Solid state disk assembly and computer

Abstract

The embodiment of the utility model provides a solid state disk assembly and a computer. The solid state disk assembly comprises a heat dissipation part, a hard disk mainboard and a fixing part, the fixing part comprises a spring support and a fixing piece provided with a containing cavity and a plurality of buckles. The spring support abuts against at least one part of the heat dissipation component and is used for providing pre-pressure for fixing the heat dissipation component in the containing cavity. The hard disk mainboard is connected with the heat dissipation part, and the hard disk mainboard can be fixed in the accommodating cavity through the heat dissipation part; and when the spring bracket and the buckle are clamped with each other, the spring bracket forms pre-pressure. According to the solid state disk assembly, the spring support and the fixing piece with the containing cavity and the buckle are additionally arranged, and the hard disk mainboard and the radiator are fixed through mutual cooperation between the spring support and the fixing piece; compared with a traditional solid state disk assembly, the solid state disk assembly has the advantage of being convenient to assemble, so that the assembling efficiency can be effectively improved, and the time cost and the manpower cost can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, and in particular to a solid state hard disk component and a computer. Background Art

[0002] Solid-state disk (SSD) is a computer storage device that mainly uses flash memory as permanent memory. Since M.2 solid-state disk (M.2 is an interface standard with the advantages of small size and high-speed storage), M.2 solid-state disk can show better performance in a smaller size, therefore, M.2 solid-state disk has gradually become the future trend of solid-state disk technology development.

[0003] At present, most of the M.2 solid-state drive heat dissipation components on the market are often fixed with screws during installation. This assembly method is not simple enough, which not only affects work efficiency, but also wastes manpower, thereby increasing the time cost of assembling solid-state drive components and increasing labor costs. Utility Model Content

[0004] The solid state hard disk assembly and the computer provided by the utility model are intended to solve at least one defect of the existing solid state hard disk assembly.

[0005] In a first aspect, the utility model provides a solid state hard disk assembly. The solid state hard disk assembly includes: a heat dissipation component and a hard disk mainboard; and also includes:

[0006] A fixing component; the fixing component comprises: a spring bracket and a fixing component with a receiving cavity; the fixing component is provided with a plurality of buckles;

[0007] The spring bracket abuts against at least a portion of the heat dissipation component and is used to provide a pre-pressure to fix the heat dissipation component in the accommodating cavity;

[0008] The hard disk mainboard is connected to the heat dissipation component, and the hard disk mainboard can be fixed in the accommodating cavity through the heat dissipation component;

[0009] Wherein, when the spring bracket and the buckle are locked with each other, the spring bracket forms the pre-pressure.

[0010] In some embodiments, the hard disk motherboard includes:

[0011] A PCB board and a plurality of functional modules; the plurality of functional modules are arranged on the PCB board.

[0012] In some embodiments, the heat dissipation component includes:

[0013] Heat dissipation aluminum extrusion; the heat dissipation aluminum extrusion comprises: a heat dissipation substrate and a plurality of heat dissipation fins protruding from the surface of the heat dissipation substrate;

[0014] Wherein, the spring bracket passes through the heat dissipation fins and abuts against the heat dissipation substrate.

[0015] In some embodiments, the heat dissipation component further includes:

[0016] A first thermally conductive pad and a plurality of second thermally conductive pads;

[0017] Wherein, the first thermally conductive pad is attached to the surface of the PCB board facing away from the functional module; each of the second thermally conductive pads is attached to the surface of the corresponding functional module.

[0018] In some embodiments, when the heat dissipation component is fixed in the accommodating cavity, the first thermally conductive gasket may abut against the bottom surface of the accommodating cavity, so that the heat generated on the PCB board is transferred to the fixing member.

[0019] In some embodiments, when the heat dissipation component is fixed in the accommodating cavity, the second thermal conductive gasket may abut against the surface of the heat dissipation substrate facing away from the heat dissipation fins, so that the heat generated on the functional module is transferred to the heat dissipation aluminum extrusion.

[0020] In some embodiments, the fixing member comprises:

[0021] A bottom plate and a pair of back plates; the pair of back plates both protrude from the surface of the bottom plate to enclose and form the accommodating cavity;

[0022] Wherein, the back plate has protrusions at two ends which are away from each other in the length direction; and the buckle is arranged at the end of the protrusion away from the bottom plate.

[0023] In some embodiments, the spring support comprises:

[0024] horizontal pieces and diagonal pieces;

[0025] One end of the horizontal member is provided with a snap-fit ​​head; the other end of the horizontal member is connected to one end of the oblique member to form an extrusion portion; the other end of the oblique member is provided with a hook;

[0026] In response to the formation of the pre-pressure, the pressing portion may abut against the surface of the heat dissipation substrate.

[0027] In some embodiments, in the locked position, the hook and the engaging head are correspondingly locked in a plurality of the buckles, so that the spring bracket provides the pre-pressure to fix the heat dissipation component and the hard disk motherboard in the accommodating cavity of the fixing member;

[0028] When in the unlocked position, the hook and the engaging head are disengaged from the corresponding plurality of buckles, so that the heat dissipation component and the hard disk mainboard can be separated from the fixing member.

[0029] In a second aspect, the utility model provides a computer. The computer comprises: a computer body and the above-mentioned solid state hard disk assembly;

[0030] Wherein, the solid state hard disk component is fixed in the computer body.

[0031] At least one beneficial effect of the solid-state hard disk assembly and computer provided by the embodiments of the utility model is: a new type of solid-state hard disk assembly is proposed, by adding a spring bracket and a fixing member with a accommodating cavity and a buckle, the solid-state hard disk assembly realizes the fixation between the hard disk mainboard and the radiator through the mutual cooperation between the spring bracket and the fixing member; compared with the traditional solid-state hard disk assembly, the solid-state hard disk assembly can not only remove the conventional screw locking, but also better fix the hard disk mainboard and the heat dissipation components, and has the advantage of easy assembly, thereby effectively improving the assembly efficiency and effectively reducing the time cost and manpower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent the same elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0033] Figure 1 A schematic diagram of the structure of a solid state drive assembly provided by an embodiment of the utility model;

[0034] Figure 2 A schematic diagram of an exploded view of a solid state drive assembly provided in an embodiment of the utility model.

[0035] : 100, solid state drive assembly; 1, heat dissipation component; 11, heat dissipation aluminum extrusion; 12, first thermally conductive gasket; 13, second thermally conductive gasket; 111, heat dissipation substrate; 112, heat dissipation fins; 2, hard disk main board; 21, PCB board; 22, functional module; 3, fixing component; 31, spring bracket; 32, fixing piece; 311, horizontal piece; 312, oblique piece; 321, bottom plate; 322, back plate; 3101, extrusion part; 3111, snap-fit ​​head; 3121, hook; 3201, accommodating cavity; 3202, length direction; 3221, protrusion; 3222, buckle. DETAILED DESCRIPTION

[0036] The present invention is described in detail below in conjunction with specific embodiments. It should be emphasized that the following description is merely illustrative and is not intended to limit the scope and application of the present invention.

[0037] It should be noted that, unless otherwise clearly specified and limited, the terms "inside", "length direction", "departure", "protruding from", "departing from each other", "detached", "separated", etc. used in this specification to indicate the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. The terms such as "installation", "fitting", "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; "fixation" can be bolt fixation, snap fixation or glue fixation; the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, the features specified as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" or "several" means two or more; in addition, "and / or" includes any and all combinations of one or more related listed items; for ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances.

[0038] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] In this embodiment, the specific shape, structure, size, etc. of the "solid state drive assembly" is not limited, and those skilled in the art may selectively use any appropriate implementation method according to actual needs.

[0040] Figure 1 A schematic structural diagram of a solid state drive assembly provided in an embodiment of the utility model. Figure 2 A schematic diagram of an exploded view of a solid state drive assembly provided in an embodiment of the utility model.

[0041] See also Figure 1 and Figure 2 The solid state drive assembly 100 includes: a heat dissipation component 1 and a hard disk mainboard 2.

[0042] The solid state drive assembly 100 further includes: a fixing component 3 .

[0043] The fixing component 3 includes a spring bracket 31 and a fixing member 32 .

[0044] In addition, the fixing member 32 has a receiving cavity 3201 , and a plurality of buckles 3222 are provided on the fixing member 32 .

[0045] It can be understood that the spring bracket 31 abuts against at least a portion of the heat dissipation component 1 and is used to provide a pre-pressure to fix the heat dissipation component 1 in the accommodating cavity 3201 .

[0046] It should be noted that the hard disk mainboard 2 is connected to the heat dissipation component 1 , and the hard disk mainboard 2 can be fixed in the accommodating cavity 3201 through the heat dissipation component 1 .

[0047] Specifically, when the spring bracket 31 and the buckle 3222 are locked with each other, the spring bracket 31 forms a pre-pressure.

[0048] In some embodiments, reference Figure 2 It can be seen that the hard disk mainboard 2 includes: a PCB board 21 and a plurality of functional modules 22 .

[0049] In the embodiment of the present application, a plurality of functional modules 22 are arranged on the PCB board 21 .

[0050] Specifically, the hard disk motherboard 2 can be an M.2 solid-state hard disk; wherein, the M.2 solid-state hard disk has the advantages of high performance and low power consumption; in addition, the M.2 solid-state hard disk adopts the M.2 interface standard and uses high-speed communication protocols (for example, PCIe (Peripheral Component Interconnect Express) and SATA (Serial Advanced Technology Attachment); wherein, PCI (Peripheral Component Interconnect) is a bus standard for connecting internal and external devices of a computer, PCI provides the ability of high-speed data transmission, allowing the computer to communicate with various external devices (such as graphics cards, sound cards, network cards, etc.), and the characteristics of the PCI bus are pluggability and hot-swap functions; in addition, ATA (Advanced Technology Attachment) is an interface standard for hard disk drives and other storage devices, ATA defines the specifications of data transmission and control signals, enabling computers to read and write data in storage devices, and the ATA interface is generally used to connect hard disk drives and optical disk drives, providing high-speed data transmission and easy-to-use characteristics), and can be directly connected to the M.2 slot on the corresponding component of the computer (not shown in the figure) (for example, the host of a desktop computer or the motherboard of a laptop computer).

[0051] It should be noted that the M.2 solid-state drive has a smaller size than the traditional 2.5-inch solid-state drive and is suitable for installation in computers with limited space (for example, laptops or ultra-thin desktops); among them, the M.2 solid-state drive does not require a data cable or a power cable, but only needs to be connected to the hard disk motherboard 2 through the above-mentioned M.2 slot, so the assembly method of the M.2 solid-state drive is simpler and more convenient.

[0052] It is understandable that the M.2 solid-state drive has a higher data transfer speed and random read and write performance, which can significantly improve the computer startup speed, application loading speed and file transfer speed; among them, the M.2 solid-state drive also has lower power consumption and higher durability, which is more durable and reliable than traditional mechanical hard drives.

[0053] Specifically, M.2 solid-state drives can be divided into two interfaces according to the type of internal chip: PCIe interface and SATA interface; among them, the M.2 solid-state drive with PCIe interface is faster and suitable for users with higher performance requirements; while the M.2 solid-state drive with SATA interface is slightly slower and suitable for general users and office environments.

[0054] In some embodiments, Figure 2 As shown, the heat dissipation component 1 includes:

[0055] Heat dissipation aluminum extrusion 11; the heat dissipation aluminum extrusion 11 comprises: a heat dissipation substrate 111 and a plurality of heat dissipation fins 112 protruding from the surface of the heat dissipation substrate 111;

[0056] The spring bracket 31 passes through the heat dissipation fins 112 and abuts against the heat dissipation substrate 111 .

[0057] In the embodiment of the present application, the heat dissipation aluminum extrusion is a heat dissipation device formed by extrusion processing using aluminum material; the heat dissipation aluminum extrusion is generally used in electronic equipment, computers and other high-power equipment to help dissipate heat and reduce temperature.

[0058] It should be noted that the main function of the heat dissipation aluminum extrusion is to quickly conduct the heat generated on the hard disk motherboard 2 to the heat dissipation substrate 111 through the first thermal conductive gasket 12 and several second thermal conductive gaskets 13, and release the heat to the surrounding environment through natural convection acting on the heat dissipation fins 112 or auxiliary fans and other heat dissipation methods.

[0059] It is understandable that, in the heat dissipation aluminum extrusion 11, the heat dissipation fins are usually slender to increase the heat dissipation surface area; in addition, the heat dissipation aluminum extrusion 11 can also be customized according to specific needs to meet the heat dissipation requirements of different computers.

[0060] In summary, the heat dissipation aluminum extrusion 11 improves the heat dissipation efficiency of the heat dissipation device by utilizing the thermal conductivity and heat dissipation performance of the aluminum material, thereby ensuring the stability and reliability of the computer when it runs at high load for a long time.

[0061] In some embodiments, Figure 2 It can be seen that the heat dissipation component 1 also includes:

[0062] A first thermally conductive pad 12 and a plurality of second thermally conductive pads 13;

[0063] The first thermally conductive pad 12 is attached to the surface of the PCB board 21 away from the functional module 22 ; and each second thermally conductive pad 13 is attached to the surface of the corresponding functional module 22 .

[0064] In the embodiment of the present application, the first thermally conductive pad 12 and the plurality of second thermally conductive pads 13 are generally made of a thermally conductive material (eg, silica gel or silicone grease) and have good thermal conductivity and insulation properties.

[0065] Specifically, the main functions of the first thermally conductive pad 12 and the second thermally conductive pad 13 include: improving heat transfer efficiency, providing electrical insulation and anti-aging.

[0066] Among them, the first thermally conductive gasket 12 can fill the gap between the surface of the PCB board 21 and the bottom plate 321 of the fixing member 32, and the second thermally conductive gasket 13 can fill the gap between the surface of several functional modules and the heat dissipation substrate 111 of the heat dissipation aluminum extrusion 11, thereby eliminating the obstruction of the air layer to heat transfer and effectively improving the heat transfer efficiency.

[0067] In addition, each functional module 22 has various components. Since each component has different sizes and different thermal expansion coefficients, stress concentration problems may occur. The second thermal conductive gasket 13 can provide preset flexibility and elasticity to make the connection between each component and the heat dissipation aluminum extrusion 11 smoother, effectively alleviating the problem of stress concentration.

[0068] Moreover, the first thermally conductive gasket 12 usually has excellent electrical insulation performance, which can isolate the current between the PCB board and the fixing part 32, and the second thermally conductive gasket 13 also has excellent electrical insulation performance, which can isolate the current between each component and the heat dissipating aluminum extrusion 11, thereby avoiding circuit short circuits and helping to protect the hard disk motherboard 2 from electrical interference and damage.

[0069] Furthermore, the first thermally conductive gasket 12 and the second thermally conductive gasket 13 also have a certain high temperature resistance performance, can work stably for a long time on the hard disk motherboard 2 with high-power components, and are not easy to age and deteriorate, thereby effectively improving the service life of the first thermally conductive gasket 12 and the second thermally conductive gasket 13; at the same time, the hard disk motherboard 2 will not cause untimely heat conduction due to the aging of the first thermally conductive gasket 12 and the second thermally conductive gasket 13, thereby indirectly improving the service life of the hard disk motherboard 2.

[0070] In some embodiments, in combination Figure 1 and Figure 2 It can be seen that when the heat dissipation component 1 is fixed in the accommodating cavity 3201 , the first thermally conductive pad 12 can abut against the bottom surface of the accommodating cavity 3201 , so that the heat generated on the PCB board 21 is transferred to the fixing member 32 .

[0071] In some embodiments, according to Figure 1 and Figure 2 It can be seen that when the heat dissipation component 1 is fixed in the accommodating cavity 3201 , the second thermally conductive pad 13 can abut against the surface of the heat dissipation substrate 111 away from the heat dissipation fins 112 , so that the heat generated on the functional module 22 is transferred to the heat dissipation aluminum extrusion 11 .

[0072] In some embodiments, Figure 2 As shown, the fixing member 32 includes a bottom plate 321 and a pair of back plates 322 .

[0073] It should be noted that the pair of back plates 322 both protrude from the surface of the bottom plate 321 to enclose and form the accommodating cavity 3201 .

[0074] It can be understood that the back plate 322 has protrusions 3221 at two ends that are away from each other in the length direction 3202 ; and the buckle 3222 is arranged at the end of the protrusion 3221 away from the bottom plate 321 .

[0075] In some embodiments, please refer to Figure 1 and Figure 2 The spring support 31 includes a horizontal member 311 and an inclined member 312 .

[0076] One end of the horizontal piece 311 is provided with a locking head 3111 ; the other end of the horizontal piece 311 is connected to one end of the oblique piece 312 to form an extrusion portion 3101 ; the other end of the oblique piece 312 is provided with a hook 3121 .

[0077] In addition, in response to the formation of the pre-pressure, the pressing portion 3101 may abut against the surface of the heat dissipation substrate 111 .

[0078] In the embodiment of the present application, the spring bracket 31 may be made of a metal material having elastic deformation capability, or may be made of a plastic material having elastic deformation capability.

[0079] In some embodiments, in combination Figure 1 and Figure 2 It can be seen that when in the locked position, the hook 3121 and the engaging head 3111 are correspondingly locked in a plurality of buckles 3222, so that the spring bracket 31 provides pre-pressure to fix the heat dissipation component 1 and the hard disk motherboard 2 in the accommodating cavity 3201 of the fixing member 32.

[0080] Furthermore, when in the unlocked position, the hook 3121 and the engaging head 3111 are disengaged from the corresponding plurality of buckles 3222 , so that both the heat dissipation component 1 and the hard disk mainboard 2 can be separated from the fixing member 32 .

[0081] See also Figure 1 and Figure 2 The computer includes: a computer body (not shown in the figure) and the above-mentioned solid-state hard disk assembly 100; and the solid-state hard disk assembly 100 is fixed in the above-mentioned computer body.

[0082] Specifically, the computer can be a desktop computer or a laptop computer; if it is a desktop computer, the computer body includes a host (that is, the hard disk motherboard 2 is directly plugged into the M.2 slot on the host); if it is a laptop computer, the computer body includes a motherboard (that is, the hard disk motherboard 2 is directly plugged into the M.2 slot on the motherboard).

[0083] In summary, the solid state drive assembly and computer provided by the embodiment of the utility model, by adding a spring bracket and a fixing member with a receiving cavity and a buckle, the solid state drive assembly realizes the fixation between the hard disk motherboard and the heat sink through the mutual cooperation between the spring bracket and the fixing member; compared with the traditional solid state drive assembly, the solid state drive assembly can not only remove the conventional screw locking, but also better fix the hard disk motherboard and the heat dissipation component, and has the advantage of being easy to assemble, thereby effectively improving the assembly efficiency and effectively reducing the time cost and manpower. Therefore, the solid state drive assembly provided by the embodiment of the utility model has a certain novelty compared with the traditional solid state drive assembly.

[0084] The above contents are further detailed descriptions of the present invention in combination with specific / preferred implementations, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A solid state drive assembly, comprising: Heat dissipation components and hard disk mainboard; characterized in that it also includes: A fixing component; the fixing component comprises: a spring bracket and a fixing component with a receiving cavity; the fixing component is provided with a plurality of buckles; The spring bracket abuts against at least a portion of the heat dissipation component and is used to provide a pre-pressure to fix the heat dissipation component in the accommodating cavity; The hard disk mainboard is connected to the heat dissipation component, and the hard disk mainboard can be fixed in the accommodating cavity through the heat dissipation component; Wherein, when the spring bracket and the buckle are locked with each other, the spring bracket forms the pre-pressure.

2. The solid state drive assembly according to claim 1, characterized in that: The hard disk mainboard comprises: A PCB board and a plurality of functional modules; the plurality of functional modules are arranged on the PCB board.

3. The solid state drive assembly according to claim 2, wherein: The heat dissipation component comprises: Heat dissipation aluminum extrusion; the heat dissipation aluminum extrusion comprises: a heat dissipation substrate and a plurality of heat dissipation fins protruding from the surface of the heat dissipation substrate; Wherein, the spring bracket passes through the heat dissipation fins and abuts against the heat dissipation substrate.

4. The solid state drive assembly according to claim 3, characterized in that: The heat dissipation component also includes: A first thermally conductive pad and a plurality of second thermally conductive pads; Wherein, the first thermally conductive pad is attached to the surface of the PCB board facing away from the functional module; each of the second thermally conductive pads is attached to the surface of the corresponding functional module.

5. The solid state drive assembly according to claim 4, characterized in that: When the heat dissipation component is fixed in the accommodating cavity, the first thermally conductive pad may abut against the bottom surface of the accommodating cavity, so that the heat generated on the PCB board is transferred to the fixing member.

6. The solid state drive assembly according to claim 4, characterized in that: When the heat dissipation component is fixed in the accommodating cavity, the second thermally conductive gasket may abut against the surface of the heat dissipation substrate facing away from the heat dissipation fins, so that the heat generated on the functional module is transferred to the heat dissipation aluminum extrusion.

7. The solid state drive assembly according to claim 1, wherein: The fixing member comprises: A bottom plate and a pair of back plates; the pair of back plates both protrude from the surface of the bottom plate to enclose and form the accommodating cavity; Wherein, the back plate has protrusions at two ends which are away from each other in the length direction; and the buckle is arranged at the end of the protrusion away from the bottom plate.

8. The solid state drive assembly according to claim 3, characterized in that: The spring bracket comprises: horizontal pieces and diagonal pieces; One end of the horizontal member is provided with a snap-fit ​​head; the other end of the horizontal member is connected to one end of the oblique member to form an extrusion portion; the other end of the oblique member is provided with a hook; In response to the formation of the pre-pressure, the pressing portion may abut against the surface of the heat dissipation substrate.

9. The solid state drive assembly according to claim 8, characterized in that: When in the locked position, the hook and the engaging head are correspondingly locked in a plurality of the buckles, so that the spring bracket provides the pre-pressure to fix the heat dissipation component and the hard disk motherboard in the accommodating cavity of the fixing member; When in the unlocked position, the hook and the engaging head are disengaged from the corresponding plurality of buckles, so that the heat dissipation component and the hard disk mainboard can be separated from the fixing member.

10. A computer, characterized in that: include: A computer body and a solid state hard disk assembly as claimed in any one of claims 1 to 9; Wherein, the solid state hard disk component is fixed in the computer body.

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