valve 10 is set on each liquid return branch pipe 7. When one liquid supply tank 1 supplies liquid, the switch valve 10 on the liquid return branch pipe 7 connected to the liquid supply tank 1 is opened, and the switch valves 10 on the liquid return branch pipes 7 connected to other liquid supply tanks 1 are closed.

[0049] Reference Figure 1 and Figure 3 Each liquid supply branch pipe 2 is provided with a liquid supply pump 5. Specifically, the liquid supply pump 5 can be a variable frequency pump, that is, the frequency of the liquid supply pump 5 can be adjusted. By providing the liquid supply pump 5, power can be provided for the supply of the cutting mixed liquid.

[0050] Reference Figure 1 and Figure 3, each liquid return branch pipe 7 is provided with a filter 9. Specifically, the filter 9 can be a filter valve. The filter 9 is used to filter impurities in the refluxed cutting mixed liquid to improve the cutting quality.

[0051] Reference Figure 4 The top and bottom of the liquid supply tank 1 are respectively provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to a liquid inlet pipe 11, and the liquid outlet is connected to a liquid outlet pipe 12.

[0052] Specifically, the liquid inlet pipe 11 is provided with a liquid inlet valve, and the liquid discharge pipe 12 is provided with a liquid discharge valve. After one cutting is completed, when the next cutting is performed, the cutting mixed liquid in the liquid supply tank 1 needs to be discharged through the liquid discharge pipe 12, and then new cutting mixed liquid is re-injected through the liquid inlet pipe 11 to prevent the silicon powder in the cutting mixed liquid refluxed last time from affecting the next cutting.

[0053] In a second aspect, the embodiment of the utility model further discloses a liquid supply control system, comprising any of the above-mentioned liquid supply devices. Since the liquid supply control system comprises the above-mentioned liquid supply device, it also has the beneficial effects of the above-mentioned liquid supply device, which will not be described in detail here.

[0054] The liquid supply control system provided by the embodiment of the utility model also includes a controller, and the liquid supply device includes a main liquid supply pipe 3 and at least two liquid supply tanks 1, each liquid supply tank 1 is connected to the main liquid supply pipe 3 through a liquid supply branch pipe 2, and each liquid supply branch pipe 2 is provided with a valve 4, and the controller is electrically connected to the valve 4. The controller is also used to be electrically connected to the displacement sensor in the slicer, and the displacement sensor is used to measure the cutting depth of the silicon rod. Specifically, the different stages of cutting can be determined according to the cutting depth of the silicon rod, and the controller is used to control the opening and closing of different valves 4 according to the cutting depth, so as to achieve the connection of different liquid supply tanks 1 at different stages of cutting.

[0055] The multiple valves 4 include a first valve and a second valve. The controller is used to control the first valve to open and the second valve to close when the cutting depth is less than a preset depth. The controller is also used to control the first valve to close and the second valve to open when the cutting depth is greater than or equal to a preset depth, wherein the preset depth is 90mm-120mm.

[0056] Specifically, when the liquid supply device includes two liquid supply tanks 1, the two liquid supply tanks 1 are respectively a first liquid supply tank and a second liquid supply tank, the first liquid supply tank is connected to the main liquid supply pipe 3 through a first liquid supply branch pipe, and the second liquid supply tank is connected to the main liquid supply pipe 3 through a second liquid supply branch pipe, a first valve is provided on the first liquid supply branch pipe, and a second valve is provided on the second liquid supply branch pipe. The first liquid supply tank is used to supply liquid in the first half of the cutting, and the second liquid supply tank is used to supply liquid in the second half of the cutting.

[0057] When the cutting depth is less than the preset depth, it indicates that it is in the first half of the cutting. At this time, the controller controls the first valve to open and the second valve to close, and the first liquid supply tank supplies liquid to the spray device 14 through the first liquid supply branch pipe and the main liquid supply pipe 3. When the cutting depth is greater than or equal to the preset depth, it indicates that it is in the second half of the cutting. At this time, the controller controls the first valve to close and the second valve to open, and the second liquid supply tank supplies liquid to the spray device 14 through the second liquid supply branch pipe and the main liquid supply pipe 3. The preset depth can be set according to actual needs, such as 90mm, 95mm, 100mm, 110mm, 115mm, 120mm, etc.

[0058] In a third aspect, the embodiment of the utility model further discloses a slicer, comprising any one of the above-mentioned liquid supply control systems. Since the slicer comprises the above-mentioned liquid supply control system, it also has the beneficial effects of the above-mentioned liquid supply control system, which will not be described in detail here.

[0059] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0060] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, which all fall within the protection of the utility model.

Claims

1. A liquid supply device, characterized in that: It includes a main liquid supply pipe and at least two liquid supply tanks, wherein the liquid supply tanks are used to hold a cutting mixed liquid, each of the liquid supply tanks is connected to the main liquid supply pipe through a liquid supply branch pipe, and at least two of the liquid supply tanks are used to provide a cutting mixed liquid to a spray device through the liquid supply branch pipe and the main liquid supply pipe in sequence during silicon rod processing.

2. The liquid supply device according to claim 1, characterized in that: The cutting mixture includes cutting liquid, and the proportion and / or components of the cutting liquid in the cutting mixture contained in at least two of the liquid supply tanks are inconsistent.

3. The liquid supply device according to claim 1, characterized in that: Each of the liquid supply branches is provided with a valve.

4. The liquid supply device according to any one of claims 1 to 3, characterized in that: It also includes a main liquid return pipe, and each of the liquid supply tanks is connected to the main liquid return pipe through a liquid return branch pipe.

5. The liquid supply device according to claim 2, characterized in that: The cutting mixture further comprises water, and the at least two liquid supply tanks comprise a first liquid supply tank and a second liquid supply tank, wherein the first liquid supply tank and the second liquid supply tank contain a first cutting mixture and a second cutting mixture respectively; The ratio of the volume of water to the volume of the cutting liquid in the first cutting mixture is 12-14, and the ratio of the volume of water to the volume of the cutting liquid in the second cutting mixture is 9-11.

6. The liquid supply device according to claim 4, characterized in that: The main liquid return pipe is connected to a plurality of liquid return branch pipes via a diverter valve.

7. The liquid supply device according to any one of claims 1 to 3, characterized in that: Each of the liquid supply branches is provided with a liquid supply pump.

8. The liquid supply device according to claim 4, characterized in that: Each of the liquid return branches is provided with a filter.

9. The liquid supply device according to any one of claims 1 to 3, characterized in that: The top and bottom of the liquid supply tank are respectively provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to a liquid inlet pipe, and the liquid outlet is connected to a liquid outlet pipe.

10. A liquid supply control system, characterized in that: A liquid supply device comprising the liquid supply device according to any one of claims 1 to 9.

11. The liquid supply control system according to claim 10, characterized in that: It also includes a controller, the liquid supply device includes a main liquid supply pipe and at least two liquid supply tanks, each of the liquid supply tanks is connected to the main liquid supply pipe through a liquid supply branch pipe, each of the liquid supply branch pipes is provided with a valve, the controller is electrically connected to the valve, and the controller is also used to be electrically connected to a displacement sensor in the slicer, and the displacement sensor is used to measure the cutting depth of the silicon rod.

12. The liquid supply control system according to claim 11, characterized in that: The multiple valves include a first valve and a second valve. The controller is used to control the first valve to open and the second valve to close when the cutting depth is less than a preset depth. The controller is also used to control the first valve to close and the second valve to open when the cutting depth is greater than or equal to the preset depth, wherein the preset depth is 90mm-120mm.

13. A slicer, characterized in that: The liquid supply control system comprises the liquid supply control system according to any one of claims 10 to 12.

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