Sintering mold of heat exchanger, heat exchanger, refrigeration equipment and quantum computer

Abstract

The utility model discloses a sintering mold of a heat exchanger, the heat exchanger, refrigeration equipment and a quantum computer, and the sintering mold comprises a first fixing frame and a second fixing frame which are detachably connected and clamp a metal substrate; the first fixing frame is provided with at least one first through hole for exposing part of the metal substrate; the second fixing frame is provided with at least one second through hole which exposes part of the metal substrate. The first through hole and the second through hole are both used for containing heat exchange pieces, so that the heat exchange pieces are allowed to be attached to the surface of the metal substrate to form a heat exchanger after the sintering mold is sintered; and the pressing blocks are pressed on the surfaces of the heat exchange sheets. By arranging the first fixing frame, the second fixing frame and the pressing block, the heat exchange pieces and the metal base plate are fixed, meanwhile, shaking of the heat exchange pieces and the metal base plate is avoided, the relative positions of the burnt heat exchange pieces and the metal base plate are limited, and the consistency and stability of the formed heat exchanger are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a sintering mold of a heat exchanger, a heat exchanger, a refrigeration device and a quantum computer. Background Art

[0002] Quantum computing is a new computing model that follows the laws of quantum mechanics to control basic information units for computing. Currently, there are two main types of quantum computer research and development: superconducting quantum computing and spin quantum computing based on semiconductor quantum dots. The core of both types of computing is quantum chips. The operating environment of superconducting quantum computing requires an extremely low temperature environment close to absolute zero, while semiconductor quantum computing requires a magnetic field environment of 1.5K.

[0003] The dilution refrigerator can maintain milliKelvin temperature for a long time, has a large cooling capacity, is not complicated in structure and operation, and is not affected by magnetic fields. It is an important refrigeration method for obtaining milliKelvin temperature and can provide a good low-temperature environment for the stable operation of quantum chips.

[0004] At present, the heat exchanger of millikelvin temperature in the dilution refrigerator usually adopts a sintered heat exchanger with high heat exchange efficiency. As an important component of the dilution refrigerator, the performance of the sintered heat exchanger will determine the lowest temperature that the dilution refrigerator can obtain. Generally, the sintered heat exchanger is formed by sintering the sintered heat exchanger plate on a metal substrate. Therefore, it is urgent to propose a sintering mold of the heat exchanger to limit the relative position of the sintered heat exchanger plate and the metal substrate, so as to ensure the consistency and stability of the heat exchanger after forming.

[0005] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0006] The utility model aims to provide a sintering mold, a heat exchanger, a refrigeration device and a quantum computer for a heat exchanger, so as to limit the relative position of a sintered heat exchanger plate and a metal substrate, thereby ensuring the consistency and stability of the heat exchanger after molding.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] The utility model provides a sintering mold for a heat exchanger in a first aspect. The heat exchanger comprises a metal substrate and a heat exchange plate to be loaded onto the metal substrate. The sintering mold comprises:

[0009] A first fixing frame and a second fixing frame are detachably connected to clamp the metal substrate; the first fixing frame is provided with at least one first through hole exposing a portion of the metal substrate; the second fixing frame is provided with at least one second through hole exposing a portion of the metal substrate; the first through hole and the second through hole are both used to accommodate heat exchanger fins, so as to allow the heat exchanger fins to be attached to the surface of the metal substrate to form the heat exchanger after sintering of the sintering mold;

[0010] The pressing block is pressed on the surface of the heat exchange plate.

[0011] The sintering mold of the heat exchanger as described above, further, the first fixing frame and the second fixing frame are connected by nuts and bolts to achieve a detachable connection between the first fixing frame and the second fixing frame;

[0012] Alternatively, the first fixing frame and the second fixing frame are respectively provided with a card slot and a card block that engage with each other, and the card slot and the card block are engaged with each other to achieve a detachable connection between the first fixing frame and the second fixing frame.

[0013] The sintering mold of the heat exchanger as described above, further, the metal substrate is provided with a first conduit and a second conduit, the first fixing frame is provided with a first positioning hole matching the outer diameter of the first conduit, and the second fixing frame is provided with a second positioning hole matching the outer diameter of the second conduit.

[0014] The sintering mold of the heat exchanger as described above, further, the pressing block includes at least one first pressing block and at least one second pressing block;

[0015] The first pressing block is arranged in one-to-one correspondence with the first through hole, and the end surface of the first pressing block close to the first through hole is embedded in the first through hole so as to be pressed on the surface of the heat exchange plate;

[0016] The second pressing blocks are arranged in one-to-one correspondence with the second through holes, and the end surface of the second pressing block close to the second through hole is embedded in the second through hole so as to be pressed on the surface of the heat exchange plate.

[0017] The sintering mold of the heat exchanger as described above further comprises a first fixing member located at an end surface of the first pressing block away from the heat exchange fins and a second fixing member located at an end surface of the second pressing block away from the heat exchange fins;

[0018] The first fixing member and the second fixing member are detachably connected so that the first pressing block and the second pressing block are pressed tightly onto the heat exchange plate.

[0019] As for the sintering mold of the heat exchanger as described above, further, the first fixing member and the second fixing member are provided with a plurality of second through holes corresponding to each other along the periphery, and the second through holes are used to fix the first fixing member and the second fixing member with bolts.

[0020] As for the sintering mold of the heat exchanger as described above, further, a first spring washer and a second spring washer are sleeved on the screw rod of the bolt, the first spring washer is attached to the upper end surface of the first fixing member, and the second spring washer is attached to the lower end surface of the second fixing member.

[0021] The second aspect of the utility model provides a heat exchanger, which is formed by sintering using the above-mentioned sintering mold. The heat exchanger includes a metal substrate, and at least one heat exchange fin is attached to two opposite end surfaces of the metal substrate.

[0022] A third aspect of the present invention provides a refrigeration device, wherein the refrigeration device includes the above-mentioned heat exchanger to provide the ambient temperature required by the quantum processor.

[0023] A fourth aspect of the utility model provides a quantum computer, comprising the above-mentioned refrigeration device and a quantum processor, wherein the quantum processor operates in the lowest temperature region of the refrigeration device.

[0024] The beneficial effects of the utility model are:

[0025] The mold of the present application fixes the metal substrate by setting a first fixing frame and a second fixing frame. The first fixing frame is provided with at least one first through hole exposing a part of the metal substrate; the second fixing frame is provided with at least one second through hole exposing a part of the metal substrate; the first through hole and the second through hole are both used to accommodate the heat exchanger, and a pressing block is pressed on the heat exchanger to make the heat exchanger and the metal substrate fit more closely; the heat exchanger is fixed on the metal substrate by high-temperature sintering to form a heat exchanger. The first fixing frame, the second fixing frame and the pressing block can fix the heat exchanger and the metal substrate, not only avoiding the shaking of the heat exchanger and the metal substrate, but also limiting the relative position of the sintered heat exchanger and the metal substrate, thereby ensuring the consistency and stability of the heat exchanger after forming.

[0026] The heat exchanger provided by the utility model is formed by sintering using the above-mentioned sintering mold, and thus has the same beneficial effects as the above-mentioned sintering mold, which will not be described in detail here.

[0027] The refrigeration equipment provided by the utility model includes the above-mentioned heat exchanger, and thus has the same beneficial effects as the above-mentioned heat exchanger, which will not be described in detail here.

[0028] The quantum computer provided by the utility model includes the above-mentioned refrigeration device, and thus has the same beneficial effects as the above-mentioned refrigeration device, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the explosion structure of the first sintering mold provided by the embodiment of the utility model;

[0030] Figure 2 A schematic diagram of the three-dimensional structure of a first sintering mold provided by an embodiment of the utility model;

[0031] Figure 3 A schematic diagram of the explosion structure of the second sintering mold provided by the embodiment of the utility model;

[0032] Figure 4 A schematic diagram of the three-dimensional structure of a second sintering mold provided by an embodiment of the utility model;

[0033] Figure 5 A schematic structural diagram of a third sintering mold provided by an embodiment of the utility model;

[0034] Figure 6 A schematic structural diagram of a fourth sintering mold provided by an embodiment of the utility model;

[0035] Figure 7 A schematic diagram of the structure of a bolt provided in an embodiment of the utility model;

[0036] Figure 8 A schematic structural diagram of a heat exchanger provided in an embodiment of the utility model.

[0037] In the reference numerals:

[0038] 10. First fixing frame; 11. First through hole; 20. Second fixing frame; 21. Second through hole; 30. Metal substrate; 40. Heat exchange plate; 50. First pressing block; 60. Second pressing block; 70. First conduit; 80. Second conduit; 90. First fixing member; 100. Second fixing member; 110. Bolt; 111. First spring washer; 112. Second spring washer; 120. Third pressing block; 130. Fourth pressing block. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.

[0040] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] Figure 1 A schematic diagram of the three-dimensional structure of a first sintering mold provided by an embodiment of the utility model; Figure 2 The first embodiment of the utility model provides a schematic diagram of the explosion structure of the sintering mold; Figure 1 and Figure 2 As shown: The embodiment of the present application discloses a sintering mold of a heat exchanger, wherein the heat exchanger includes a metal substrate 30 and a heat exchange plate to be loaded onto the metal substrate 30, and the sintering mold includes: a first fixing frame 10 and a second fixing frame 20 for clamping the metal substrate 30 through a detachable connection (specifically, the first fixing frame 10 and the second fixing frame 20 are respectively clamped on two opposite end surfaces of the metal substrate 30), the first fixing frame 10 is provided with at least one first through hole 11 exposing a portion of the metal substrate 30; the second fixing frame 20 is provided with at least one second through hole 21 exposing a portion of the metal substrate 30; the first through hole 11 and the second through hole 21 are both used to accommodate the heat exchange plate 40, so as to allow the heat exchange plate 40 to be attached to the surface of the metal substrate 30 after sintering of the sintering mold to form the heat exchanger; a pressing block, which is pressed on the surface of the heat exchange plate 40.

[0043] The mold of this embodiment fixes the metal substrate 30 by setting a first fixing frame 10 and a second fixing frame 20. The first fixing frame 10 is provided with at least one first through hole 11 exposing a part of the metal substrate 30; the second fixing frame 20 is provided with at least one second through hole 21 exposing a part of the metal substrate 30; the first through hole 11 and the second through hole 21 are both used to accommodate the heat exchanger 40, and a pressing block is pressed on the heat exchanger 40 so that the heat exchanger 40 and the metal substrate 30 fit more closely; the heat exchanger 40 is fixed on the metal substrate 30 by high-temperature sintering to form a heat exchanger. The first fixing frame 10, the second fixing frame 20 and the pressing block can fix the heat exchanger 40 and the metal substrate 30, and not only avoid the shaking of the heat exchanger 40 and the metal substrate 30, but also limit the relative position of the sintered heat exchanger 40 and the metal substrate 30, so as to ensure the consistency and stability of the heat exchanger after forming.

[0044] In this embodiment, the heat exchanger fin 40 is a heat exchanger fin 40 formed by sintering using a specific sintering tool, and its shape is not specifically limited, and may be an arc shape, a U shape, or other shapes.

[0045] In this embodiment, the number of the first through holes 11 is not specifically limited, and can be 1, 2, or other numbers. The shape of the first through hole 11 is not specifically limited, and can match the shape of the heat exchange fin 40 accommodated therein. Specifically, the heat exchange fin 40 in the first through hole 11 is gap-matched with the first through hole 11. In this embodiment, the number of the second through holes 21 is not specifically limited, and can be 1, 2, or other numbers. The shape of the second through hole 21 is not specifically limited, and can match the shape of the heat exchange fin 40 accommodated therein. Specifically, the heat exchange fin 40 in the second through hole 21 is gap-matched with the first through hole 11.

[0046] In this embodiment, the relationship between the first through hole 11 and the second through hole 21 is limited by the specific structure of the heat exchanger. In some implementations of this embodiment, the number and shape of the first through hole 11 and the second through hole 21 are consistent, and the projections of the first through hole 11 and the second through hole 21 on the metal substrate 30 completely overlap. For example, Figure 1 As shown: two first through holes 11 are provided on the first fixed frame 10, and the two first through holes 11 are arranged axially symmetrically around the central axis of the first fixed frame 10; two second through holes 21 are provided on the second fixed frame 20, and the two second through holes 21 are arranged axially symmetrically around the central axis of the second fixed frame 20, the first through hole 11 and the second through hole 21 have the same shape, both are arc-shaped, and the projections of the first through hole 11 and the second through hole 21 on the metal substrate 30 completely overlap.

[0047] In this embodiment, the shape and number of the pressing blocks are not specifically limited, as long as they are pressed on the surface of the heat exchanger fin 40. In order to ensure the compaction effect on the heat exchanger fin 40, in some implementations of this embodiment, the pressing blocks include at least one first pressing block 50 and at least one second pressing block 60; the first pressing blocks 50 are arranged in a one-to-one correspondence with the first through holes 11, and the end faces of the first pressing blocks 50 close to the first through holes 11 are embedded in the first through holes 11 to be pressed on the surface of the heat exchanger fin 40; the second pressing blocks 60 are arranged in a one-to-one correspondence with the second through holes 21, and the end faces of the second pressing blocks 60 close to the second through holes 21 are embedded in the second through holes 21 to be pressed on the surface of the heat exchanger fin 40.

[0048] For example, Figure 1 As shown: the pressing blocks include two first pressing blocks 50 and two second pressing blocks 60, the two first pressing blocks 50 are arranged in a one-to-one correspondence with the two first through holes 11, and the end surfaces of the first pressing blocks 50 close to the first through holes 11 are embedded in the first through holes 11 to be pressed on the surface of the heat exchanger fin 40; the two second pressing blocks 60 are arranged in a one-to-one correspondence with the two second through holes 21, and the end surfaces of the second pressing blocks 60 close to the second through holes 21 are embedded in the second through holes 21 to be pressed on the surface of the heat exchanger fin 40.

[0049] In one implementation of the embodiment of the present application, metal powder is laid on the surface of the metal substrate 30 in the area of ​​the first through hole 11 and the second through hole 21. In this embodiment, metal powder is first laid on the surface of the metal substrate 30 in the area of ​​the first through hole 11 and the second through hole 21, and then the heat exchanger fin 40 is placed in the first through hole 11 and the second through hole 21, covered with metal powder. During sintering, the sintering tooling fixes the metal substrate 30 and the heat exchanger fins 40 at both end surfaces by the stickiness of the metal powder after high temperature heating, thereby ensuring the structural stability after sintering.

[0050] In this embodiment, the implementation method of the detachable connection between the first fixing frame 10 and the second fixing frame 20 is not specifically limited; two methods are given below as specific examples.

[0051] Example 1: Figure 3 A schematic diagram of the three-dimensional structure of a second sintering mold provided by an embodiment of the utility model; Figure 4 The exploded structure diagram of the second sintering mold provided by the embodiment of the utility model is as follows; Figure 3 and Figure 4As shown: the first fixing frame 10 and the second fixing frame 20 are connected by nuts and bolts or fixed by screws to achieve a detachable connection between the first fixing frame 10 and the second fixing frame 20. In this example, in order to further improve the effect of sandwiching the metal substrate 30 between the first fixing frame 10 and the second fixing frame 20, a plurality of screws are arranged, specifically including a plurality of screws evenly spaced along the periphery of the first fixing frame 10 and the second fixing frame 20 and screws arranged at the center of the first fixing frame 10 and the second fixing frame 20.

[0052] Example 2: The first fixed frame 10 and the second fixed frame 20 are respectively provided with mutually engaging slots and blocks, and the slots and blocks are engaged with each other to achieve a detachable connection between the first fixed frame 10 and the second fixed frame 20. In this example, in order to further improve the effect of clamping the metal substrate 30 between the first fixed frame 10 and the second fixed frame 20, the slots and blocks can also be matched and arranged in multiple pairs, specifically including multiple pairs evenly spaced along the periphery of the first fixed frame 10 and the second fixed frame 20 and a pair arranged at the center of the first fixed frame 10 and the second fixed frame 20. In addition, the slots and blocks in this embodiment can also be replaced by mutually matching positioning holes and positioning columns.

[0053] Continue as Figure 3 and Figure 4 As shown, in order to further accurately control the relative positions of the metal substrate 30, the first fixed frame 10, and the second fixed frame 20, the metal substrate 30 is provided with a first conduit 70 and a second conduit 80, the first fixed frame 10 is provided with a first positioning hole matching the outer diameter of the first conduit 70, and the second fixed frame 20 is provided with a second positioning hole matching the outer diameter of the second conduit 80. By setting the first positioning control and the first conduit 70, the relative positions of the metal substrate 30 and the first fixed frame 10 are accurately positioned; by setting the second positioning control and the second conduit 80, the relative positions of the metal substrate 30 and the second fixed frame 20 are accurately positioned.

[0054] Figure 5 The schematic diagram of the structure of the third sintering mold provided by the embodiment of the utility model is as follows: Figure 5 As shown: The embodiment of the present application discloses a sintering mold for a heat exchanger. Figure 5The sintering mold further includes a first fixing member 90 located at one end face of the first pressing block 50 away from the heat exchange fin 40 and a second fixing member 100 located at one end face of the second pressing block 60 away from the heat exchange fin 40; the first fixing member 90 and the second fixing member 100 are detachably connected to press the first pressing block 50 and the second pressing block 60 onto the heat exchange fin 40. The first fixing member 90 and the second fixing member 100 press the first pressing block 50 and the second pressing block 60, and then press the heat exchange fin 40 pressed by the first pressing block 50 and the second pressing block 60 onto the metal substrate 30, thereby ensuring the performance of the heat exchanger formed after sintering.

[0055] Continue as Figure 5 As shown, in some implementations of the present embodiment, the first fixing member 90 and the second fixing member 100 are provided with a plurality of second through holes 21 corresponding to each other along the periphery, and the second through holes 21 are used for fixing the first fixing member 90 and the second fixing member 100 with bolts 110. Specifically, the sizes of the first fixing member 90 and the second fixing member 100 are respectively larger than the sizes of the first pressing block 50 and the second pressing block 60, and a plurality of second through holes 21 corresponding to each other are provided on the outer periphery of the first fixing member 90 and the second fixing member 100, and the first fixing member 90 and the second fixing member 100 are fastened and connected by fastening with bolts 110 through the third through holes, so as to ensure the fixing and pressing effect of the first pressing block 50, the first fixing frame 10, the metal substrate 30, the second fixing frame 20 and the second pressing block 60 after loading.

[0056] Figure 7 A schematic diagram of the structure of a bolt 110 provided in an embodiment of the utility model; Figure 5 and Figure 7 As shown: In some implementations of the present embodiment, the first spring washer 111 and the second spring washer 112 are sleeved on the screw rod of the bolt 110, the first spring washer 111 is attached to the upper end surface of the first fixing member 90, and the second spring washer 112 is attached to the lower end surface of the second fixing member 100. By providing the first spring washer 111 and the second spring washer 112, the fixing and pressing effect of the first pressing block 50, the first fixing frame 10, the metal substrate 30, the second fixing frame 20 and the second pressing block 60 after loading is further ensured; in addition, the resilience of the first spring washer 111 and the second spring washer 112 can also be relied on to provide the mold pressure loss caused by the sintering shrinkage of the metal powder.

[0057] Figure 6 A schematic diagram of the structure of a fourth sintering mold provided by an embodiment of the utility model, as shown in Figure 6 As shown: The embodiment of the present application discloses a sintering mold for a heat exchanger. Figure 6On the basis of the sintering mold, it also includes a third pressing block 120 fixed to the side of the first fixing member 90 away from the first pressing block 50 and a fourth pressing block 130 fixed to the side of the second fixing member 100 away from the second pressing block 60. By setting the third pressing block 120 and the fourth pressing block 130, the radial position of the first fixing member 90 and the second fixing member 100 can be fixed to avoid uneven force on the first fixing member 90 and the second fixing member 100 due to the tightening of the bolt 110, thereby affecting the fixing effect. In the specific implementation, the shape of the third pressing block 120 and the fourth pressing block 130 can be directly circular, square and other shapes; it can be a solid metal column or a hollow metal column. In this embodiment, a hollow circular metal column is preferably used for easy contact and heat conduction.

[0058] Furthermore, in order to ensure uniform force on the metal substrate 30 and the heat exchange plate 40, the third pressing block 120, the fourth pressing block 130, the first fixing member 90, the second fixing member 100, the first fixing frame 10, and the second fixing frame 20 are all arranged coaxially with the metal substrate 30.

[0059] The assembly and use steps of the sintering mold in this embodiment specifically include: firstly, attaching the first fixing frame 10 and the second fixing frame 20 to the two end surfaces of the metal substrate 30 and fixing them with screws, then applying metal powder in the first through hole 11 of the first fixing frame 10, and placing the heat exchange plate 40 on the surface of the metal powder in the first through hole 11, and then pressing the first pressing block 50 on the surface of the heat exchange plate 40 in the first through hole 11; then installing the first fixing member 90 on the first pressing block 50; turning over, and arranging the metal powder, the heat exchange plate 40, the second pressing block 60, and the second fixing member 100 in turn according to the above steps; finally, installing the third pressing block 120 and the fourth pressing block 130 on the end surfaces of the first fixing member 90 and the second fixing member 100 respectively, and tightening the bolts 110 to complete the assembly of the sintering mold.

[0060] Based on the same application concept, the embodiment of the present application also provides a heat exchanger, which is formed by sintering using the above sintering mold, and the heat exchanger includes a metal substrate 30, and at least one heat exchange fin 40 is attached to the upper end surface and the lower end surface of the metal substrate 30. For example, Figure 8 A schematic diagram of the structure of a heat exchanger provided in an embodiment of the utility model; Figure 8 As shown, the heat exchanger includes a circular metal substrate 30, and two heat exchange fins 40 are attached to the upper and lower end surfaces of the metal substrate 30. The heat exchanger of the present application is sintered by the above sintering mold, so it has the same beneficial effects as the above sintering mold, which will not be repeated here.

[0061] Based on the same application concept, the embodiment of the present application also provides a refrigeration device, which includes the above heat exchanger to provide the ambient temperature required by the quantum processor. The refrigeration device of the present application includes the above heat exchanger, so it has the same beneficial effects as the above heat exchanger, which will not be repeated here.

[0062] Based on the same application concept, the embodiment of the present application also provides a quantum computer, including the above-mentioned refrigeration device and a quantum processor, wherein the quantum processor operates in the lowest temperature region of the refrigeration device. The quantum computer of the present application includes the above-mentioned refrigeration device, and thus has the same beneficial effects as the above-mentioned refrigeration device, which will not be described in detail here.

[0063] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0064] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A sintering mold for a heat exchanger, the heat exchanger comprising a metal substrate and a heat exchanger sheet to be loaded onto the metal substrate, characterized in that: The sintering mold comprises: A first fixing frame and a second fixing frame are detachably connected to clamp the metal substrate; the first fixing frame is provided with at least one first through hole exposing a portion of the metal substrate; the second fixing frame is provided with at least one second through hole exposing a portion of the metal substrate; the first through hole and the second through hole are both used to accommodate heat exchanger fins, so as to allow the heat exchanger fins to be attached to the surface of the metal substrate to form the heat exchanger after sintering of the sintering mold; A pressing block, pressed on the surface of the heat exchange plate; The metal substrate is provided with a first conduit and a second conduit, the first fixing frame is provided with a first positioning hole matching the outer diameter of the first conduit, and the second fixing frame is provided with a second positioning hole matching the outer diameter of the second conduit.

2. The sintering mold for the heat exchanger according to claim 1, characterized in that: The first fixing frame and the second fixing frame are connected by nuts and bolts to achieve a detachable connection between the first fixing frame and the second fixing frame; Alternatively, the first fixing frame and the second fixing frame are respectively provided with a card slot and a card block that engage with each other, and the card slot and the card block are engaged with each other to achieve a detachable connection between the first fixing frame and the second fixing frame.

3. The sintering mold for the heat exchanger according to claim 1, characterized in that: The pressing block includes at least one first pressing block and at least one second pressing block; The first pressing block is arranged in one-to-one correspondence with the first through hole, and the end surface of the first pressing block close to the first through hole is embedded in the first through hole so as to be pressed on the surface of the heat exchange plate; The second pressing blocks are arranged in one-to-one correspondence with the second through holes, and the end surface of the second pressing block close to the second through hole is embedded in the second through hole so as to be pressed on the surface of the heat exchange plate.

4. The sintering mold for the heat exchanger according to claim 3, characterized in that: It also includes a first fixing member located at an end surface of the first pressing block away from the heat exchange fin and a second fixing member located at an end surface of the second pressing block away from the heat exchange fin; The first fixing member and the second fixing member are detachably connected so that the first pressing block and the second pressing block are pressed tightly onto the heat exchange plate.

5. The sintering mold for the heat exchanger according to claim 4, characterized in that: The first fixing member and the second fixing member are provided with a plurality of second through holes corresponding to each other along the periphery, and the second through holes are used for fixing the first fixing member and the second fixing member with bolts.

6. The sintering mold for the heat exchanger according to claim 5, characterized in that: A first spring washer and a second spring washer are sleeved on the screw rod of the bolt. The first spring washer is attached to the upper end surface of the first fixing member, and the second spring washer is attached to the lower end surface of the second fixing member.

7. A heat exchanger, characterized in that: The heat exchanger is sintered by using the sintering mold according to any one of claims 1 to 6, wherein the heat exchanger comprises a metal substrate, and at least one heat exchange fin is attached to two opposite end surfaces of the metal substrate.

8. A refrigeration device, characterized in that: The refrigeration device includes the heat exchanger as claimed in claim 7 to provide the ambient temperature required by the quantum processor.

9. A quantum computer, characterized in that: The invention comprises the refrigeration device as claimed in claim 8 and a quantum processor, wherein the quantum processor operates in the lowest temperature region of the refrigeration device.

Images